CN110621439B - Flux, cored solder and solder paste - Google Patents
Flux, cored solder and solder paste Download PDFInfo
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- CN110621439B CN110621439B CN201880032119.3A CN201880032119A CN110621439B CN 110621439 B CN110621439 B CN 110621439B CN 201880032119 A CN201880032119 A CN 201880032119A CN 110621439 B CN110621439 B CN 110621439B
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/362—Selection of compositions of fluxes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
- B23K35/0255—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in welding
- B23K35/0261—Rods, electrodes, wires
- B23K35/0266—Rods, electrodes, wires flux-cored
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/3601—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with inorganic compounds as principal constituents
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/365—Selection of non-metallic compositions of coating materials either alone or conjoint with selection of soldering or welding materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3489—Composition of fluxes; Methods of application thereof; Other methods of activating the contact surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
- B23K35/3613—Polymers, e.g. resins
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
- B23K35/3615—N-compounds
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
- B23K35/3618—Carboxylic acids or salts
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/368—Selection of non-metallic compositions of core materials either alone or conjoint with selection of soldering or welding materials
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Inorganic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The soldering flux of the present invention comprises phosphine oxide. Thereby, it is possible to provide: a flux capable of improving solder wettability, a cored solder containing the flux, and a solder paste containing the flux.
Description
Cross reference to related applications
The application claims priority from Japanese patent application No. 2017-130388, which is incorporated by reference into the description of the specification of the application.
Technical Field
The invention relates to a soldering flux used in soldering, a cored solder containing the soldering flux, and a soldering paste containing the soldering flux.
Background
Examples of the solder composition for bonding an electronic component to an electronic circuit board such as a printed circuit board include: a solder paste mixed with solder alloy powder and flux; a cored solder in which flux is filled in the wire-like solder alloy. As a flux contained in these solder compositions, resin-based fluxes containing natural resins such as rosin, synthetic resins, activators, solvents, and the like are widely used.
Conventionally, metal materials such as copper and copper alloys to which solder is easily attached have been used for bonding base materials such as electronic circuit boards for bonding electronic components. However, copper and copper alloys have problems of being expensive and having poor mechanical strength. Therefore, in recent years, as the bonding base material, for example, a metal material such as 42Alloy (Fe-42 Ni), kovar (Fe-29 Ni-17 Co), iron, or the like is often used. These metal materials are inexpensive and superior in strength compared to copper and copper alloys, but have poor solder wettability. Therefore, when a metal material that is difficult to solder (hereinafter, also referred to as a difficult-to-bond base material) such as 42Alloy is used, solder wettability is improved by using a flux containing a large amount of a highly active activator containing a halogen component (patent document 1).
However, if a flux containing a halogen-based active agent having high activity is used, corrosion is likely to occur in a soldered portion, and a harmful substance such as dioxin is discharged when a soldered substrate is discarded. Therefore, from the viewpoint of composition, improvement of the flux is required. For example, patent document 2 discloses the following technique: solder wettability of a tin-plated steel sheet is improved by using a flux containing a rosin resin, a non-halogen activator, a solvent, and an amine compound.
Documents of the prior art
Patent literature
Patent document 1: japanese patent application laid-open No. 2001-105131
Patent document 2: japanese laid-open patent publication No. 2015-123491
Disclosure of Invention
Problems to be solved by the invention
However, as for the difficult-to-join base material, soldering is performed using a flux containing a rosin resin, a non-halogen activator, a solvent, and an amine compound, which is disclosed in patent document 2, and as a result, solder wettability cannot be sufficiently improved. Therefore, further improvement in flux composition is required.
The present invention has been made to solve the above problems, and an object of the present invention is to provide: a flux capable of improving solder wettability, a cored solder containing the flux, and a solder paste containing the flux.
Means for solving the problems
The fluxing agent of the present invention comprises a phosphine oxide.
The flux of the present invention preferably further contains at least one of a rosin-based resin and a synthetic resin.
The flux of the present invention preferably further comprises an organic acid-based active agent.
In the flux of the present invention, the content of the phosphine oxide is preferably 0.1 to 10 parts by weight based on 100 parts by weight of the entire flux.
In the flux of the present invention, preferably, the phosphine oxide is triphenylphosphine oxide.
The flux of the present invention preferably further comprises an amine-based compound.
In the flux of the present invention, the content of the amine compound is preferably 0.5 to 10 parts by weight based on 100 parts by weight of the entire flux.
In the flux of the present invention, it is preferable that the amine compound has a cyclic structure.
In the flux of the present invention, the amine compound is preferably an imidazole compound.
The cored solder of the invention comprises the flux.
The soldering paste comprises the soldering flux.
Detailed Description
Hereinafter, a flux according to an embodiment of the present invention, a cored solder including the flux, and a solder paste including the flux will be described.
< soldering flux >
The flux of the present embodiment is used for soldering, and includes phosphine oxide.
The phosphine oxide is a phosphorus compound having a double bond (P = O bond) of a phosphorus atom and an oxygen atom. Examples of the phosphine oxide include triphenylphosphine oxide, phenyl bis (2, 4, 6-trimethylbenzoyl) phosphine oxide, diphenyl (2, 4, 6-trimethylbenzoyl) phosphine oxide, tri-n-octylphosphine oxide, and the like. Among them, triphenylphosphine oxide is preferable from the viewpoint of improving solder wettability. These may be used alone, or 2 or more kinds may be used in combination.
From the viewpoint of improving solder wettability, the content of the phosphine oxide is preferably 0.1 to 10 parts by weight based on 100 parts by weight of the entire flux. The content of the phosphine oxide is more preferably 0.5 parts by weight or more, and still more preferably 7 parts by weight or less. When 2 or more of the phosphine oxides are contained, the content is the total content of the phosphine oxides.
The flux of the present embodiment contains phosphine oxide, and thus when soldering is performed using a solder composition containing the flux, solder wettability can be improved not only for a metal material such as copper or a copper alloy to which solder is easily attached but also for a base material which is difficult to bond. In this way, since the flux is excellent in solder wettability to the base materials difficult to bond, the content of the halogen-based active agent contained in the flux can be reduced or made zero. Such a flux can suppress the occurrence of corrosion in a portion where soldering is performed. In addition, when the soldered substrate is discarded, there is no fear that harmful substances such as dioxin are discharged, and therefore, it is also preferable from the viewpoint of reducing environmental load.
The flux of the present embodiment may further contain at least one of a rosin resin and a synthetic resin from the viewpoint of improving solder wettability. The rosin-based resin is not particularly limited, and examples thereof include gum rosin, tall oil rosin, wood rosin, polymerized rosin, hydrogenated rosin, disproportionated rosin, acrylated rosin, rosin ester, acid-modified rosin, and the like. The synthetic resin is not particularly limited, and a known synthetic resin can be used. Among them, from the viewpoint of activating the flux, it is preferable to contain 1 or more selected from the group consisting of hydrogenated rosin, acid-modified rosin, and rosin ester. These may be used alone or in combination of 2 or more.
The total content of the rosin-based resin and the synthetic resin is not particularly limited, and is, for example, preferably 20 to 99 parts by weight, more preferably 30 to 99 parts by weight, based on 100 parts by weight of the entire flux. In particular, when the flux of the present embodiment is used as a flux for core solder, the total content of the rosin-based resin and the synthetic resin is preferably 40 to 80 parts by weight, more preferably 50 to 70 parts by weight, based on 100 parts by weight of the entire flux. When any one of the rosin-based resin and the synthetic resin is contained, the content is the content of any one of the rosin-based resin and the synthetic resin.
The flux of the present embodiment may further contain an organic acid-based active agent from the viewpoint of reducing environmental load. The organic acid-based active agent is not particularly limited, and examples thereof include monocarboxylic acids such as formic acid, acetic acid, propionic acid, butyric acid, valeric acid, caproic acid, enanthic acid, capric acid, lauric acid, myristic acid, pentadecanoic acid, palmitic acid, margaric acid, stearic acid, tuberculostearic acid, arachidic acid, behenic acid, lignoceric acid, and glycolic acid; dicarboxylic acids such as oxalic acid, malonic acid, succinic acid, glutaric acid, adipic acid, pimelic acid, suberic acid, azelaic acid, sebacic acid, fumaric acid, maleic acid, tartaric acid, and diglycolic acid; dimer acid, levulinic acid, lactic acid, acrylic acid, benzoic acid, salicylic acid, anisic acid, citric acid, picolinic acid, and other organic acids. These may be used alone or in combination of 2 or more.
The content of the organic acid-based activator is not particularly limited, and is, for example, preferably 0.1 part by weight or more, and more preferably 0.3 part by weight or more, based on 100 parts by weight of the entire flux. The content of the organic acid-based active agent is preferably 10 parts by weight or less, and more preferably 7 parts by weight or less, based on 100 parts by weight of the entire flux. When 2 or more types of the organic acid-based active agents are contained, the content is the total content of the organic acid-based active agents.
The flux of the present embodiment further contains an organic acid-based active agent, and thus the content of the halogen-based active agent contained in the flux can be further reduced or reduced to zero. Such a flux can further suppress the occurrence of corrosion in the soldered portion. In addition, when the soldered substrate is discarded, there is no fear that harmful substances such as dioxin are discharged, and therefore, it is more preferable from the viewpoint of reducing the environmental load.
From the viewpoint of improving solder wettability, the flux of the present embodiment may further contain an amine compound. From the viewpoint of further improving solder wettability, the amine-based compound preferably has a cyclic structure. Examples of such amine compounds include imidazole compounds and triazole compounds. Among them, from the viewpoint of further improving solder wettability, imidazole-based compounds are preferably contained. Examples of the imidazole-based compound include benzimidazole, 2-methylimidazole, 2-ethylimidazole, 2-ethyl-4-methylimidazole (2E 4 MZ), 2-heptadecylimidazole, 2-undecylimidazole, 1- (4, 6-diamino-s-triazin-2-yl) ethyl-2-undecylimidazole, and 1-butylimidazole. Examples of the triazole-based compound include benzotriazole, 1H-benzotriazole-1-methanol, and 1-methyl-1H-benzotriazole. Examples of the other amine-based compound include hexadecylamine, erucamide, 3- (dimethylamino) -1, 2-propanediol, 3, 5-dimethylpyrazole, dimethylurea, hexahydro-1, 3, 5-triphenyl-1, 3, 5-triazine, pyrazinamide, N-phenylglycine, 3-methyl-5-pyrazolone, and N-lauroylsarcosine. Among them, 2-heptadecylimidazole is preferably contained from the viewpoint of improving solder wettability. These may be used alone, or 2 or more kinds may be used in combination.
From the viewpoint of improving solder wettability, the content of the amine compound is preferably 0.5 to 10 parts by weight, more preferably 2 to 10 parts by weight, based on 100 parts by weight of the entire flux. When the content of the amine compound is 10 parts by weight or less, the storage stability of the resulting solder composition can be improved. When 2 or more of the amine compounds are contained, the content is the total content of the amine compounds.
The flux of the present embodiment can further improve solder wettability by using a synergistic effect of the phosphine oxide and the amine compound in combination.
The flux of the present embodiment may contain, for example, a solvent, a thixotropic agent, an antioxidant, a surfactant, an antifoaming agent, an anticorrosive agent, and the like as other additive materials.
The solvent is not particularly limited, and a known solvent can be used. Examples of the solvent include glycol ethers such as diethylene glycol monohexyl ether (hexyldiglycol), diethylene glycol dibutyl ether (dibutyldiglycol), diethylene glycol mono-2-ethylhexyl ether (2-ethylhexyl diglycol), and diethylene glycol monobutyl ether (butyldiglycol); aliphatic compounds such as n-hexane, isohexane and n-heptane; esters such as isopropyl acetate, methyl propionate, and ethyl propionate; ketones such as methyl ethyl ketone, methyl n-propyl ketone, and diethyl ketone; alcohols such as ethanol, n-propanol, isopropanol, and isobutanol. These may be used alone or in combination of 2 or more.
The content of the solvent is not particularly limited, and is, for example, preferably 10 parts by weight or more, and more preferably 20 parts by weight or more, based on 100 parts by weight of the entire flux. The content of the solvent is preferably 60 parts by weight or less, and more preferably 40 parts by weight or less, based on 100 parts by weight of the entire flux. When 2 or more of the solvents are contained, the content is the total content of the solvents.
The thixotropic agent is not particularly limited, and examples thereof include hydrogenated castor oil, amides, kaolin, colloidal silica, organobentonite, and glass frit. These may be used alone or in combination of 2 or more.
The content of the thixotropic agent is not particularly limited, and is, for example, preferably 1 part by weight or more, more preferably 2 parts by weight or more, and still more preferably 3 parts by weight or more, based on 100 parts by weight of the entire flux. The content of the thixotropic agent is preferably 10 parts by weight or less, more preferably 6 parts by weight or less, and still more preferably 5 parts by weight or less, based on 100 parts by weight of the entire flux. When 2 or more of the thixotropic agents are contained, the content is the total content of the thixotropic agents.
The method for producing the flux of the present embodiment is not particularly limited. For example, after the phosphine oxide and, if necessary, other additives are put into a heating vessel, the vessel is heated to 160 to 180 ℃ to dissolve all the raw materials. Finally, the flux of the present embodiment can be obtained by cooling to room temperature.
< cored solder >
The cored solder of the present embodiment contains the flux. More specifically, the core solder is composed of a thin tubular solder alloy and the flux filled in the center of the solder alloy. The content of the flux is preferably 1 to 5 parts by weight based on 100 parts by weight of the entire core solder.
The solder alloy is not particularly limited, and examples thereof include a lead-free solder alloy and a lead-containing solder alloy, and a lead-free solder alloy is preferable from the viewpoint of reducing environmental load. Examples of the lead-free solder alloy include alloys containing tin, silver, copper, indium, zinc, bismuth, antimony, and the like. More specifically, there may be mentioned alloys such as Sn/Ag, sn/Ag/Cu, sn/Ag/Bi, sn/Ag/Cu/Bi, sn/Sb, sn/Zn/Bi, sn/Zn/Al, sn/Ag/Bi/In, sn/Ag/Cu/Bi/In/Sb, and In/Ag.
The core solder of the present embodiment contains a flux having good solder wettability, and thus poor fillet formation, poor solder bridges between terminals, poor edges (japanese: 12484, 1249485.
< solder paste >
The solder paste of the present embodiment contains the above flux. More specifically, the solder paste is obtained by mixing a solder alloy powder with the flux. The content of the flux is preferably 5 to 20 parts by weight based on 100 parts by weight of the entire solder paste. The content of the solder alloy powder is preferably 80 to 95 parts by weight based on 100 parts by weight of the entire solder paste. As the solder alloy in the solder alloy powder, the same alloy as that contained in the core solder can be used.
Since the solder paste of the present embodiment includes the flux having good solder wettability, defects such as solder shrinkage are less likely to occur in a component using a material difficult to bond such as a lead portion or a base material difficult to bond, as in the case of the cored solder including the flux.
The flux, the cored solder, and the solder paste according to the present embodiment can be suitably used for the base materials that are difficult to bond. The base material difficult to join here means a metal material which is difficult to solder such as 42Alloy (Fe-42 Ni), kovar (Fe-29 Ni-17 Co), iron, and the like.
Examples
Hereinafter, examples of the present invention will be described, but the present invention is not limited to the following examples.
[ scaling powder ]
< preparation of flux >
The respective raw materials were charged in the amounts indicated in tables 1 and 2 into a heating vessel and heated to 180 ℃ to dissolve the whole raw materials. Thereafter, the mixture was cooled to room temperature, thereby obtaining the fluxes of examples 1 to 30 and comparative example 1 which were uniformly dispersed. The amounts of the respective components shown in tables 1 and 2 were equal to the contents of the respective components contained in the flux.
[ Table 1]
[ Table 2]
Details of each raw material shown in tables 1 and 2 are shown below.
(rosin resin)
KR-610: hydrogenated rosin, product name "KR-610" manufactured by Mitsukawa chemical industries, ltd "
KE-604: acid-modified rosin, product of Mikan chemical industry Co., ltd., "KE-604"
KE-359: superpale rosin ester, product of Mikan chemical industries, ltd., trade name "KE-359"
(organic acid-based active agent)
Adipic acid: sumitomo chemical industry Co., ltd
Azelaic acid: manufactured by China and foreign drug industry Co., ltd
(phosphine oxide)
TPPO: triphenylphosphine oxide, tokyo chemical industry Co., ltd
BAPO: phenylbis (2, 4, 6-trimethylbenzoyl) phosphine oxide, tokyo chemical Co., ltd
TMDPO: diphenyl (2, 4, 6-trimethylbenzoyl) phosphine oxide, tokyo chemical Co., ltd
TOPO: tri-n-octylphosphine oxide, manufactured by Tokyo chemical industries, ltd
(amine-based Compound)
C17Z: 2-heptadecylimidazole manufactured by Siguo Kabushiki Kaisha
C11Z: 2-undecylimidazole manufactured by Siguo Kasei Kogyo
C11Z-A:1- (4, 6-diamino-s-triazin-2-yl) ethyl-2-undecylimidazole, manufactured by Siguo Kasei Kogyo
Amine Pb: hexadecylamine, manufactured by Nissan oil Co., ltd
Neutron S: erucamide, manufactured by Nippon Kogyo K.K.K
1-butylimidazole: manufactured by Tokyo chemical industry Co., ltd
3- (dimethylamino) -1, 2-propanediol: manufactured by Tokyo chemical industry Co., ltd
3, 5-dimethylpyrazole: manufactured by Tokyo chemical industry Co Ltd
Dimethyl urea: manufactured by Tokyo chemical industry Co Ltd
Hexahydro-1, 3, 5-triphenyl-1, 3, 5-triazine: manufactured by Tokyo chemical industry Co Ltd
Pyrazinamide: manufactured by Tokyo chemical industry Co Ltd
N-phenylglycine: manufactured by Tokyo chemical industry Co Ltd
3-methyl-5-pyrazolone: manufactured by Tokyo chemical industry Co Ltd
Sarcosinate LH: n-lauroylsarcosine, nikko Chemicals Co., ltd., manufactured by Ltd
< evaluation of wettability >
The wettability evaluation of the fluxes of examples 1 to 30 and comparative example 1 was performed by calculating the spreading rate of each flux by the following method.
A test piece was prepared by placing a wire solder (solder Alloy: SAC305 (96.5 mass% Sn, 3.0 mass% Ag, 0.5 mass% Cu), a length of about 5.6mm, and a diameter of 0.8 mm) in a ring shape having a diameter of 1.6mm on a degreased and cleaned 42Alloy substrate (30 mm. Times.30 mm. Times.0.3 mm thick), and placing one piece (about 10 mg) of each flux on the ring-shaped wire solder.
Each test piece was placed on a solder bath heated to 260 ℃ to melt the wire solder, 5 seconds passed after the melting, and then the test piece was removed from the solder bath.
Each test piece was washed with isopropyl alcohol, and the height of each test piece was measured with a micrometer (manufactured by Mitutoyo Corporation). Then, the spreading rate was calculated by the following calculation formula. The results are shown in tables 1 and 2.
Spreading ratio (%) =100 × (D-H)/D
H: height of solder = { thickness of test piece after test } - { thickness of substrate before test (= 0.3 mm) }
D: diameter (mm) =2.2 (mm) when the wire solder used in the test is regarded as a ball
As shown in tables 1 and 2, examples 1 to 30, both of which satisfy the technical features of the present invention, have good wettability because of a higher spreading ratio than comparative example 1. In examples 1 to 30, examples 10 to 30, which further contained an amine compound, showed a higher spreading rate, and thus showed better wettability.
[ solder paste ]
< preparation of flux >
The raw materials were charged into a heating vessel in the amounts shown in Table 3, and heated to 180 ℃ to dissolve the whole raw materials. Thereafter, the mixture was cooled to room temperature, thereby obtaining uniformly dispersed fluxes of example 31 and comparative example 2. The respective amounts shown in table 3 were equal to the contents of the respective components contained in the flux.
[ Table 3]
Details of each raw material shown in table 3 are shown below.
(rosin resin)
KR-610: hydrogenated rosin, product of Mikan chemical industries, ltd., trade name "KR-610"
KE-604: acid-modified rosin, product of Mikan chemical industries, ltd., "KE-604"
KE-359: superlight rosin ester, available from Mikan chemical industries, ltd., trade name "KE-359"
(organic acid-based active agent)
Adipic acid: manufactured by Sumitomo chemical industry Co., ltd
Azelaic acid: manufactured by Zhongzhou and foreign pharmaceuticals industry Co., ltd
(phosphine oxide)
TPPO: triphenylphosphine oxide, tokyo chemical industry Co., ltd
(amine compound)
C17Z: 2-heptadecylimidazole manufactured by Siguo Kabushiki Kaisha
(solvent)
HeDG: hexyl diglycol, manufactured by Nippon emulsifier Co., ltd
(thixotropic agent)
Slimacs ZHH: hexamethylene hydroxystearic acid amide, manufactured by Nippon chemical Co., ltd
< evaluation of wettability >
The wettability evaluation of the solder paste containing the flux of example 31 and comparative example 2 was performed by a dehumidification test based on JIS Z3284-4. Each solder paste was obtained as follows: each flux was mixed with solder alloy powders (SAC 305: 96.5 mass% Sn, 3.0 mass% Ag, 0.5 mass% Cu). The content of each flux was set to 11 parts by weight based on 100 parts by weight of the entire solder paste. As the substrate, a 42Alloy substrate (30 mm. Times.30 mm. Times.0.3 mm thick) cleaned by degreasing was used.
As a result of the dehumidification test, the flux whose spread degree was classified into 1 or 2 in JIS Z3284-4 was evaluated as "O" and the flux whose spread degree was classified into 3 or 4 was evaluated as "X". The evaluation results are shown in table 3.
As shown in table 3, in example 31, which all satisfied the technical features of the present invention, solder sink did not occur, but in comparative example 2, solder sink occurred, and therefore, wettability was good.
Claims (6)
1. A flux comprising a phosphine oxide and a solvent, wherein the phosphine oxide is contained in an amount of 0.1 to 10 parts by weight based on 100 parts by weight of the entire flux,
the soldering flux further comprises an amine-based compound,
the content of the amine compound is 2 to 10 parts by weight relative to 100 parts by weight of the whole soldering flux,
the amine-based compound has a cyclic structure,
the amine compound is an imidazole compound.
2. The flux according to claim 1, further comprising at least one of a rosin-based resin and a synthetic resin.
3. The flux of claim 1 or 2, further comprising an organic acid-based active agent.
4. The soldering flux according to claim 1 or 2, wherein the phosphine oxide is triphenylphosphine oxide.
5. Cored solder comprising the soldering flux of any one of claims 1 to 4.
6. A solder paste comprising the flux of any one of claims 1 to 4.
Applications Claiming Priority (3)
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|---|---|---|---|
| JP2017-130388 | 2017-07-03 | ||
| JP2017130388A JP7150232B2 (en) | 2017-07-03 | 2017-07-03 | Flux, flux cored solder and solder paste |
| PCT/JP2018/024753 WO2019009191A1 (en) | 2017-07-03 | 2018-06-29 | Flux, resin-flux cored solder and solder paste |
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| CN110621439A CN110621439A (en) | 2019-12-27 |
| CN110621439B true CN110621439B (en) | 2022-12-06 |
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| US (1) | US11541485B2 (en) |
| EP (1) | EP3628438B1 (en) |
| JP (1) | JP7150232B2 (en) |
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| JP6681567B1 (en) * | 2019-05-27 | 2020-04-15 | 千住金属工業株式会社 | Solder paste and flux |
| JP6681566B1 (en) * | 2019-05-27 | 2020-04-15 | 千住金属工業株式会社 | Solder paste and flux |
| EP4260971A4 (en) * | 2020-12-11 | 2024-05-29 | Senju Metal Industry Co., Ltd. | Flux for resin-cored solder, resin-cored solder, and soldering method |
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| KR20160042173A (en) * | 2011-06-06 | 2016-04-18 | 센주긴조쿠고교 가부시키가이샤 | No-clean flux for solder paste |
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- 2018-06-29 WO PCT/JP2018/024753 patent/WO2019009191A1/en unknown
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| CN1671506A (en) * | 2002-05-30 | 2005-09-21 | 弗莱氏金属公司 | Solder paste flux system |
| JP2005288490A (en) * | 2004-03-31 | 2005-10-20 | Nof Corp | Flux composition for soldering and solder paste |
| CN102039497A (en) * | 2010-12-27 | 2011-05-04 | 东莞市阿比亚能源科技有限公司 | Lead-free paste flux |
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| Publication number | Publication date |
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| US11541485B2 (en) | 2023-01-03 |
| JP7150232B2 (en) | 2022-10-11 |
| US20200114477A1 (en) | 2020-04-16 |
| CN110621439A (en) | 2019-12-27 |
| EP3628438B1 (en) | 2022-08-10 |
| KR20190134727A (en) | 2019-12-04 |
| EP3628438A4 (en) | 2020-04-15 |
| EP3628438A1 (en) | 2020-04-01 |
| JP2019013924A (en) | 2019-01-31 |
| WO2019009191A1 (en) | 2019-01-10 |
| KR102255041B1 (en) | 2021-05-21 |
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