CN110612015A - Phase-change natural convection heat dissipation device with laminated structure - Google Patents

Phase-change natural convection heat dissipation device with laminated structure Download PDF

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Publication number
CN110612015A
CN110612015A CN201910718966.1A CN201910718966A CN110612015A CN 110612015 A CN110612015 A CN 110612015A CN 201910718966 A CN201910718966 A CN 201910718966A CN 110612015 A CN110612015 A CN 110612015A
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China
Prior art keywords
plate
condensation
evaporation
condensing
heat dissipation
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CN201910718966.1A
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CN110612015B (en
Inventor
李强
陈浩
石秋雨
穆小斌
康伟
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Nanjing Tech University
Global Energy Interconnection Research Institute
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Nanjing Tech University
Global Energy Interconnection Research Institute
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/20309—Evaporators
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/20318—Condensers

Abstract

The invention discloses a phase-change natural convection heat dissipation device with a laminated structure, which is characterized by comprising an evaporation plate, a plurality of condensation plates arranged side by side, a liquid storage device, fins and a pipeline, wherein the evaporation plate is provided with a plurality of heat dissipation holes; the liquid inlet of the evaporation plate is connected with the outlet of the liquid reservoir through a pipeline, and the outlet of the evaporation plate is connected with the inlet at the upper end of the condensation plate through a pipeline; the lower outlet of the condensing plate is connected with the inlet of the liquid storage device through a pipeline to form a circulating loop of the whole system; the opposite inner side surfaces of the plurality of condensation plates are provided with mutually parallel fins at intervals.

Description

Phase-change natural convection heat dissipation device with laminated structure
Technical Field
The invention belongs to a heat sink of electronic equipment, in particular to a phase-change natural convection heat sink with a laminated structure.
Background
For electronic devices which are dispersedly arranged in high-power equipment, the temperature distribution of the equipment is uneven due to different heat generated by the devices, and the working performance and efficiency of the equipment are greatly influenced due to the difference of electrical performance among the devices due to uneven temperature distribution. Aiming at the strict requirements of electronic equipment on electric load and external input power under special conditions, the heat dissipation device needs to reduce the electric load and the external input power as much as possible. For electronic devices arranged in a scattered manner, the heat dissipation device needs to dissipate heat of each part of the device. The heat dissipation device has the advantages of large heat dissipation requirement, simple structure and no external power, thereby effectively dissipating heat of high-power electric equipment. The method of mounting the fins on the surface of the heat dissipation system greatly increases the surface convection heat exchange area of the heat dissipation system, thereby effectively improving the heat exchange capacity of the heat dissipation system, but the heat dissipation area is increased once, so that the volume, the weight and the cost of the heat dissipation system are greatly increased, and the heat dissipation efficiency is reduced.
The traditional natural convection heat dissipation system with fins has too large size difference with a heat source, waste heat at the heat source can only be transferred to all parts of the system through solid heat conduction of the system, so that the efficiency is low, and the heat transfer coefficient is high in consideration of uniform and consistent temperature of a working medium when phase change occurs, so that the heat dissipation requirement of high-power equipment can be met by utilizing the high heat conductivity and good temperature uniformity of phase change heat transfer. Heat pipes are capable of transferring large amounts of heat through a small cross-sectional area and are among the most efficient heat transfer elements known today. Because the heat pipe technology has the advantages of high heat conductivity, flexible and reliable control, no need of maintenance and the like, the high-efficiency heat exchange elements such as a steam cavity, a loop heat pipe and the like which utilize the heat pipe technology are widely researched and applied, and the expansion and application of the heat pipe technology have important practical significance for the research and production of electronic equipment. When applied to high-power equipment, the traditional heat pipe technology can not meet the heat dissipation requirement under the natural convection condition, so that the temperature of the equipment is too high and even exceeds the temperature bearing range, thereby causing the burning of internal electronic devices, and if the size of the heat pipe is increased to meet the heat dissipation requirement, the required space of the heat dissipation device can be greatly increased.
For high-power electric power equipment, the heat exchange quantity is very large, the heat can not be effectively dissipated by only depending on natural convection, the surface area of a heat dissipation device is increased, and the size of the device is greatly increased. The documents refer to Reyes M, Alonso D, Arias J R, et al, Experimental and the theoretical study of a vacuum chamber base vapor distributor for applications, Applied Thermal Engineering, (37)2012,51-59. Studies were made on the Thermal performance of vertically placed isothermal vapor chambers under forced convection and natural convection conditions, and the results show that for component surface temperatures in the range of 80 ℃ to 100 ℃, the maximum heat dissipation power of the device varies from 95W to 145W under forced convection conditions and from 33W to 38W under natural convection conditions; the heat source size in the above document is 35mm × 35mm × 1mm, and the heat dissipation device size is 190mm × 140mm × 15mm, for a heat source with higher power, the difficulty of heat dissipation by using the device in the above document is greatly increased, the required size is also increased, the occupied space is greatly increased, and the processing difficulty is also increased due to the existence of the internal capillary structure. A
Disclosure of Invention
The invention aims to provide a phase-change natural convection heat dissipation device with a laminated structure, so that heat can be transferred from an evaporation plate to a condensation plate without external power, and the volume of the heat dissipation device is reduced.
The technical solution for realizing the purpose of the invention is as follows:
a phase-change natural convection heat dissipation device with a laminated structure is characterized by comprising an evaporation plate, a plurality of condensation plates arranged side by side, a liquid storage device, fins and a pipeline;
the liquid inlet of the evaporation plate is connected with the outlet of the liquid reservoir through a pipeline, and the outlet of the evaporation plate is connected with the inlet at the upper end of the condensation plate through a pipeline; the lower outlet of the condensing plate is connected with the inlet of the liquid storage device through a pipeline to form a circulating loop of the whole system; the opposite inner side surfaces of the plurality of condensation plates are provided with mutually parallel fins at intervals.
Compared with the prior art, the invention has the following remarkable advantages:
(1) the condensing plate provided with the fins is combined with the evaporating plate, a circulation loop formed by the evaporation micro-channel inside and the condensation flow channel 22 can effectively dissipate heat of high-power electric equipment, the working fluid is driven to circulate in the loop by gravity, heat can be transferred to the condensing plate from the evaporating plate without external power, and the heat dissipation device is small in size.
(2) The micro-channels in the evaporation plate can transfer heat to the working fluid more effectively, so that the heat exchange performance of the evaporation plate is enhanced.
(3) The evaporation plate is provided with a plurality of cold plates which are parallel to each other and have the same structure and size, so that heat sources at different levels can be effectively contacted with the evaporation plate.
(4) The condensing plate inlet cross flow channels 21 are tapered to allow the working fluid entering the condensing plate to be evenly distributed into each vertical condensing flow channel 22.
Drawings
Fig. 1 is a schematic structural diagram of a phase-change natural convection heat dissipation device with a laminated structure according to the present invention.
Fig. 2 is a schematic view of an internal flow passage structure of the condensation plate.
Fig. 3 is a sectional view of an evaporation plate structure.
FIG. 4 is a schematic structural diagram of a heat dissipation device according to an embodiment.
FIG. 5 is a graph of the non-uniformity of the flow channels within the cold plate as a function of angle.
Detailed Description
The invention is further described with reference to the following figures and embodiments.
With reference to fig. 1-3, a phase-change natural convection heat dissipation device with a laminated structure according to the present invention includes an evaporation plate 1, a plurality of condensation plates 2 arranged side by side, a liquid reservoir 3, fins 4, and a pipeline;
a liquid inlet of the evaporation plate 1 is connected with an outlet of the liquid reservoir 3 through a pipeline, and an outlet of the evaporation plate 1 is connected with an inlet at the upper end of the condensation plate 2 through a pipeline; and the outlet at the lower end of the condensing plate 2 is connected with the inlet of the liquid storage device 3 through a pipeline to form a circulating loop of the whole system. The inner side surfaces opposite to the plurality of condensation plates 2 are all provided with mutually parallel fins 4 at intervals, so that the heat dissipation surface area of the device is greatly increased, and the number of the fins 4 can be set according to the size of the substrate.
A plurality of parallel evaporation micro-channels are arranged in the evaporation plate 1; the inlet of the condensing plate 2 is provided with a gradually reduced transverse flow passage 21 and m (m is more than or equal to 2) parallel vertical condensing flow passages 22, and the working medium is distributed to each condensing flow passage 22 through the gradually reduced transverse flow passage 21; the flow resistance loss of the working medium from the inlet to each vertical condensing flow channel 22 is ensured to be as close as possible. The inlets and outlets of the evaporation plate 1 and the condensation plate 2 are respectively positioned at two opposite ends of the evaporation plate 1 and the condensation plate 2; the flow distance of the working medium in the condensing flow channel 22 or the evaporation micro-channel is consistent, the flow resistance is consistent, and the heat exchange is more uniform and sufficient.
The resistance loss calculation formula is as follows:
in the formula,. DELTA.piFor the loss of flow resistance, ζ, of working medium from the inlet to the ith vertical pipelineiAnd p is the density of the working medium, and u is the flow velocity of the working medium.
The local loss coefficient can be calculated by:
where k is a coefficient relating to the taper angle α of the lateral flow channel 21, as shown in table 1.
TABLE 1 relationship of k to Angle α
α° 5 10 20 30 40 50 60
k 0.40 0.25 0.20 0.20 0.30 0.40 0.60
The taper angle alpha of the transverse flow passage 21 satisfies:
wherein S1Is the cross-sectional area of the inlet section of the transverse flow passage 21, SiThe cross-sectional area of the transverse flow passage 21 at the ith vertical condensing flow passage 22; m is the total number of vertical condensing channels 22, dgWidth of the condensing flow path 22, djThe distance between adjacent condensing channels 22, dhThe width of the transverse flow channel 21 at the mth condensation flow channel 22.
For the transverse flow channel 21, by changing the pipeline reducing angle alpha, the coefficient k and the ratio of the cross-sectional area of the inlet section and the outlet section of the transverse flow channel 21 can be changed, so that the flow resistance loss is changed, by optimizing the reducing angle alpha, the flow resistance loss of the working medium from the inlet to each vertical condensing flow channel 22 is as close as possible, and the closer the flow resistance loss of the working medium from the inlet to each vertical condensing flow channel 22 is, the smaller the unevenness of the vertical condensing flow channel 22 is.
The unevenness of the vertical condensation channels 22 of the condensation plate 2 can be calculated by the following formula:
in the formula, QiThe flow rate of the working medium of the ith condensing flow passage,the average working medium flow of m condensation channels.
Furthermore, a plurality of reinforcing columns in an array are distributed in the evaporation plate 1, so that the structural strength of the evaporation plate 1 is greatly enhanced.
Preferably, the length direction of the fins 4 is parallel to the direction of the flow channels of the vertical condensation flow channels 22.
Further, gaps are arranged between the fins 4 of the adjacent condensation plates 2, so that ventilation between the fins 4 is facilitated.
In some embodiments, the outer side surface of the condensation plate 2 is also provided with fins 4 at intervals, which are parallel to each other, so that the heat dissipation surface area of the whole device can be further increased.
In some embodiments, the evaporation plate 1 is a plurality of evaporation plates, and the plurality of evaporation plates 1 are arranged in an array at a certain inclination angle with respect to the horizontal plane.
The condensing flow channels 22 or evaporating microchannels are formed by channels that are parallel to each other. The evaporating plate 1 is located the 2 bottoms of condensing plate, and during the use, evaporating plate 1 and electron device direct contact, the heat accessible evaporating plate 1 that electron device produced directly pass to condensing plate 2, need not external input power, and evaporating plate 1 that has inclination makes the working fluid of the evaporation of being heated get into condensing plate 2 under the buoyancy lift effect, and the working fluid after the condensation circulates in the device under the gravity drive.
Examples
Referring to fig. 4, the phase-change natural convection heat dissipation device with a laminated structure having two evaporation plates, 30 condensation channels 22 and 200 evaporation microchannels according to the present invention includes a first evaporation plate 1-1 and a second evaporation plate 1-2, a first condensation plate 2-1 and a second condensation plate 2-2, a liquid reservoir 3, fins 4, and a pipeline; the evaporation plate 1 comprises 200 evaporation micro-channels; the condensation plate 2 comprises 30 condensation flow channels 22;
an outlet of the liquid storage device 3 is connected with liquid inlets of the first evaporation plate 1-1 and the second evaporation plate 1-2, gas outlets of the first evaporation plate 1-1 and the second evaporation plate 1-2 are connected with inlets of the first condensation plate 2-1 and the second condensation plate 2-2 through pipelines, and outlets of the first condensation plate 2-1 and the second condensation plate 2-2 are connected with an inlet of the liquid storage device 3 to form a circulation loop of the whole device.
The condensing flow channels 22 or evaporating microchannels are formed by mutually parallel channels, which are provided in the evaporating plate or the condensing plate, and in which the fluid flows; the channels within a single substrate flow in a uniform direction.
The number of the channels of the first evaporation plate 1-1 and the second evaporation plate 1-2 is 200, the number of the channels of the first condensation plate 2-1 and the second condensation plate 2-2 is 30, each channel is of a rectangular structure, and the pipelines are symmetrically arranged at two opposite ends of the evaporation plate or the condensation plate, so that the flowing distances of fluid in the condensation flow channel 22 or the evaporation flow channel are consistent, the flowing resistances of the fluid in each channel are consistent, and the heat exchange is more uniform and sufficient.
The transverse flow channel 21 at the inlet of the condensing plate 2 is in a tapered shape, so that the flow resistance loss of the working medium from the inlet to each vertical condensing flow channel 22 is ensured to be as close as possible.
The first evaporation plate and the second evaporation plate are internally distributed with array reinforcing columns, so that the structural strength of the evaporation plates is greatly increased.
Furthermore, the inner side surfaces of the first condensation plate 2-1 and the second condensation plate 2-2 opposite to each other are provided with mutually parallel fins 4 at intervals, so that the heat dissipation surface area of the device is greatly increased, the fins 4 are all vertical to the surface of the base plate, the length direction of the fins 4 is parallel to the direction of the condensation flow channel 22, the number of the fins 4 on one side is 50, and gaps are formed between the fins 4 of the condensation plate 2-1 and the fins 4 of the condensation plate 2-2, so that ventilation among the fins 4 is facilitated.
Evaporating plate L1The length is 200-400mm, and the width W1200-400mm, thickness H13-10mm, the length of the evaporation micro-channel in the cold plateL2180 mm, 380mm, width W20.1-0.5mm, depth H20.1-2mm, length L of the condensation plate31500-3500-1000mm, thickness H35-15mm, length L of vertical condensing flow passage 22 in condensing plate41400-2400mm, width W45-15mm, depth H41-14mm, and the reducing angle of the transverse flow channel 21 at the inlet of the condensing plate is 1-10 degrees.
The phase-change natural convection heat dissipation device with the laminated structure has the working process that:
working fluid is heated in the evaporating plate that has inclination and evaporates and forms steam, and steam passes through the pipeline evenly distributed to two condensing panels under the buoyancy lift effect, and the steam of being heated passes through horizontal convergent pipeline evenly distributed to every vertical condensation runner 22 in, and the steam of being heated releases the heat in condensation runner 22 and condenses, and the condensate liquid flows downwards under the gravity drive, flows through in reservoir 3 reentrant two evaporating plates to the inside circulation flow process of device has been accomplished. In the circulating flow process, heat at the heat source is transferred to the condensing plate from the evaporating plate by working fluid, and then the heat exchange is carried out with the ambient environment through natural convection on the surface of the condensing plate, the natural convection-phase change coupling device has excellent heat transfer and heat dissipation performance, and the temperature at the heat source is well controlled.
For example: when the working medium is R245fa, the liquid filling rate is 40%, the total heating power is 3600W, the operating environment temperature is 40 ℃, and for a heat source which is non-uniformly distributed on each evaporation plate, the heat flow density is from 31.7W/cm2-156.6W/cm2Under the working condition of (1), the highest temperature of the device is 77 ℃, and the heat transfer resistance of the evaporation plate is 5.95 multiplied by 10-3The heat transfer resistance of the device is 6.97 multiplied by 10℃/W-4The device has good heat transfer and heat dissipation performance under the condition of natural convection for high-power electrical equipment.
For example: the working medium is R245fa, the liquid filling rate is 40%, the total heating power is 3200W, the operating environment temperature is 40 ℃, as shown in FIG. 5, the unevenness reaches the minimum value when the angle of the tapered pipeline is 5 degrees, which indicates that the flow distribution of the working medium in the vertical flow channel is more uniform at the angle. For theThe heat source is unevenly distributed on each evaporation plate, and the heat flow density is from 31.7W/cm2-156.6W/cm2Under the working condition of (1), the highest temperature of the device is 72.1 ℃, and the heat transfer resistance of the evaporation plate is 5.53 multiplied by 10-3The heat transfer resistance of the device is 3.56 multiplied by 10℃/W-4The device has good heat transfer and heat dissipation performance under the condition of natural convection for high-power electrical equipment.

Claims (8)

1. A phase-change natural convection heat dissipation device with a laminated structure is characterized by comprising an evaporation plate (1), a plurality of condensation plates (2) arranged side by side, a liquid storage device (3), fins (4) and pipelines;
a liquid inlet of the evaporation plate (1) is connected with an outlet of the liquid reservoir (3) through a pipeline, and an outlet of the evaporation plate (1) is connected with an inlet at the upper end of the condensation plate (2) through a pipeline; the lower end outlet of the condensing plate (2) is connected with the inlet of the liquid storage device (3) through a pipeline to form a circulating loop of the whole system; mutually parallel fins (4) are arranged on the opposite inner side surfaces of the plurality of condensation plates (2) at intervals.
2. The heat sink according to claim 1, characterized in that a plurality of parallel evaporation micro channels are provided in the evaporation plate (1); the inlet of the condensing plate (2) is provided with a tapered transverse flow passage (21) and m parallel vertical condensing flow passages (22), wherein m is more than or equal to 2; the inlets and outlets of the evaporation plate (1) and the condensation plate (2) are respectively positioned at two opposite corners of the evaporation plate (1) and the condensation plate (2).
3. The heat sink as recited in claim 1, characterised in that the transverse flow channel (21) tapers at an angle α satisfying:
wherein S1Is the cross-sectional area of the inlet section of the transverse flow passage (21), SiIs the cross-sectional area of the transverse flow passage (21) at the ith vertical condensing flow passage (22); m is the total number of vertical condensing channels (22), dgIs a condensation flow passage (2)2) Width, djIs the distance between adjacent condensing channels (22), dhIs the width of the transverse flow channel (21) at the mth condensation flow channel (22).
4. The heat sink as claimed in claim 2, characterised in that the longitudinal direction of the fins (4) is parallel to the direction of the vertical condensation channels (22).
5. The heat sink according to claim 1, characterised in that gaps are provided between the fins (4) of adjacent condensation plates (2).
6. The heat sink as claimed in claim 1, characterised in that the condensation plate (2) is also provided on its outer side surface at intervals with mutually parallel ribs (4).
7. The heat sink as claimed in claim 1, characterized in that a plurality of reinforcing columns in an array are distributed inside the evaporation plate (1).
8. The heat dissipation device according to claim 1, wherein the evaporation plate (1) is a plurality of evaporation plates, and the plurality of evaporation plates (1) are arranged in an array at an inclined angle to the horizontal plane.
CN201910718966.1A 2019-08-05 2019-08-05 Phase-change natural convection heat dissipation device with laminated structure Active CN110612015B (en)

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Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6282913B1 (en) * 1999-06-11 2001-09-04 Mitsubishi Denki Kabushiki Kaisha Water vaporization type cooling apparatus for heat-generating unit
CN104501387A (en) * 2014-12-11 2015-04-08 广东美的制冷设备有限公司 Air conditioner
CN109073311A (en) * 2016-04-27 2018-12-21 东芝生活电器株式会社 Refrigerator

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2834120Y (en) * 2005-09-07 2006-11-01 中国科学院工程热物理研究所 Natural air-cooled passive circulating micro-grooves phase change heat radiation system
CN202836310U (en) * 2012-06-25 2013-03-27 上海吉益能源技术有限公司 Plate-shaped heat exchange element and water medium heat exchange device thereof

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6282913B1 (en) * 1999-06-11 2001-09-04 Mitsubishi Denki Kabushiki Kaisha Water vaporization type cooling apparatus for heat-generating unit
CN104501387A (en) * 2014-12-11 2015-04-08 广东美的制冷设备有限公司 Air conditioner
CN109073311A (en) * 2016-04-27 2018-12-21 东芝生活电器株式会社 Refrigerator

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