CN110614440A - CO2 laser remelting and gasification composite polishing method for optical element - Google Patents
CO2 laser remelting and gasification composite polishing method for optical element Download PDFInfo
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- CN110614440A CN110614440A CN201910820748.9A CN201910820748A CN110614440A CN 110614440 A CN110614440 A CN 110614440A CN 201910820748 A CN201910820748 A CN 201910820748A CN 110614440 A CN110614440 A CN 110614440A
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- polishing
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- remelting
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/352—Working by laser beam, e.g. welding, cutting or boring for surface treatment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/352—Working by laser beam, e.g. welding, cutting or boring for surface treatment
- B23K26/354—Working by laser beam, e.g. welding, cutting or boring for surface treatment by melting
Abstract
The invention relates to a CO2 laser remelting and gasification composite polishing method for an optical element, which uses CO2The laser parallel scanning mode carries out remelting polishing and gasification polishing alternate layered scanning on the optical element by changing the laser power, the repetition frequency and the spot diameter, the scanning track directions of each layer are different, and the high-efficiency and high-precision polishing of the optical element is realized. The invention is suitable for the high-efficiency and high-precision polishing of various optical elements.
Description
Technical Field
The invention relates to optical element polishing, in particular to a CO2 laser remelting and gasification composite polishing method for an optical element.
Background
The polishing method of the optical element at present is divided into contact polishing and non-contact polishing according to whether the optical element is in direct contact with a processed workpiece, and mainly comprises air bag polishing, small tool polishing, ion beam polishing, laser polishing and the like, wherein the former belongs to contact polishing and is easy to embed impurities into the optical element, and the latter belongs to non-contact polishing and is free of pressure stress and small in residual stress. The laser polishing has no higher requirements on environment, target materials and the like unlike the magnetorheological polishing, and has the advantages of wide application range, convenient operation, high precision, high efficiency and the like.
According to different action modes of laser and substances, laser polishing can be divided into hot polishing and cold polishing, wherein the laser hot polishing adopts continuous long-wavelength laser or long-pulse laser, and the polishing purpose is realized by melting, evaporating and other methods by utilizing the heat effect generated by the action of the laser and the substances. The polishing of the surface of the optical element is generally realized by adopting a fusion type or a gasification type, but when the fusion polishing is adopted, factors such as the geometric shape of a molten pool and the residence time of light spots which influence the flow quantity need to be accurately controlled, when the gasification polishing is adopted, process parameters such as the incident light angle and the energy density need to be adjusted, and in order to realize the purpose of fine polishing, a layer-by-layer polishing method is needed no matter the fusion polishing or the gasification polishing is adopted. The main effective rate of the melt polishing is relatively low, and the melt polishing has the defects of residual thermal stress, easy pore formation and the like; the problems of higher polishing precision, difficult determination of laser incidence angle, difficult removal of ablation vapor, poor polishing effect and the like exist in gasification polishing.
Disclosure of Invention
The invention aims to solve the defects of the prior art and provide a CO2 laser remelting and gasification composite polishing method for an optical element, which improves the polishing efficiency and quality of the optical element and does not introduce impurities. The method adopts a method of alternately carrying out melting polishing and evaporation polishing to realize the purposes of quick and fine polishing.
The technical scheme adopted by the invention for solving the technical problems is as follows:
super optical elementThe polishing method comprises cleaning and drying optical elements, laser remelting and polishing with CO2, and polishing with CO2Laser gasification polishing by CO2And performing remelting polishing and gasification polishing on the surface of the optical element layer by layer alternately by using laser.
CO2The laser repairing method specifically comprises the following steps:
firstly, putting a sample into an ultrasonic cleaning device to be cleaned in a ten-thousand-level clean room, and then taking out the sample to be dried by a blower in a normal temperature mode;
secondly, placing the sample on a workbench and fixing the sample to ensure that the surface to be remelted and polished is vertical to the laser direction;
thirdly, starting a CO2 laser system, drawing a graph of a scanning track, wherein the area of a polishing area is 1.01-1.1 times of the surface to be polished of the sample, and introducing the graph into the laser system;
fourthly, during remelting and polishing, adjusting laser power, frequency, duty ratio, spot diameter, defocusing amount and scanning speed;
fifthly, placing the sample on a workbench for fixing, ensuring that the gasification polishing parallel track is vertical to the re-melting polishing parallel track at the last time, and adjusting an included angle between the normal of the surface to be gasified and polished and the laser incident line direction;
sixthly, during the gasification polishing, adjusting the laser power, the frequency, the duty ratio, the spot diameter, the defocusing amount and the scanning speed;
and seventhly, repeating the second step to the fourth step after finishing the primary remelting and polishing and the gasification polishing alternately, wherein when remelting and polishing are carried out each time, the laser power in the fourth step is properly reduced by 3-5W, the scanning speed is 3-5 mm/s, and the polishing track direction is increased by 10 percent compared with the last track direction0～200The other parameters are unchanged; repeating the fifth step to the seventh step, and gradually increasing the incident angle 2 between the laser beam and the normal direction of the sample in the fifth step during each gasification polishing0～50And properly reducing the laser power by 3-5W and the scanning speed by 3-5 mm/s in the seventh step, and sequentially and alternately polishing layer by layer.
Further, the optical glass includes fused silica glass, KDP or K9.
Furthermore, the included angle between the gasification polishing incident light and the normal direction of the optical element is 450～800。
Further, in the first step, the ultrasonic cleaning solution is absolute ethyl alcohol or acetone.
Further, in the fourth step, CO2The laser related parameters are as follows: the laser power is 10-50W, the frequency is 1-20 kHz, the duty ratio is 1% -10%, the diameter of a light spot is 1-5 mm, the defocusing amount is 5-50mm, and the scanning speed is 5-50 mm/s.
Further, in the fifth step, the included angle between the normal of the surface to be gasified and the incident line direction of the laser is 450～800。
Further, in the sixth step, CO2The laser related parameters are as follows: the laser power is 50-100W, the frequency is 1-20 kHz, the duty ratio is 1% -10%, the diameter of a light spot is 0.01-0.1 mm, the defocusing amount is 1-10 mm, and the scanning speed is 50-1000 mm/s.
Compared with the prior art, the invention has the following remarkable advantages:
1. in an ultra-clean room environment where the laser polishing device is located, the surface of the optical element is cleaned by the ultrasonic cleaner, and the surface is dried by the blower at normal temperature, so that the operation is simple, convenient and efficient, secondary pollution to the optical element in the transportation process is avoided, and the surface of the optical element cannot be damaged in any form;
2. remelting and gasifying composite polishing are carried out by adopting a CO2 laser, so that new impurities cannot be introduced;
3. the method of limiting and fixing the optical element is adopted, the operation is convenient, and no clamping force is generated;
4. remelting and gasifying composite polishing is carried out by adopting a CO2 laser, no polishing pressure is generated, and only small internal stress is generated during remelting and polishing;
5、CO2the laser scanning motion track adopts parallel motion modes with different angles, the scanning is uniform, the operation is simple and easy, and the intermediate frequency can be reduced. The scanning area is larger than the surface to be polished of the optical element, so as to avoid the rise or fall of laser energyThe impact on polishing quality;
6. the CO2 laser remelting and gasification composite polishing method references the advantages of the laser remelting and gasification composite polishing method, and simultaneously avoids respective defects skillfully, thereby providing a new way for high-efficiency and high-precision polishing.
Drawings
FIG. 1 is a CO of the present invention2Laser polishing intent.
In the figure 1 is CO2The laser instrument, 2 are the beam expanding mirror, 3 are the optical gate, 4 are the diaphragm, 5 are the dichroic mirror, 6 are the speculum, 7 are the CCD system, 8 are the plastic mirror, 9 are the mirror that shakes, 10 are the focusing mirror, 11 are the suction nozzle, 12 samples, 13 right angle wedge fixed stations, 14 electronic translation platforms.
FIG. 2 is a schematic view of sample fixation according to the present invention. In fig. 2, 15 is a fixing jig.
FIG. 3 is a schematic view of the angle between the incident laser beam and the normal of the sample for vapor polishing according to the present invention. In fig. 3, 16-bit laser incident rays are shown, and theta is an included angle between the laser incident rays and the normal line of the sample.
Fig. 4 is a schematic diagram of parallel scanning trajectories.
Detailed Description
The invention is further described below with reference to the accompanying drawings:
the invention can be widely applied to the fine polishing of optical elements with various surface shapes and materials, such as quartz and crystal optical elements with planes, spherical surfaces, cylindrical surfaces, non-rotating surfaces, aspheric surfaces and the like, in particular to optical elements with surfaces with complex shapes.
The principle and basis of the invention are as follows: fused silica glass for 10.6 μm wavelength CO2The laser energy has better absorption performance, when the laser energy is greater than a melting threshold value and lower than a gasification threshold value, the viscosity of the glass is reduced, and the melted wave crest glass flows to a wave trough under the action of surface tension, so that the surface roughness is reduced; when the laser energy is higher than the gasification threshold, the glass surface is irradiated by an incident angle forming a certain angle with the glass surface method, the wave crest is irradiated by the laser to be gasified, and the wave trough is not irradiated by the laser to be gasified, so that the purpose of reducing the surface roughness is achieved. The larger the molten pool during melting and polishing, the longer the residence timeThe longer the surface is, the smoother the surface is, but the greater the stress generated is, the lower the processing efficiency is, and the purpose of reducing the roughness cannot be achieved if the surface is irradiated along the normal direction of the glass surface during gasification polishing, so that the incident light is incident at a certain angle with the normal direction of the glass surface, and the greater the incident angle is, the better the precision is improved, but the greater the incident angle is, the higher the requirements on the device and related detection means are, and in addition, the smaller the spot diameter is, the better the gasification polishing effect is, the less the peaks and the valleys are easily removed at the same time, but the polishing efficiency is reduced correspondingly. Therefore, in order to fully exert the respective advantages of remelting and polishing and gasifying and polishing, the method of combining large-spot remelting and polishing and small-spot gasifying and polishing is adopted to quickly reduce the surface roughness of the fused quartz.
The device in figure 1 of the invention takes gasification polishing as an example, and the working process is as follows: a sample 12 is fixed on a right-angle wedge-shaped fixing table 13 through a fixing clamp 15 in fig. 2, the right-angle wedge-shaped fixing table 13 is also fixed on an electric translation table 14 in the same manner, a CO2 laser 1 is started, light rays respectively pass through a beam expander 2, an optical shutter 3 and a diaphragm 4 along a light path diagram shown in fig. 1 and reach a dichroic mirror 5, most of the light rays are reflected to a shaping mirror 8, after passing through a field lens composed of a vibrating mirror 9 and a focusing mirror 10, the laser passes through a suction nozzle 11 with a transparent upper end and is focused on the surface of the sample 12, and after polishing is finished, a CCD system 7 observes the processed surface morphology of the sample 12 through a light path system composed of a reflecting mirror 6.
Example 1
Subjecting an optical element to CO2Laser remelting and gasification composite polishing, wherein the substrate material is fused quartz. The experiment was conducted in a ten thousand grade clean room equipped with a CO2 laser polishing apparatus. Firstly, cleaning the surface of an optical element by using an ultrasonic cleaner, then drying the optical element by using a blower in a normal temperature mode, placing a sample 12 on an optical platform shown in figure 1, fixing the sample by adopting a mode shown in figure 2, starting a laser 1, and adjusting laser parameters: the laser power is 40W, the frequency is 10kHz, the duty ratio is 5%, the diameter of a light spot is 4mm, the defocusing amount is 10mm, the track interval is 0.08mm, the scanning speed is 40mm/s, and the parallel graph shown in FIG. 3 is drawnAnd guiding the track into a laser system, determining set laser parameters, positioning the workpiece to an initial processing position through a CCD (charge coupled device) observation system, and then remelting and polishing the optical element. After polishing, the sample is taken down and installed on the right-angle wedge-shaped fixed table 13, and the included angle between the normal of the polishing surface to be gasified and the laser incident line direction is ensured to be 450And ensuring that the parallel track of the gasification polishing is vertical to the parallel track of the remelting polishing at the last time at the position where the sample is placed, and adjusting laser parameters: the laser power is 80W, the frequency is 15kHz, the duty ratio is 3%, the spot diameter is 0.1mm, the defocusing amount is 8mm, the track interval is 0.08mm, the scanning speed is 1000mm/s, the gasification polishing track is determined to be perpendicular to the last remelting polishing track through a CCD observation system, the set laser parameters are determined to carry out gasification polishing, and primary remelting and gasification alternate layer-by-layer polishing are completed. During the subsequent remelting and polishing, the laser power is reduced by 5W, the scanning speed is reduced by 5mm/s, and the polishing track direction is increased by 10 percent compared with the last track direction0The other parameters are unchanged; increasing the incident angle 5 between the laser beam and the normal direction of the sample during each subsequent gasification polishing0Reducing the laser power by 3W, scanning at the speed of 3mm/s, and sequentially and alternately remelting and gasifying polishing layer by layer.
The remelting and gasification composite polishing method does not introduce impurities in the processing process, and can remove the original impurities on the subsurface of the optical element. The cleaning and drying method adopted in the polishing process step does not damage the optical element and has no pollution. The remelting and gasification composite polishing method adopts layer-by-layer alternate polishing, and the polishing tracks are different every time, so that the intermediate frequency of the optical element can be effectively reduced.
When the remelting and gasification combined polishing method is used for remelting and polishing, the laser energy and speed components are reduced, the corresponding gasification polishing incidence angle is changed from small to large, and the processing efficiency and the processing precision are effectively improved.
Claims (8)
1. The CO2 laser remelting and gasification combined polishing method for the optical element is characterized by comprising the steps of cleaning and drying the optical element, CO2 laser remelting and polishing, and CO2 laser remelting and gasification combined polishing2Laser gasification polishing by CO2Laser-to-optical element surfaceAnd performing remelting polishing and gasification polishing alternately layer by layer.
2. The CO2 laser remelting and gasification combined polishing method for optical elements according to claim 1, wherein the CO2 laser remelting and gasification combined polishing method is characterized in that2The laser repairing method specifically comprises the following steps:
firstly, putting a sample into an ultrasonic cleaning device to be cleaned in a ten-thousand-level clean room, and then taking out the sample to be dried by a blower in a normal temperature mode;
secondly, placing the sample on a workbench and fixing the sample to ensure that the surface to be remelted and polished is vertical to the laser direction;
thirdly, starting a CO2 laser system, drawing a graph of a scanning track, wherein the area of a polishing area is 1.01-1.1 times of the surface to be polished of the sample, and introducing the graph into the laser system;
fourthly, during remelting and polishing, adjusting laser power, frequency, duty ratio, spot diameter, defocusing amount and scanning speed;
fifthly, placing the sample on a workbench for fixing, ensuring that the gasification polishing parallel track is vertical to the re-melting polishing parallel track at the last time, and adjusting an included angle between the normal of the surface to be gasified and polished and the laser incident line direction;
sixthly, during the gasification polishing, adjusting the laser power, the frequency, the duty ratio, the spot diameter, the defocusing amount and the scanning speed;
seventhly, after one-time remelting polishing and gasification polishing alternate polishing are completed, repeating the second step to the fourth step, properly reducing the laser power of 3-5W in the fourth step when remelting polishing is performed each time, scanning speed is 3-5 mm/s, the polishing track direction is increased by 10-20 degrees compared with the last track direction, and the rest parameters are unchanged; and repeating the fifth step to the seventh step, gradually increasing the incident angle of the laser beam and the normal direction of the sample in the fifth step by 2-5 degrees during each gasification polishing, properly reducing the laser power by 3-5W in the seventh step, and sequentially performing layer-by-layer alternate polishing at the scanning speed of 3-5 mm/s.
3. The CO2 laser remelting and gasification combined polishing method for optical elements according to claim 2, wherein the optical glass comprises fused silica glass, KDP or K9.
4. The CO2 laser remelting and gasification combined polishing method for optical elements according to claim 2, wherein the angle between the incident light for gasification polishing and the normal direction of the optical elements is 45 ° to 80 °.
5. The CO2 laser remelting and gasification combined polishing method for optical elements according to claim 2, wherein in the first step, the ultrasonic cleaning solution is absolute ethyl alcohol or acetone.
6. The CO2 laser remelting and gasification combined polishing method for optical elements according to claim 2, wherein in the fourth step, CO2The laser related parameters are as follows: the laser power is 10-50W, the frequency is 1-20 kHz, the duty ratio is 1% -10%, the diameter of a light spot is 1-5 mm, the defocusing amount is 5-50mm, and the scanning speed is 5-50 mm/s.
7. The CO2 laser remelting and gasification combined polishing method for optical elements according to claim 2, wherein in the fifth step, the angle between the normal of the surface to be gasified and the incident line direction of the laser is 45 ° to 80 °.
8. The CO2 laser remelting and gasification combined polishing method for optical elements according to claim 2, wherein in the sixth step, CO2The laser related parameters are as follows: the laser power is 50-100W, the frequency is 1-20 kHz, the duty ratio is 1% -10%, the diameter of a light spot is 0.01-0.1 mm, the defocusing amount is 1-10 mm, and the scanning speed is 50-1000 mm/s.
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Cited By (3)
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| CN112589263A (en) * | 2020-12-11 | 2021-04-02 | 浙江工业大学 | Evaporation-fusion composite laser polishing method for metal surface with peak clipping and valley filling |
| CN113500297A (en) * | 2021-06-21 | 2021-10-15 | 深圳信息职业技术学院 | Laser polishing method and laser polishing equipment |
| CN113909696A (en) * | 2021-08-24 | 2022-01-11 | 清华大学 | Mirror surface processing device |
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