CN110621135A - Shell of terminal equipment and processing method thereof - Google Patents

Shell of terminal equipment and processing method thereof Download PDF

Info

Publication number
CN110621135A
CN110621135A CN201810629117.4A CN201810629117A CN110621135A CN 110621135 A CN110621135 A CN 110621135A CN 201810629117 A CN201810629117 A CN 201810629117A CN 110621135 A CN110621135 A CN 110621135A
Authority
CN
China
Prior art keywords
heat
layer
heat conduction
nano carbon
shell
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201810629117.4A
Other languages
Chinese (zh)
Inventor
杨善强
张新服
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hisense Mobile Communications Technology Co Ltd
Original Assignee
Hisense Mobile Communications Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hisense Mobile Communications Technology Co Ltd filed Critical Hisense Mobile Communications Technology Co Ltd
Priority to CN201810629117.4A priority Critical patent/CN110621135A/en
Publication of CN110621135A publication Critical patent/CN110621135A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body

Landscapes

  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

The application provides a shell of terminal equipment and a processing method thereof, wherein the shell comprises: the shell body to and the spraying in the heat-conducting layer on shell body surface, including nano carbon particle and heat conduction metal particle in the heat-conducting layer, the surface of heat-conducting layer has unevenness's heat dissipation microstructure. Wherein the nano carbon particles have excellent heat conduction and heat radiation performance, the heat conduction performance is mainly reflected in heat diffusion transfer, and the heat diffusion speed of the nano carbon particles is more than or equal to 200mm2(S), the heat radiation coefficient is 0.92-0.95, and the heat conduction performance is excellent; in addition, the nano carbon particles can form a continuous heat conduction channel on the surface of the shell after being dried, so that the heat conduction performance is enhanced, and the heat is conducted out more quickly. The particle size of the heat conduction metal particles is large, and the uneven heat dissipation microstructure can be formed on the surface of the shell body by the nano carbon particles and the heat conduction metal particles, so that the heat radiation area is increased, and the heat dissipation performance of the heat conduction layer is further improved.

Description

Shell of terminal equipment and processing method thereof
Technical Field
The disclosure relates to the technical field of heat dissipation, in particular to a shell of a terminal device and a processing method thereof.
Background
At present, the development of the intelligent terminal industry is promoted by the appearance of large-scale integrated circuits. Meanwhile, the density of electronic components is continuously increased, effective heat management is difficult due to the fact that the intelligent terminal is light and thin and the packaging technology is compact, and the intelligent terminal can be overheated locally when working for a long time.
At present, common heat dissipation means includes attached heat dissipation membrane, heat conduction silica gel and copper facing etc. and wherein, copper facing's mode can form the one deck fine and close, smooth copper layer on the terminal housing, and this copper layer has good heat conductivility to can closely laminate with the terminal housing, thereby promote intelligent terminal to the ambient radiation heat energy.
However, the heat dissipation method of the evaporation copper layer is mainly based on heat conduction, the longitudinal heat dissipation capability is insufficient, and in addition, the smooth surface of the copper layer also limits the heat conduction area, and the heat dissipation effect is reduced.
Disclosure of Invention
The embodiment of the invention provides a shell of terminal equipment and a processing method thereof, and aims to solve the problem that the heat dissipation effect of the terminal equipment in the prior art is poor.
In a first aspect, the present invention provides a housing of a terminal device, comprising: the shell comprises a shell body and a heat conduction layer sprayed on the surface of the shell body, wherein the heat conduction layer comprises nano carbon particles and heat conduction metal particles, the surface of the heat conduction layer is provided with an uneven heat dissipation microstructure, the height difference between the highest point and the lowest point of the heat dissipation microstructure is 1-6 mu m, and the heat conduction metal particles are 1-3 mu m.
In a second aspect, the present invention further provides a method for processing a terminal device housing, including:
providing a shell body;
the shell body is sprayed with a heat conduction layer formed by carbon nanoparticles and heat conduction metal particles, and the surface of the heat conduction layer is provided with an uneven heat dissipation microstructure.
The beneficial effect of this application is as follows:
the application provides a shell of terminal equipment and a processing method thereof, wherein the shell comprises: the shell body and the spraying in the heat conduction layer on the surface of the shell body, the heat conduction layer comprises nano carbon particles and heat conduction metal particles, and the surface of the heat conduction layer is provided with concave-convex partsA flat heat dissipation microstructure. Wherein the nano carbon particles have excellent heat conduction and heat radiation performance, the heat conduction performance is mainly reflected in heat diffusion transfer, and the heat diffusion speed of the nano carbon particles is more than or equal to 200mm2(S), the heat radiation coefficient is 0.92-0.95, and the heat conduction performance is excellent; in addition, the nano carbon particles can form a continuous heat conduction channel on the surface of the shell after being dried, so that the heat conduction performance is enhanced, and the heat is conducted out more quickly. The particle size of the heat conduction metal particles is large, and the uneven heat dissipation microstructure can be formed on the surface of the shell body by the nano carbon particles and the heat conduction metal particles, so that the heat radiation area is increased, and the heat dissipation performance of the heat conduction layer is further improved.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the invention and together with the description, serve to explain the principles of the invention.
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, and it is obvious for those skilled in the art that other drawings can be obtained according to the drawings without inventive exercise.
Fig. 1 is a schematic structural diagram of a housing of a terminal device provided in the present application;
fig. 2 is a schematic structural diagram of a housing of another terminal device provided in the present application.
Detailed Description
In order to make those skilled in the art better understand the technical solution of the present invention, the technical solution in the embodiment of the present invention will be clearly and completely described below with reference to the drawings in the embodiment of the present invention, and it is obvious that the described embodiment is only a part of the embodiment of the present invention, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
The application provides a shell of a terminal device and a processing method thereof, aiming at the problem that the heat dissipation effect of the terminal device in the prior art is poor.
In this application, casing body 1 is metal casing, can be materials such as magnesium alloy, zinc alloy, aluminum alloy to the surface at metal casing can effectively be attached to nano-carbon particle and heat conduction metal particle. The heat-conducting metal particles can be micron-sized copper particles, silver particles and the like, and the heat conductivity coefficient of the heat-conducting metal particles is larger than 398W/MK, so that the heat dissipation effect is ensured. The particle size of heat conduction metal particle is too little, then can't form unevenness's micro-structure, and heat conduction metal particle's particle size is too big, then can lead to heat conduction metal particle discontinuous, and under the heat-conducting layer of the same thickness promptly, the continuity between the heat conduction metal particle that the particle size is big is poor than the continuity between the heat conduction metal particle that the particle size is little, and heat conductivility is poor. In the present application, the particle size of the heat conductive metal particles is preferably 1 to 3 μm to ensure formation of a distinct heat dissipation microstructure having a height difference of 1 to 6 μm between the highest point and the lowest point.
Please refer to fig. 1, which is a schematic structural diagram of a housing of a terminal device provided in the present application. As can be seen from fig. 1, the housing of the terminal device provided in the present embodiment includes: the heat conduction layer 2 comprises a nano carbon layer 21 and a heat conduction metal layer 22, the heat conduction metal layer 22 is formed on the surface of the shell body 1, and the nano carbon layer 21 is formed on the surface of the heat conduction metal layer 22. The nano-carbon layer 21 includes nano-carbon particles 210 therein, and the heat-conducting metal layer 22 includes heat-conducting metal particles 220 therein. The particle size of the heat conducting metal particles 220 is relatively large, and the nano carbon layer 21 and the heat conducting metal layer 22 are both formed on the surface of the housing body 1 in a spraying manner, so that an uneven heat dissipation microstructure can be formed on the surface of the housing body 1, the horizontal line where the highest point of the heat dissipation microstructure is located is H, the horizontal line where the lowest point is located is L, and the height difference between the lines H and L is 1-6 μm. Wherein, the nano carbon particles 210 have excellent heat conduction and heat radiation performance, the heat conduction performance is mainly reflected in heat diffusion transfer, in the embodiment, the heat diffusion speed of the nano carbon particles 210 is more than or equal to 200mm2S, heat radiationThe coefficient is 0.92-0.95, and the heat conduction performance is excellent; in addition, the nano carbon particles 210 can form a continuous heat conduction channel on the surface of the shell after drying, which is beneficial to enhancing the heat conduction performance and enabling heat to be conducted out more quickly. The particle size of the heat conducting metal particles 220 is large, and the uneven heat dissipation microstructure can be formed on the surface of the shell body 1 by the nano carbon particles 210 and the heat conducting metal particles 220, so that the heat radiation area is increased, and the heat dissipation performance of the heat conducting layer 2 is further improved.
Please refer to fig. 2, which is a schematic structural diagram of a housing of another terminal device provided in the present application. As can be seen from fig. 2, the housing of the terminal device provided in the present embodiment includes: the heat conduction layer 2 comprises a shell body 1 and a heat conduction layer 2 sprayed on the surface of the shell body 1, the heat conduction layer 2 comprises a mixture of nano carbon particles 210 and heat conduction metal particles 220, the nano carbon particles 210 with small particle sizes are dispersed among the heat conduction metal particles 220 with large particle sizes, and uneven heat dissipation microstructures can be formed on the surface of the shell body 1. The horizontal line of the highest point of the heat dissipation microstructure is H, the horizontal line of the lowest point of the heat dissipation microstructure is L, and the height difference between the lines H and L is 1-6 μm.
In this application, the raw materials of heat-conducting layer include according to the part by mass: 25-30 parts of waterborne polyurethane resin, 0.2-0.5 part of surfactant, 8-10 parts of graphite and 50-70 parts of deionized water. In addition, the mass part ratio of the nano carbon particles to the heat conducting metal particles is 1: (1.3-1.4). Wherein, graphite is a raw material for forming the nano carbon particles, the water-based polyurethane resin is a main material of the coating, the spraying adhesion force can be increased, the nano carbon particles are dispersed, and the surfactant can be additives with leveling and defoaming effects, such as polyether modified polydimethylsiloxane and the like.
In addition, the application also provides a processing method of the terminal equipment shell, which comprises the following steps:
step S100: a housing body is provided.
Step S200: and spraying a heat conduction layer formed by the nano carbon particles and the heat conduction metal particles on the shell body, wherein the surface of the heat conduction layer is provided with an uneven heat dissipation microstructure.
Specific forming manners of the heat conductive layer may include two manners, wherein the first manner includes the following steps:
step S211: uniformly mixing the waterborne polyurethane resin, the surfactant, the graphite, the heat-conducting metal particles and the deionized water according to the preset mass part to form the heat-conducting coating.
Step S212: and spraying the heat-conducting coating to the surface of the shell body in an electrostatic spraying mode.
The steps of the second mode are as follows:
step S221: and thermally conducting metal particles are sprayed on the surface of the shell body in an electrostatic spraying mode.
Step S222: uniformly mixing the waterborne polyurethane resin, the surfactant, the graphite and the deionized water according to the preset mass part to form the nano-carbon coating.
Step S223: and spraying the nano carbon coating on the surface of the heat-conducting metal particles in an electrostatic spraying manner.
The first method for forming the heat conducting layer is to pre-mix the raw materials such as the waterborne polyurethane resin, the surfactant, the graphite and the heat conducting metal particles, and the heat conducting metal particles can precipitate in the nano carbon slurry formed by the waterborne polyurethane resin, the surfactant, the graphite and the like, so that the heat conducting coating needs to be stirred simultaneously during spraying to avoid the heat conducting metal particles from depositing at the bottom and influencing the uniformity of the heat conducting coating. The appearance of the heat-conducting layer formed by the first method is different from that of the heat-conducting layer formed by the second method, the appearance of the heat-conducting layer formed by the first method is the appearance of mixing bronze speckles in black, and the appearance of the heat-conducting layer formed by the second method is black.
In addition, the temperature of spraying in this application is 90 ℃ to 130 ℃. The spraying temperature is too high, so that the shell is easy to deform at high temperature, and the spraying temperature is too low, so that the adhesive force of the coating is easy to reduce. After the spraying is finished, the coating is usually dried for 5-30min at 80-120 ℃ to further improve the bonding force between the coating and the shell. The present solution is further described below with reference to specific embodiments.
Example 1
The embodiment provides a processing method of a terminal device shell, which comprises the following steps:
uniformly mixing 25 parts of waterborne polyurethane resin, 0.2 part of surfactant, 10 parts of graphite, 65 parts of deionized water and 10.4 parts of metal copper particles by mass to form a heat-conducting coating;
and spraying the heat-conducting coating to the surface of the shell body in an electrostatic spraying mode.
Example 2
The embodiment provides a processing method of a terminal device shell, which comprises the following steps:
uniformly mixing 30 parts of waterborne polyurethane resin, 0.5 part of surfactant, 8 parts of graphite, 60 parts of deionized water and 14 parts of metallic copper particles by mass to form a heat-conducting coating;
and spraying the heat-conducting paint on the surface of the left side of the upper shell of the mobile phone in an electrostatic spraying mode.
Example 3
The embodiment provides a processing method of a terminal device shell, which comprises the following steps:
uniformly mixing 30 parts of waterborne polyurethane resin, 0.5 part of surfactant, 8 parts of graphite, 60 parts of deionized water and 14 parts of metallic copper particles by mass to form a heat-conducting coating;
and spraying the heat-conducting paint on the surfaces of the upper shell and the lower shell of the mobile phone in an electrostatic spraying manner.
Example 4
The embodiment provides a processing method of a terminal device shell, which comprises the following steps:
uniformly mixing 30 parts of waterborne polyurethane resin, 0.5 part of surfactant, 10 parts of graphite, 60 parts of deionized water and 14 parts of metallic copper particles by mass to form a heat-conducting coating;
and spraying the heat-conducting paint on the surface of the upper shell or the lower shell of the mobile phone in an electrostatic spraying manner.
Example 5
The embodiment provides a processing method of a terminal device shell, which comprises the following steps:
uniformly mixing 28 parts of waterborne polyurethane resin, 0.3 part of surfactant, 9 parts of graphite, 70 parts of deionized water and 12 parts of metallic silver particles by mass to form a heat-conducting coating;
and spraying the heat-conducting coating on the surface of the shell body in an electrostatic spraying mode.
Example 6
The embodiment provides a processing method of a terminal device shell, which comprises the following steps:
spraying 12 parts of metal silver particles on the surface of the shell body in an electrostatic spraying mode to form a heat-conducting metal layer;
uniformly mixing 28 parts of waterborne polyurethane resin, 0.3 part of surfactant, 9 parts of graphite and 70 parts of deionized water to form a nano carbon coating;
and spraying the nano carbon coating on the surface of the heat-conducting metal layer in an electrostatic spraying manner to form a nano carbon layer.
The case obtained in example 1 (for the sake of comparison, the case of the terminal device obtained in example 1 is hereinafter referred to as example 1, and the similar cases are not labeled one by one), and the cases and the case bodies of the terminal devices provided in comparative examples 1 and 2 were subjected to a temperature difference test (the test result is expressed as the difference between the case temperature and the case body provided in the example or the comparative example). Wherein, the shell provided by the comparative example 1 is sprayed with a carbon slurry coating, and the components of the carbon slurry comprise 25 parts of waterborne polyurethane resin, 0.2 part of surfactant, 8 parts of graphite and 65 parts of deionized water according to the mass parts; the shell provided by the comparative example 2 is plated with nano copper ions, and a mixed layer of carbon paste is sprayed on a copper layer formed by the nano copper ions, wherein the mixed layer comprises 10.4 parts of metal copper particles, 25 parts of waterborne polyurethane resin, 0.2 part of surfactant, 8 parts of graphite and 65 parts of deionized water in parts by mass. The test results of example 1, comparative example 1 and comparative example 2 are shown in table 1.
Table 1: results of temperature rise test of example 1, comparative example 1 and comparative example 2
Examples Temperature difference (. degree.C.)
Example 1 -3.8
Comparative example 1 -2.9
Comparative example 2 -2.9
As can be seen from table 1, the temperature of the terminal device case prepared by the processing method provided in example 1 is reduced by 3.8 ℃ compared with the case body, and the temperature of the terminal device case provided in comparative examples 1 and 2 is reduced by 2.9 ℃ compared with the case body, which indicates that the heat dissipation effect is better in the mixed spraying manner of the nano carbon paste and the copper nanoparticles than in the single spraying manner of the nano carbon paste or the plating manner of the nano carbon paste and the copper nanoparticles.
The temperature difference test was also performed on the case and the case body of the terminal devices manufactured in examples 5 and 6 (the test results are expressed as the difference between the case temperature and the case body provided in the examples or the comparative examples). The test results of example 5 and example 6 are shown in table 2.
Table 2: results of temperature rise test for examples 5 and 6
Examples Temperature difference (. degree.C.)
Example 5 -4.2
Example 6 -4.8
As can be seen from table 2, the temperature of the housing of the terminal device provided in example 5 of the present application is reduced by 4.2 ℃ as compared with the housing body, and the temperature of the housing of the terminal device provided in example 6 is reduced by 4.8 ℃ as compared with the housing body, and it can be seen that although the raw materials of the heat dissipation material coated on the housing body are the same, the processing technique also affects the performance of the heat dissipation material. In the application, the process of coating the heat-conducting metal layer and then coating the nano carbon layer is stronger in heat dissipation performance than the shell coated by mixing the heat-conducting metal and the nano carbon ions.
The temperature difference test is also carried out on the left end and the right end of the shell prepared in the embodiment 2, the shell provided in the comparative example 3, the shell provided in the comparative example 4 and the shell provided in the comparative example 5, and the temperature difference test is carried out on the left end and the right end after the shell prepared in the embodiment 2, the shell provided in the comparative example 3, the shell provided in the comparative example 4 and the shell provided in the comparative example 5 are assembled with a TP module (touch screen), wherein a carbon slurry coating is sprayed on the shell provided in the comparative example 3, and the components of the carbon slurry comprise 30 parts by mass of aqueous polyurethane resin, 0.5 part by mass of surfactant, 8 parts by mass of graphite and 60 parts by mass of deionized water; the shell provided by the comparative example 4 is sprayed with a carbon paste coating, the carbon paste comprises 30 parts of waterborne polyurethane resin, 0.5 part of surfactant, 10 parts of graphite and 60 parts of deionized water according to the mass parts, and the thickness of the carbon paste coating in the comparative example 4 is 8 microns; the shell provided by the comparative example 5 is sprayed with a carbon paste coating, the carbon paste comprises 30 parts of waterborne polyurethane resin, 0.5 part of surfactant, 10 parts of graphite and 60 parts of deionized water according to parts by mass, and the thickness of the carbon paste coating in the comparative example 5 is 12 microns. Comparative example 4 the mass fraction of graphite in comparative example 4 was increased compared to comparative example 3. The test results of example 2, comparative example 3, comparative example 4 and comparative example 5 are shown in table 3.
Table 3: results of temperature rise test for example 2, comparative example 3, comparative example 4, and comparative example 5
The plain shell in table 3 is the smart terminal housing without any coating applied, where the temperature is in degrees celsius. It can be seen from table 3 that, no matter whether the test is carried out to the individual test of casing or to the casing install the TP module additional, the scheme that embodiment 8 provided all has the strongest radiating effect, wherein, when testing alone to the casing, the difference in temperature of casing left end and right-hand member reaches 6 ℃, when testing to the casing install the TP module additional, the difference in temperature of casing left end and right-hand member is 1 ℃, is far higher than the scheme that embodiments 3-5 provided. In addition, the heat dissipation effect is not significant for the solutions provided in comparative example 4 and comparative example 5, (comparative example 4 is slightly better than comparative example 5) the temperature is slightly increased even in the test of housing-mounted TP module. The method for enhancing heat dissipation in natural air comprises two modes, namely plane diffusion and enhanced heat radiation, wherein the plane diffusion is generally called 'uniform temperature opening'; the enhanced heat radiation is to radiate more heat through infrared rays by improving the blackness of the surface of an object. Planar diffusion is in any case effective, but the intensified thermal radiation is only effective at the surface of the object. Comparative example 4 is the same as comparative example 5 in the composition of the carbon paste, except for the thickness of the carbon paste coating, wherein the thickness of the carbon paste coating in comparative example 5 is greater than the thickness of the carbon paste coating in comparative example 4. Comparative examples 4 and 5 provide solutions that can only enhance heat radiation, and when the case test is performed, the coating is exposed on the surface of the case, thus having a heat dissipation effect; after installing the TP module additional, coating and TP module encapsulate inside the casing jointly, consequently, the effect of thermal radiation embodies unobviously, leads to the radiating effect of comparative example 4 unobvious. The scheme provided by the embodiment 2 can strengthen heat radiation and plane diffusion, and the copper particles can further improve the plane diffusion capability, so that the heat dissipation effect is optimal.
The temperature difference test was also performed on the terminal device case prepared in example 3, the cases provided in comparative example 3, comparative example 4 and comparative example 5 under different application environments, and the test results are shown in tables 4 and 5.
Table 4: example 3, comparative example 4, and comparative example 5 temperature rise test results in a game scene
Table 5: temperature rise test results of example 9, comparative example 3, comparative example 4 and comparative example 5 in the standby state
The plain shell in tables 4 and 5 is the smart terminal housing without any coating applied, and the temperature units in tables 4 and 5 are in degrees celsius. As can be seen from tables 4 and 5, the heat dissipation effect of the intelligent terminal is different in different operation states, and the heat dissipation effect is more obvious when the power consumption of the intelligent terminal is larger (the power consumption in the game state is larger than that in the standby state). In addition, compared with comparative examples 3, 4 and 5, the temperature difference between the upper shell and the lower shell of the cooling device is smaller, so that the cooling device has a better heat dissipation effect, and the cooling effect on the upper shell or the lower shell is obvious.
The embodiments in the present specification are described in a progressive manner, and the same and similar parts among the embodiments are referred to each other, and each embodiment focuses on the differences from the other embodiments. In particular, for apparatus or system embodiments, since they are substantially similar to method embodiments, they are described in relative terms, as long as they are described in partial descriptions of method embodiments. The above-described embodiments of the apparatus and system are merely illustrative, and the units described as separate parts may or may not be physically separate, and the parts displayed as units may or may not be physical units, may be located in one place, or may be distributed on a plurality of network units. Some or all of the modules may be selected according to actual needs to achieve the purpose of the solution of the present embodiment. One of ordinary skill in the art can understand and implement it without inventive effort.
The foregoing is merely a detailed description of the invention, and it should be noted that modifications and adaptations by those skilled in the art may be made without departing from the principles of the invention, and should be considered as within the scope of the invention.

Claims (10)

1. A housing for a terminal device, comprising: the shell comprises a shell body and a heat conduction layer sprayed on the surface of the shell body, wherein the heat conduction layer comprises nano carbon particles and heat conduction metal particles, the surface of the heat conduction layer is provided with an uneven heat dissipation microstructure, the height difference between the highest point and the lowest point of the heat dissipation microstructure is 1-6 mu m, and the heat conduction metal particles are 1-3 mu m.
2. A terminal device casing according to claim 1, wherein the thermally conductive metal particles have a thermal conductivity of more than 398W/MK.
3. The casing of the terminal device as claimed in claim 1, wherein the ratio of the parts by mass of the nano carbon particles to the parts by mass of the heat conducting metal particles is 1: (1.3-1.4).
4. The casing of the terminal equipment as claimed in claim 1, wherein the heat conducting layer comprises the following raw materials in parts by mass: 10.4-14 parts of heat-conducting metal particles, 25-30 parts of waterborne polyurethane resin, 0.2-0.5 part of surfactant, 8-10 parts of graphite and 50-70 parts of deionized water.
5. The casing of the terminal device according to claim 1, wherein the heat conductive layer includes a nano carbon layer and a heat conductive metal layer, the heat conductive metal layer is formed on a surface of the casing body, and the nano carbon layer is formed on a surface of the heat conductive metal layer.
6. The housing of a terminal device as set forth in claim 1, wherein the nano-carbon particles have a particle size of 10 to 100 nm.
7. A processing method of a terminal device shell is characterized by comprising the following steps:
providing a shell body;
the shell body is sprayed with a heat conduction layer formed by carbon nanoparticles and heat conduction metal particles, and the surface of the heat conduction layer is provided with an uneven heat dissipation microstructure.
8. The method as claimed in claim 7, wherein the step of spraying the heat conductive layer formed by the nano carbon particles and the heat conductive metal particles on the housing body comprises:
uniformly mixing waterborne polyurethane resin, a surfactant, graphite, heat-conducting metal particles and deionized water according to preset parts by mass to form a heat-conducting coating;
and spraying the heat-conducting coating to the surface of the shell body in an electrostatic spraying mode.
9. The method as claimed in claim 7, wherein the step of spraying the heat conductive layer formed by the nano carbon particles and the heat conductive metal particles on the housing body comprises:
spraying heat-conducting metal particles on the surface of the shell body in an electrostatic spraying mode to form a heat-conducting metal layer;
uniformly mixing waterborne polyurethane resin, a surfactant, graphite and deionized water according to a preset mass part to form a nano carbon coating;
and spraying the nano carbon coating on the surface of the heat-conducting metal layer in an electrostatic spraying manner to form a nano carbon layer.
10. The method for processing the terminal device casing according to claim 7, wherein the temperature of the spraying is 90 ℃ to 130 ℃.
CN201810629117.4A 2018-06-19 2018-06-19 Shell of terminal equipment and processing method thereof Pending CN110621135A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201810629117.4A CN110621135A (en) 2018-06-19 2018-06-19 Shell of terminal equipment and processing method thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201810629117.4A CN110621135A (en) 2018-06-19 2018-06-19 Shell of terminal equipment and processing method thereof

Publications (1)

Publication Number Publication Date
CN110621135A true CN110621135A (en) 2019-12-27

Family

ID=68920171

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201810629117.4A Pending CN110621135A (en) 2018-06-19 2018-06-19 Shell of terminal equipment and processing method thereof

Country Status (1)

Country Link
CN (1) CN110621135A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112954973A (en) * 2021-02-09 2021-06-11 陆兵 Multipoint thermal vibration type high-heat-dissipation power supply
CN116734649A (en) * 2023-08-08 2023-09-12 中国空气动力研究与发展中心高速空气动力研究所 Self-adaptive thermal management device based on infrared optical regulation and control and preparation method

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102615278A (en) * 2011-01-26 2012-08-01 新光电气工业株式会社 Method of manufacturing metal composite material, metal composite material, method of manufacturing heat dissipating component, and heat dissipating component
CN103378022A (en) * 2012-04-13 2013-10-30 普罗旺斯科技(深圳)有限公司 Radiating fin and manufacturing method thereof
CN203261617U (en) * 2013-04-04 2013-10-30 北京依米康散热技术有限公司 Metal wire heat-conducting gasket
CN205179140U (en) * 2015-12-01 2016-04-20 深圳市添正弘业科技有限公司 Do benefit to radiating cell-phone shell
CN105778278A (en) * 2016-03-15 2016-07-20 深圳市京信通科技有限公司 Nanocarbon material filled high-thermal-conductivity resin composite and preparation method thereof
CN206014744U (en) * 2016-08-16 2017-03-15 东莞市金虹电子科技有限公司 A kind of nanometer carbon coating fin
CN107112602A (en) * 2015-05-26 2017-08-29 株式会社Lg 化学 Include the battery module of heat radiation coating coating
CN206625069U (en) * 2017-03-24 2017-11-10 东莞市鸿艺电子有限公司 A kind of conductive radiator coating

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102615278A (en) * 2011-01-26 2012-08-01 新光电气工业株式会社 Method of manufacturing metal composite material, metal composite material, method of manufacturing heat dissipating component, and heat dissipating component
CN103378022A (en) * 2012-04-13 2013-10-30 普罗旺斯科技(深圳)有限公司 Radiating fin and manufacturing method thereof
CN203261617U (en) * 2013-04-04 2013-10-30 北京依米康散热技术有限公司 Metal wire heat-conducting gasket
CN107112602A (en) * 2015-05-26 2017-08-29 株式会社Lg 化学 Include the battery module of heat radiation coating coating
CN205179140U (en) * 2015-12-01 2016-04-20 深圳市添正弘业科技有限公司 Do benefit to radiating cell-phone shell
CN105778278A (en) * 2016-03-15 2016-07-20 深圳市京信通科技有限公司 Nanocarbon material filled high-thermal-conductivity resin composite and preparation method thereof
CN206014744U (en) * 2016-08-16 2017-03-15 东莞市金虹电子科技有限公司 A kind of nanometer carbon coating fin
CN206625069U (en) * 2017-03-24 2017-11-10 东莞市鸿艺电子有限公司 A kind of conductive radiator coating

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112954973A (en) * 2021-02-09 2021-06-11 陆兵 Multipoint thermal vibration type high-heat-dissipation power supply
CN116734649A (en) * 2023-08-08 2023-09-12 中国空气动力研究与发展中心高速空气动力研究所 Self-adaptive thermal management device based on infrared optical regulation and control and preparation method
CN116734649B (en) * 2023-08-08 2023-10-27 中国空气动力研究与发展中心高速空气动力研究所 Self-adaptive thermal management device based on infrared optical regulation and control and preparation method

Similar Documents

Publication Publication Date Title
CN108129841B (en) Liquid metal insulation heat conduction material and preparation method thereof
CN109206961B (en) Graphene electric-conduction heat-conduction coating and preparation method thereof
CN110621135A (en) Shell of terminal equipment and processing method thereof
CN107338426B (en) A method of high-adhesion silver metal pattern is grown on Kapton surface
CN205920959U (en) Radiator for reducing temperature of air conditioner controller chip and air conditioner
CN110402064B (en) Heat radiating fin, preparation method thereof, shell assembly and electronic equipment
CN102627856B (en) Polyimide film of high-peel-strength flexible printed circuit board, preparation method thereof and printed circuit board made of polyimide film
CN104206028A (en) Fluorine resin substrate
CN103103590A (en) Direct-electroplating conductive liquid and preparation method thereof
CN111117443A (en) Graphene heat dissipation coating for aluminum electrolytic capacitor, graphene heat dissipation material and preparation method of graphene heat dissipation coating
US11431086B2 (en) Heat dissipation from a mobile radio antenna for connection to at least one base station
CN105611811A (en) Thermal diffusion film/metal foil composite heat sink
CN207491321U (en) A kind of high frequency printed circuit boards of dielectric glass fibre cloth
CN107306489A (en) The manufacture method of fin and fin
JP3211676U (en) Radiator with circuit by screen printing or spray painting
CN103648253A (en) Novel thermally conductive and insulating structure
CN210630148U (en) Heat radiation structure and mobile device
CN209602442U (en) Heat conductive silica gel laminated film
KR101657693B1 (en) Manufacturing method of the heat dissipation material for metal PCB including carbon nano-material
CN109429444A (en) The shell of portable electronic devices transfers thermal dispersant coatings structure
CN208781834U (en) Heat radiation structure
CN105038626B (en) Compound two-sided tape
CN211152321U (en) Metal-based copper-clad plate
CN207496138U (en) A kind of lightweight glass honeycomb aluminum substrate
CN207766643U (en) A kind of high-speed high frequency circuit board with SHD figure layers

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
RJ01 Rejection of invention patent application after publication

Application publication date: 20191227

RJ01 Rejection of invention patent application after publication