CN110631288A - Dynamic adjustable refrigerating and heating device for experiment and semiconductor refrigerating plate - Google Patents
Dynamic adjustable refrigerating and heating device for experiment and semiconductor refrigerating plate Download PDFInfo
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- CN110631288A CN110631288A CN201910762479.5A CN201910762479A CN110631288A CN 110631288 A CN110631288 A CN 110631288A CN 201910762479 A CN201910762479 A CN 201910762479A CN 110631288 A CN110631288 A CN 110631288A
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B21/00—Machines, plants or systems, using electric or magnetic effects
- F25B21/02—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect
- F25B21/04—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect reversible
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B49/00—Arrangement or mounting of control or safety devices
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
- H10N10/10—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects
- H10N10/17—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects characterised by the structure or configuration of the cell or thermocouple forming the device
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B2321/00—Details of machines, plants or systems, using electric or magnetic effects
- F25B2321/02—Details of machines, plants or systems, using electric or magnetic effects using Peltier effects; using Nernst-Ettinghausen effects
- F25B2321/021—Control thereof
- F25B2321/0212—Control thereof of electric power, current or voltage
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Abstract
The invention discloses a dynamically adjustable refrigerating and heating device for experiments and a semiconductor refrigerating and heating plate, wherein a refrigerating and heating module adopts the semiconductor refrigerating and heating plate and comprises a refrigerating working mode and a heating working mode, wherein the refrigerating and heating working mode comprises an upper layer used for taking away redundant energy, a lower layer used for outputting energy outwards, and a middle layer comprising a plurality of semiconductor refrigerating sheets used for generating energy; the cold and hot switching module is used for changing the current direction leading to the refrigerating and heating module through the adjusting instruction of the control module so as to control the working mode of the refrigerating and heating module; the sensing module is used for acquiring a heat flow density value and a temperature value; the data acquisition module is used for acquiring the heat flow density value and the temperature value at each moment; the control module is used for sending an adjusting instruction to the cold-hot switching module and the power supply module; the power module is used for supplying power to the device. The device has the advantages of compact structure, high temperature rise and fall speed and high temperature control precision, provides an arbitrary temperature environment of-65-120 ℃ for the refrigerating and heating object surface, and has strong load capacity.
Description
Technical Field
The invention belongs to the technical field of temperature control, and particularly relates to a dynamically adjustable refrigerating and heating device for experiments and a semiconductor refrigerating plate.
Background
The electric heating element of the traditional temperature controller is generally mainly composed of an electric heating rod and a heating ring, and the electric heating rod and the heating ring are both made of resistance wires. During temperature control, when the ambient temperature is lower than the lower temperature limit set by the temperature sensor, the circuit is switched on, the resistance wire starts to heat, and when the temperature exceeds the upper temperature limit set by the temperature sensor, the circuit is switched off, and the resistance wire stops heating. The temperature controller can only realize temperature control within a certain range, and belongs to contact control, so that the traditional fixed point switch has an inertial temperature error phenomenon of several degrees of positive and negative errors in temperature control, and the temperature controller also has the defects of high use cost and the like caused by large energy consumption and large consumption of an electric heating assembly.
The traditional electric refrigeration is short for converting electric energy into cold energy, and can be classified into an electronic refrigeration type and a compressor refrigeration type according to the refrigeration mode. The compressor has the same refrigeration principle as the refrigerator, has the characteristics of high reliability of the whole machine, high refrigeration efficiency, high refrigeration speed, large cold water supply quantity and the like, has refrigeration performance obviously superior to that of an electronic refrigeration water dispenser, but has very expensive selling price and is suitable for occasions with large cold quantity requirements. The electronic refrigeration type adopts a semiconductor element for refrigeration, and has the characteristics of low power consumption, low operation noise, no pollution, automatic control, low selling price and the like. The defects are that the refrigerating speed is low, the supplied cold quantity is less, and the refrigerating device is suitable for occasions with small cold quantity requirement.
The experimental environment includes: cold trap, cold box, cold bath, electron low temperature testing arrangement, various constant temperature, high low temperature experiments etc. need provide law and continuous temperature to the environment for the experiment and become the circulation, create the quasi-static process of experimental temperature, lack the refrigeration heating device that the problem that two kinds of traditional refrigeration methods exist of overcoming simultaneously is applicable to experimental environment at present.
Disclosure of Invention
The invention aims to provide a dynamically adjustable refrigerating and heating device for experiments, which is used for solving the problems that an electronic refrigerating mode in the prior art is low in refrigerating speed, less in supplied refrigerating capacity, high in cost and very expensive in price, and a compressor refrigerating mode is not suitable for a laboratory environment.
In order to realize the task, the invention adopts the following technical scheme:
the semiconductor refrigeration plate is characterized by comprising an upper plate, a middle layer refrigeration heating plate and a lower plate which are arranged from top to bottom, wherein an S-shaped water channel is arranged on the upper plate and used for taking away redundant energy through heat exchange, the lower plate is used for outputting energy outwards, and the middle layer refrigeration heating plate is used for generating energy;
the middle-layer refrigerating and heating plate comprises a plurality of semiconductor refrigerating sheet groups which are connected in parallel, each semiconductor refrigerating sheet group comprises a plurality of semiconductor refrigerating sheets which are connected in series, the middle-layer refrigerating and heating plate generates heat when working in a heating mode, and generates cold when working in a refrigerating mode.
Further, the middle-layer refrigerating and heating plate comprises 10 semiconductor refrigerating sheet groups, and each semiconductor refrigerating sheet group comprises 4 semiconductor refrigerating sheets.
Furthermore, a water channel water inlet/outlet and a water channel water outlet are arranged on one side of the upper plate;
furthermore, a sealing ring is arranged on the periphery of the middle-layer refrigerating and heating plate.
Further, the lower plate is a copper plate.
A dynamically adjustable experimental refrigerating and heating device comprises a refrigerating and heating module, a cold-hot switching module, a sensing module, a data acquisition module, a control module and a power module;
the refrigerating and heating module adopts any one of the semiconductor refrigerating plates;
the cold and hot switching module is used for changing the current direction leading to the refrigerating and heating module through the adjusting instruction of the control module so as to control the working mode of the refrigerating and heating module;
the sensing module is used for acquiring a heat flow density value and a temperature value of the upper surface of the refrigerating and heating module;
the data acquisition module is used for storing the heat flow density value and the temperature value of the sensing module at each moment and drawing an acquisition curve of the heat flow density value and the temperature value;
the control module is used for receiving current information of the data acquisition module, the power supply module and the cold-hot switching module, sampling a heat flow density value and a temperature value acquisition curve obtained by the data acquisition module, comparing the sampling values with a set target value respectively, and sending an adjusting instruction to the cold-hot switching module and the power supply module according to a comparison result;
the power module is used for supplying power to the device, communicating with the control module and displaying the current state through the LED display function.
Further, cold and hot switching module includes PLC and relay, and the inside multiple operating instruction of carrying out logic operation, sequence control, timing, count and arithmetic operation of storage of PLC, PLC pass through control module's regulation instruction and give the relay with operating instruction, and the relay switches the current direction and changes the current direction who leads to the heating module of refrigerating to the mode of control heating module.
Further, the sensing module comprises a heat flow sensor, the heat flow sensor is used for generating a direct current voltage value which is proportional to the heat flow density value and the temperature value of the upper surface of the refrigerating and heating module, and the sensing module obtains the actual heat flow density value and the actual temperature value according to the direct current voltage value and the sensitivity value of the sensor and transmits the actual heat flow density value and the actual temperature value to the data acquisition module.
Further, the control module is used for sampling the heat flow density value and the temperature value acquisition curve obtained by the data acquisition module, comparing the sampling values with the set target value respectively, and sending an adjusting instruction to the cold-hot switching module and the power supply module according to the comparison result, and the method is characterized by comprising the following steps of:
(1) when the absolute value of the difference between the sampling value and the target value is smaller than the precision value, the LED green indicator lamp of the power supply module is turned on, a current voltage maintaining instruction is sent to the power supply to indicate that the heat flow density or the temperature of the surface of the refrigerating and heating plate is basically in a target state, and the error is within the precision range and meets the control requirement;
(2) when the absolute value of the difference between the sampling value and the target value is not less than the precision value and the difference between the sampling value and the target value is greater than 0, the LED yellow indicator lamp of the power supply module is turned on, and a voltage-reducing delta U instruction is sent to the power supply to indicate that the error is within the precision range, and the surface heat flux density or the temperature of the refrigerating heating plate is higher than the target value;
(3) when the absolute value of the difference between the sampling value and the target value is not less than the precision value and the difference between the sampling value and the target value is less than 0, the LED red indicator lamp of the power supply module is turned on, and a voltage delta U instruction for increasing is sent to the power supply to indicate that the error is within the precision range, and the surface heat flux density or the temperature of the refrigerating heating plate is lower than the target value.
The power distribution box is further characterized by further comprising a power distribution box which is used for switching on or off a circuit by means of a manual or automatic switch in normal operation and switching off the circuit or giving an alarm by means of a protective electric appliance in fault or abnormal operation so as to prompt or send a signal when the power distribution box deviates from a normal working state.
Compared with the prior art, the invention has the following technical characteristics:
(1) the device has the advantages of compact structure, no vibration, no noise, easy control and adjustment, light weight, convenient movement, high temperature rise and fall speed, high temperature control precision, low manufacturing cost and the like, can provide an arbitrary temperature environment of-65-120 ℃ for a refrigerating and heating object carrying surface, and has strong load capacity.
(2) The device has wide application range, is particularly suitable for cold traps, cold boxes, cold tanks, electronic low-temperature testing devices, various constant-temperature and high-low-temperature experiments and other experimental processes, provides regular and continuous temperature change circulation, and creates a quasi-static process of experimental temperature.
(3) The semiconductor refrigeration plate has the advantages of more flexible refrigeration and heating processes, excellent energy-saving and environment-friendly performance, high intelligent level, strong practicability and stronger popularization and application values.
Drawings
FIG. 1 is a connection diagram of the modules of the apparatus of the present invention;
FIG. 2 is a block diagram of the present invention;
FIG. 3 is a block diagram of the control module adjustment logic of the present invention;
FIG. 4 is a schematic structural view of a semiconductor refrigeration plate;
FIG. 5 is a schematic view of the upper plate structure of the semiconductor refrigeration plate;
FIG. 6 is a schematic diagram of a middle layer structure of the semiconductor refrigeration plate;
FIG. 7 is a schematic diagram of the structure of the lower plate of the semiconductor refrigeration plate;
FIG. 8 is a schematic circuit diagram of a semiconductor cold plate;
fig. 9 is a schematic view of the installation position of the semiconductor refrigeration plate;
fig. 10 is a schematic diagram of an experimental placement environment of a brine tank with a semiconductor refrigeration plate.
The reference numerals in the figures mean: 1-upper plate, 2-middle layer refrigerating and heating plate, 3-lower plate, 4-water channel, 5-semiconductor refrigerating sheet group, 6-semiconductor refrigerating sheet, 7-sealing ring and 8-fastening screw;
an 11-water channel water inlet and a 12-water channel water outlet;
a-baffle bar, B-slope, C-semiconductor refrigeration plate, D-copper electric heating plate, E-saline water and F-glass water tank.
Detailed Description
Example 1
The embodiment discloses a semiconductor refrigeration plate, which comprises an upper plate 1, a middle layer refrigeration heating plate 2 and a lower plate 3 which are arranged from top to bottom, wherein a water channel 4 is arranged on the upper plate 1 and used for taking away redundant energy through heat exchange, the lower plate 3 is used for outputting energy outwards, and the middle layer refrigeration heating plate 2 is used for generating energy;
the middle-layer refrigerating and heating plate 2 comprises a plurality of semiconductor refrigerating sheet groups 5 which are connected in parallel, each semiconductor refrigerating sheet group 5 comprises a plurality of semiconductor refrigerating sheets 6 which are connected in series, when in processing, the plurality of semiconductor refrigerating sheets are connected in series to obtain the semiconductor refrigerating sheet group, then the plurality of semiconductor refrigerating sheet groups are connected in parallel, the middle-layer refrigerating and heating plate 2 generates heat when working in a heating mode, and generates cold when working in a refrigerating mode.
Preferably, the middle-layer refrigerating and heating plate 2 shown in fig. 2 includes 10 semiconductor refrigerating sheet groups 5, and each refrigerating sheet group 5 includes 4 semiconductor refrigerating sheets 6. Because a single semiconductor wafer has very small heat effect and cannot meet the requirement of regulation and control, in order to expand the regulation and control range, a processing mode of firstly connecting a plurality of semiconductor refrigerating wafers in series to boost pressure to form refrigerating units and then connecting the refrigerating units in parallel to boost flow can be adopted, and in order to ensure the reliability of the refrigerating units, the number of the semiconductor refrigerating wafers connected in series with each refrigerating unit is preferably not more than 5. Therefore, a plurality of semiconductor cooling plates are required to be connected into an assembly, the semiconductor cooling plates are connected in parallel and in series, the cooling capacity of the cooling plates cannot be changed due to series connection or parallel connection, and meanwhile, the semiconductor cooling plates can work in a more stable state due to the connection mode of series-parallel connection. When the parallel connection is used, if one of the semiconductor wafers is damaged, the rest semiconductor wafers can continue to operate; when used in series, if one of the semiconductor chips is broken, all the chips stop operating. When the circuit is used in parallel, the voltage is low, the current is large, and components for controlling the chip current, such as a relay transistor or a CMOS (complementary metal oxide semiconductor), are large in loss and high in price; when the device is used in series, the voltage is high and the current is small. The components for controlling the chip current, such as relay transistors or CMOS, are low in loss and low in price.
Specifically, the water channel 4 that sets up on the upper plate 1 is the S type water channel, sets up to the S type and is favorable to bigger degree exchange heat, one side of upper plate 1 is provided with water channel water inlet 11 and water channel delivery port 12, and 1S type water channel is intake through the water channel water inlet, through the drainage of water channel delivery port, and water inlet and delivery port position can be exchanged. When the device works in a refrigeration mode, one side of the semiconductor refrigeration sheet refrigerates, the other side of the semiconductor refrigeration sheet generates redundant heat, and cold water in the water channel can take away the redundant heat, so that a good auxiliary effect is achieved on the refrigeration effect; when the device works in a heating mode, one side of the semiconductor refrigerating sheet heats to heat cold water in the water channel, so that redundant cold energy is taken away.
Specifically, the sealing ring 7 is arranged on the periphery of the middle-layer refrigerating and heating plate 2, and the sealing ring 7 can effectively prevent liquid, dust and the like from entering the sealed cavity, so that components inside the sealing ring 7 can be effectively protected, and the sealing ring is particularly suitable for occasions with severe environments, such as water environments.
Specifically, the lower plate 3 is a copper plate, and the copper plate has two main advantages of good heat conductivity and corrosion resistance, so that the copper plate is used as a cold conducting and heat dissipating surface, so that the heat loss can be reduced, and the application range of the device can be expanded.
Specifically, the upper plate 1, the middle layer refrigerating and heating plate 2 and the lower plate 3 are connected through fastening screws 8.
Specifically, the design of an anti-corrosion coating can be added according to different practical working occasions; when placed in air, a paint coating can be added to prevent corrosion by air; and when the corrosion inhibitor works in the saline water, the design of the saline water corrosion inhibitor coating can be increased. Preferably, the anti-corrosion coating is arranged on the outer surface of the middle-layer refrigerating and heating plate so as to meet various complex and severe environment requirements.
Fig. 5 is a schematic diagram of a partial working circuit of the semiconductor refrigeration plate in the connection mode, wherein the current is in a refrigeration mode in a clockwise direction, and the power supply is in a heating mode when the positive and negative poles are switched, namely the current is in a counterclockwise direction. Each dotted frame is internally provided with 4 semiconductor refrigerating pieces which are mutually connected in series, and 5 dotted frames are connected to show that 5 groups of semiconductor refrigerating pieces which are connected in series are connected in parallel.
FIG. 6 is a schematic view showing the installation position of the semiconductor refrigeration plate in an experimental environment, in which when a slope B is generally provided in the experimental tank and the semiconductor refrigeration plate is placed in the experimental tank, the slope B is required to be placed at an inclination angle a with respect to the wall surface of the experimental tank, and in order to prevent the semiconductor refrigeration plate C from sliding, a stop bar A is provided at the upper portion and the lower portion of the wall surface in contact with the experimental tank, respectively, for fixing the position of the semiconductor refrigeration plate C.
Fig. 7 shows a schematic view of a placing environment when a semiconductor refrigeration plate is placed in saline water for a water tank experiment, the semiconductor refrigeration plate C is firstly placed on a slope B in a glass water tank F, then the semiconductor refrigeration plate C is fixed in position by a baffle bar a, a copper electric heating plate D is also needed for auxiliary heating when the water tank experiment is performed in the saline water, and the depth of the saline water E in the glass water tank F is 4 times of the height of the slope B. And adjusting the current led to the semiconductor refrigeration plate C according to the heat flux density required by the experiment so as to control the temperature, thereby completing the experiment.
Example 2
The embodiment discloses a dynamically adjustable refrigerating and heating device for experiments, which comprises a refrigerating and heating module, a cold-hot switching module, a sensing module, a data acquisition module, a control module and a power module;
the refrigerating and heating module adopts the semiconductor refrigerating plate in any one of embodiment 1;
the cold and hot switching module is used for changing the current direction leading to the refrigerating and heating module through the adjusting instruction of the control module so as to control the working mode of the refrigerating and heating module;
the sensing module is used for acquiring a heat flow density value and a temperature value of the upper surface of the refrigerating and heating module;
the data acquisition module is used for storing the heat flow density value and the temperature value of the sensing module at each moment and drawing an acquisition curve of the heat flow density value and the temperature value;
the control module is used for receiving current information of the data acquisition module, the power supply module and the cold-hot switching module, sampling a heat flow density value and a temperature value acquisition curve obtained by the data acquisition module, comparing the sampling values with a set target value respectively, and sending an adjusting instruction to the cold-hot switching module and the power supply module according to a comparison result;
the power module is used for supplying power to the device, communicating with the control module and displaying the current state through the LED display function.
The present invention attempts to use semiconductor chilling plates in laboratory settings: in the experimental processes of cold traps, cold boxes, cold tanks, electronic low-temperature testing devices, various constant-temperature and high-low-temperature experiments and the like, an automatic control system is formed by control of input current or voltage, real-time detection of temperature and data-driven control programs, regular and continuous temperature change circulation is provided, and a quasi-static process of experimental temperature is created.
The working process of the invention is as follows: the method comprises the steps of firstly, measuring the heat flux density/temperature of the surface of a refrigerating and heating plate by using a heat flux sensor, transmitting the value by using digital signals such as voltage or current and the like, acquiring and recording the value by using a data acquisition instrument, and finally feeding the value back to an upper computer by using the data acquisition instrument. After the upper computer monitors, analyzes and processes the received digital signals, the control module sends corresponding instructions, and the direct current stabilized voltage power supply is adjusted after the signal interface, so that the refrigeration mode is taken as an example, the refrigeration instructions and corresponding heat flux density or temperature values are input into the upper computer, and after the refrigeration instructions are received by the PLC, the relay corresponding to the refrigeration mode is controlled to be closed, and the relay corresponding to the heating mode is controlled to be opened. Meanwhile, the upper computer monitors, analyzes and processes the digital signals received from the data acquisition instrument, compares the digital signals with a set heat flow density or temperature value, sends a corresponding adjusting instruction to the direct current stabilized power supply through the signal interface, enables the refrigerating power of the semiconductor refrigerating sheet to be maintained in a set range by changing the output current or voltage of the direct current stabilized power supply, and continues to measure the heat flow density or temperature of the surface of the refrigerating and heating plate, so that the circulating operation of the whole system is completed. The heating mode is similar to the above process.
Specifically, cold and hot switching module includes PLC and relay, and the inside multiple operating instruction of carrying out logic operation, sequence control, timing, count and arithmetic operation of storage of PLC, PLC transmit operating instruction for the relay through the regulation instruction of host computer, through the switching state who switches corresponding relay, change the current direction who leads to the heating module of refrigeration, can switch its heating refrigeration mode.
Specifically, the sensing module comprises a heat flow sensor, the heat flow sensor is used for generating a direct current voltage value which is proportional to a heat flow density value and a temperature value of the upper surface of the refrigerating and heating module, and the sensing module obtains an actual heat flow density value and a temperature value and transmits the actual heat flow density value and the actual temperature value to the data acquisition module according to the direct current voltage value and the sensitivity value of the sensor.
Specifically, the control module samples the heat flow density value and the temperature value acquisition curve obtained by the data acquisition module, compares the sampled values with the set target value respectively, and sends an adjustment instruction to the cold-hot switching module and the power supply module according to the comparison result, and the control module comprises the following steps:
because the heat flow density sampling value and the temperature sampling value are the voltage value U generated by the sensor, the Kr value is provided by the calibration of a sensor manufacturer through the relational expressions T Kr U and q Kr U, so that the conversion from the sampling value to the actual temperature value is realized, and the sampling value mentioned in the step 3 already represents the actual temperature value and the heat flow density value;
(1) when the absolute value of the difference between the sampling value and the target value is smaller than the precision value, the LED green indicator lamp of the power supply module is turned on, a current voltage maintaining instruction is sent to the power supply to indicate that the heat flow density or the temperature of the surface of the refrigerating and heating plate is basically in a target state, and the error is within the precision range and meets the control requirement;
(2) when the absolute value of the difference between the sampling value and the target value is not less than the precision value and the difference between the sampling value and the target value is greater than 0, the LED yellow indicator lamp of the power supply module is turned on, and a voltage-reducing delta U instruction is sent to the power supply to indicate that the error is within the precision range, and the surface heat flux density or the temperature of the refrigerating heating plate is higher than the target value;
(3) when the absolute value of the difference between the sampling value and the target value is not less than the precision value and the difference between the sampling value and the target value is less than 0, the LED red indicator lamp of the power supply module is turned on, and a voltage delta U instruction for increasing is sent to the power supply to indicate that the error is within the precision range, and the surface heat flux density or the temperature of the refrigerating heating plate is lower than the target value.
The power distribution box is used for switching on or switching off a circuit by a manual or automatic switch during normal operation, and switching off the circuit or giving an alarm by a protective electric appliance during fault or abnormal operation to prompt or send a signal when the power distribution box deviates from a normal working state.
Example 3
Referring to fig. 3, on the basis of embodiment 2, the invention discloses a dynamically adjustable experimental refrigerating and heating device, wherein a semiconductor refrigerating and heating plate, a cold and hot switching module, a CHS series ultrathin heat flow sensor, a data acquisition instrument, a gishley (Keithley)2701 data acquisition instrument, a valley urban ventilation testing system, a power supply module, a programmable direct current voltage and current stabilizing power supply, a distribution box and a data connecting line are selected as a refrigerating and heating module, a sensing module, a data acquisition module, a control module, a valley urban ventilation testing system and a power supply module.
Specifically, the adopted customized semiconductor refrigerating and heating plate is a galvanic couple formed by connecting two different semiconductor materials in series, and is a temperature sensor manufactured based on the Peltier effect. When current passes through the couple, one metal surface of the refrigeration plate absorbs heat, and the other metal surface releases heat, thereby influencing the temperature of the surrounding environment. When the direction of the connected current is changed, the metal heat absorption surface and the heat release surface of the semiconductor refrigeration sheet can be mutually converted.
Specifically, the CHS series ultrathin heat flow sensor is used for measuring plane heat loss, and the sensor is fixed on the outer surface of the upper layer of the refrigeration plate by using proper heat-conducting silicone grease, double-sided adhesive tapes, a pressing plate and a clamp. The direct current voltage signal (voltage signal range is 0-100mv) generated by the sensor is measured by connecting a lead with a Gishley (Keithley2701) data acquisition instrument,
specifically, a Gishley (Keithley2701) data acquisition instrument is selected to acquire temperature/heat flow density data from a CHS series ultrathin heat flow sensor and store the temperature/heat flow density data into a csv file for receiving and reading in an input sampling stage of an upper computer.
Specifically, the upper computer selects a valley city ventilation test system in which a logic program (shown in figure 2) is pre-implanted, the working process of the system is divided into three stages of input sampling, user program execution and output refreshing, and the three stages are completed and called a scanning period. The input sampling stage periodically receives and reads csv file data from the data acquisition instrument, the user program execution stage judges the data through a pre-implanted logic program so as to output a corresponding voltage/current regulation command, and the output refreshing stage transmits a latest voltage/current regulation command to the power module through an established communication protocol. The above three phases are repeatedly performed at a certain scanning speed during the entire operation.
Specifically, the selected programmable direct-current voltage-stabilizing and current-stabilizing power supply is a high-frequency power supply produced and researched by Wuxi Annes electronic technology limited, and the product is mainly characterized by having high stability on high-frequency current and voltage output and meeting the requirement of high-frequency real-time acquisition and control on the power of the semiconductor refrigerating sheet in a control system. The main parameters of the product are as follows: output voltage AC220V (or 380V); constant voltage and constant current continuous adjustable range: 0-rated output; the precision is +/-1%. The method achieves regular and continuous control of the semiconductor refrigeration plate and creates a quasi-static process of experimental temperature.
Specifically, the selected PLC and the relay realize the on-off control and safety protection of the circuit and the switching function of the anode and the cathode of the power supply through a logic operation program. In addition, the automatic switching of the anode and the cathode of the power supply can be realized, and the seamless switching between the refrigerating working condition and the heating working condition in the experimental process is met.
Specifically, the distribution box is a low-voltage distribution device formed by assembling switch equipment, a measuring instrument, a leakage protector (air switch) and auxiliary equipment in a closed or semi-closed metal cabinet or on a screen according to the electrical wiring requirement.
The above description is only a preferred embodiment of the present invention, and is not intended to limit the present invention in any way, and all modifications and equivalents of the above embodiments according to the technical spirit of the present invention are within the scope of the present invention.
The above disclosure is only one specific embodiment of the present invention, however, the present invention is not limited thereto, and any variations that can be made by those skilled in the art are intended to fall within the scope of the present invention.
Claims (10)
1. The semiconductor refrigeration plate is characterized by comprising an upper plate (1), a middle-layer refrigeration heating plate (2) and a lower plate (3) which are arranged from top to bottom, wherein an S-shaped water channel is arranged on the upper plate (1) and used for taking away redundant energy through heat exchange, the lower plate (3) is used for outputting energy outwards, and the middle-layer refrigeration heating plate (2) is used for generating energy;
the middle-layer refrigerating and heating plate (2) comprises a plurality of semiconductor refrigerating sheet groups (5) which are connected in parallel, each semiconductor refrigerating sheet group (5) comprises a plurality of semiconductor refrigerating sheets (6) which are connected in series, the middle-layer refrigerating and heating plate (2) generates heat when working in a heating mode, and generates cold when working in a refrigerating mode.
2. The semiconductor refrigeration plate as claimed in claim 1, characterized in that the middle layer refrigeration heating plate (2) comprises 10 semiconductor refrigeration plate groups (5), each semiconductor refrigeration plate group (5) comprising 4 semiconductor refrigeration plates (6).
3. Semiconductor refrigeration plate according to claim 1, characterized in that one side of the upper plate (1) is provided with a water inlet/outlet (11) and a water outlet (12).
4. The semiconductor refrigeration plate as claimed in claim 1, characterized in that the periphery of the middle layer refrigeration heating plate (2) is provided with a sealing ring (7).
5. Semiconductor refrigeration plate according to claim 1, characterized in that the lower plate (3) is a copper plate.
6. A dynamically adjustable refrigerating and heating device for experiments is characterized by comprising a refrigerating and heating module, a cold and hot switching module, a sensing module, a data acquisition module, a control module and a power module;
the refrigerating and heating module adopts any one of the semiconductor refrigerating boards as claimed in claims 1-5;
the cold and hot switching module is used for changing the current direction leading to the refrigerating and heating module through the adjusting instruction of the control module so as to control the working mode of the refrigerating and heating module;
the sensing module is used for acquiring a heat flow density value and a temperature value of the upper surface of the refrigerating and heating module;
the data acquisition module is used for storing the heat flow density value and the temperature value of the sensing module at each moment and drawing an acquisition curve of the heat flow density value and the temperature value;
the control module is used for receiving current information of the data acquisition module, the power supply module and the cold-hot switching module, sampling a heat flow density value and a temperature value acquisition curve obtained by the data acquisition module, comparing the sampling values with a set target value respectively, and sending an adjusting instruction to the cold-hot switching module and the power supply module according to a comparison result;
the power module is used for supplying power to the device, communicating with the control module and displaying the current state through the LED display function.
7. The dynamically adjustable refrigerating and heating device for experiments as claimed in claim 6, wherein the cold-hot switching module comprises a PLC and a relay, a plurality of operation commands for performing logic operation, sequence control, timing, counting and arithmetic operation are stored in the PLC, the PLC transmits the operation commands to the relay through the adjusting commands of the control module, and the relay switches the current direction to change the current direction leading to the refrigerating and heating module, thereby controlling the working mode of the refrigerating and heating module.
8. The dynamically adjustable cooling and heating device for experiments as claimed in claim 6, wherein the sensing module comprises a heat flow sensor for generating a DC voltage value proportional to the heat flow density value and the temperature value of the upper surface of the cooling and heating module, and the sensing module obtains the actual heat flow density value and the temperature value according to the DC voltage value and the sensitivity value of the sensor and transmits the values to the data acquisition module.
9. The dynamically adjustable refrigerating and heating device for experiments as claimed in claim 6, wherein the control module samples the heat flow density value and the temperature value collection curve obtained by the data collection module, compares the sampled values with the set target values respectively, and sends the adjustment command to the cold-hot switching module and the power supply module according to the comparison result comprises the following steps:
step 1, setting a heat flow density target value, a temperature target value, a heat flow density precision value and a temperature precision value;
step 2, sampling the heat flow density value and the temperature value acquisition curve obtained by the data acquisition module to obtain a heat flow density sampling value and a temperature sampling value;
step 3, comparing the heat flux density sampling value with a set heat flux density target value, then comparing the temperature target value of the temperature sampling value, and sending an adjusting instruction to the cold-hot switching module and the power supply module according to the following three conditions in each comparison:
(1) when the absolute value of the difference between the sampling value and the target value is smaller than the precision value, the LED green indicator lamp of the power supply module is turned on, a current voltage maintaining instruction is sent to the power supply to indicate that the heat flow density or the temperature of the surface of the refrigerating and heating plate is basically in a target state, and the error is within the precision range and meets the control requirement;
(2) when the absolute value of the difference between the sampling value and the target value is not less than the precision value and the difference between the sampling value and the target value is greater than 0, the LED yellow indicator lamp of the power supply module is turned on, and a voltage-reducing delta U instruction is sent to the power supply to indicate that the error is within the precision range, and the surface heat flux density or the temperature of the refrigerating heating plate is higher than the target value;
(3) when the absolute value of the difference between the sampling value and the target value is not less than the precision value and the difference between the sampling value and the target value is less than 0, the LED red indicator lamp of the power supply module is turned on, and a voltage delta U instruction for increasing is sent to the power supply to indicate that the error is within the precision range, and the surface heat flux density or the temperature of the refrigerating heating plate is lower than the target value.
10. A dynamically adjustable laboratory cooling and heating apparatus as claimed in claim 6, further comprising an electrical box for switching on and off the electrical circuit by means of a manual or automatic switch during normal operation, and for switching off the electrical circuit or alarming by means of a protective device during fault or abnormal operation, to indicate or signal deviation from normal operation.
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