CN110631688B - Vector underwater acoustic sensor - Google Patents
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- CN110631688B CN110631688B CN201910941430.6A CN201910941430A CN110631688B CN 110631688 B CN110631688 B CN 110631688B CN 201910941430 A CN201910941430 A CN 201910941430A CN 110631688 B CN110631688 B CN 110631688B
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- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims abstract description 36
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 36
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Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01H—MEASUREMENT OF MECHANICAL VIBRATIONS OR ULTRASONIC, SONIC OR INFRASONIC WAVES
- G01H11/00—Measuring mechanical vibrations or ultrasonic, sonic or infrasonic waves by detecting changes in electric or magnetic properties
- G01H11/06—Measuring mechanical vibrations or ultrasonic, sonic or infrasonic waves by detecting changes in electric or magnetic properties by electric means
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
- G01S7/00—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00
- G01S7/52—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00 of systems according to group G01S15/00
- G01S7/521—Constructional features
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Computer Networks & Wireless Communication (AREA)
- Radar, Positioning & Navigation (AREA)
- Remote Sensing (AREA)
- Transducers For Ultrasonic Waves (AREA)
Abstract
The invention provides a vector underwater sound sensor which comprises a substrate, a vector chip arranged on the substrate and an underwater sound receiving piece connected with the vector chip. The vector chip comprises a silicon substrate, an underwater acoustic measurement piece, chip pins, TGV glass and metalized through holes, wherein the underwater acoustic measurement piece, the chip pins, the TGV glass and the metalized through holes are arranged on the silicon substrate along at least two different directions, the TGV glass is clamped between a base plate and the silicon substrate, and the chip pins are respectively connected with the underwater acoustic measurement piece and the metalized through holes. The underwater sound receiving piece is used for receiving the vector underwater sound signal; the underwater acoustic measuring piece is used for converting the vector underwater acoustic signal into a vector electric signal; and the TGV glass is used for sealing the chip pins and transmitting the vector electric signals out through the metalized through holes. The acoustic field vector signals can be measured, and the positioning precision is improved; the device can directly contact with external water environment media without arranging a sound-transmitting cover, thereby avoiding energy loss caused by the sound-transmitting cover and improving the sensitivity; the volume is small, can reduce sonar system volume, reduces the implementation degree of difficulty of sonar system engineering.
Description
Technical Field
The invention belongs to the technical field of sensors, and particularly relates to a vector underwater sound sensor.
Background
Sonar equipment is the essential equipment of marine environment information detection, and good sonar equipment needs possess the excellent performance's water sound sensor. The vector underwater acoustic sensor can simultaneously measure vector information such as sound pressure, particle vibration velocity and the like in a sound field, so that more comprehensive sound field information is obtained.
In an isotropic background environment noise field, the vector underwater sound sensor has spatial directivity to partially cancel the interference of background noise, and the target radiation noise cannot be canceled due to the specific propagation direction, so that the single vector underwater sound sensor has a certain spatial processing gain. The traditional scalar underwater sound sensor cannot obtain the gain because the traditional scalar underwater sound sensor does not have space directivity. Therefore, in theory, the sonar system based on the vector underwater sound sensor has higher positioning precision than the sonar system based on the traditional scalar underwater sound sensor.
At present, although a widely-used towed line array passive sonar system can realize remote positioning, the system is too large, and engineering implementation is complex. In addition, the general underwater acoustic device needs the sound-transmitting cover to protect the internal device, and although the material of the sound-transmitting cover is equivalent to the water density of the underwater acoustic environment as much as possible, the underwater acoustic device has a certain degree of underwater acoustic energy loss compared with a bare device.
Disclosure of Invention
The invention aims to solve at least one technical problem in the prior art and provides a vector underwater sound sensor.
The invention provides a vector underwater sound sensor, which comprises a substrate, a vector chip arranged on the substrate and an underwater sound receiving piece connected with the vector chip, wherein the vector chip comprises a silicon substrate, an underwater sound measuring piece, chip pins, TGV glass and metalized through holes, the underwater sound measuring piece, the chip pins, the TGV glass and the metalized through holes are arranged on the silicon substrate along at least two different directions, the TGV glass is clamped between the substrate and the silicon substrate, the chip pins are respectively connected with the underwater sound measuring piece and the metalized through holes,
the underwater sound receiving piece is used for receiving the vector underwater sound signal;
the underwater acoustic measurement piece is used for converting the vector underwater acoustic signal into a vector electric signal.
The TGV glass is used for sealing chip pins and transmitting the vector electric signals out through the metalized through holes.
Optionally, the TGV glass is located between the base plate and the silicon substrate, and the silicon substrate is fabricated with a cross-shaped cantilever beam pattern, the cross-shaped cantilever beam pattern including a cross-shaped intersection, two first straight cantilever beams extending from the cross-shaped intersection to the outside in a first direction, and two second straight cantilever beams extending from the cross-shaped intersection to the outside in a second direction; wherein,
the surface of the cross-shaped intersection part, which faces away from the substrate, is connected with the underwater sound receiving piece;
at least one underwater sound measuring piece is manufactured on the surface, facing the substrate, of the first cantilever beam, and at least one underwater sound measuring piece is manufactured on the surface, facing the substrate, of the second cantilever beam.
Optionally, the surface of the cross-shaped cantilever beam pattern facing away from the base plate is lower than the surface of the silicon substrate facing away from the base plate.
Optionally, a waterproof passivation layer is arranged on the surface, facing the substrate, of the cross-shaped cantilever beam pattern, and the waterproof passivation layer is made of one or more of silicon dioxide, silicon nitride, aluminum oxide and silicon carbide.
Optionally, a first end of the metalized via is electrically connected to the underwater acoustic measurement member, and a second end of the metalized via is electrically connected to the substrate.
Optionally, the vector underwater acoustic sensor further comprises a lead wire,
the lead wire extends from the end of the underwater sound measuring part to the outside, and is arranged in the same layer as the underwater sound measuring part;
the chip pins are arranged on one side of the lead facing the substrate and are in contact with the metalized through holes.
Optionally, the lead is a boron-doped lead, and the chip pin is a metal pin. .
Optionally, the hydroacoustic receiving member is of a cylindrical structure; or,
the underwater sound receiving piece comprises a spherical part and a columnar part connected with the spherical part, and the columnar part is connected with the vector chip; or,
the cross section size of the underwater sound receiving piece is periodically reduced and then enlarged.
Optionally, the outer surface of the hydroacoustic receiving element is a low surface energy hydrophobic surface; or,
the vector underwater sound sensor further comprises a hydrophobic protective film, and the hydrophobic protective film is covered on the outer surface of the underwater sound receiving piece.
Optionally, the vector chip is electrically connected with the substrate, and the connection gap is sealed by low-temperature glass powder sintering or waterproof glue.
The invention provides a vector underwater sound sensor which comprises a base plate, a vector chip arranged on the base plate and an underwater sound receiving piece connected with the vector chip, wherein the vector chip comprises a silicon substrate, an underwater sound measuring piece, chip pins, TGV glass and metalized through holes, the underwater sound measuring piece, the chip pins, the TGV glass and the metalized through holes are arranged on the silicon substrate in at least two different directions, the TGV glass is clamped between the base plate and the silicon substrate, and the chip pins are respectively connected with the underwater sound measuring piece and the metalized through holes. The underwater sound receiving piece is used for receiving the vector underwater sound signal; the underwater acoustic measuring piece is used for converting the vector underwater acoustic signal into a vector electric signal; and the TGV glass is used for sealing the chip pins and transmitting the vector electric signals out through the metalized through holes. The vector underwater sound sensor can measure sound field vector signals, obtain more comprehensive sound field information and improve the positioning precision of a sonar system; the vector underwater acoustic sensor can directly contact with an external water environment medium without arranging an acoustic cover, so that the energy loss of an underwater acoustic signal caused by the acoustic cover is avoided, and the sensitivity of the vector underwater acoustic sensor is improved; the volume is small, can reduce the volume of sonar system greatly, and then reduces the implementation degree of difficulty of sonar system engineering.
Drawings
FIG. 1 is a schematic diagram of a vector underwater acoustic sensor according to an embodiment of the present invention;
FIG. 2 is a bottom view of a vector chip silicon substrate portion of a vector hydroacoustic sensor in accordance with an embodiment of the present invention;
FIG. 3 is a top view of a vector chip of a vector underwater acoustic sensor according to an embodiment of the present invention;
FIG. 4 is a schematic view of the TGV glass of a vector hydroacoustic sensor in accordance with an embodiment of the present invention;
fig. 5 is a schematic structural diagram of an underwater sound receiving member of the vector underwater sound sensor according to the embodiment of the present invention.
Detailed Description
In order to make the technical solutions of the present invention better understood, the present invention will be described in further detail with reference to the accompanying drawings and specific embodiments.
As shown in fig. 1 and 2, the present invention provides a vector hydroacoustic sensor 100, the vector hydroacoustic sensor 100 including a substrate 110, a vector chip 120 disposed on the substrate 110, and an hydroacoustic receiving member 130 connected to the vector chip 120. The vector chip 120 includes an acoustic measurement member 121 and a silicon substrate 122, and the acoustic measurement member 121 is disposed on the silicon substrate 122 in at least two different directions. The vector chip 120 further comprises a waterproof passivation layer 123, TGV glass 124 and chip pins 125, wherein the TGV glass 124 comprises metalized through holes 124a, the TGV glass 124 is clamped between the substrate 110 and the silicon substrate 122, and the chip pins 125 are respectively connected with the underwater acoustic measurement part 121 and the metalized through holes 124 a. The underwater sound receiving piece 130 is used for receiving the vector underwater sound signal; an underwater acoustic measurement member 121 for converting the vector underwater acoustic signal into a vector electric signal; TGV glass is used to seal the chip pins 125 and to carry out the vector electrical signals through the metallized vias 124 a.
Specifically, when the vector underwater sound sensor 100 with the structure of the present embodiment is placed in an environment to be measured, when a sound wave reaches the position of the vector underwater sound sensor 100, the underwater sound receiving element 130 can vibrate with the water particle at the position, and in order to obtain a better vibration effect, the density of the underwater sound receiving element 130 is preferably the same as or similar to the water quality density of the underwater sound medium to be measured. Since the hydroacoustic receiving element 130 is connected to the vector chip 120, the vibrating hydroacoustic receiving element 130 applies a moment to the vector chip 120, and the hydroacoustic measuring element 121 located in different directions may generate strain with the moment, so as to cause the electrical parameters (e.g., resistance, etc.) thereof to change, and the acoustic wave characteristics may be calculated according to the change of the electrical parameters of the hydroacoustic measuring element 121 located in different directions.
In the vector underwater sound sensor of the present embodiment, when the underwater sound receiving unit 130 vibrates, the underwater sound measuring device disposed in different directions changes the electrical parameter of the underwater sound measuring device, so that the sound field vector information of the water particle can be detected according to the change of the electrical parameter, for example, the vibration characteristic of the water particle, that is, the vibration acceleration of the water particle (corresponding to the sound pressure gradient,
more comprehensive sound field information is obtained. When the vector underwater acoustic sensor 100 of the present embodiment is applied to a sonar system, the positioning accuracy can be improved as compared with a conventional scalar underwater acoustic sensor.
As shown in fig. 1, 2 and 3, the vector chip 120 further includes a silicon substrate 122, and the silicon substrate 122 may be a common single crystal silicon or an SOI silicon substrate. A cross-shaped cantilever beam pattern 122a is formed on the silicon substrate 122 by using an MEMS process, and the cross-shaped cantilever beam pattern 122a includes a cross-shaped beam intersection 122a1, two first straight cantilever beams 122a2 extending outward from the connection portion 122a1 in the first direction, and two second straight cantilever beams 122a3 extending outward from the connection portion 122a1 in the second direction. Wherein the surface of the cross beam intersection 122a1 facing away from the base plate 110 interfaces with the hydroacoustic receiving member 130; the surface of the first straight suspension beam 122a2 facing the substrate 110 is formed with an acoustic measurement element 121, and the surface of the second straight suspension beam 122a3 facing the substrate 110 is formed with an acoustic measurement element 121.
It should be noted that the cross beam intersection 122a1 may be in the shape of a circular disk, and the central circular disk is closely connected to the hydroacoustic receiving member 130.
As shown in fig. 2, the first direction of the "cross" shaped cantilever beam 122a is perpendicular to the second direction to measure vector signals in both directions x and y.
As shown in fig. 1, a surface of the "cross" cantilever beam pattern 122a facing away from the substrate 110 is lower than a surface of the silicon substrate 122 facing away from the substrate 110, and a suspension space is formed between the "cross" cantilever beam pattern 122a and the TGV glass 124, so that when the underwater sound receiving component 130 vibrates, the "cross" cantilever beam pattern 122a can freely vibrate in the suspension space better, which causes electrical parameters of the underwater sound measuring component 121 to change more accurately, and thus, sound field vector information of water particles can be calculated by means of the changed electrical parameters.
As shown in fig. 1, in order to protect the underwater acoustic measurement piece 121, the vector chip 120 includes a waterproof passivation layer 123, and the waterproof passivation layer 123 is provided with a cross-shaped cantilever beam pattern 122a facing the surface of the substrate 110 to protect the underwater acoustic measurement piece 121 from water. The material of the passivation layer 123 is not limited, for example, the material of the passivation layer 123 may be one or more of silicon dioxide, silicon nitride, aluminum oxide, silicon carbide, and other films, and besides, a person skilled in the art may select other materials to form the waterproof passivation layer 123 according to actual needs. In order to prevent the underwater acoustic organisms from entering the vector chip 120 through the suspension space, the suspension space can be filled with gel-like colloid, so that external water quality can be isolated, various underwater acoustic organisms can be prevented from entering the vector chip 120, and the vector chip 120 can be effectively protected from reducing the influence of external impurities on measurement.
As shown in fig. 1, the TGV glass 124 is located between the base plate 110 and the silicon substrate 122, and the TGV glass 124 is electrically connected to the silicon substrate 122 through a bonding process. A first end of the metalized via 124a is electrically connected to the underwater acoustic measurement part 121, and a second end of the metalized via 124a is electrically connected to the substrate 110 to lead out an electrical signal.
As shown in fig. 1 and 2, vector hydroacoustic sensor 100 further includes a lead 150. A first end of lead 150 is electrically connected to underwater acoustic measurement member 121 and a second end of lead 150 is electrically connected to metalized via 124 a. The electrical signal measured by the hydroacoustic measuring device 121 is transmitted to an external circuit through the metallized via 124a by means of the lead 150.
As shown in fig. 2 and 4, the lead wire 150 extends from the end of the hydroacoustic measuring device 121 to the outside, and the lead wire 150 is provided in the same layer as the hydroacoustic measuring device 121. The chip pin 125 is disposed on a side of the lead 150 facing the substrate 110 and contacts the metalized via 124 a.
The lead 150 is a dense boron lead, and the underwater acoustic measurement element 121 is a silicon pressure-sensitive structure manufactured by an MEMS process, specifically, light boron is used as a force-sensitive resistor. The lead 150 is made of concentrated boron rather than metal, so that the surface of the silicon substrate is flat and has no protrusion, the subsequent bonding process of the silicon substrate 122 and the TGV glass 124 is easy to realize, the sealing performance is good, and the waterproof passivation layer is convenient to use for liquid isolation.
It should be noted that the TGV glass 124 may specifically include a metalized via 124a and a through hole glass 124b, the chip pins 125 are metal pins, the chip pins 125 correspond to the metalized vias 124a one-to-one, a groove 124c is formed in the TGV glass 124 at a position corresponding to the cross-shaped cantilever pattern 122a, and the TGV glass 124 may be hermetically and tightly connected to the silicon substrate 122 through a bonding process to hermetically isolate the chip pins 125 from the outside. Specifically, bonding may be performed directly, or bonding may be performed using an intermediate layer such as amorphous silicon, polycrystalline silicon, metal, or alloy, which is added. The metalized vias 124a are filled with a conductive material, such as metal, conductive paste, conductive glass, etc., and the conductive material in the metalized vias 124a is in close contact with the chip pins 125.
As shown in fig. 1, the groove 124c of the TGV glass 124 is uniformly filled with gel-like colloid for isolating the external water quality and protecting the vector chip 120.
Note that the waterproof passivation layer 123 exposes only the area corresponding to the metalized via 124 a.
The main process steps of the manufacturing method of the MEMS vector underwater acoustic sensor chip 120 are as follows:
1. injecting light boron into an n-type (100) silicon substrate to form a silicon piezoresistor;
2. injecting concentrated boron to form ohmic contact regions at two ends of the silicon piezoresistor, and using the concentrated boron as a lead;
3. annealing to enable the impurity ions to go deeper and repair the injection damage;
4. growing a passivation protective layer on the surface of the silicon substrate;
5. etching a contact hole between the metal and the concentrated boron region;
6. manufacturing a metal pin;
7. etching the back;
8. etching a cross-shaped cantilever beam structure on the front surface;
9. the silicon substrate structure is bonded to the TGV glass.
As shown in fig. 5a, the underwater sound receiving member 130 may have a cylindrical structure, for example, a cylindrical structure or a prismatic structure, one end of the cylindrical structure is connected to the vector chip 120, the other end of the cylindrical structure extends out of the vector underwater sound sensor 100 and is suspended, and the underwater sound receiving member 130 of the cylindrical structure can increase the moment acting on the cross beam structure by increasing the moment arm due to its rod-shaped structure, thereby increasing the sensitivity of the sensor appropriately.
Furthermore, as shown in fig. 5b, the hydroacoustic receiving member 130 may also include a spherical portion connected to the vector chip 120 and a pillar structure connected to the spherical portion, which is located outside the vector hydroacoustic sensor 100, and the spherical portion may increase its mass, thereby increasing the moment acting on the cross beam structure, thereby suitably increasing the sensor sensitivity.
In addition, as shown in fig. 5c, the cross-sectional size of the hydroacoustic receiving part 130 may be periodically decreased and then increased, that is, the hydroacoustic receiving part 130 may adopt a bionic seal beard structure. The underwater sound receiving piece 130 with the periodically changed cross-sectional dimension can better transmit underwater sound related parameters.
It should be noted that the underwater sound receiving element 130 is not limited to the three structures shown in fig. 5a to 5c, and those skilled in the art may select different structures of the underwater sound receiving element according to the characteristics of the underwater sound signal to be measured, so as to improve the accuracy of signal measurement.
Preferably, in order to prevent the adhesion of the underwater sound creatures to the underwater sound receiving member 130, the outer surface of the underwater sound receiving member 130 may be made a low surface energy hydrophobic surface, or a hydrophobic protective film may be formed on the outer surface of the underwater sound receiving member 130.
As shown in fig. 1, the vector underwater acoustic sensor 100 further includes a water-proof protective layer 160 for isolating the vector chip from the outside. The vector underwater sound sensor 100 further comprises a protective shell 170, wherein a through hole is formed in the protective shell 170 on the side away from the substrate 110, and the underwater sound receiving piece 121 is connected with the vector chip 120 through the through hole.
In the vector underwater acoustic sensor 100, the vector chip 120 is electrically connected with the substrate 100, and the connection gap is sealed by low-temperature glass powder sintering or waterproof glue and is used for isolating an electric signal from an external liquid medium.
In use, vector hydroacoustic sensor 100 is mounted within a cartridge 200. Specifically, the vector chip 120 is first mounted on the substrate 110, and then a water-stop protective layer 160 is used to fill up the gap between the outer side of the vector chip 120 and the substrate 110 and isolate the gap from the outside. The waterproof protective layer 160 may be sintered by waterproof glue or glass powder. The vector underwater sound sensor 100 is protected by a protective shell 170, and the protective shell 170 is provided with a through hole, so that the underwater sound receiving piece 130 can be conveniently installed. It should be noted that the remaining positions in the protective shell 170 and the tube shell 200 are uniformly filled with gel-like colloid for isolating the external water quality and preventing various underwater organisms from entering the vector chip 120 structure and affecting the normal operation thereof.
When an underwater sound signal exists in the vector underwater sound sensor 100, the underwater sound receiving part 130 vibrates along with water particles, the vibration frequency and the amplitude are consistent with those of the water particles, force generated by the vibration acceleration of the underwater sound receiving part 130 acts on the cross-shaped cantilever beam pattern 122a, corresponding stress is generated on the cross-shaped cantilever beam pattern 122a, and the resistance value of the underwater sound measuring part 121 on the cross-shaped cantilever beam pattern 122a changes along with the change of the stress, so that the change of an output value is caused.
The underwater sound receiving piece 130 of the vector underwater sound sensor 100 provided by the invention is not provided with an electrical structure, and the surface of the underwater sound receiving piece 130 can be sprayed with a hydrophobic protective film to prevent underwater organisms from attaching, so that the underwater sound receiving piece can be directly contacted with external environment media such as seawater or lake water, and a sound transmission cover is not required to be arranged, thereby avoiding the energy loss of underwater sound signals caused by the sound transmission cover and improving the sensitivity of the vector underwater sound sensor.
It will be understood that the above embodiments are merely exemplary embodiments taken to illustrate the principles of the present invention, which is not limited thereto. It will be apparent to those skilled in the art that various modifications and improvements can be made without departing from the spirit and substance of the invention, and these modifications and improvements are also considered to be within the scope of the invention.
Claims (9)
1. A vector underwater acoustic sensor is characterized by comprising a substrate, a vector chip arranged on the substrate and an underwater acoustic receiving piece connected with the vector chip, wherein the vector chip comprises a silicon substrate, an underwater acoustic measuring piece arranged on the silicon substrate along at least two different directions, a chip pin, TGV glass and a metalized via hole arranged in the TGV glass, the TGV glass is clamped between the substrate and the silicon substrate, the chip pin is respectively connected with the underwater acoustic measuring piece and the metalized via hole, and the vector chip comprises a first chip, a second chip and a third chip,
the underwater sound receiving piece is used for receiving the vector underwater sound signal;
the underwater acoustic measurement piece is used for converting the vector underwater acoustic signal into a vector electric signal; the TGV glass is used for sealing chip pins and transmitting the vector electric signals out through the metalized through holes;
the outer surface of the underwater sound receiving piece is a hydrophobic surface with low surface energy; or,
the vector underwater sound sensor further comprises a hydrophobic protective film, and the hydrophobic protective film is covered on the outer surface of the underwater sound receiving piece.
2. The vector hydroacoustic sensor as recited in claim 1, wherein the silicon substrate is formed with a cross-shaped cantilever pattern including a cross-shaped intersection, two first cantilever beams extending outward in a first direction from the cross-shaped intersection, and two second cantilever beams extending outward in a second direction from the cross-shaped intersection; wherein,
the surface of the cross-shaped intersection part, which faces away from the substrate, is connected with the underwater sound receiving piece;
at least one underwater sound measuring piece is manufactured on the surface, facing the substrate, of the first direct suspension beam, and at least one underwater sound measuring piece is manufactured on the surface, facing the substrate, of the second direct suspension beam.
3. The vector hydroacoustic sensor as recited in claim 2 wherein a surface of the "cross" cantilever beam pattern facing away from the base plate is lower than a surface of the substrate facing away from the base plate.
4. The vector hydroacoustic sensor as recited in claim 2, wherein a surface of the cross-shaped cantilever beam pattern facing the substrate has a waterproof passivation layer made of one or more of silicon dioxide, silicon nitride, aluminum oxide, and silicon carbide.
5. The vector hydroacoustic sensor as recited in any one of claims 1 to 4, wherein a first end of the metallized via is electrically connected to the hydroacoustic measurement member and a second end of the metallized via is electrically connected to the substrate.
6. The vector hydroacoustic sensor of claim 5 further comprising a lead wire,
the lead wire extends from the end of the underwater sound measuring part to the outside, and is arranged in the same layer as the underwater sound measuring part;
the chip pins are arranged on one side of the lead facing the substrate and are in contact with the metalized through holes.
7. The vector hydroacoustic sensor as recited in claim 6, wherein the leads are boron-doped leads and the chip leads are metal leads.
8. The vector hydroacoustic sensor as recited in any one of claims 1 to 4, wherein the hydroacoustic receiving member is of a cylindrical configuration; or,
the underwater sound receiving piece comprises a spherical part and a columnar part connected with the spherical part, and the columnar part is connected with the vector chip; or,
the cross section size of the underwater sound receiving piece is periodically reduced and then enlarged.
9. The vector underwater acoustic sensor according to any one of claims 1 to 4, wherein the vector chip is electrically connected to the substrate, and a connection gap is sealed by low-temperature glass frit sintering or waterproof glue.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910941430.6A CN110631688B (en) | 2019-09-30 | 2019-09-30 | Vector underwater acoustic sensor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910941430.6A CN110631688B (en) | 2019-09-30 | 2019-09-30 | Vector underwater acoustic sensor |
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| Publication Number | Publication Date |
|---|---|
| CN110631688A CN110631688A (en) | 2019-12-31 |
| CN110631688B true CN110631688B (en) | 2022-01-25 |
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| CN102175305B (en) * | 2011-01-24 | 2013-05-15 | 中北大学 | Single chip integrated trivector vibration sensor |
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| CN104121984B (en) * | 2014-08-16 | 2016-08-31 | 中北大学 | A kind of high-sensitivity resonance formula MEMS vector hydrophone structure |
| CN105067100A (en) * | 2015-07-23 | 2015-11-18 | 中北大学 | Neutral buoyancy type MEMS vector hydrophone |
| CN109579975B (en) * | 2018-12-19 | 2020-10-27 | 中北大学 | X, Y-direction vibration suppression piezoresistive three-dimensional vector hydrophone |
| CN110044520B (en) * | 2019-05-29 | 2021-02-26 | 南京元感微电子有限公司 | Force sensor for measuring pressure between solids |
| CN110171799B (en) * | 2019-05-29 | 2024-04-09 | 苏州知芯传感技术有限公司 | MEMS switch and manufacturing method thereof |
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| CN1648621A (en) * | 2005-02-02 | 2005-08-03 | 哈尔滨工程大学 | High frequency small two-dimension coseismal column type vector hydrophone and its process |
| CN109883578A (en) * | 2019-03-29 | 2019-06-14 | 夏罗登工业科技(上海)有限公司 | Pressure sensor |
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