CN110576072A - Preparation method of multilayer pure copper-brass composite board - Google Patents

Preparation method of multilayer pure copper-brass composite board Download PDF

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Publication number
CN110576072A
CN110576072A CN201810590545.0A CN201810590545A CN110576072A CN 110576072 A CN110576072 A CN 110576072A CN 201810590545 A CN201810590545 A CN 201810590545A CN 110576072 A CN110576072 A CN 110576072A
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pure copper
brass
multilayer
percent
plates
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CN110576072B (en
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李玉胜
李建生
王帅卓
毛庆忠
刘艳芳
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Nanjing Tech University
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Nanjing Tech University
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B21MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21CMANUFACTURE OF METAL SHEETS, WIRE, RODS, TUBES OR PROFILES, OTHERWISE THAN BY ROLLING; AUXILIARY OPERATIONS USED IN CONNECTION WITH METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL
    • B21C37/00Manufacture of metal sheets, bars, wire, tubes or like semi-manufactured products, not otherwise provided for; Manufacture of tubes of special shape
    • B21C37/02Manufacture of metal sheets, bars, wire, tubes or like semi-manufactured products, not otherwise provided for; Manufacture of tubes of special shape of sheets
    • CCHEMISTRY; METALLURGY
    • C22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22FCHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • C22F1/02Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working in inert or controlled atmosphere or vacuum
    • CCHEMISTRY; METALLURGY
    • C22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22FCHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • C22F1/08Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Pressure Welding/Diffusion-Bonding (AREA)

Abstract

The invention discloses a preparation method of a multilayer pure copper-brass composite board. Firstly, stacking pure copper and brass plates with the thickness of 0.1-5 mm in a multi-layer mode, and then tightly welding the pure copper and the brass plates together by using a diffusion pressure welding treatment means; finally, the multilayer pure copper-brass composite plate with the soft and hard alternate structure is obtained through the traditional cold rolling and annealing process. The metallographic result of the multilayer pure copper-brass composite plate prepared by the invention shows that the interface of the multilayer pure copper-brass composite plate is tightly combined, and the mechanical experiment result shows that the multilayer pure copper-brass composite plate has good strength and plasticity.

Description

Preparation method of multilayer pure copper-brass composite board
Technical Field
The invention relates to the field of preparation of structural materials, in particular to a preparation method of a multilayer pure copper-brass composite plate.
Background
Copper and copper alloys are non-ferrous metals having a very close relationship with humans, and are widely used in the fields of electrical, light industry, machine manufacturing, construction industry, defense industry, and the like. Pure copper has excellent electrical and thermal conductivity, however, its strength is low (coarse-grained tensile strength is about 200MPa), limiting its further applications. The pure copper is added with Zn, Ni, Sn and other elements to form different copper alloys, so that the strength, the processability, the corrosion resistance and the like of the pure copper can be improved, and the application of the pure copper in related industrial fields is further expanded.
The preparation of multilayer composites has long been recognized as an effective method of adjusting the overall properties of the material. Recently, scholars such as Ma Xiaolong and the like adopt a cold deformation and annealing process to prepare a multilayer composite plate of pure copper and brass, and the result of mechanical test shows that: the multilayer pure copper-brass composite board produced in the mode has excellent mechanical properties, and is mainly caused by additional back stress strengthening generated when soft and hard interfaces are in coordinated deformation. However, this preparation method has many disadvantages. On one hand, two different metals are difficult to have good interface combination only depending on cold deformation, and the problem of low material utilization rate caused by cracks and poor combination property also occurs in the deformation process; on the other hand, the preparation of the multilayer composite board needs to be combined with a pack rolling deformation process, the process is complicated, and impurities are more easily introduced, so that a two-phase interface is polluted. Therefore, how to seek a new preparation method to solve the problems is very beneficial to industrial production and has great significance.
Disclosure of Invention
The invention aims to provide a preparation method of a multilayer pure copper-brass composite plate.
the technical scheme adopted for realizing the invention is as follows:
A preparation method of a multilayer pure copper-brass composite board comprises the following steps:
(1) cutting plate and removing oxide layer on surface
Cutting 0.1-5 mm thick pure copper and brass plates into the same size, mechanically polishing the upper and lower surfaces, cleaning the surface oxide layer to make the surface roughness Ra less than 1.0 μm, then cleaning in acetone solution for 10-30 min, and finally air-drying with cold air.
(2) Diffusion pressure welding process
And (3) sequentially and alternately stacking the pure copper and brass plates without the oxide layers, putting the pure copper and brass plates into a vacuum or inert gas protection pressure system, applying positive pressure between the pure copper and brass stacked plates, raising the temperature of the system to 500-900 ℃ at a heating rate of 10 ℃/min, preserving the temperature for 0.5-10 h, cooling the furnace to room temperature, and taking out.
(3) High strain reduction cold rolling treatment
And (3) carrying out cold rolling treatment of 70-95% of deformation reduction on the multilayer pure copper-brass composite plate subjected to diffusion pressure welding treatment.
(4) Heat treatment for regulating and controlling soft and hard lamellar structure
And (2) carrying out recrystallization heat treatment at 200-500 ℃ on the cold-rolled deformed multilayer pure copper-brass composite plate, keeping the temperature for 1-2 h for recrystallization, heating to a specified temperature, lofting, air cooling, and carrying out the whole process under the protection of nitrogen airflow.
Further, the pure copper used is industrial T2 grade pure copper, and its chemical composition (wt.%) requires: cu + Ag >99.90, the brass is industrial H62 brand brass, and the chemical composition (wt.%) of the brass is required to be: 60.5-63.5 percent of Cu, less than or equal to 0.15 percent of Fe, less than or equal to 0.08 percent of Pb, less than or equal to 0.005 percent of Sb, less than or equal to 0.002 percent of Bi, less than or equal to 0.01 percent of P, the balance of Zn, and less than or equal to 0.5 percent of impurity sum.
Further, the number of layers alternately stacked in (2) is at least two.
Further, the vacuum degree in (2) is less than 10-3Pa。
further, the positive pressure in the step (2) is more than 0.1 MPa.
The main purposes of the cold rolling treatment are as follows: on one hand, the thickness of the required plate can be accurately obtained by controlling the deformation reduction amount, and the controllable design of the size is facilitated; on the other hand, the multilayer pure copper and brass plates are subjected to large deformation treatment, so that the tissue structure can be regulated and controlled in the subsequent annealing process, and the purpose of regulating the tissue controllably is achieved.
Compared with the prior art, the invention has the following remarkable advantages:
1) The invention can prepare the pure copper-brass composite board with the appointed number of layers at one time through the steps of design, sample surface cleaning, stacking, diffusion pressure welding, deformation and heat treatment, and avoids the complex process of traditional pack rolling.
2) The pure copper-brass composite board prepared by the invention has a good combined interface, and the interface can effectively enhance the back stress strengthening of the material, thereby improving the comprehensive mechanical property of the material.
3) according to the invention, the high strain reduction cold rolling process is adopted to achieve accurate molding of the material, the heat treatment process can realize regulation and control of the soft and hard structures of the pure copper and the brass layers, and the controllability of the overall process is strong.
4) The invention can realize the preparation of large-size samples, has relatively simple production process and high utilization rate of raw materials.
Drawings
FIG. 1 is a flow chart of the preparation process of the multi-layer pure copper-brass composite plate in the example.
Fig. 2 is a cross-sectional hardness distribution diagram of the multilayer pure copper-brass composite plate obtained by the treatment of the example and a metallographic structure diagram of a soft-hard interface after the heat treatment at 300 ℃.
Fig. 3 is a drawing graph of a multilayer pure copper-brass composite plate after the treatment of the example.
Detailed Description
The invention is further described in detail below with reference to the figures and the specific embodiments.
Example one
First, the present embodiment adopts the following apparatus: a high-temperature diffusion pressure welding device is provided,two-roller reversible-temperature rolling mill and heat treatment tube furnace capable of filling protective gas.
the process flow chart of the preparation of the multilayer pure copper-brass composite plate in the embodiment is shown in fig. 1, and the specific operations are as follows:
The thickness of the pure copper and brass plates used in this example was 1mm, and the dimensions were 200X 200mm2The chemical composition (wt.%) of the pure copper used was: 99.94 percent of Cu, 0.0041 percent of Zn, 0.0007 percent of Pb and 0.0 percent of Sn005, Fe:0.0031, Ni:0.0028, Si:0.028, and the balance of inevitable impurities, wherein the chemical components (wt.%) of the brass are as follows: 63.25 Cu, 36.42 Zn, 0.025 Fe, 0.0005 Pb, 0.002 Sb, 0.0005 Bi, 0.004P and inevitable impurities in balance.
selecting 2 pieces of pure copper and brass plates, mechanically polishing and cleaning the upper and lower surfaces of the pure copper and brass plates, removing a surface oxide layer to ensure that the surface roughness Ra is less than 1.0 mu m, then putting the pure copper and brass plates into an acetone solution for cleaning for 30min, removing oil stains, and finally air-drying the pure copper and brass plates by cold wind.
Stacking the pure copper and brass plates with the oxide layer and the greasy dirt removed in sequence at intervals (4 layers in total) in vacuum (C)<10-3Pa), applying forward pressure (4.5t) between pure copper and brass stacked plates in a hearth of high-temperature diffusion pressure welding equipment, then raising the temperature of the system to 850 ℃ at a heating rate of 10 ℃/min, preserving the temperature for 2h, cooling the furnace to room temperature, and taking out.
And (3) carrying out cold rolling treatment with 85% deformation reduction on the 4-layer pure copper-brass composite plate subjected to diffusion pressure welding treatment to finally obtain the composite plate with the thickness of 600 micrometers, namely, the thickness of each layer is about 150 micrometers.
carrying out recrystallization heat treatment at 200 ℃ on the 4-layer pure copper-brass composite plate with the cold rolling deformation state, keeping the temperature for 2h, heating to a specified temperature for lofting, air cooling to room temperature, and carrying out the whole process under the protection of nitrogen airflow to finally obtain the soft-hard alternating pure copper and brass laminated composite plate, wherein as shown in figure 2, the brass layer is a hard layer, the hardness is about 230HV, the pure copper is a soft layer, the hardness is about 110HV, and the two-phase interface is tightly combined and has no cracks.
In this example, the yield strength of the 4-layer pure copper-brass composite board obtained by the above method is 530MPa, the tensile strength is 560MPa, the uniform elongation is 1%, and the breaking elongation is 2%. The engineering stress-engineering strain curve is shown in fig. 3, and it can be seen that the multilayer pure copper-brass composite board treated by the method of the present invention has high strength, and can promote the industrial application thereof.
Example two
First, the present embodiment adopts the following apparatus: a high-temperature diffusion pressure welding device is provided,Two-roller reversible-temperature rolling mill and heat treatment tube furnace capable of filling protective gas.
The process flow chart of the preparation of the multilayer pure copper-brass composite plate in the embodiment is shown in fig. 1, and the specific operations are as follows:
the thickness of the pure copper and brass plates used in this example was 1mm, and the dimensions were 200X 200mm2The chemical composition (wt.%) of the pure copper used was: 99.94 of Cu, 0.0041 of Zn, 0.0007 of Pb, 0.0005 of Sn, 0.0031 of Fe, 0.0028 of Ni, 0.028 of Si and the balance of inevitable impurities, wherein the chemical components (wt.%) of the brass are as follows: 63.25 Cu, 36.42 Zn, 0.025 Fe, 0.0005 Pb, 0.002 Sb, 0.0005 Bi, 0.004P and inevitable impurities in balance.
Selecting 2 pieces of pure copper and brass plates, mechanically polishing and cleaning the upper and lower surfaces of the pure copper and brass plates, removing a surface oxide layer to ensure that the surface roughness Ra is less than 1.0 mu m, then putting the pure copper and brass plates into an acetone solution for cleaning for 30min, removing oil stains, and finally air-drying the pure copper and brass plates by cold wind.
Stacking the pure copper and brass plates with the oxide layer and the greasy dirt removed in sequence at intervals (4 layers in total) in vacuum (C)<10-3Pa), applying forward pressure (4.5t) between pure copper and brass stacked plates in a hearth of high-temperature diffusion pressure welding equipment, then raising the temperature of the system to 850 ℃ at a heating rate of 10 ℃/min, preserving the temperature for 2h, cooling the furnace to room temperature, and taking out.
And (3) carrying out cold rolling treatment with 85% deformation reduction on the 4-layer pure copper-brass composite plate subjected to diffusion pressure welding treatment to finally obtain the composite plate with the thickness of 600 micrometers, namely, the thickness of each layer is about 150 micrometers.
And (2) carrying out recrystallization heat treatment at 300 ℃ on the 4-layer pure copper-brass composite plate with the cold rolling deformation, keeping the temperature for 2h, heating to a specified temperature for lofting, air cooling to room temperature, and carrying out the whole process under the protection of nitrogen airflow to finally obtain the pure copper-brass laminated composite plate with alternating hardness and softness, wherein as shown in figure 2, the brass layer is a hard layer, the hardness is about 150HV, the pure copper is a soft layer, the hardness is about 60HV, the sizes of two phases of crystal grains are obviously different, the interface is tightly combined, and no crack exists.
In this example, the 4-layer pure copper-brass composite board obtained by the above method has a yield strength of 250MPa, a tensile strength of 390MPa, a uniform elongation of 24% and an elongation at break of 27.5%. The engineering stress-engineering strain curve is shown in fig. 3, and it can be seen that the multilayer pure copper-brass composite board treated by the method of the invention has good strength plastic matching, and can greatly promote the industrial application thereof.
EXAMPLE III
First, the present embodiment adopts the following apparatus: a high-temperature diffusion pressure welding device is provided,Two-roller reversible-temperature rolling mill and heat treatment tube furnace capable of filling protective gas.
The process flow chart of the preparation of the multilayer pure copper-brass composite plate in the embodiment is shown in fig. 1, and the specific operations are as follows:
the thickness of the pure copper and brass plates used in this example was 1mm, and the dimensions were 200X 200mm2The chemical composition (wt.%) of the pure copper used was: 99.94 of Cu, 0.0041 of Zn, 0.0007 of Pb, 0.0005 of Sn, 0.0031 of Fe, 0.0028 of Ni, 0.028 of Si and the balance of inevitable impurities, wherein the chemical components (wt.%) of the brass are as follows: 63.25 Cu, 36.42 Zn, 0.025 Fe, 0.0005 Pb, 0.002 Sb, 0.0005 Bi, 0.004P and inevitable impurities in balance.
selecting 2 pieces of pure copper and brass plates, mechanically polishing and cleaning the upper and lower surfaces of the pure copper and brass plates, removing a surface oxide layer to ensure that the surface roughness Ra is less than 1.0 mu m, then putting the pure copper and brass plates into an acetone solution for cleaning for 30min, removing oil stains, and finally air-drying the pure copper and brass plates by cold wind.
Stacking the pure copper and brass plates with the oxide layer and the greasy dirt removed in sequence at intervals (4 layers in total) in vacuum (C)<10-3Pa), applying forward pressure (4.5t) between pure copper and brass stacked plates in a hearth of high-temperature diffusion pressure welding equipment, then raising the temperature of the system to 850 ℃ at a heating rate of 10 ℃/min, preserving the temperature for 2h, cooling the furnace to room temperature, and taking out.
And (3) carrying out cold rolling treatment with 85% deformation reduction on the 4-layer pure copper-brass composite plate subjected to diffusion pressure welding treatment to finally obtain the composite plate with the thickness of 600 micrometers, namely, the thickness of each layer is about 150 micrometers.
Carrying out recrystallization heat treatment at 400 ℃ on the 4-layer pure copper-brass composite plate with the cold rolling deformation state, keeping the temperature for 2h, heating to a specified temperature for lofting, air cooling to room temperature, and carrying out the whole process under the protection of nitrogen airflow to finally obtain the pure copper-brass laminated composite plate with alternating hardness and softness, wherein as shown in figure 2, the brass layer is a hard layer, the hardness is about 90HV, the pure copper is a soft layer, the hardness is about 55HV, and the two-phase interface is tightly combined and has no cracks.
In this example, the yield strength of the 4-layer pure copper-brass composite board obtained by the above method is 160MPa, the tensile strength is 335MPa, the uniform elongation is 36%, and the breaking elongation is 40%. The engineering stress-engineering strain curve is shown in fig. 3, and it can be seen that the multilayer pure copper and brass composite board treated by the method of the invention has good strength plastic matching, and can greatly promote the industrial application thereof.

Claims (6)

1. The preparation method of the multilayer pure copper-brass composite board is characterized by comprising the following steps:
S100 plate surface oxidation layer removal
Mechanically polishing and cleaning the upper and lower surfaces of the pure copper and brass plates with the thickness of 0.1-5 mm, removing surface oxide layers to enable the surface roughness Ra to be less than 1.0 mu m, then putting the pure copper and brass plates into an acetone solution for cleaning for 10-30 min, and finally air-drying the pure copper and brass plates by cold air;
S200 diffusion pressure welding process
Sequentially and alternately stacking the pure copper and brass plates without the oxide layers, putting the pure copper and brass plates into a vacuum or inert gas protection pressure system, applying positive pressure between the pure copper and brass stacked plates, raising the temperature of the system to 500-900 ℃ at a heating rate of 10 ℃/min, preserving the heat for 0.5-10 h, cooling the furnace to room temperature, and taking out;
S300 high strain reduction cold rolling treatment
Carrying out cold rolling treatment with large deformation reduction on the multilayer pure copper-brass composite plate subjected to diffusion pressure welding treatment;
S400 heat treatment for regulating and controlling soft and hard lamellar tissue
And (3) carrying out recrystallization heat treatment at 200-500 ℃ on the multi-layer pure copper-brass composite plate subjected to the cold rolling treatment, keeping the temperature for 1-2 h for recrystallization, heating to a specified temperature, lofting, air cooling, and carrying out the whole process under the protection of inert gas flow.
2. The method for preparing the multilayer pure copper-brass composite board as claimed in claim 1, wherein the pure copper is industrial T2 grade pure copper, and the chemical composition (wt.%) thereof is required to be: cu + Ag >99.90, the brass is industrial H62 brand brass, and the chemical composition (wt.%) of the brass is required to be: 60.5-63.5 percent of Cu, less than or equal to 0.15 percent of Fe, less than or equal to 0.08 percent of Pb, less than or equal to 0.005 percent of Sb, less than or equal to 0.002 percent of Bi, less than or equal to 0.01 percent of P, the balance of Zn, and less than or equal to 0.5 percent of impurity sum.
3. The method for producing a multilayer pure copper-brass composite sheet material according to claim 1, characterized in that: the inert gas introduced in the step S200 is generally argon and nitrogen, and the pressure is 100-300 Pa.
4. the method for producing a multilayer pure copper-brass composite sheet material according to claim 1, characterized in that: and the positive pressure in the S200 is more than 0.1 MPa.
5. the method for producing a multilayer pure copper-brass composite sheet material according to claim 1, characterized in that: in the step S300, a synchronous/asynchronous rolling mill is adopted, and the total rolling reduction of cold rolling is 70-95%.
6. The method for producing a multilayer pure copper-brass composite sheet material according to claim 1, characterized in that: the heating furnace described in step S400 is a tube furnace capable of filling protective gas for heat treatment, and the protective gas mainly includes nitrogen and argon, and mainly prevents oxidation.
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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112388313A (en) * 2020-10-26 2021-02-23 郑州机械研究所有限公司 Method and apparatus for producing composite strip
CN113634597A (en) * 2021-08-19 2021-11-12 安徽工程大学 Micro-nano layered copper/copper alloy composite board and preparation method thereof
CN114700603A (en) * 2022-01-05 2022-07-05 中国航空制造技术研究院 Diffusion welding method suitable for hollow layered structure part
CN115821397A (en) * 2022-12-22 2023-03-21 燕山大学 Bonded copper single crystal and atomic-scale diffusion bonding process method thereof

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CN1583303A (en) * 2004-06-09 2005-02-23 沈阳工业大学 Rolling method and apparatus for copper-aluminium double-face composite board
CN1834275A (en) * 2006-04-25 2006-09-20 东北轻合金有限责任公司 Novel composite aluminium alloy plates and prepn. method
JP2010280127A (en) * 2009-06-04 2010-12-16 Nippon Steel Corp Composite panel excellent in tensile rigidity
CN102489871A (en) * 2011-12-05 2012-06-13 贵研铂业股份有限公司 Welding method of copper and copper alloy
CN103273270A (en) * 2013-05-22 2013-09-04 周旭红 Copper-based composite material for shaped charge liner and preparation method

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Publication number Priority date Publication date Assignee Title
CN1583303A (en) * 2004-06-09 2005-02-23 沈阳工业大学 Rolling method and apparatus for copper-aluminium double-face composite board
CN1834275A (en) * 2006-04-25 2006-09-20 东北轻合金有限责任公司 Novel composite aluminium alloy plates and prepn. method
JP2010280127A (en) * 2009-06-04 2010-12-16 Nippon Steel Corp Composite panel excellent in tensile rigidity
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Publication number Priority date Publication date Assignee Title
CN112388313A (en) * 2020-10-26 2021-02-23 郑州机械研究所有限公司 Method and apparatus for producing composite strip
CN113634597A (en) * 2021-08-19 2021-11-12 安徽工程大学 Micro-nano layered copper/copper alloy composite board and preparation method thereof
CN114700603A (en) * 2022-01-05 2022-07-05 中国航空制造技术研究院 Diffusion welding method suitable for hollow layered structure part
CN114700603B (en) * 2022-01-05 2023-02-28 中国航空制造技术研究院 Diffusion welding method suitable for hollow layered structure part
CN115821397A (en) * 2022-12-22 2023-03-21 燕山大学 Bonded copper single crystal and atomic-scale diffusion bonding process method thereof

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