CN110627380A - Glass composite part, preparation method of glass composite part and laser welding equipment - Google Patents
Glass composite part, preparation method of glass composite part and laser welding equipment Download PDFInfo
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- CN110627380A CN110627380A CN201910872214.0A CN201910872214A CN110627380A CN 110627380 A CN110627380 A CN 110627380A CN 201910872214 A CN201910872214 A CN 201910872214A CN 110627380 A CN110627380 A CN 110627380A
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C27/00—Joining pieces of glass to pieces of other inorganic material; Joining glass to glass other than by fusing
Abstract
The application provides a glass composite, includes: a first glass; a second glass; and a first region; wherein the first region includes a bonding layer and a solder layer, the bonding layer being located between the first glass and the second glass; the bonding layer is located between the first glass and the second glass, and the bonding layer is located between the bonding layer and the edge of the first glass; the first glass and the second glass are connected by the bonding layer. The application also provides a preparation method of the glass composite piece and laser welding equipment.
Description
Technical Field
The application relates to the technical field of glass welding, in particular to a glass composite part, a preparation method of the glass composite part and laser welding equipment.
Background
The glass material has the advantages of corrosion resistance, high temperature resistance, non-conductivity, oxidation resistance and the like, and is widely used in the fields of electricians and electronics, aerospace and the like with higher requirements on structural strength. In practice, two or more pieces of glass are often used in conjunction. The existing glass and glass compounding method is mainly a welding method, and the glass welding method can be generally divided into methods of flame heating and melting, adhesive bonding and heat absorption, hot pressing, hot melting and the like. The flame heating and melting can cause the glass composite piece to have uneven appearance, easily generate bubbles, have uneven transmittance and other consequences. The adhesive bonding can lead to poor flatness, poor bonding density, non-uniform transmittance, etc. of the glass composite due to the presence of the adhesive. The methods of heat absorption, hot pressing, hot melting and the like have the problems of short service life of the die, high requirements on temperature control, vacuum and the like.
Disclosure of Invention
In view of the above, it is desirable to provide a glass composite, a method for manufacturing the glass composite, and a laser welding apparatus to solve at least one of the above problems.
A glass composite, comprising:
a first glass;
a second glass; and
a first region; wherein the content of the first and second substances,
the first region includes a bonding layer and a solder layer, the bonding layer being located between the first glass and the second glass;
the bonding layer is located between the first glass and the second glass, and the bonding layer is located between the bonding layer and the edge of the first glass;
the first glass and the second glass are connected by the bonding layer.
Further, the bonding layer includes a first bonding unit and a second bonding unit;
the linear distance a between the center point of the first bonding unit and the center point of the second bonding unit is in the range of 5 μm or less and a or 1000 μm or less.
Further, the thickness b of the bonding layer in the first glass region is in the range of 0 < b ≦ 90% of the thickness of the first glass.
Further, the bonding layer has a thickness c in the second glass region in the range of 0 < c ≦ 90% of the thickness of the second glass.
Further, the thickness b of the bonding layer at the first glass region is in the range of 0 < b ≦ 2000 μm.
Further, the thickness c of the bonding layer in the second glass region is in the range of 0 < c ≦ 2000 μm.
Furthermore, the range of the minimum straight-line distance x between the welding layer and the edge of the first glass is more than or equal to 0 and less than or equal to 1000 mu m.
A method of making a glass composite for compositing a first glass and a second glass, comprising the steps of:
fixing the first glass and the second glass so that a first surface of the first glass and a second surface of the second glass face each other;
emitting laser light to the first glass and through the second glass to form a welding layer between the first surface and the second surface;
emitting laser to the first glass and through the second glass to enable the first surface and the second surface to generate a bonding structure to form a bonding layer, wherein the bonding layer is connected with the first glass and the second glass, and the welding layer is located between the bonding layer and the edge of the first glass;
setting a first region and a second region, the first region including the bonding layer, the second region being located between the first region and an edge of the first glass;
cutting the second region to form the glass composite.
Further, the step of emitting laser light includes:
adjusting the position of laser emission so that laser penetrates through the first glass and the second glass;
adjusting the focusing depth of the laser light so that the focal point of the laser light covers the first surface and the second surface;
moving a scan path of the laser to scan the laser over the first surface and the second surface.
A laser welding apparatus for compounding a first glass and a second glass, comprising:
a fixing device for fixing the first glass and the second glass so that a first surface of the first glass and a second surface of the second glass face each other;
the laser emitting device is used for emitting laser to the first glass and penetrating through the second glass so that the first surface and the second surface form a welding layer, and a bonding structure is generated on the first surface and the second surface to form a bonding layer, the bonding layer is connected with the first glass and the second glass, and the welding layer is positioned between the bonding layer and the edge of the first glass;
cutting means for cutting a second region to form the glass composite, the second region being located between a first region and an edge of the first glass, the first region comprising a bonding layer; wherein the content of the first and second substances,
the laser emitting device includes a femtosecond laser.
Further, the pulse width of the femtosecond laser emission tube is less than 1000 fs; the laser emitting device further comprises an optical assembly, and the optical energy density which can be borne by a lens of the optical assembly is more than 150 mJ.
According to the glass composite piece, the preparation method of the glass composite piece and the laser welding equipment, the first glass and the second glass are connected before key joint through the welding layer positioned between the edge of the first glass and the key joint layer, the joint degree between the first glass and the second glass is improved, so that the stability of the first glass and the second glass during key joint is stronger, and the obtained glass composite piece is firmer.
Drawings
Fig. 1 is a perspective view of a glass composite according to a first embodiment of the present disclosure.
FIG. 2 is a cross-sectional view of the glass composite shown in FIG. 1 taken along line B-B.
Fig. 3 is an enlarged view at III in fig. 1.
FIG. 4 is a top view of the glass composite shown in FIG. 1.
FIG. 5 is a cross-sectional view taken along line A-A of the bonding layer of the glass composite shown in FIG. 1 in a first embodiment.
FIG. 6 is a cross-sectional view of the bonding layer of the glass composite taken along line A-A in a second embodiment.
FIG. 7 is a cross-sectional view of the bonding layer of the glass composite of the third embodiment taken along line A-A.
FIG. 8 is a flow chart of a method of making a glass composite according to an embodiment of the present application.
Fig. 9 is a schematic view of a bonding layer and a solder layer formed on the first glass and the second glass.
FIG. 10 is a schematic diagram illustrating the division of the second region and the third region according to an embodiment.
Fig. 11 is a schematic view of the resulting glass composite after cutting the third zone in fig. 10.
Fig. 12 is a schematic diagram illustrating the division of the second region and the third region according to another embodiment.
Fig. 13 is a schematic view of the resulting glass composite after cutting the third zone in fig. 12.
Fig. 14 is a flow chart of scanning the junction of the first glass and the second glass with a laser.
Fig. 15 is a schematic view of a laser welding apparatus according to an embodiment of the present application.
Description of the main elements
The following detailed description will further illustrate the invention in conjunction with the above-described figures.
Detailed Description
The present invention will be described in further detail below with reference to the accompanying drawings.
Referring to fig. 1 to 5, a glass composite 100 including a first glass 10, a second glass 20 and a first region 50 is provided in a first embodiment of the present application. The first region 50 is disposed between the first glass 10 and the second glass 20. The first region 50 includes the bonding layer 30 and the welding layer 40.
The bonding layer 30 is located between the first glass 10 and the second glass 20, and the bonding layer 30 is used for connecting the first glass 10 and the second glass 20. The solder layer 40 is located between the bonding layer 30 and the edge of the first glass 10 and at the periphery of the bonding layer 30. The weld layer 40 may be located immediately adjacent to the bonding layer 30 or spaced apart from the bonding layer 30. The solder layer 40 may be disposed proximate to an edge of the first glass 10 or spaced from an edge of the first glass 10. The linear distance from any point M of the welding layer 40 to each point of the edge of the first glass 10 is x1, x2 and x. The solder layer 40 is used to promote the conformity between the first glass 10 and the second glass 20 before the bonding layer 30 is formed. In some embodiments, the lower limit of the minimum straight-line distance x of the solder layer 40 from the edge of the first glass 10 is selected from 0.5 μm, 1 μm, 1.5 μm, 2 μm, 2.5 μm, 3 μm, 3.5 μm, 4 μm, 4.5 μm, 5 μm, 5.5 μm, 8 μm, 9 μm, 10 μm, 15 μm, 20 μm, 25 μm, 30 μm, 35 μm, 40 μm, 45 μm, 50 μm, 55 μm, 70 μm, 80 μm, 90 μm, 100 μm, 150 μm, 200 μm, 250 μm, 300 μm, 350 μm, 400 μm, 450 μm, 500 μm, 550 μm, 600 μm, 650 μm, 700 μm, 750 μm, 800 μm, 850 μm, 900 μm, 950 μm. The upper limit of the minimum straight-line distance x of the solder layer 40 from the edge of the first glass 10 is selected from one of 0.7 μm, 1 μm, 1.7 μm, 2 μm, 2.8 μm, 3 μm, 3.9 μm, 4 μm, 4.9 μm, 5 μm, 5.7 μm, 6 μm, 8 μm, 10 μm, 14 μm, 22 μm, 27 μm, 30 μm, 35 μm, 40 μm, 45 μm, 60 μm, 65 μm, 75 μm, 82 μm, 95 μm, 120 μm, 180 μm, 220 μm, 280 μm, 320 μm, 380 μm, 420 μm, 480 μm, 520 μm, 580 μm, 620 μm, 680 μm, 720 μm, 780 μm, 820 μm, 880 μm, 920 μm, 980 μm. It should be noted that the upper limit and the lower limit of the above range are subject to the practical meaning that the range is not affected, i.e., the lower limit is not more than the upper limit.
In some embodiments, the bonding layer 30 is effective to enhance the strength of the bond between the first glass 10 and the second glass 20. The test method of the bonding layer 30 includes: 1. detecting the elemental chemical status information by XPS/ESCA (X-ray photoelectron spectroscopy/chemical analysis electron spectroscopy); 2. analyzing the element composition, chemical bonds, electronic structures and the like of the micro-area of the thin sample by an energy loss spectroscopy (EELS); 3. the rotation and vibration of the chemical bond can be detected by infrared absorption spectrum; 4. qualitative analysis was performed by measuring cross-sections through SEM pictures.
In testing the bonding layer 30, the testing may be performed by one or more of the methods described above.
In other embodiments, bonding layer 30 includes organic materials. The components and physical and chemical parameters of the organic matters are selected according to requirements.
Referring to fig. 1 and 5, fig. 5 is a partial cross-sectional view of a glass composite 100 provided in a first embodiment of the present application, and in particular, is a cross-sectional view of a bonding layer 30 in the glass composite 100 along a-a direction, the bonding layer 30 includes a plurality of first bonding units 31 and a plurality of second bonding units 32, the first bonding units 31 are embedded between the first glass 10 and the second glass 20 at intervals, the second bonding units 32 are equal in number to the first bonding units 31 and are located between adjacent first bonding units 31, and opposite ends of each of the second bonding units 32 partially overlap two adjacent first bonding units 31. The first key unit 31 and the second key unit 32 are each elliptical, and the major axis of the first key unit 31 and the major axis of the second key unit 32 are both parallel to the first surface 11 or the second surface 21. The straight-line distance a between the center point of the first linking unit 31 and the center point of the second linking unit 32 is in the range of 5 μm or less and a or 1000 μm or less.
Wherein a lower limit of a range of a straight-line distance a between the center point of the first bonding unit 31 to the center point of the second bonding unit 32 is selected from one of 6 μm, 7 μm, 9 μm, 15 μm, 20 μm, 30 μm, 50 μm, 70 μm, 90 μm, 100 μm, 150 μm, 200 μm, 250 μm, 300 μm, 350 μm, 400 μm, 500 μm, 600 μm, 700 μm, 800 μm, 900 μm; the upper limit of the range of the straight-line distance a between the center point of the first bonding unit 31 to the center point of the second bonding unit 32 is selected from one of 7 μm, 10 μm, 13 μm, 20 μm, 30 μm, 50 μm, 70 μm, 90 μm, 100 μm, 150 μm, 200 μm, 250 μm, 300 μm, 350 μm, 400 μm, 500 μm, 600 μm, 700 μm, 800 μm, 950 μm. It should be noted that the upper limit and the lower limit of the above range are subject to the practical meaning that the range is not affected, i.e., the lower limit is not more than the upper limit.
Specifically, the upper and lower limits of the range of the straight-line distance a between the center point of the first keying unit 31 to the center point of the second keying unit 32 should be selected reasonably, i.e., the lower limit is equal to or less than the upper limit. Specifically, when a is less than 5 μm, the first glass 10 or the second glass 20 may crack at the time of welding. When a is larger than 1000 μm, the first glass 10 and the second glass 20 may be bonded loosely.
In one embodiment, the bonding layer is located at a thickness b of the first glass 10 in the range 0 < b ≦ 90% of the thickness of the first glass 10. In one embodiment, the bonding layer 30 is located at a lower limit of the range where the thickness b of the first glass 10 accounts for the thickness of the first glass 10, selected from one of 1%, 3%, 5%, 7%, 9%, 10%, 15%, 20%, 25%, 30%, 35%, 40%, 45%, 50%, 55%, 60%, 65%, 70%, 75%, 80%, 85%; the bonding layer is located at one of 2%, 4%, 6%, 8%, 10%, 12%, 18%, 22%, 28%, 33%, 35%, 40%, 45%, 50%, 55%, 60%, 65%, 70%, 75%, 80%, 85% of the thickness b of the first glass 10 that accounts for the upper limit of the range of the thickness of the first glass 10; specifically, the upper and lower limits of the thickness b of the bonding layer 30 in the first glass 10 are selected reasonably, that is, the lower limit is equal to or less than the upper limit. Specifically, the bonding layer 30 needs to have a thickness in the region of the first glass 10 to achieve the bonding effect, so b is greater than 0; b is in the range of 90% or less of the thickness of the first glass 10, and too large results in cracks in the first glass 10.
In one embodiment, the bonding layer 30 is located at a thickness c of the second glass 20 in the range of 0 < c ≦ 90% of the thickness of the second glass 20. In one embodiment, the bonding layer is located at one of the lower limits of the range in which the thickness c of the second glass 20 accounts for the thickness of the second glass 20, selected from 1%, 3%, 5%, 7%, 9%, 10%, 15%, 20%, 25%, 30%, 35%, 40%, 45%, 50%, 55%, 60%, 65%, 70%, 75%, 80%, 85%; the bonding layer is located at one of 2%, 4%, 6%, 8%, 10%, 12%, 18%, 22%, 28%, 33%, 35%, 40%, 45%, 50%, 55%, 60%, 65%, 70%, 75%, 80%, 85% of the thickness c of the second glass 20 in the range where the upper limit of the thickness of the second glass 20 is the thickness; specifically, the upper and lower limits of the thickness c of the bonding layer located on the second glass 20 should be selected reasonably, that is, the lower limit is equal to or less than the upper limit. Specifically, the bonding layer 30 needs to have a thickness in the region of the second glass 20 to achieve the bonding effect, so c is greater than 0; c is in the range of 90% or less of the thickness of the first glass 10, and too large a range may cause cracks in the first glass 10.
In one embodiment, the bonding layer 30 is located at a thickness b of the first glass 10 in the range 0 < b ≦ 2000 μm. In one embodiment, the bonding layer is located at the lower limit of the range of the thickness b of the first glass 10 selected from one of 6 μm, 7 μm, 9 μm, 15 μm, 20 μm, 30 μm, 50 μm, 70 μm, 90 μm, 100 μm, 150 μm, 200 μm, 250 μm, 300 μm, 350 μm, 400 μm, 500 μm, 600 μm, 700 μm, 800 μm, 900 μm, 1000 μm, 1050 μm, 1200 μm, 1250 μm, 1300 μm, 1350 μm, 1400 μm, 1500 μm, 1600 μm, 1700 μm, 1800 μm, 1900 μm; the upper limit of the range of the thickness b of the bonding layer at the first glass 10 is selected from one of 8 μm, 10 μm, 13 μm, 19 μm, 20 μm, 30 μm, 50 μm, 70 μm, 90 μm, 100 μm, 150 μm, 200 μm, 250 μm, 300 μm, 350 μm, 400 μm, 500 μm, 600 μm, 700 μm, 800 μm, 900 μm, 1000 μm, 1050 μm, 1200 μm, 1250 μm, 1300 μm, 1350 μm, 1450 μm, 1550 μm, 1650 μm, 1750 μm, 1850 μm, 1950 μm; specifically, the upper and lower limits of the thickness b of the bonding layer in the first glass 10 are selected as appropriate, that is, the lower limit is equal to or less than the upper limit.
In one embodiment, the bonding layer 30 is located at a thickness c of the second glass 20 in the range of 0 < c ≦ 2000 μm. In one embodiment, the bonding layer is located at the lower limit of the range of the thickness c of the second glass 20 selected from one of 6 μm, 7 μm, 9 μm, 15 μm, 20 μm, 30 μm, 50 μm, 70 μm, 90 μm, 100 μm, 150 μm, 200 μm, 250 μm, 300 μm, 350 μm, 400 μm, 500 μm, 600 μm, 700 μm, 800 μm, 900 μm, 1000 μm, 1050 μm, 1200 μm, 1250 μm, 1300 μm, 1350 μm, 1400 μm, 1500 μm, 1600 μm, 1700 μm, 1800 μm, 1900 μm; the upper limit of the range of the thickness c of the bonding layer at the second glass 20 is selected from one of 8 μm, 10 μm, 13 μm, 19 μm, 20 μm, 30 μm, 50 μm, 70 μm, 90 μm, 100 μm, 150 μm, 200 μm, 250 μm, 300 μm, 350 μm, 400 μm, 500 μm, 600 μm, 700 μm, 800 μm, 900 μm, 1000 μm, 1050 μm, 1200 μm, 1250 μm, 1300 μm, 1350 μm, 1450 μm, 1550 μm, 1650 μm, 1750 μm, 1850 μm, 1950 μm; specifically, the upper and lower limits of the thickness c of the bonding layer located on the second glass 20 should be selected reasonably, that is, the lower limit is equal to or less than the upper limit.
The bonding layer 30 needs to have a thickness in the region of the second glass 20 to achieve the bonding effect, so c is greater than 0; when the range of c is more than 90% of the thickness of the second glass 20, glass cracking is easily caused.
Referring to fig. 1 and 6, fig. 6 is a partial cross-sectional view of a glass composite 200 provided in a second embodiment of the present application, specifically, a cross-sectional view of a bonding layer 230 of the glass composite 200 along the direction a-a. The second embodiment provides a glass composite 200 comprising a first glass 210, a second glass 220, and a bonding layer 230. The first glass 210 has a first surface 211 and the second glass 220 has a second surface 221 opposite the first surface 211. The bonding layer 230 includes a plurality of first bonding units 231 and a plurality of second bonding units 232, the first bonding units 231 are disposed between the first glass 210 and the second glass 220 at intervals, and the second bonding units 232 are disposed between the adjacent first bonding units 231 and are equal in number to the first bonding units 231. The first and second keying units 231 and 232 are each elliptical in shape, and the minor axis of the first keying unit 231 and the minor axis of the second keying unit 232 are both parallel to the first surface 211 or the second surface 221.
Referring to fig. 1 and 7, fig. 7 is a partial cross-sectional view of a glass composite 300 provided in a third embodiment of the present application, specifically, a cross-sectional view of a bonding layer 330 of the glass composite 300 along the direction a-a. The third embodiment provides a glass composite 300 comprising a first glass 310, a second glass 320, and a bonding layer 330. The first glass 310 has a first surface 311 and the second glass 320 has a second surface 321 opposite the first surface 311. The bonding layer 330 includes a plurality of first bonding units 331 and second bonding units 232, the first bonding units 331 are spaced apart from each other and interposed between the first glass 310 and the second glass 320, and the second bonding units 332 are equal in number to the first bonding units 331 and are located between the adjacent first bonding units 331. The first and second keying units 331 and 332 are each elliptical, and the major axis of the first keying unit 331 and the major axis of the second keying unit 332 are both parallel to the first surface 311 or the second surface 321.
In the correlation technique, because laser welding belongs to the welding of nothing material, the plane degree reason of glass itself makes and has the clearance between two glass for glass can not laminate completely about carrying out laser welding when carrying out laser welding, thereby the influence carries out laser welding's stability to glass.
In view of this, referring to fig. 8, the present invention also provides a method for manufacturing glass composites 600 and 700 for improving stability during laser welding between glasses, wherein the method for manufacturing glass composites 600 and 700 is used for connecting a first glass 10 and a second glass 20. The method of making the glass composite 600, 700 includes the following steps.
Step S510: the first glass 10 and the second glass 20 are fixed so that the first surface 11 of the first glass 10 and the second surface 21 of the second glass 20 face each other.
Step S520: laser light is emitted to the first glass 10 and transmitted through the second glass 20 so that a solder layer 40 is formed between the first surface 11 and the second surface 21.
Step S530: emitting laser to the first glass 10 and through the second glass 20 to generate a bonding structure between the first surface 11 and the second surface 21 to form a bonding layer 30, wherein the bonding layer 30 connects the first glass 10 and the second glass 20, and the welding layer 40 is located between the bonding layer 30 and the edge of the first glass 10, as shown in fig. 9.
Step S540: a second region 60(160) and a third region 70(170) are defined on the first glass 10 and the second glass 20 on which the bonding layer 30 and the solder layer 40 are formed, the second region 60(160) including the bonding layer 30, and the third region 70(170) is located between the second region 60(160) and the edge of the first glass 10.
Step S550: cutting (180) the third region 70(170) along the juncture 80(180) of the second region 60(160) and the third region 70(170) to form the glass composite 600 (700).
Specifically, in some embodiments, referring to fig. 10, the second region 60 may not include the solder layer 40, correspondingly, the third region 70 includes the entire solder layer 40, and the glass composite 600 formed after cutting the third region 70 does not include the solder layer 40, as shown in fig. 11. In other embodiments, referring to fig. 12, the second region 160 includes a portion of the solder layer 40, the third region 170 includes the remaining solder layer 40, and the glass composite 700 formed after cutting the third region 170 includes a portion of the solder layer 40, as shown in fig. 13.
Specifically, the laser emission in steps S520 and S530 is performed by a laser emission device through the first glass 10 and the second glass 20. Referring to fig. 14, the step of emitting laser light to the first glass 10 and through the second glass 20 includes the following steps S521-S523.
S521, the position of laser irradiation is adjusted so that the laser passes through the first glass 10 and the second glass 20.
S523, the focusing depth of the laser is adjusted so that the focal point of the laser is located on the first surface 11 and the second surface 21. In particular, since the focal point of the laser has a certain height, it can cover both the first surface 11 and the second surface 21. Of course, in other embodiments, the focal point of the laser may cover the first surface 11 and then the second surface 21 after a short time to achieve bonding.
S523, the scanning path of the laser is moved so that the laser scans the first surface 11 and the second surface 21.
It is understood that the order of the steps S521, S522 and S523 can be adjusted, and is not limited specifically herein.
In other embodiments, the above steps further comprise a step of applying an organic substance, and the composition and physicochemical parameters of the organic substance are selected as required.
Referring to fig. 15, the present invention also provides a laser welding apparatus for combining a first glass 10 and a second glass 20, which includes a fixing device (not shown), a laser emitting device 400, and a cutting device (not shown).
The fixing means is for fixing the first glass 10 and the second glass 20 so that the first surface 11 of the first glass 10 and the second surface 21 of the second glass 20 face each other.
The laser emitting device 400 is used for emitting laser to the first glass 10 and penetrating the second glass 20 to form a welding layer on the first surface 11 and the second surface 21, and creating a bonding structure on the first surface 11 and the second surface 21 to form a bonding layer 30, wherein the bonding layer 30 connects the first glass 10 and the second glass 20, and the welding layer is located between the bonding layer 30 and the edge of the first glass 10.
The cutting device is used to cut a third zone 70, thereby forming the glass composite 100, wherein the third zone 70 is located between a second zone 60 and the edge of the first glass 10, the second zone 60 including the bonding layer 30.
The laser emitting device 400 includes a femtosecond laser emitting tube 410. The femtosecond laser emitting tube 410 has a pulse width less than 1000 fs.
The laser emitting device 400 further includes an optical assembly 420. The optic of the optic 420 can withstand optical energy densities greater than 150 mJ.
The optical assembly 420 may include a beam expander 421, a mirror 422, and a focusing mirror 423. The beam expander 421 serves to expand the diameter of the laser light and reduce the divergence angle of the laser light. The mirror 422 is used to change the direction of the laser light so that the laser light is irradiated onto the first glass 10 and the second glass 20. The focusing mirror 423 is used for changing the focal point of the laser light to focus on the first surface 11 and the second surface 21.
In other embodiments, the soldering apparatus further includes an organic application device (not shown) for applying an organic on the first glass 10 and the second glass 20. The application mode of the organic matter, the components and the physical and chemical parameters of the organic matter are selected according to requirements.
The glass composite 100, 200, 300, the method for manufacturing the glass composite 600, 700, and the laser welding apparatus provided by the present application enable the first glass 10 and the second glass 20 to be connected before bonding through the welding layer 40 located between the edge of the first glass 10 and the bonding layer 30, so that the degree of fit between the first glass 10 and the second glass 20 is improved, and the stability of bonding between the first glass 10 and the second glass 20 is stronger.
It will be appreciated by those skilled in the art that the above embodiments are illustrative only and not intended to be limiting, and that suitable modifications and variations to the above embodiments are within the scope of the disclosure provided that the invention is not limited thereto.
Claims (11)
1. A glass composite, comprising:
a first glass;
a second glass; and
a first region; wherein the content of the first and second substances,
the first region includes a bonding layer and a solder layer, the bonding layer being located between the first glass and the second glass;
the bonding layer is located between the first glass and the second glass, and the bonding layer is located between the bonding layer and the edge of the first glass;
the first glass and the second glass are connected by the bonding layer.
2. The glass composite of claim 1, wherein the bonding layer comprises a first bonding unit and a second bonding unit;
the linear distance a between the center point of the first bonding unit and the center point of the second bonding unit is in the range of 5 μm or less and a or 1000 μm or less.
3. The glass composite as claimed in claim 1, wherein the bonding layer has a thickness b in the first glass region in the range of 0 < b ≦ 90% of the first glass thickness.
4. The glass composite as claimed in claim 1, wherein the bonding layer has a thickness c in the second glass region in the range of 0 < c ≦ 90% of the second glass thickness.
5. The glass composite as claimed in claim 1, wherein the thickness b of the bonding layer in the first glass region is in the range 0 < b ≦ 2000 μm.
6. The glass composite as claimed in claim 1, wherein the bonding layer has a thickness c in the second glass region in the range 0 < c ≦ 2000 μm.
7. The glass composite as in claim 1, wherein a minimum straight-line distance x of the solder layer from the edge of the first glass is in the range of 0 ≦ x ≦ 1000 μm.
8. A method of making a glass composite for compositing a first glass and a second glass, comprising the steps of:
fixing the first glass and the second glass so that a first surface of the first glass and a second surface of the second glass face each other;
emitting laser light to the first glass and through the second glass to form a welding layer between the first surface and the second surface;
emitting laser to the first glass and through the second glass to enable the first surface and the second surface to generate a bonding structure to form a bonding layer, wherein the bonding layer is connected with the first glass and the second glass, and the welding layer is located between the bonding layer and the edge of the first glass;
setting a second zone and a third zone, the second zone including the bonding layer, the third zone being located between the second zone and an edge of the first glass;
cutting the third zone to form the glass composite.
9. The manufacturing method of claim 8, wherein the step of emitting laser light includes:
adjusting the position of laser emission so that laser penetrates through the first glass and the second glass;
adjusting the focusing depth of the laser light so that the focal point of the laser light covers the first surface and the second surface;
moving a scan path of the laser to scan the laser over the first surface and the second surface.
10. A laser welding apparatus for compounding a first glass and a second glass, comprising:
a fixing device for fixing the first glass and the second glass so that a first surface of the first glass and a second surface of the second glass face each other;
the laser emitting device is used for emitting laser to the first glass and penetrating through the second glass so that the first surface and the second surface form a welding layer, and a bonding structure is generated on the first surface and the second surface to form a bonding layer, the bonding layer is connected with the first glass and the second glass, and the welding layer is positioned between the bonding layer and the edge of the first glass;
cutting means for cutting a third zone to form the glass composite, the third zone being located between a second zone and the edge of the first glass, the second zone comprising a bonding layer; wherein the content of the first and second substances,
the laser emitting device comprises a femtosecond laser emitting tube.
11. The laser welding apparatus according to claim 10,
the pulse width of the femtosecond laser emission tube is less than 1000 fs;
the laser emitting device further comprises an optical assembly, and the optical energy density which can be borne by a lens of the optical assembly is more than 150 mJ.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910872214.0A CN110627380A (en) | 2019-09-16 | 2019-09-16 | Glass composite part, preparation method of glass composite part and laser welding equipment |
| US17/018,423 US20210078294A1 (en) | 2019-09-16 | 2020-09-11 | Glass article, methods for manufacturing the same, and laser welding equipemnt |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910872214.0A CN110627380A (en) | 2019-09-16 | 2019-09-16 | Glass composite part, preparation method of glass composite part and laser welding equipment |
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| Publication Number | Publication Date |
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| CN110627380A true CN110627380A (en) | 2019-12-31 |
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