CN110613167A - Atomizer microporous ceramic heating device and preparation process thereof - Google Patents
Atomizer microporous ceramic heating device and preparation process thereof Download PDFInfo
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- CN110613167A CN110613167A CN201910873624.7A CN201910873624A CN110613167A CN 110613167 A CN110613167 A CN 110613167A CN 201910873624 A CN201910873624 A CN 201910873624A CN 110613167 A CN110613167 A CN 110613167A
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/20—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater
- H05B3/22—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible
- H05B3/28—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible heating conductor embedded in insulating material
- H05B3/283—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible heating conductor embedded in insulating material the insulating material being an inorganic material, e.g. ceramic
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Abstract
The invention discloses an atomizer microporous ceramic heating device which comprises a microporous ceramic substrate and a heating wire arranged on the microporous ceramic substrate. The heating wire is a thin strip-shaped heating wire formed by thick film printing, sintering and forming and then mechanical cutting, chemical etching or laser photoetching. The heating wires are uniformly distributed on the heating surface of the ceramic substrate. The preparation process of the microporous ceramic heating device of the atomizer comprises the following steps: setting up a micropore ceramic base member, micropore ceramic base member has a heating surface, right the heating surface of micropore ceramic base member carries out thick film printing, stoving, sintering treatment. And then, carrying out mechanical cutting, chemical etching or laser photoetching treatment on the sintered thick film printing part to form a strip heating wire with a preset shape.
Description
Technical Field
The invention relates to a microporous ceramic heating device of an atomizer, in particular to a microporous ceramic substrate heating device taking a thick film printed resistor as a heating material.
The invention also relates to a preparation process of the microporous ceramic heating device.
Background
In the field of electronic cigarette technology, microporous ceramics have become the mainstream configuration for oil guiding medium. In the electron smog spinning disk atomiser of leading oily medium with microporous ceramic, need make the resistance wire be close the electron cigarette tobacco tar in the microporous ceramic as far as possible, only be close the tobacco tar and just can atomize with heat transfer for the tobacco tar. Although the resistance wire far away from the tobacco tar can also generate heat, when the microporous ceramic is used as an oil guide part, the precipitated electronic tobacco tar cannot be separated from the surface of the microporous ceramic, and only the surface of the microporous ceramic can be used as a precipitation area of the electronic tobacco tar. When the resistance wire is separated from the surface or the part which is not on the surface is separated from the tobacco tar, even if the resistance wire generates heat, the resistance wire is dry-burned, the heat can not be well utilized, the atomization effect is influenced, and the service life is also influenced.
Therefore, in an atomizer using a microporous ceramic heating device, the heat-generating body is brought close to the atomizing surface of the microporous ceramic to the maximum extent. This requires that the heat-generating wires minimize exposed portions and increase the portions proximate to the microporous ceramic surface, i.e., the closer the wires are to the ceramic heating surface, the better the effect will be. Meanwhile, because the lead is arranged on the surface of the microporous ceramic, the ceramic surface area directly covered by the lead is not the best atomization area, and only the ceramic surfaces on the two sides of the lead are the best atomization areas. The ceramic heating surfaces are therefore preferably arranged both with heating wires and with exposed ceramic surfaces, preferably evenly spaced.
As shown in fig. 2, because the microporous ceramic is not a good heat conductor, a temperature gradient is formed in the atomization regions at both sides of the wire, and due to the temperature gradient, the temperature of the region near the edge of the heating wire is high, the atomization effect is good, while the temperature of the region far away from the edge of the heating wire is low, the atomization effect is poor, and the phenomena of uneven atomization effect and taste influence are generated.
The electronic cigarette is a personal microelectronic product, so the requirement of lightness, thinness, shortness and smallness needs to be met as much as possible, and the smaller the microporous ceramic heater is, the higher the power density is, and the better the atomization effect is. Accordingly, the combination of resistance wire with microporous ceramic has been advanced to the field of thick film printed resistor technology, by which thick film printed resistive heating wire is formed on the surface of microporous ceramic. Due to the application of the thick film printing technology, the miniaturization of the electronic cigarette heating device is basically realized, the effect that the resistance heating wire is as close to the surface of the microporous ceramic as possible is also realized, and the unprecedented heating atomization effect is achieved.
The prior thick film printing micropore ceramic heating device has the following defects:
first, referring to fig. 1, the resistance of the heating resistor of the electronic cigarette atomizer is usually small, mostly between 0.5-5 ohms, so the length of the resistor wire is not large, and the difficulty of uniformly arranging the heating wires 3 on the ceramic heating surface 4 is large. Generally, one or two heating wires are arranged on the heating surface 4, and some heating wires are bent, but the heating wires arranged on the ceramic heating surface 4 still cannot achieve a good uniform atomization effect, so that the problem of temperature gradient cannot be solved well. As shown in fig. 1, when the length and width of the ceramic surface is 5 and 4 mm, and the width of the heating wire is 0.6 mm, except for two parallel heating wires of 0.6 mm, the rest of the heating areas are the heating areas, and some points are close to 1 mm from the closest distance of the heating wires, thus affecting the atomization effect.
Secondly, because the thick film resistance wire is formed by screen printing and sintering the metal paste, the uniformity of the resistance wire is not perfect and is not as uniform as the resistance of the alloy wire due to the problems of printing technology and sintering deformation. The printed heating wire 3 is in a flange and concave edge 5 alternating state, namely, the edge is poor and uneven in levelness, and the width or thickness of some parts is uneven, so that the uneven current density is uneven and the heating temperature is inconsistent when the printed heating wire is electrified, and the resistance wire is deformed due to the temperature difference, generates the phenomena of warping, peeling and the like, and finally is fused. The local damage of the thick film heating resistor is basically caused by local concentrated overheating due to width unevenness. Therefore, although the current thick film resistor technology can print the conducting wire to a thinner degree, such as 0.1 mm, the conducting wire of 0.1 mm can be used as a common conducting wire and a resistor, when the resistor is used for generating heat, because the heating temperature is higher, the thick film resistance wire with the size is easy to be melted by local overheating due to heating, and in fact, the thick film printed resistor width for generating heat is basically the result of the second-off of the power supply when the width is less than 0.5 mm.
Thirdly, because thick film printing heating wire is on ceramic base body heating surface through the silk screen printing of leaking, leads to wire surface protrusion in heating surface, convex wire portion hardly contacts the tobacco tar, and then produces the dry combustion method phenomenon, and the thickness of heating wire also can influence the heating effect. The heating wire pattern is directly formed by screen printing missing, so that the printing mode can not print after the groove is formed on the surface of the ceramic, otherwise, the screen pattern is difficult to directly correspond to the groove during printing. I.e. the wires cannot be printed in the grooves of the heating surface.
In view of the above, the present inventors have devised a heating apparatus for a microporous ceramic substrate, which can overcome the above-mentioned drawbacks.
Disclosure of Invention
The invention aims to provide a microporous ceramic heating device for an atomizer, which can uniformly heat the surface of microporous ceramic, reduce the influence of temperature gradient, improve atomization effect and improve smoking taste.
The invention also provides a preparation process of the product.
The invention relates to an atomizer microporous ceramic heating device, which comprises a microporous ceramic base body and a heating lead arranged on the microporous ceramic base body. The heating wire is a thin strip-shaped heating wire formed by thick film printing, sintering and forming and then mechanical cutting, chemical etching or laser photoetching. The heating wires are uniformly distributed on the heating surface of the ceramic substrate.
In the above microporous ceramic heating apparatus for an atomizer, the microporous ceramic base is provided with a heating surface, the heating wire is thick-film printed on the heating surface, and an atomizing heating area is formed on the heating surface, and any point of the atomizing heating area is not more than 0.2 mm from the nearest edge of the heating wire.
In the above microporous ceramic heating device for an atomizer, the heating wires are bent and uniformly distributed on the heating surface of the ceramic substrate, or a plurality of heating wires are parallel and uniformly distributed on the heating surface of the ceramic substrate, and the distance between the parallel heating wires is not more than 0.4 mm.
In the above microporous ceramic heating device for the atomizer, the cross section of the heating wire is of a sheet structure and has a first surface and a second surface, the first surface is tightly attached to the heating surface of the ceramic substrate, and the second surface protrudes out of the heating surface of the ceramic substrate.
In the above-mentioned micropore ceramic heating device for the atomizer, the heating wire cross-section is the lamellar structure, has first surface and second surface, ceramic base heating surface sets up the heating wire recess, the heating wire sets up in the heating wire recess, the first surface and the heating surface parallel and level of heating wire set up, other positions set up in the recess.
In the microporous ceramic heating device for the atomizer, the width of the heating wire is 0.05-0.2 mm, and the thickness of the heating wire is 0.01-0.05 mm.
The preparation process of the microporous ceramic heating device for the atomizer comprises the steps of firstly, arranging a microporous ceramic substrate, wherein the microporous ceramic substrate is provided with a heating surface, and grinding and polishing the surface. And then, performing thick film printing on the heating surface of the microporous ceramic substrate to form a printed thick film, and drying. And then, sintering the ceramic substrate and the heating plane after printing and drying. In addition, the method also comprises the following steps: and performing mechanical cutting, chemical etching or laser photoetching on the sintered thick film printing part to form a strip heating wire with a preset shape.
In the preparation process of the atomizer microporous ceramic heating device, the process of grinding and polishing is further included before mechanical cutting, chemical etching or laser photoetching after sintering. The ceramic substrate heating surface polishing process also comprises a process of forming a heating wire groove.
In the preparation process of the micro-porous ceramic heating device for the atomizer, the heating wires are uniformly distributed on the heating surface of the ceramic substrate, an atomization heating area is formed on the heating surface, and any point in the atomization heating area is not more than 0.2 mm away from the nearest edge of the heating wire.
In the preparation process of the micro-porous ceramic heating device for the atomizer, the width of the heating wire is 0.05-0.2 mm, and the thickness of the heating wire is 0.01-0.05 mm.
In the product structure of the invention, as the thick film is printed, sintered and formed and then processed, the formed heating wire has neat edges and better uniformity and consistency, the local overheating phenomenon caused by the local narrower thick film heating wire can be effectively avoided, and the fusing phenomenon can be reduced. Therefore, the thick film conducting wire can be made narrower in width, the temperature rising performance consistency is better during electrifying, the heating tolerance is better, the heating requirement is met, and the thick film conducting wire can be used on electronic cigarette products. Because the wire can be made narrower, and then can be better many lay on limited heating surface, can reduce the distance of arbitrary point on the heating surface to heating wire edge, reduce temperature gradient effect, improve atomization effect. Because the ceramic base body heating surface sets up the heating wire recess, and the heating wire lays in the recess, and the setting of recess makes the surface of heating wire no longer protrusion in the heating surface, and then can be fine avoid dry combustion method phenomenon to take place.
In the method, the effect of tidying and smoothing the edges of the heating wires can be achieved through mechanical cutting, chemical etching and laser photoetching, the consistency of the heating wires is increased, the width of the wires can be further reduced, the uniformity of the wire arrangement is improved, and the temperature gradient is reduced. Overcomes the defects in the prior art.
Drawings
FIG. 1 is a schematic view of a prior art ceramic thick film heater surface arrangement;
FIG. 2 is a schematic cross-sectional view and a schematic temperature change of the prior art ceramic thick film heating apparatus shown in FIG. 1;
FIG. 3 is an enlarged view of the edge of the wire of the prior art ceramic thick film heating apparatus of FIG. 1;
FIG. 4 is a schematic view of the surface layout of a ceramic thick film heating apparatus according to example 1 of the present invention;
fig. 5 is a schematic cross-sectional structure and a schematic temperature change diagram of a ceramic thick film heating apparatus according to embodiment 1 of the present invention.
FIG. 6 is a schematic view of the surface layout of a ceramic thick film heating apparatus according to example 2 of the present invention;
FIG. 7 is an enlarged view of the edge of a ceramic thick film heater wire obtained by the process of the present invention;
FIG. 8 is a schematic view of the surface layout of the ceramic thick film heating apparatus of example 8;
FIG. 9 is a schematic sectional view showing a ceramic thick film heating apparatus according to example 9.
Shown in the figure: 1 is a heating surface of a microporous ceramic matrix; 2 is a heating electrode; 3 is a heating wire; 4 is a heating area; 5, printing the edge of the heating wire by using the thick film; 6, the machined edge of the heating wire; and 7, a heating wire groove.
Detailed Description
The present invention is described in detail with reference to the following embodiments, but the embodiments are only for explaining the technical solutions of the present invention, and any description thereof does not affect the limitation of the protection scope.
Example 1: as shown in fig. 4, in this example, a heating apparatus for thick film printing of a microporous ceramic substrate is provided, in which a resistance heating wire 3 is formed on a heating surface 1 of the microporous ceramic substrate by thick film printing. The resistance heating wires 3 are arranged in parallel, and are uniformly distributed on the heating surface 1 of the ceramic substrate in parallel. The resistance wire 3 is a thin strip-shaped structure, the width of which is 0.1 mm, and the thickness of which is 0.03 mm. The resistance wires 3 are uniformly arranged on the heat emitting surface 1, and the number of the heating wires 3 is 12. The two ends of the resistance wires 3 are connected to the heating electrodes 2 in parallel, and the heating wires 3 are arranged in parallel. At this time, the atomization heating regions 4 are formed in the region of the parallel heating wires 3 and the edge part region, in the heating regions 4, the width between two adjacent heating wires 3 is preferably controlled to be less than 0.2 mm, and at this time, any point in the heating region 4 of the heating surface 1 can be ensured not to exceed 0.1 mm from the edge of the resistance heating wire 3, so that the effect of reducing the temperature gradient can be well achieved, and the atomization effect is improved.
If the size of the integral microporous ceramic heating surface is 5 x 4 mm, the length of each heating wire is 4 mm, and the width is 0.1 mm, the number of the heating wires is 12, the heating wires are made of silver paste, each resistor is 21.33 ohm, and the integral heating resistor is 1.78 ohm.
After the ceramic heating apparatus of the present embodiment is energized, the temperature distribution pattern in the heating region 4 on the heating surface 1 is combined with the heating wire distribution according to the cross-sectional view thereof as shown in fig. 5. The temperature gradient is smaller, the defect of large temperature gradient in the prior art can be overcome, and the problems of poor atomization effect and poor taste are solved.
The heating device is thus manufactured.
First, a microporous ceramic substrate is prepared, which is mainly composed of ceramic substrates such as YSZ and Al2O 3.
The microporous ceramic substrate is a cuboid, one surface of the microporous ceramic substrate is selected as a heating atomization surface, namely a heating surface 1, and the heating surface area is 5 mm in length and 4 mm in width. And grinding and polishing the heating surface to meet the condition of screen printing of the thick film resistor.
The second step is that: since the thick film heating resistor paste is prepared by using the resistor heating wire 3 as thin as possible, a metal having a high melting point is selected as a resistor material as much as possible, and the printing paste is a silver paste to prepare a silver resistor heating wire.
The third step: the entire thick paste film was printed on the heat-generating surface with a screen printer, the thick film thickness was 0.03-0.05 mm (for loss during buffing) and the area was 5 x 4 mm.
The fourth step: and drying at 200 ℃ after the thick film is formed.
The fifth step: and sintering the mixture in a roasting furnace for 60 minutes at 1350 ℃ in a nitrogen environment after drying and forming.
And a sixth step: and after sintering and cooling, grinding and polishing the printed surface to enable the printed surface to have a smooth outer surface and uniform thickness as much as possible.
The seventh step: the printed surface is mechanically cut by micromachining, and after the cutting, a part of the heating wire 3 is left, and the rest part of the heating wire is exposed out of the ceramic surface, so that the layout structure of the heating wire 3 as shown in fig. 4 is formed.
The heating wire 3 of the present embodiment is formed by thick-film printing, sintering and machining, and thus the micro-machining accuracy can be controlled. As shown in fig. 7, the line edge 6 of the formed heating wire 3 is smooth and regular, and the line edge 6 has no or slight flanges and concave edges 5, unlike the heating wire formed by sintering after printing, the heating wire does not have non-uniform width, which causes local overheating and fusing.
Example 2: as shown in fig. 6, this example was fabricated using the same ceramic substrate, the same slurry, and the same process as in example 1, with the width of the heating wire being controlled to be 0.2 mm, the line interval being 0.4 mm, and the distance from any point in the heating zone to the heating guide edge being not more than 0.2 mm. The thickness of the resistance wire is still 0.03 mm. However, as the line width increases, the number of resistance lines needs to be reduced accordingly. For example, 12 strips in fig. 4, reduced to 6 strips, have the same resistance value as in example 1. Each resistance was 10.67 ohms and the overall firing resistance was 1.78 ohms.
Example 3: this example was prepared using the same ceramic substrate, the same paste, and the same process as in example 1, with the resistance line width being held at 0.15 mm, the line spacing still being 0.3 mm, and the resistance line thickness still being 0.03 mm. However, as the line width increases, the number of resistance lines needs to be reduced accordingly. Such as 12 in fig. 4, reduced to 8. Have the same resistance value. Each resistor was 14.22 ohms and the overall firing resistance was 1.78 ohms.
Example 4: this example was prepared using the same ceramic substrate, the same paste, and the same process as in example 1, with the resistance line width at 0.05 μm, the line spacing still at 0.1 mm, and the resistance line thickness still at 0.03 mm. However, as the line width is reduced, the number of resistance lines is required to be increased accordingly. Such as 12 in fig. 4, here increased to 24. Each resistance was 42.67 ohms and the overall firing resistance was 1.78 ohms.
In addition, products with line widths of 0.3 mm, 0.6 mm and 1.2 mm are prepared according to the preparation process of the invention, other dimensional data are not changed, and the products are listed as example 5 to example 7 respectively for comparing and explaining the beneficial effects.
Comparative examples 1 to 7: according to the solution of the embodiment of the present invention described above, the heater structures of the corresponding 7 comparative examples were designed. In the comparative example, the heating wires with the same size and specification are printed by using the ceramics and the slurry with the same specification in a screen printing way, and then are dried and sintered at the same temperature and the same flow to obtain the micropore ceramic thick film printing heater.
Comparative test method:
1. 20 products of the corresponding examples and comparative examples were passed simultaneously with the same amount of current, and the fusing time and the time for other damages to occur were recorded, and the supply voltage was stabilized at 5 volts, i.e., the operating voltage and operating current of the conventional electronic cigarette.
2. Recording fusing time shown in a table I, recording the fusing time by using an electronic timer, starting fusing by starting from a current to a first heating wire, and recording fusing instances by taking 0.5 second as a first file, wherein the fusing time is not recorded any more when other wires are subsequently fused;
3. recording the warping time shown in a table II, observing the warping time by naked eyes, starting the warping position by the first heating wire, and recording the warping cases by taking 0.5 second as a first step;
4. recording the skin explosion time as shown in a table III, observing the skin explosion time by naked eyes, starting the warping position of the first heating wire, and recording the skin explosion cases by taking 0.5 second as a first level;
5. all examples and comparative examples have the longest time of 5 seconds, and more than 5 seconds are not taken as recorded data, and 5 seconds of continuous electrification of the electronic cigarette product are enough to be used.
After the above comparative tests, data pairs such as the following are recorded:
through the above comparative tests, it was found that heating devices made with the prior art process were compared to the device of the present invention.
1. In the line width structure of more than 0.6 mm, products produced by the prior art process method are individually fused, and the method does not fuse. However, the products prepared by the prior art have small warpage or skin cracking phenomena.
2. In the line width structure of less than 0.3 mm, although a small part of fusing occurs, compared with the comparative example, the effect is obvious.
Example 8: as shown in fig. 8, in this embodiment, the parallel connection of the heating wires in embodiments 1 to 7 is not used, but a single wire is bent and uniformly arranged, which is more suitable for the arrangement of the heating wires 3 with large heating resistance.
Example 9: as shown in fig. 9, the product of this embodiment no longer has a plane as a heating surface, but grooves 7 for accommodating heating wires are formed in the heating surface 4, and the heating wire grooves 7 are used for laying the thick film printed heating wires 3. So that the upper surface of the heating wire 3 is flush with the heating surface 4, the upper surface of the heating wire 3 is prevented from protruding out of the heating surface 4 of the ceramic substrate, and the phenomenon of partial dry burning is avoided. When the product of the embodiment is manufactured, the heating surface 4 of the ceramic substrate needs to be provided with the heating wire grooves 7, and the heating wire grooves 7 may be machined, may also be manufactured by laser lithography, and of course, may also be integrally formed when the ceramic surface is formed. And then the heating surface 4 provided with the heating wire groove 7 is subjected to heating area whole-surface thick film printing, and after being dried and sintered, the heating wire 3 which is parallel to the heating surface 4 is formed by machining and the like according to the originally arranged groove 7.
According to the invention, the thick film heating wire formed after thick film printing is subjected to mechanical processing, chemical etching or laser photoetching to form a smooth and level wire edge, so that the local overheating fusing phenomenon caused by uneven current density due to poor width consistency of the heating wire can be avoided, and the defect that the printed heating wire is large in width and is unevenly distributed on the heating surface in the prior art is overcome. Meanwhile, the structure of the groove of the heating wire also overcomes the phenomenon of local dry burning on the surface of the wire. The foregoing description is given for illustrative embodiments, and modifications and variations are possible without departing from the spirit of the invention.
Table one: the amount of fusion within 5 seconds was observed by electrifying the examples and comparative examples
| Test object | 0.5s | 1.0s | 1.5s | 2.0s | 2.5s | 3.0s | 3.5s | 4.0s | 4.5s | 5.0s |
| Example 1 | 0 | 0 | 0 | 0 | 1 | 1 | 2 | 2 | 1 | 1 |
| Comparative example 1 | 7 | 13 | -- | -- | -- | -- | -- | -- | -- | -- |
| Example 2 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 1 | 2 | 1 |
| Comparative example 2 | 3 | 7 | 5 | 5 | -- | -- | -- | -- | -- | -- |
| Example 3 | 0 | 0 | 0 | 1 | 1 | 2 | 1 | 2 | 1 | 1 |
| Comparative example 3 | 15 | 5 | -- | -- | -- | -- | -- | -- | -- | -- |
| Example 4 | 0 | 0 | 0 | 1 | 2 | 2 | 2 | 4 | 1 | 3 |
| Comparative example 4 | 20 | -- | -- | -- | -- | -- | -- | -- | -- | -- |
| Example 5 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 2 | 0 |
| Comparative example 5 | 1 | 3 | 2 | 3 | 4 | 5 | 2 | -- | -- | -- |
| Example 6 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 |
| Comparative example 6 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 1 | 0 |
| Example 7 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 |
| Comparative example 7 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 |
Table two: the amount of warpage in 5 seconds was observed by energization
| Test object | 0.5s | 1.0s | 1.5s | 2.0s | 2.5s | 3.0s | 3.5s | 4.0s | 4.5s | 5.0s |
| Example 1 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 1 | 2 | 1 |
| Comparative example 1 | 7 | -- | -- | -- | -- | -- | -- | -- | -- | -- |
| Example 2 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 1 | 1 |
| Comparative example 2 | 5 | 8 | 7 | -- | -- | -- | -- | -- | -- | -- |
| Example 3 | 0 | 0 | 0 | 1 | 0 | 0 | 1 | 0 | 1 | 1 |
| Comparative example 3 | 8 | -- | -- | -- | -- | -- | -- | -- | -- | -- |
| Example 4 | 0 | 0 | 1 | 0 | 0 | 1 | 2 | 2 | 1 | 1 |
| Comparative example 4 | -- | -- | -- | -- | -- | -- | -- | -- | -- | -- |
| Example 5 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 1 | 2 | 1 |
| Comparative example 5 | 0 | 0 | 2 | 3 | 1 | 1 | 0 | 2 | 1 | 1 |
| Example 6 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 |
| Comparative example 6 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 1 |
| Example 7 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 |
| Comparative example 7 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 |
Table three: observing the number of the implosion skins within 5 seconds by electrifying
| Test object | 0.5s | 1.0s | 1.5s | 2.0s | 2.5s | 3.0s | 3.5s | 4.0s | 4.5s | 5.0s |
| Example 1 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 1 | 1 | 1 |
| Comparative example 1 | 0 | -- | -- | -- | -- | -- | -- | -- | -- | -- |
| Example 2 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 1 |
| Comparative example 2 | 2 | 1 | 0 | 0 | -- | -- | -- | -- | -- | -- |
| Example 3 | 0 | 0 | 0 | 0 | 0 | 0 | 1 | 1 | 1 | 1 |
| Comparative example 3 | 3 | 0 | -- | -- | -- | -- | -- | -- | -- | -- |
| Example 4 | 0 | 0 | 0 | 0 | 0 | 0 | 3 | 0 | 1 | 0 |
| Comparative example 4 | 0 | -- | -- | -- | -- | -- | -- | -- | -- | -- |
| Example 5 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 1 | 2 | 1 |
| Comparative example 5 | 0 | 0 | 0 | 0 | 1 | 1 | 2 | 1 | 3 | 0 |
| Example 6 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 |
| Comparative example 6 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 1 | 1 | 0 |
| Example 7 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 |
| Comparative example 7 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 |
Claims (10)
1. The utility model provides an atomizer micropore ceramic heating device, package micropore ceramic base member and setting are in heating wire on the micropore ceramic base member which characterized in that: the heating wire is a thin strip-shaped heating wire formed by thick film printing, sintering and forming and then mechanical cutting, chemical etching or laser photoetching; the heating wires are uniformly distributed on the heating surface of the ceramic substrate.
2. The atomizer microporous ceramic heating apparatus of claim 1, wherein: the micro-porous ceramic substrate is provided with a heating surface, the heating wire is arranged on the heating surface in a thick film printing mode, an atomization heating area is formed on the heating surface, and any point of the atomization heating area is not more than 0.2 mm away from the nearest edge of the heating wire.
3. The atomizer microporous ceramic heating apparatus of claim 2, wherein: the heating wires are bent and uniformly distributed on the heating surface of the ceramic substrate, or a plurality of heating wires are parallelly and uniformly distributed on the heating surface of the ceramic substrate, and the distance between the parallel heating wires is not more than 0.4 mm.
4. The atomizer microporous ceramic heating apparatus of claim 3, wherein: the heating wire is of a sheet structure and is provided with a first surface and a second surface, the first surface is tightly attached to the heating surface of the ceramic matrix, and the second surface protrudes out of the heating surface of the ceramic matrix.
5. The atomizer microporous ceramic heating apparatus of claim 3, wherein: the heating wire is characterized in that the cross section of the heating wire is of a sheet structure and is provided with a first surface and a second surface, the heating surface of the ceramic substrate is provided with a heating wire groove, the heating wire is arranged in the heating wire groove, the first surface of the heating wire is flush with the heating surface, and other parts of the heating wire are arranged in the groove.
6. The atomizer microporous ceramic heating apparatus of any one of claims 1 to 5, wherein: the width of the heating wire is 0.05-0.2 mm, and the thickness of the heating wire is 0.01-0.05 mm.
7. A preparation process of a microporous ceramic heating device of an atomizer comprises the following steps: firstly, arranging a microporous ceramic substrate, wherein the microporous ceramic substrate is provided with a heating surface, and grinding and polishing the surface; then, carrying out thick film printing on the heating surface of the microporous ceramic substrate to form a printed thick film, and drying; then, sintering the ceramic substrate and the heating plane after printing and drying; the method is characterized by further comprising the following steps: and performing mechanical cutting, chemical etching or laser photoetching on the sintered thick film printing part to form a strip heating wire with a preset shape.
8. The process for preparing a microporous ceramic heating device for an atomizer according to claim 7, wherein: the mechanical cutting, chemical etching or laser photoetching after sintering also comprises a grinding and polishing process; the method also comprises a process of forming a groove of the heating wire after the ceramic substrate is heated and polished and before the thick film is printed.
9. The process for preparing a microporous ceramic heating device for an atomizer according to claim 7, wherein: the heating wires are uniformly distributed on the heating surface of the ceramic substrate, an atomization heating area is formed on the heating surface, and any point in the atomization heating area is not more than 0.2 mm away from the nearest edge of the heating wire.
10. The process for preparing a microporous ceramic heating device for an atomizer according to claim 7, wherein: the width of the heating wire is 0.05-0.2 mm, and the thickness of the heating wire is 0.01-0.05 mm.
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| CN113040425A (en) * | 2021-01-22 | 2021-06-29 | 深圳市基克纳科技有限公司 | Atomizer multi-core linkage heating method and atomizer |
Citations (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0415571A2 (en) * | 1989-08-07 | 1991-03-06 | Ford Motor Company Limited | Layered thick film resistors and method for producing same |
| JPH11126853A (en) * | 1997-10-24 | 1999-05-11 | Noritake Co Ltd | Production of thick-film circuit board |
| US20010012692A1 (en) * | 1998-10-30 | 2001-08-09 | Robin L. Miller | Thick-film etch-back process for use in manufacturing fine-line hybrid circuits |
| CN1582095A (en) * | 2003-08-06 | 2005-02-16 | 中国科学院福建物质结构研究所二部 | Mask-free ceramic base board interconnecting lead manufacturing technique |
| CN202998515U (en) * | 2012-12-26 | 2013-06-12 | 宫铭杨 | Infrared ray honeycomb ceramic heater |
| CN104072186A (en) * | 2013-03-27 | 2014-10-01 | 比亚迪股份有限公司 | A preparing method of a ceramic copper-clad plate |
| CN105632898A (en) * | 2014-10-30 | 2016-06-01 | 陕西盛迈石油有限公司 | Thick-film photoetching processing method |
| CN106413270A (en) * | 2016-11-04 | 2017-02-15 | 大连大学 | Aluminum nitride ceramic circuit board and preparation method thereof |
| EP3188570A2 (en) * | 2016-04-22 | 2017-07-05 | Shenzhen First Union Technology Co., Ltd. | Atomizer of electronic cigarette, ceramic heating atomizing core and ceramic heater therein |
| CN108272136A (en) * | 2018-01-13 | 2018-07-13 | 深圳市新宜康电子技术有限公司 | Self-adjustable intelligence atomization core and preparation method thereof |
| CN109803500A (en) * | 2019-01-31 | 2019-05-24 | 井敏 | A kind of super-narrow line width line-spacing metallized ceramic substrate and preparation method thereof |
| CN110037349A (en) * | 2019-04-02 | 2019-07-23 | 湖南聚能陶瓷材料有限公司 | A kind of micropore ceramics heater and preparation method thereof for electronic cigarette |
| CN110074463A (en) * | 2019-05-14 | 2019-08-02 | 东莞市东思电子技术有限公司 | A kind of electronic cigarette oil atomization core micropore ceramics thick film heating element and preparation method thereof |
-
2019
- 2019-09-17 CN CN201910873624.7A patent/CN110613167B/en active Active
Patent Citations (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0415571A2 (en) * | 1989-08-07 | 1991-03-06 | Ford Motor Company Limited | Layered thick film resistors and method for producing same |
| JPH11126853A (en) * | 1997-10-24 | 1999-05-11 | Noritake Co Ltd | Production of thick-film circuit board |
| US20010012692A1 (en) * | 1998-10-30 | 2001-08-09 | Robin L. Miller | Thick-film etch-back process for use in manufacturing fine-line hybrid circuits |
| CN1582095A (en) * | 2003-08-06 | 2005-02-16 | 中国科学院福建物质结构研究所二部 | Mask-free ceramic base board interconnecting lead manufacturing technique |
| CN202998515U (en) * | 2012-12-26 | 2013-06-12 | 宫铭杨 | Infrared ray honeycomb ceramic heater |
| CN104072186A (en) * | 2013-03-27 | 2014-10-01 | 比亚迪股份有限公司 | A preparing method of a ceramic copper-clad plate |
| CN105632898A (en) * | 2014-10-30 | 2016-06-01 | 陕西盛迈石油有限公司 | Thick-film photoetching processing method |
| EP3188570A2 (en) * | 2016-04-22 | 2017-07-05 | Shenzhen First Union Technology Co., Ltd. | Atomizer of electronic cigarette, ceramic heating atomizing core and ceramic heater therein |
| CN106413270A (en) * | 2016-11-04 | 2017-02-15 | 大连大学 | Aluminum nitride ceramic circuit board and preparation method thereof |
| CN108272136A (en) * | 2018-01-13 | 2018-07-13 | 深圳市新宜康电子技术有限公司 | Self-adjustable intelligence atomization core and preparation method thereof |
| CN109803500A (en) * | 2019-01-31 | 2019-05-24 | 井敏 | A kind of super-narrow line width line-spacing metallized ceramic substrate and preparation method thereof |
| CN110037349A (en) * | 2019-04-02 | 2019-07-23 | 湖南聚能陶瓷材料有限公司 | A kind of micropore ceramics heater and preparation method thereof for electronic cigarette |
| CN110074463A (en) * | 2019-05-14 | 2019-08-02 | 东莞市东思电子技术有限公司 | A kind of electronic cigarette oil atomization core micropore ceramics thick film heating element and preparation method thereof |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113040425A (en) * | 2021-01-22 | 2021-06-29 | 深圳市基克纳科技有限公司 | Atomizer multi-core linkage heating method and atomizer |
| CN113040425B (en) * | 2021-01-22 | 2022-12-09 | 深圳市基克纳科技有限公司 | Multi-core linkage heating method and device for atomizer |
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|---|---|
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