CN110600193A - 用于印刷线缆安装的方法和具有集成线束系统的复合元件 - Google Patents

用于印刷线缆安装的方法和具有集成线束系统的复合元件 Download PDF

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CN110600193A
CN110600193A CN201910511104.1A CN201910511104A CN110600193A CN 110600193 A CN110600193 A CN 110600193A CN 201910511104 A CN201910511104 A CN 201910511104A CN 110600193 A CN110600193 A CN 110600193A
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conductive
printing
aircraft
composite element
trace
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阿兰·罗德耶罗
何塞·桑切斯-戈麦斯
塔马拉·布兰科巴雷拉
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Airbus Operations GmbH
Airbus Operations SL
Airbus Operations SAS
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    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02G—INSTALLATION OF ELECTRIC CABLES OR LINES, OR OF COMBINED OPTICAL AND ELECTRIC CABLES OR LINES
    • H02G3/00—Installations of electric cables or lines or protective tubing therefor in or on buildings, equivalent structures or vehicles
    • H02G3/30—Installations of cables or lines on walls, floors or ceilings
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/015—Ink jet characterised by the jet generation process
    • B41J2/04—Ink jet characterised by the jet generation process generating single droplets or particles on demand
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B64—AIRCRAFT; AVIATION; COSMONAUTICS
    • B64C—AEROPLANES; HELICOPTERS
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    • B64C1/14—Windows; Doors; Hatch covers or access panels; Surrounding frame structures; Canopies; Windscreens accessories therefor, e.g. pressure sensors, water deflectors, hinges, seals, handles, latches, windscreen wipers
    • B64C1/1407—Doors; surrounding frames
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B64—AIRCRAFT; AVIATION; COSMONAUTICS
    • B64D—EQUIPMENT FOR FITTING IN OR TO AIRCRAFT; FLIGHT SUITS; PARACHUTES; ARRANGEMENT OR MOUNTING OF POWER PLANTS OR PROPULSION TRANSMISSIONS IN AIRCRAFT
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    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
    • H01B13/06—Insulating conductors or cables
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B7/00—Insulated conductors or cables characterised by their form
    • H01B7/0009—Details relating to the conductive cores
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B7/00—Insulated conductors or cables characterised by their form
    • H01B7/0045—Cable-harnesses
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B7/00—Insulated conductors or cables characterised by their form
    • H01B7/02—Disposition of insulation
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02G—INSTALLATION OF ELECTRIC CABLES OR LINES, OR OF COMBINED OPTICAL AND ELECTRIC CABLES OR LINES
    • H02G1/00—Methods or apparatus specially adapted for installing, maintaining, repairing or dismantling electric cables or lines
    • H02G1/06—Methods or apparatus specially adapted for installing, maintaining, repairing or dismantling electric cables or lines for laying cables, e.g. laying apparatus on vehicle
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    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
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    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
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    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
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    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/102—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by bonding of conductive powder, i.e. metallic powder
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    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
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    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1241—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing
    • H05K3/125—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing by ink-jet printing
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    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1283—After-treatment of the printed patterns, e.g. sintering or curing methods
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    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
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    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/14—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using spraying techniques to apply the conductive material, e.g. vapour evaporation
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    • B64—AIRCRAFT; AVIATION; COSMONAUTICS
    • B64D—EQUIPMENT FOR FITTING IN OR TO AIRCRAFT; FLIGHT SUITS; PARACHUTES; ARRANGEMENT OR MOUNTING OF POWER PLANTS OR PROPULSION TRANSMISSIONS IN AIRCRAFT
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    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0228—Compensation of cross-talk by a mutually correlated lay-out of printed circuit traces, e.g. for compensation of cross-talk in mounted connectors
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Abstract

公开了一种用于在飞行器线束系统中进行印刷线缆安装的方法和具有集成线束系统的复合元件。所述方法包括：利用印刷技术将包括导电颗粒的至少第一导电迹线印刷到飞行器的表面；利用所述印刷技术将包含导电颗粒的至少第二导电迹线印刷到所述飞行器表面；借助激光烧结所述第一导电迹线和所述第二导电迹线；并且在所述第一导电迹线和所述第二导电迹线之间插入绝缘膜。对于小于5米的迹线长度，在印刷有防护迹线时所述第一导电迹线和所述第二导电迹线提供双绞线的电磁兼容性。

Description

用于印刷线缆安装的方法和具有集成线束系统的复合元件
技术领域
本发明涉及一种用于线缆安装的方法，该方法将导电迹线印刷到飞行器的表面上以构成线束系统的电路，并且涉及一种用于飞行器的、具有集成线束系统的复合元件。
背景技术
传统上，线缆布线遍布整个飞行器，并且尤其是使用线缆布线线束布线穿过飞行器机身，这些线缆布线线束是用于组装线缆(同轴线缆和双绞线线缆)的基本上不可弯曲的结构构件。安装包括大量线缆和若干单独线束的线束系统是昂贵且费力的过程，并且其中，必须执行零件钻孔和螺纹连接动作。因此，当前用于线束系统的安装过程可能非常耗时，尤其是在处理复杂位置时(例如，用于飞行器门的线束系统包括有待组装在如图1所示的飞行器门上的24根线缆)。
目前，每次线束线缆安装都必须经历支撑件安装过程，该过程包括在线缆安装和线缆连接过程之前的零件钻孔、螺纹连接、和/或粘合技术，如图2所示。线束线缆安装可能是昂贵的程序，其需要准确的过程控制以避免损害系统质量和性能。另外，传统的线缆安装程序会增加交付周期、材料成本，并含有人为缺陷。
因此，期望的是简化当前的线缆安装方法并解决上述缺点的用于在线束系统中进行线缆安装的方法。
发明内容
利用所提出的用于在飞行器的线束系统中进行线缆安装的方法，可以通过至少避免在线缆安装和线缆连接过程之前的支撑件安装过程来简化当前的线束线缆安装过程。因此，在一个方面，本发明涉及一种用于在线束系统中进行线缆安装的方法，该方法包括在飞行器机身的表面或任何其他结构上印刷预定数量的独立导电迹线对。对于小于5米的迹线长度小于并且当迹线印刷有防护迹线以减少串扰时，独立导电迹线对之间的电磁兼容性相当于通过传统线束系统中所使用的双绞线而实现的电磁兼容性。通常，防护迹线在两个端部处接地。
在优选实施例中，制造了用于飞行器的、具有集成线束系统的复合元件。线束系统通过利用用于印刷电子设备的印刷技术在复合元件的表面上印刷预定数量的导电迹线对来获得。印刷技术允许在飞行器的复合元件上施涂金属印刷路径。用于电子设备的印刷技术可以在各种基质上形成电气装置，并意味着低成本工艺。根据本发明使用的印刷技术的实例是基于墨料的技术(例如如气溶胶喷射的喷墨印刷)和基于粉末的技术(例如气体动力冷喷涂(gas dynamic cold spray，CS))。铜以及其他导体非常适合具有34Ω/km的最大线性电阻的印刷线缆的电气性能。
前述印刷技术提供了粘合稳定性，以避免金属印刷路径的剥离。另外，所施涂的印刷路径实现了用于支持系统的电气要求(主要是电流和线性电阻)的正确厚度。
在根据本披露的一个实例中，线束系统是用于飞行器门的系统，并且其中，金属印刷路径基于任何前述技术印刷在碳纤维增强聚合物框架(以下称为CFRP)门表面上。
利用所提出的方法，不再需要支撑件安装过程，从而避免了材料成本支出。另外，所提出的方法是避免人为缺陷、减少制造步骤和维护的自动化过程。另外，所提出的方法有助于节省时间、成本和资源。另外，电子印刷允许缩短安装持续时间；因此，可以缩短交付时间并且节省相关资源。由于导电迹线或金属路径是自动印刷的，所以可以进行多功能模块化，因此可以减少组装费用。另外，与传统系统相比，固体零件的数量减小，相应重量减少，并且因此可用空间增大。
附图说明
为了更好地理解以上说明并且仅为了提供实例的目的，将一些非限制性附图包括在内，这些非限制性附图示意性地描绘实际实施例。
图1示出了飞行器门的传统线束系统；
图2示出了传统线缆安装过程的框图；
图3示出了根据本披露的使用气溶胶喷射作为印刷技术的在线束系统上进行印刷线缆安装的第一框图；
图4示出了根据本披露的使用冷喷涂作为印刷技术在线束系统上进行印刷线缆安装的第二框图。
具体实施方式
图1示出了飞行器门的传统线束系统100。如之前所提到的，在一些飞行器中，线束系统可以包括24根线缆，这些线缆实现必须装组装在飞行器门上的结合、接地、供电、以及模拟功能。这个组件复杂、昂贵，并且受到维护和老化的影响。
图2示出了传统线缆安装过程的框图200。框图200包括用于加工CFRP表面的方框201，使得通过受控的材料去除工艺将所述CFRP表面切割成期望的最终形状和尺寸。框图200包括用于支撑件安装的方框202，支撑件安装可以包括涉及需要准确过程控制以避免损害系统质量和性能的昂贵程序的若干步骤，如钻孔/螺纹连接和/或粘合技术。另外，框图200包括用于线缆安装的方框203和用于线缆连接的方框204。
图3示出了用于在飞行器机身的CFRP表面的线束系统中进行印刷线缆安装的框图300。使用气溶胶喷射作为印刷技术来印刷导电迹线。框图300包括用于加工CFRP表面的方框301，使得通过受控的材料去除工艺将所述CFRP表面切割成期望的最终形状和尺寸。框图300进一步包括用于清洁CFRP表面的方框302。框图300进一步包括方框303，用于通过使用气溶胶喷射在CFRP表面上印刷金属路径对。
框图300进一步包括方框304，用于进行激光烧结以烧结包含在金属路径中的粉末材料。烧结是由包含在金属印刷路径中的导电粉末压实并形成固体导电材料块的过程。烧结可以通过利用激光施加热量而不将其熔化到液化点来进行。
框图300进一步包括方框305，用于在金属印刷路径对之间进行线缆隔离。为了获得正确的导电性，并因此获得最小的线性电阻并消除串扰，在金属路径对之间插入绝缘膜。绝缘膜在所述金属路径对之间提供屏蔽和保护。
框图300进一步包括方框306，用于在施涂预定数量的金属路径对作为线束系统的一部分之后通过连接电压源、负载等来构成电路。在实例中，线束系统是为飞行器门构建的，该线束系统包括192条金属印刷路径，这些路径被分组成96对，这些对与24条绞合电缆相对应。
图4示出了用于在飞行器机身的CFRP表面的线束系统中进行印刷线缆安装的框图400。使用冷喷涂作为印刷技术来印刷金属路径。框图400包括用于加工CFRP表面的方框401。框图400进一步包括用于清洁并保护CFRP表面的方框402。框图400进一步包括方框403，用于通过使用冷喷涂在CFRP表面上印刷金属路径对。
框图400进一步包括方框404，用于进行激光烧结以烧结包含在金属路径中的粉末材料。框图400进一步包括方框405，用于在金属印刷路径对之间进行线缆隔离，以实现双绞线线缆的电气益处并且获得最小的线性电阻。框图400进一步包括方框406，用于在施涂线束系统所需的预定数量的导电金属路径对之后构成电路。
尽管已经参考了本发明的特定实施例，但对本领域技术人员显而易见的是，本文描述的避雷装置易于进行多种变化和修改，并且提及的所有细节可以被其他技术的等同细节替代而不脱离所附权利要求限定的保护范围。

Claims (13)

1.一种用于在飞行器线束系统中进行印刷线缆安装的方法，所述方法包括：
利用印刷技术将包括导电颗粒的至少第一导电迹线印刷(303，403)到飞行器的表面上；
利用所述印刷技术将包含导电颗粒的至少第二导电迹线印刷(303，403)到所述飞行器表面上，
借助激光来烧结(304，404)所述第一导电迹线和所述第二导电迹线；
在所述第一导电迹线与所述第二导电迹线之间插入(305，405)绝缘膜，
其中，对于小于5米的迹线长度，并且在印刷有防护迹线时所述第一导电迹线和所述第二导电迹线提供双绞线的电磁兼容性。
2.如权利要求2所述的方法，进一步包括：在印刷所述第一导电迹线和所述第二导电迹线之前清洁(302)所述飞行器的表面。
3.如权利要求3所述的方法，进一步包括在印刷所述第一导电迹线和所述第二导电迹线之前保护(402)所述飞行器的表面。
4.如权利要求1至3所述的方法，其中，所述印刷技术包括基于墨料的印刷。
5.如权利要求4所述的方法，其中，所述基于墨料的印刷技术包括气溶胶喷射。
6.如权利要求1至3所述的方法，其中，所述印刷技术包括基于粉末的印刷。
7.如权利要求6所述的方法，其中，所述基于粉末的印刷技术包括冷喷涂。
8.如权利要求1至7所述的方法，包括使用铜作为用于所述印刷技术的导体。
9.一种用于飞行器的、具有集成线束系统的复合元件，所述复合元件包括利用印刷技术施涂在所述复合元件的表面上的多个导电迹线对，
其中，每个导电迹线对包括：
-第一导电迹线和第二导电迹线；以及
-插入在所述第一导电迹线和所述第二导电迹线之间的绝缘膜，
其中，对于小于5米的迹线长度并且对于每个导电迹线对，在印刷有防护迹线时所述第一导电迹线和所述第二导电迹线提供双绞线的电磁兼容性，并且
其中，所述多个导电迹线对构成飞行器线束系统的电路。
10.如权利要求9所述的复合元件，其中，所述印刷技术包括基于墨料的印刷。
11.如权利要求9所述的复合元件，其中，所述印刷技术包括基于粉末的印刷。
12.如权利要求9至11所述的复合元件，其中，所述复合元件是机身区段的一部分。
13.如权利要求9至11所述的复合元件，其中，所述复合元件是飞行器门。
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