Color film substrate and manufacturing method thereof
Technical Field
The invention belongs to the field of display panels, and particularly relates to a color film substrate and a manufacturing method thereof.
Technical Field
Fig. 1 is a schematic view of a conventional display panel, as shown in fig. 1, the conventional display panel includes two areas, namely a display area 100 and a non-display area 200(Dummy area), a virtual color resist layer 03(Dummy RGB) is disposed at a boundary between the display area 100 and the non-display area 200, and a spacer (not shown) is disposed on the virtual color resist layer 03, and the size of the spacer is the same as that of a Sub spacer (Sub PS) in the display area.
Fig. 2 is a schematic cross-sectional view of a display region and a non-display region, as shown in fig. 2, the display region 100 and the non-display region 200 are both provided with a black matrix 02(BM), except that the non-display region 200 is laid with the whole black matrix 02, and the display region is a stripe (slit-shaped) black matrix 02 provided with an opening, when coating RGB color layers, since the color resists before exposure are liquid substances with certain viscosity, and the partial color resists flow to an opening region of the black matrix in the display region 100, the final film thickness height of the RGB color layers in the display region 100 is obviously lower than the total height of the virtual resist layer 03, and the difference in film layer height at the positions of the display region 100 and the virtual resist layer 03 easily causes peripheral display defects.
If the virtual color resist layer 03 is directly removed, the thickness of the film layer may collapse, and accumulation of the liquid crystal alignment liquid PI at the boundary between the display area 100 and the non-display area 200 is likely to occur; if the spacer on the virtual color resist layer is removed, the edge of the display panel will collapse due to the thickness of the cell, which is likely to cause the edge of the display panel to be blackened. Therefore, the film layer height difference at the positions of the display area 100 and the virtual color resist layer 03 cannot be reduced only by the planarization layer (OC) without changing the spacer design on the current virtual color resist layer 03.
Disclosure of Invention
The invention provides a color film substrate and a manufacturing method thereof.A non-display area virtual color resistance layer is provided with an opening area, so that part of a flat layer flows into the opening area when the flat layer is coated, the height of the virtual color resistance layer is effectively reduced, and the film layer heights of the display area and the virtual color resistance layer are uniform.
The technical scheme of the invention is as follows:
the invention discloses a color film substrate, which comprises a display area and a non-display area, and also comprises: a substrate; the black matrix is positioned on the substrate, and is in an array shape in the display area and in a sheet shape in the non-display area; the color resistance layer comprises a first color resistance layer positioned on the display area and between adjacent black matrixes and a virtual color resistance layer positioned on the non-display area and on the black matrixes, and the virtual color resistance layer is provided with an opening area; a planarization layer covering the color resist layer; and a spacer positioned on the planarization layer and disposed between adjacent color layers.
Preferably, the spacer comprises a main spacer and an auxiliary spacer, the main spacer is located above the first color resistance layer, and the auxiliary spacers are located above the first color resistance layer and above the virtual color resistance layer.
Preferably, the opening area depth is a part of the thickness of the virtual color resistance layer.
Preferably, the depth of the opening area is the thickness of the virtual color resistance layer.
Preferably, the thickness of the flat layer above the first color resist layer is greater than the thickness of the flat layer above the virtual color resist layer.
The invention also discloses a manufacturing method of the color film substrate, which comprises the following steps:
s1: forming a black matrix on a substrate, wherein the black matrix is in an array shape in a display area and is in a sheet shape in a non-display area;
s2: forming a color resistance layer on the basis of the step S1;
s3: forming a planarization layer covering the color resist layer on the basis of step S2;
s4: forming a spacer on the flat layer on the basis of the step S3;
the color resistance layer consists of a plurality of color layers and comprises a first color resistance layer which is positioned on the display area and between the adjacent black matrixes and a virtual color resistance layer which is positioned on the non-display area and on the black matrixes, wherein the virtual color resistance layer is provided with an opening area; the spacers are located between adjacent color layers.
Preferably, the spacer comprises a main spacer and an auxiliary spacer, the main spacer is located above the first color resistance layer, and the auxiliary spacers are located above the first color resistance layer and above the virtual color resistance layer.
The invention can bring at least one of the following beneficial effects:
according to the invention, the design of the virtual color resistance layer in the non-display area is changed, and the opening area is arranged on the virtual color resistance layer, so that when the flat layer is coated, part of the flat layer flows into the opening area, thus the height of the virtual color resistance layer is effectively reduced, the membrane layer heights of the display area and the virtual color resistance layer are uniform, and the phenomenon of poor display of the periphery of the panel is avoided.
Drawings
The present invention will be further described in the following detailed description of preferred embodiments, which is to be read in connection with the accompanying drawings.
FIG. 1 is a schematic diagram of a conventional display panel;
fig. 2 is a schematic cross-sectional view of a display area and a non-display area on a conventional display panel;
fig. 3 is a schematic cross-sectional view of a color filter substrate according to the present invention;
FIG. 4 is a top view of a color resist layer of the present invention;
FIG. 5 is a schematic view of another embodiment of a color resist layer of the present invention;
FIG. 6 is a schematic cross-sectional view of another embodiment of the color resist layer of the present invention.
Detailed Description
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following description will be made with reference to the accompanying drawings. It is obvious that the drawings in the following description are only some examples of the invention, and that for a person skilled in the art, other drawings and embodiments can be derived from them without inventive effort.
For the sake of simplicity, the drawings only schematically show the parts relevant to the present invention, and they do not represent the actual structure as a product. In addition, in order to make the drawings concise and understandable, components having the same structure or function in some of the drawings are only schematically illustrated or only labeled. In this document, "one" means not only "only one" but also a case of "more than one".
The invention provides a color film substrate which comprises a display area 100 and a non-display area 200. Fig. 3 is a schematic cross-sectional view of a color filter substrate according to the present invention.
As shown in fig. 3, the color filter substrate further includes: a substrate 01; a black matrix 02 on the substrate 01, the black matrix 02 being in the form of an array in the display region 100 and in the form of a sheet in the non-display region 200; a color resist layer 03 composed of a plurality of color layers; a planarization layer 04 over the color resist layer 03; and a spacer 05 on the flat layer 04 and placed between adjacent color layers.
Fig. 4 is a top view of the color resist layer 03, which includes a first color resist layer 031 located between the display area 100 and the adjacent black matrix 02 and a virtual color resist layer 032 located on the non-display area 200 and the black matrix 02.
The first color resist layer 031 and the virtual color resist layer 032 each include a plurality of color layers such as a red color layer, a green color layer, and a blue color layer.
An opening area 300 is provided on each color layer of the virtual color resist layer 032.
The flat layer 04 covers the first color resist layer 031, the virtual color resist layer 032, and the opening area 300.
The spacers 05 include a main spacer 051 and an auxiliary spacer 052 above the first color resistance layer 031, and an auxiliary spacer 052 above the virtual color resistance layer 032.
The shock insulator 05 comprises a main shock insulator 051 and an auxiliary shock insulator 052, the main shock insulator 051 is located above the first color resistance layer 031, and the auxiliary shock insulators 052 are located above the first color resistance layer 031 and the virtual color resistance layer 032.
The black matrix 02 on the color filter substrate is used as a light shielding layer, and the substrate 01 is divided into a display area 100 and a non-display area 200 according to the shape of the light shielding layer, wherein the black matrix 02 in the display area 100 is in an array shape, and the black matrix 02 in the non-display area 200 is in a whole-surface sheet shape around the substrate 01 for achieving a better light shielding effect.
Note that the color resist layer 03 shown in the embodiment of the present invention is composed of RGB color layers, but the present invention is not limited to these three color layers.
The technical solution of the present invention is described in detail with specific examples below.
The first embodiment is as follows:
in this embodiment, the depth of the opening 300 on the virtual color resist 032 is the thickness of the virtual color resist 032, that is, the opening 300 needs to be formed by digging a certain area on the virtual color resist 032 along the film thickness direction. Thus, when the planarization layer 04 is coated (not exposed and cured) later, the planarization layer liquid flows into the opening area 300 of the virtual resist 032 due to the fluidity of the planarization layer liquid, so as to reduce the thickness of the planarization layer 04 above the virtual resist 032, and the thickness of the planarization layer 04 above the virtual resist 032 is significantly smaller than the thickness of the planarization layer 04 above the first resist 031.
By combining the main spacer 051 and the auxiliary spacer 052 positioned above the first color resistance layer 031 and the auxiliary spacer 052 positioned above the virtual color resistance layer 032, because the height of the main spacer 051 is higher than that of the auxiliary spacer 052, the thickness of the film layer of the display area 100 on the substrate 01 is finally the same as the thickness of the total film layer at the position of the virtual color resistance layer 032, and the phenomenon of poor peripheral display is avoided.
The area of the opening area 300 on the virtual color resist layer 032 is not limited, and the area of the opening area 300 can be adjusted according to the difference between the total height of the display area 100 and the total height of the virtual color resist layer 032. The shape of the opening area 300 is not limited, and may be a square shape or a circular shape, as shown in fig. 5.
In addition to the depth of the opening area 300 on the virtual color resist layer 032 mentioned in this embodiment being equal to the thickness of the virtual color resist layer 032, the depth of the opening area 300 of the present invention may also be only a part of the thickness of the virtual color resist layer 032, as shown in fig. 6, the specific depth of the opening area 300 in this embodiment may also be adjusted according to the difference between the height of the film layer in the display area 100 and the height of the film layer at the position of the virtual color resist layer 032.
The invention also discloses a manufacturing method of the color film substrate, which comprises the following steps:
s1: forming a black matrix 02 on a substrate, the black matrix 02 being in the form of an array in the display area 100 and in the form of a sheet in the non-display area 200;
s2: forming a color resist layer 03 on the basis of step S1;
s3: forming a flat layer 04 covering the color resist layer 03 on the basis of step S2;
s4: forming spacers 05 on the flat layer 04 and interposed between the adjacent color layers on the basis of step S3;
the color resist layer 03 is composed of a plurality of color layers, and includes a first color resist layer 031 located on the display area 100 and between adjacent black matrices, and a virtual color resist layer 032 located on the non-display area 200 and on the black matrices, where the virtual color resist layer 032 is provided with an opening area 300.
In the process of making the opening area 300 of the virtual color resist 032, only a common photomask is needed to be used, and a semi-permeable mask is not needed, so that the cost is saved.
The spacers 05 include a main spacer 051 and an auxiliary spacer 052 above the first color barrier 031, and an auxiliary spacer 052 above the virtual color barrier 032.
In the process of manufacturing the spacer 05, the spacer 05 needs to be manufactured between adjacent color layers, and at the non-display area 200, the spacer 05 needs to avoid the opening area 300 of the virtual color resist 032 so as not to affect the total film thickness.
Because of the existence of the opening 300 on the virtual resist 032, when the flat layer 04 is coated subsequently (not exposed and cured at this time), the liquid flows into the opening 300 of the virtual resist 032 due to the fluidity of the liquid, so that the thickness of the flat layer 04 above the virtual resist 032 is reduced, and the thickness of the flat layer 04 above the first resist 031 is greater than the thickness of the flat layer 04 above the virtual resist 032.
After the main spacer 051 and the auxiliary spacer 052 which are positioned above the first color resistance layer 031 and the auxiliary spacer 052 which are positioned above the virtual color resistance layer 032 are manufactured, because the main spacer 051 is higher than the auxiliary spacer 052, the thickness of the film layer of the display area 100 on the finally formed substrate 01 is the same as the thickness of the total film layer at the position of the virtual color resistance layer 032, the uniformity of the thickness of the whole color film substrate box is maintained, the thick collapse of the peripheral box of the display panel is avoided, and the phenomenon of poor peripheral display is avoided.
According to the color film substrate provided by the invention, by changing the design of the virtual color resist 032 in the non-display area 300, the opening area 300 is arranged on the virtual color resist 032, so that when the flat layer 04 is coated, part of the flat layer 04 flows into the opening area 300, the film layer height at the virtual color resist 032 is effectively reduced, and the film layer heights at the display area and the virtual color resist are uniform.
It should be noted that the above mentioned embodiments are only preferred embodiments of the present invention, but the present invention is not limited to the details of the above embodiments, and it should be noted that, for those skilled in the art, it is possible to make various modifications and amendments within the technical concept of the present invention without departing from the principle of the present invention, and various modifications, amendments and equivalents of the technical solution of the present invention should be regarded as the protection scope of the present invention.