CN110723900A - Glass composite part, preparation method of glass composite part and laser welding equipment - Google Patents
Glass composite part, preparation method of glass composite part and laser welding equipment Download PDFInfo
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- CN110723900A CN110723900A CN201910872215.5A CN201910872215A CN110723900A CN 110723900 A CN110723900 A CN 110723900A CN 201910872215 A CN201910872215 A CN 201910872215A CN 110723900 A CN110723900 A CN 110723900A
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- 239000011521 glass Substances 0.000 title claims abstract description 216
- 239000002131 composite material Substances 0.000 title claims abstract description 46
- 238000003466 welding Methods 0.000 title claims abstract description 17
- 238000002360 preparation method Methods 0.000 title abstract description 6
- 230000003287 optical effect Effects 0.000 claims description 11
- 238000004519 manufacturing process Methods 0.000 claims description 6
- 238000013329 compounding Methods 0.000 claims description 3
- 238000000034 method Methods 0.000 description 11
- 230000000694 effects Effects 0.000 description 7
- 238000010521 absorption reaction Methods 0.000 description 6
- 238000002844 melting Methods 0.000 description 4
- 230000008018 melting Effects 0.000 description 4
- 239000000126 substance Substances 0.000 description 4
- 238000004833 X-ray photoelectron spectroscopy Methods 0.000 description 3
- 238000004566 IR spectroscopy Methods 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 238000004026 adhesive bonding Methods 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 238000005336 cracking Methods 0.000 description 2
- 238000009792 diffusion process Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 238000007731 hot pressing Methods 0.000 description 2
- 238000002834 transmittance Methods 0.000 description 2
- 229910008045 Si-Si Inorganic materials 0.000 description 1
- 229910002808 Si–O–Si Inorganic materials 0.000 description 1
- 229910006411 Si—Si Inorganic materials 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000001941 electron spectroscopy Methods 0.000 description 1
- 125000000524 functional group Chemical group 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000004611 spectroscopical analysis Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B23/00—Re-forming shaped glass
- C03B23/20—Uniting glass pieces by fusing without substantial reshaping
- C03B23/203—Uniting glass sheets
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Joining Of Glass To Other Materials (AREA)
Abstract
The application provides a glass composite, a preparation method of the glass composite and laser welding equipment, the glass composite comprises: a first glass; a second glass; and a bonding layer between the first glass and the second glass; wherein the first glass and the second glass are connected by the bonding layer.
Description
Technical Field
The application relates to a glass composite part, a preparation method of the glass composite part and a laser welding device.
Background
As industrial applications develop, it is desirable to compound two or more glass pieces to form a glass composite. The existing glass and glass compounding method is mainly a welding method, and the glass welding method can be generally divided into methods of flame heating and melting, adhesive bonding and heat absorption, hot pressing, hot melting and the like. The flame heating and melting can cause the glass composite piece to have uneven appearance, easily generate bubbles, have uneven transmittance and other consequences. The adhesive bonding can lead to poor flatness, poor bonding density, non-uniform transmittance, etc. of the glass composite due to the presence of the adhesive. The methods of heat absorption, hot pressing, hot melting and the like have the problems of short service life of the die, high requirements on temperature control, vacuum and the like.
Disclosure of Invention
In view of the above, it is desirable to provide a glass composite, a method for manufacturing the glass composite, and a laser welding apparatus to solve the above problems.
A glass composite, comprising:
a first glass;
a second glass; and
a bonding layer between the first glass and the second glass; wherein,
the first glass and the second glass are connected by the bonding layer.
Further, the bonding layer includes a first bonding unit and a second bonding unit;
the linear distance a between the center point of the first bonding unit and the center point of the second bonding unit is in the range of 5 μm or less and a or 1000 μm or less.
Further, the thickness b of the bonding layer in the first glass region is in the range of 0 < b ≦ 90% of the thickness of the first glass.
Further, the bonding layer has a thickness c in the second glass region in the range of 0 < c ≦ 90% of the thickness of the second glass.
Further, the thickness b of the bonding layer at the first glass region is in the range of 0 < b ≦ 2000 μm.
Further, the thickness c of the bonding layer in the second glass region is in the range of 0 < c ≦ 2000 μm.
A method of making a glass composite for compositing a first glass and a second glass, comprising the steps of:
fixing the first glass and the second glass so that a first surface of the first glass and a second surface of the second glass face each other;
and emitting laser to the first glass and through the second glass to enable the first surface and the second surface to generate a bonding structure to form a bonding layer, wherein the bonding layer is connected with the first glass and the second glass to form the glass composite.
Further, the step of emitting laser light includes:
adjusting the position of laser emission so that laser penetrates through the first glass and the second glass;
adjusting the focusing depth of the laser light so that the focal point of the laser light covers the first surface and the second surface;
moving a scan path of the laser to scan the laser over the first surface and the second surface.
A laser welding apparatus for compounding a first glass and a second glass, comprising:
a fixing device for fixing the first glass and the second glass so that a first surface of the first glass and a second surface of the second glass face each other;
laser emitting means for emitting laser light to said first glass and through said second glass to create a bonding structure between said first surface and said second surface to form a bonding layer, said bonding layer connecting said first glass and said second glass to form said glass composite; wherein,
the laser emitting device comprises a femtosecond laser emitting tube.
Further, the pulse width of the femtosecond laser emission tube is less than 1000 fs;
the laser emitting device further comprises an optical assembly, and the optical energy density which can be borne by a lens of the optical assembly is more than 150 mJ.
The glass welding method in the prior art belongs to the change of physical form; the preparation method of the glass composite part forms a key joint structure by generating a multi-photon absorption effect through laser, and chemical bonds are formed again after being broken, so that the glass composite part is smooth in appearance and small in welding marks.
Drawings
Fig. 1 is a perspective view of a glass composite according to a first embodiment of the present disclosure.
FIG. 2 is a cross-sectional view of the glass composite shown in FIG. 1 taken along line B-B.
Figure 3 is an enlarged view of a portion of the glass composite shown in figure 2 at III.
FIG. 4 is a cross-sectional view of an embodiment of the glass composite shown in FIG. 1 taken along line A-A.
FIG. 5 is a cross-sectional view of a second embodiment of a glass composite taken along line A-A.
FIG. 6 is a cross-sectional view of a third embodiment of a glass composite taken along line A-A.
FIG. 7 is a flow chart of a method of making a glass composite according to an embodiment of the present application.
Fig. 8 is a flow chart of scanning the junction of the first glass and the second glass with a laser.
Fig. 9 is a schematic view of a laser welding apparatus according to an embodiment of the present application.
Description of the main elements
First key unit 31
Laser emitting device 400
Femtosecond laser emitting tube 410
Optical assembly 420
Beam expander 421
Reflecting mirror 422
Focusing mirror 423
Linear distance a
Thickness b, c
The following detailed description will further illustrate the present application in conjunction with the above-described figures.
Detailed Description
The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein in the description of the present application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application.
Some embodiments of the present application will be described in detail below with reference to the accompanying drawings. The embodiments described below and the features of the embodiments can be combined with each other without conflict.
Referring to fig. 1 to 4, a glass composite 100 according to a first embodiment of the present disclosure includes a first glass 10, a second glass 20, and a bonding layer 30. The bonding layer 30 is located between the first glass 10 and the second glass 20. The first glass 10 and the second glass 20 are connected by the bonding layer 30.
The first glass 10 comprises a first surface 11, the second glass 20 comprises a second surface 21, and the first surface 11 is opposite to the second surface 21.
The bonding layer 30 is formed by generating a multi-photon absorption effect (multi-photon absorption) by energy that instantaneously obtains a bonding energy of the molecules of the first glass 10 and the second glass 20 exceeding Si-Si or Si-O-Si or SiO-OSi by an ultra-short pulse time of laser, thereby bonding the first glass 10 and the second glass 20 by diffusion (diffusion bond).
The bonding layer 30 can be determined by the following method and apparatus tests:
x-ray photoelectron spectroscopy/chemical analysis electron spectroscopy (XPS/ESCA) can detect qualitative, quantitative and energy state information of elements; energy Loss Spectroscopy (EELS) can be used for analyzing the element composition, chemical bonds, electronic structures and the like of the micro-area of the thin sample; infrared absorption spectroscopy (IR) can be used to qualitatively and quantitatively determine the functional groups.
Dimensional information of the bonding layer 30 may be determined by scanning a cross-section of the glass composite 100 with a Scanning Electron Microscope (SEM).
A linear distance a between the center point of the first bonding unit 31 and the center point of the second bonding unit 32 is in a range of 5 μm or less and a 1000 μm or less, wherein a lower limit of the range of the linear distance a between the center point of the first bonding unit 31 and the center point of the second bonding unit 32 is selected from one of 6 μm, 7 μm, 9 μm, 15 μm, 20 μm, 30 μm, 50 μm, 70 μm, 90 μm, 100 μm, 150 μm, 200 μm, 250 μm, 300 μm, 350 μm, 400 μm, 500 μm, 600 μm, 700 μm, 800 μm, 900 μm; the upper limit of the range of the straight-line distance a between the center point of the first bonding unit 31 to the center point of the second bonding unit 32 is selected from one of 7 μm, 10 μm, 13 μm, 20 μm, 30 μm, 50 μm, 70 μm, 90 μm, 100 μm, 150 μm, 200 μm, 250 μm, 300 μm, 350 μm, 400 μm, 500 μm, 600 μm, 700 μm, 800 μm, 950 μm. It should be noted that the upper limit and the lower limit of the above range are subject to the practical meaning that the range is not affected, i.e., the lower limit is not more than the upper limit. Specifically, the upper and lower limits of the range of the straight-line distance a between the center point of the first keying unit 31 to the center point of the second keying unit 32 should be selected reasonably, i.e., the lower limit is equal to or less than the upper limit.
When the linear distance a is less than 5um, cracks are easy to appear; when the linear distance a is greater than 5um, there is a problem of binding tightness.
The thickness b of the bonding layer 30 in the region of the first glass 10 is in the range 0 < b > 90% of the thickness of the first glass 10. In some embodiments, the bonding layer 30 is located at one of the lower limits of the range where the thickness b of the first glass 10 accounts for the thickness of the first glass 10, selected from 1%, 3%, 5%, 7%, 9%, 10%, 15%, 20%, 25%, 30%, 35%, 40%, 45%, 50%, 55%, 60%, 65%, 70%, 75%, 80%, 85%; the bonding layer is located at one of 2%, 4%, 6%, 8%, 10%, 12%, 18%, 22%, 28%, 33%, 35%, 40%, 45%, 50%, 55%, 60%, 65%, 70%, 75%, 80%, 85% of the thickness b of the first glass 10 that accounts for the upper limit of the range of the thickness of the first glass 10; specifically, the upper and lower limits of the thickness b of the bonding layer 30 in the first glass 10 are selected reasonably, that is, the lower limit is equal to or less than the upper limit. Specifically, the bonding layer 30 needs to have a thickness in the region of the first glass 10 to achieve the bonding effect, so b is greater than 0; b is in the range of 90% or less of the thickness of the first glass 10, and too large results in cracks in the first glass 10.
The thickness b of the bonding layer 30 in the region of the first glass 10 is in the range 0 < b ≦ 2000 μm. In some embodiments, bonding layer 30 is located at a lower limit of the range of thickness b of first glass 10 selected from one of 6 μm, 7 μm, 9 μm, 15 μm, 20 μm, 30 μm, 50 μm, 70 μm, 90 μm, 100 μm, 150 μm, 200 μm, 250 μm, 300 μm, 350 μm, 400 μm, 500 μm, 600 μm, 700 μm, 800 μm, 900 μm, 1000 μm, 1050 μm, 1200 μm, 1250 μm, 1300 μm, 1350 μm, 1400 μm, 1500 μm, 1600 μm, 1700 μm, 1800 μm, 1900 μm; the upper limit of the range of the thickness b of the bonding layer at the first glass 10 is selected from one of 8 μm, 10 μm, 13 μm, 19 μm, 20 μm, 30 μm, 50 μm, 70 μm, 90 μm, 100 μm, 150 μm, 200 μm, 250 μm, 300 μm, 350 μm, 400 μm, 500 μm, 600 μm, 700 μm, 800 μm, 900 μm, 1000 μm, 1050 μm, 1200 μm, 1250 μm, 1300 μm, 1350 μm, 1450 μm, 1550 μm, 1650 μm, 1750 μm, 1850 μm, 1950 μm; specifically, the upper and lower limits of the thickness b of the bonding layer in the first glass 10 are selected as appropriate, that is, the lower limit is equal to or less than the upper limit.
The bonding layer 30 needs to have a thickness in the region of the first glass 10 to achieve the bonding effect, so b is greater than 0; when the range of b is more than 90% of the thickness of the first glass 10, glass cracking is easily caused.
The thickness c of the bonding layer 30 in the region of the second glass 20 is in the range 0 < c.ltoreq.90% of the thickness of the second glass 20. In some embodiments, the bonding layer 30 is located at a thickness c of the second glass 20 in the range of 0 < c ≦ 90% of the thickness of the second glass 20. In some embodiments, the bonding layer is located at one of a lower limit of the range where the thickness c of the second glass 20 accounts for the thickness of the second glass 20 selected from 1%, 3%, 5%, 7%, 9%, 10%, 15%, 20%, 25%, 30%, 35%, 40%, 45%, 50%, 55%, 60%, 65%, 70%, 75%, 80%, 85%; the bonding layer is located at one of 2%, 4%, 6%, 8%, 10%, 12%, 18%, 22%, 28%, 33%, 35%, 40%, 45%, 50%, 55%, 60%, 65%, 70%, 75%, 80%, 85% of the thickness c of the second glass 20 in the range where the upper limit of the thickness of the second glass 20 is the thickness; specifically, the upper and lower limits of the thickness c of the bonding layer located on the second glass 20 should be selected reasonably, that is, the lower limit is equal to or less than the upper limit. Specifically, the bonding layer 30 needs to have a thickness in the region of the second glass 20 to achieve the bonding effect, so c is greater than 0; c is in the range of 90% or less of the thickness of the first glass 10, and too large a range may cause cracks in the first glass 10.
The thickness c of the bonding layer 30 in the region of the second glass 20 is in the range 0 < c ≦ 2000 μm. In some embodiments, bonding layer 30 is located at a lower limit of the range of thickness c of second glass 20 selected from one of 6 μm, 7 μm, 9 μm, 15 μm, 20 μm, 30 μm, 50 μm, 70 μm, 90 μm, 100 μm, 150 μm, 200 μm, 250 μm, 300 μm, 350 μm, 400 μm, 500 μm, 600 μm, 700 μm, 800 μm, 900 μm, 1000 μm, 1050 μm, 1200 μm, 1250 μm, 1300 μm, 1350 μm, 1400 μm, 1500 μm, 1600 μm, 1700 μm, 1800 μm, 1900 μm; the upper limit of the range of the thickness c of the bonding layer at the second glass 20 is selected from one of 8 μm, 10 μm, 13 μm, 19 μm, 20 μm, 30 μm, 50 μm, 70 μm, 90 μm, 100 μm, 150 μm, 200 μm, 250 μm, 300 μm, 350 μm, 400 μm, 500 μm, 600 μm, 700 μm, 800 μm, 900 μm, 1000 μm, 1050 μm, 1200 μm, 1250 μm, 1300 μm, 1350 μm, 1450 μm, 1550 μm, 1650 μm, 1750 μm, 1850 μm, 1950 μm; specifically, the upper and lower limits of the thickness c of the bonding layer located on the second glass 20 should be selected reasonably, that is, the lower limit is equal to or less than the upper limit.
The bonding layer 30 needs to have a thickness in the region of the second glass 20 to achieve the bonding effect, so c is greater than 0; when the range of c is more than 90% of the thickness of the second glass 20, glass cracking is easily caused.
Referring to fig. 4 to 6, the first key unit 31, 231, 331 and the second key unit 32, 232, 332 of the key layer 30, 230, 330 are slightly different in shape and position depending on the focal point and path of the laser.
Referring to fig. 4, the bonding layer 30 according to the first embodiment of the present application includes a first bonding unit 31 and a second bonding unit 32. The first key unit 31 and the second key unit 32 are each substantially elliptical in shape with the major axis thereof parallel to the first surface 11 and the second surface 21, and there is a partial overlap between the first key unit 31 and the second key unit 32.
Referring to fig. 5, a glass composite 200 according to a second embodiment of the present disclosure includes a first glass 210, a second glass 220, and a bonding layer 230. The bonding layer 230 includes a first bonding unit 231 and a second bonding unit 232. The first bonding unit 231 and the second bonding unit 232 are each substantially elliptical in shape with the major axis perpendicular to the first surface 211 of the first glass 210 and the second surface 221 of the second glass 220, and the first bonding unit 231 and the second bonding unit 232 are not coincident.
Referring to fig. 6, a glass composite 300 according to a third embodiment of the present disclosure includes a first glass 310, a second glass 320, and a bonding layer 330. The bonding layer 330 includes a first bonding unit 331 and a second bonding unit 332. The first and second bonding units 331 and 332 each have a substantially elliptical shape with a major axis parallel to the first surface 311 of the first glass 310 and the second surface 321 of the second glass 320, and the first and second bonding units 331 and 332 do not coincide.
Referring also to fig. 7, a method of making a glass composite 100 for laminating a first glass 10 and a second glass 20 includes the steps of:
s201: fixing the first glass 10 and the second glass 20 so that the first surface 11 of the first glass 10 and the second surface 21 of the second glass 20 face each other;
s202: emitting laser light to the first glass 10 and through the second glass 20 to generate a bonding structure between the first surface 11 and the second surface 21 to form a bonding layer 30, wherein the bonding layer 30 connects the first glass 10 and the second glass 20 to form the glass composite 100.
The laser scanning method for the joint of the first glass 10 and the second glass 20 specifically comprises the following steps:
referring to fig. 8, S301: adjusting the position of laser emission so that laser penetrates through the first glass 10 and the second glass 20;
s302: adjusting the focusing depth of the laser light so that the focal point of the laser light covers the first surface 11 of the first glass 10 and the second surface 21 of the second glass 20;
s303: the scanning path of the laser is moved so that the laser scans the first surface 11 and the second surface 21.
Since the focal point of the laser has a certain height, it can cover both the first surface 11 and the second surface 21. Of course, in other embodiments, the focal point of the laser may cover the first surface 11 and then the second surface 21 after a short time to achieve bonding.
Referring to fig. 9, a laser welding apparatus for combining a first glass 10 and a second glass 20 includes a fixing device (not shown) and a laser emitting device 400.
The fixing device is used for fixing the first glass 10 and the second glass 20 so that the first surface 11 of the first glass 10 and the second surface 21 of the second glass 20 face each other.
The laser emitting device 400 is used for emitting laser to the first glass 10 and transmitting the second glass 20, so that the first surface 11 and the second surface 21 generate a bonding structure to form a bonding layer 30. The bonding layer 30 connects the first glass 10 and the second glass 20 to form the glass composite 100.
The laser emitting device 400 includes a femtosecond laser emitting tube 410. The femtosecond laser emitting tube 410 has a pulse width less than 1000 fs.
The laser emitting device 400 further includes an optical assembly 420. The optical assembly 420 has a lens that can withstand optical energy density of greater than 150 mJ.
The optical assembly 420 may include a beam expander 421, a mirror 422, and a focusing mirror 423.
The beam expander 421 serves to expand the diameter of the laser light and reduce the divergence angle of the laser light. The reflecting mirror 422 is used to change the direction of the laser light so that the laser light irradiates the first glass 10 and the second glass 20. The focusing mirror 423 is used for changing the focal point of the laser light to focus on the first surface 11 and the second surface 21.
The glass welding method in the prior art belongs to the change of physical form; the preparation method of the glass composite part forms a key joint structure by generating a multi-photon absorption effect through laser, and chemical bonds are formed again after being broken, so that the glass composite part is smooth in appearance and small in welding marks.
According to the glass welding method, the auxiliary adhesion of an adhesive is not needed, and the quality of the welded glass is high.
Although the present application has been described with reference to a preferred embodiment, it should be understood that various changes, substitutions and alterations can be made herein without departing from the spirit and scope of the invention as defined by the appended claims.
Claims (10)
1. A glass composite, comprising:
a first glass;
a second glass; and
a bonding layer between the first glass and the second glass; wherein,
the first glass and the second glass are connected by the bonding layer.
2. The glass composite of claim 1, wherein the bonding layer comprises a first bonding unit and a second bonding unit;
the linear distance a between the center point of the first bonding unit and the center point of the second bonding unit is in the range of 5 μm or less and a or 1000 μm or less.
3. The glass composite of claim 1, wherein the bonding layer has a thickness b in the first glass region in the range of 0 < b ≦ 90% of the first glass thickness.
4. The glass composite of claim 1, wherein the bonding layer has a thickness c in the second glass region in the range of 0 < c ≦ 90% of the second glass thickness.
5. The glass composite according to claim 1, wherein the thickness b of the bonding layer in the first glass region is in the range 0 < b ≦ 2000 μm.
6. The glass composite of claim 1, wherein the bonding layer has a thickness c in the second glass region in the range of 0 < c ≦ 2000 μm.
7. A method of making a glass composite for compositing a first glass and a second glass, comprising the steps of:
fixing the first glass and the second glass so that a first surface of the first glass and a second surface of the second glass face each other;
and emitting laser to the first glass and through the second glass to enable the first surface and the second surface to generate a bonding structure to form a bonding layer, wherein the bonding layer is connected with the first glass and the second glass to form the glass composite.
8. The manufacturing method of claim 7, wherein the step of emitting laser light includes:
adjusting the position of laser emission so that laser penetrates through the first glass and the second glass;
adjusting the focusing depth of the laser light so that the focal point of the laser light covers the first surface and the second surface;
moving a scan path of the laser to scan the laser over the first surface and the second surface.
9. A laser welding apparatus for compounding a first glass and a second glass, comprising:
a fixing device for fixing the first glass and the second glass so that a first surface of the first glass and a second surface of the second glass face each other;
laser emitting means for emitting laser light to said first glass and through said second glass to create a bonding structure between said first surface and said second surface to form a bonding layer, said bonding layer connecting said first glass and said second glass to form said glass composite; wherein,
the laser emitting device comprises a femtosecond laser emitting tube.
10. The laser welding apparatus according to claim 9,
the pulse width of the femtosecond laser emission tube is less than 1000 fs;
the laser emitting device further comprises an optical assembly, and the optical energy density which can be borne by a lens of the optical assembly is more than 150 mJ.
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CN201910872215.5A CN110723900A (en) | 2019-09-16 | 2019-09-16 | Glass composite part, preparation method of glass composite part and laser welding equipment |
US17/018,423 US20210078294A1 (en) | 2019-09-16 | 2020-09-11 | Glass article, methods for manufacturing the same, and laser welding equipemnt |
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN115340293A (en) * | 2022-09-15 | 2022-11-15 | 华中科技大学 | Method and device for inhibiting cracks of glass laser welding |
Citations (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102884015A (en) * | 2010-07-28 | 2013-01-16 | 欧司朗股份有限公司 | Optoelectronic semiconductor element and associated method of production by direct welding of glass housing components by means of ultrashort pulsed laser without glass solder |
CN103958423A (en) * | 2011-09-16 | 2014-07-30 | 亚马逊技术公司 | Cover glass for electronic devices |
CN104023897A (en) * | 2011-11-08 | 2014-09-03 | 皮科塞斯公司 | Room temperature glass-to-glass, glass-to-plastic and glass-to-ceramic/semiconductor bonding |
CN106457476A (en) * | 2013-12-17 | 2017-02-22 | 康宁股份有限公司 | Stacked transparent material cutting with ultrafast laser beam optics, disruptive layers and other layers |
CN106449439A (en) * | 2016-09-27 | 2017-02-22 | 华中科技大学 | Glass chip packaging method |
CN106495454A (en) * | 2016-12-19 | 2017-03-15 | 华南师范大学 | Picosecond laser glass solder system and method |
CN107162395A (en) * | 2017-07-14 | 2017-09-15 | 湖南理工学院 | A kind of method of the double-deck or vertical packaged glass of multilayer |
CN107382044A (en) * | 2017-06-15 | 2017-11-24 | 江苏大学 | A kind of method of thin transparent glass laser transmission welding |
CN109387968A (en) * | 2017-08-14 | 2019-02-26 | 三星显示有限公司 | Multiple pileup conjugant manufactures its method and the display device including it |
CN110039177A (en) * | 2019-04-10 | 2019-07-23 | 华中科技大学 | A kind of glass capsulation welding method |
-
2019
- 2019-09-16 CN CN201910872215.5A patent/CN110723900A/en active Pending
Patent Citations (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102884015A (en) * | 2010-07-28 | 2013-01-16 | 欧司朗股份有限公司 | Optoelectronic semiconductor element and associated method of production by direct welding of glass housing components by means of ultrashort pulsed laser without glass solder |
CN103958423A (en) * | 2011-09-16 | 2014-07-30 | 亚马逊技术公司 | Cover glass for electronic devices |
CN104023897A (en) * | 2011-11-08 | 2014-09-03 | 皮科塞斯公司 | Room temperature glass-to-glass, glass-to-plastic and glass-to-ceramic/semiconductor bonding |
CN106457476A (en) * | 2013-12-17 | 2017-02-22 | 康宁股份有限公司 | Stacked transparent material cutting with ultrafast laser beam optics, disruptive layers and other layers |
CN106449439A (en) * | 2016-09-27 | 2017-02-22 | 华中科技大学 | Glass chip packaging method |
CN106495454A (en) * | 2016-12-19 | 2017-03-15 | 华南师范大学 | Picosecond laser glass solder system and method |
CN107382044A (en) * | 2017-06-15 | 2017-11-24 | 江苏大学 | A kind of method of thin transparent glass laser transmission welding |
CN107162395A (en) * | 2017-07-14 | 2017-09-15 | 湖南理工学院 | A kind of method of the double-deck or vertical packaged glass of multilayer |
CN109387968A (en) * | 2017-08-14 | 2019-02-26 | 三星显示有限公司 | Multiple pileup conjugant manufactures its method and the display device including it |
CN110039177A (en) * | 2019-04-10 | 2019-07-23 | 华中科技大学 | A kind of glass capsulation welding method |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN115340293A (en) * | 2022-09-15 | 2022-11-15 | 华中科技大学 | Method and device for inhibiting cracks of glass laser welding |
CN115340293B (en) * | 2022-09-15 | 2024-05-14 | 华中科技大学 | Glass laser welding crack inhibition method and device |
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