CN110575073A - Cooking appliance, cooking method, and computer-readable storage medium - Google Patents
Cooking appliance, cooking method, and computer-readable storage medium Download PDFInfo
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- CN110575073A CN110575073A CN201810582254.7A CN201810582254A CN110575073A CN 110575073 A CN110575073 A CN 110575073A CN 201810582254 A CN201810582254 A CN 201810582254A CN 110575073 A CN110575073 A CN 110575073A
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- refrigeration
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- temperature
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- A—HUMAN NECESSITIES
- A47—FURNITURE; DOMESTIC ARTICLES OR APPLIANCES; COFFEE MILLS; SPICE MILLS; SUCTION CLEANERS IN GENERAL
- A47J—KITCHEN EQUIPMENT; COFFEE MILLS; SPICE MILLS; APPARATUS FOR MAKING BEVERAGES
- A47J27/00—Cooking-vessels
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- A—HUMAN NECESSITIES
- A47—FURNITURE; DOMESTIC ARTICLES OR APPLIANCES; COFFEE MILLS; SPICE MILLS; SUCTION CLEANERS IN GENERAL
- A47J—KITCHEN EQUIPMENT; COFFEE MILLS; SPICE MILLS; APPARATUS FOR MAKING BEVERAGES
- A47J36/00—Parts, details or accessories of cooking-vessels
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Abstract
The present invention provides a cooking appliance, a cooking method, and a computer-readable storage medium, wherein the cooking appliance includes: refrigeration subassembly locates the lower diapire of upper cover, and refrigeration subassembly includes: semiconductor refrigeration component, semiconductor refrigeration component's cold junction is towards the inside setting of interior pot, and semiconductor refrigeration component's hot junction detachably assembles in the inside of upper cover for the inside of pot carries out cooling treatment in to. By the technical scheme, the freshness, food sanitation and edible mouthfeel of the cooked food materials are improved, and the cooking experience of a user is comprehensively improved.
Description
Technical Field
The invention relates to the technical field of cooking, in particular to a cooking appliance, a cooking method and a computer readable storage medium.
Background
As one of the most important home appliances, a cooking appliance has been developed to provide a user with a more sanitary and delicious cooked food.
In the related art, the cooking appliance may contain food during the standby process, but the food is deteriorated due to the overhigh temperature of the inner pot, which not only seriously affects the use taste of the user, but also affects the health of the user.
Disclosure of Invention
The present invention is directed to solving at least one of the problems of the prior art or the related art.
To this end, it is an object of the present invention to provide a cooking appliance.
Another object of the present invention is to provide a cooking method.
It is another object of the present invention to provide a computer-readable storage medium.
In order to achieve the above object, according to an aspect of the first aspect of the present invention, there is provided a cooking appliance including: refrigeration subassembly locates the lower diapire of upper cover, and refrigeration subassembly includes: semiconductor refrigeration component, semiconductor refrigeration component's cold junction is towards the inside setting of interior pot, and semiconductor refrigeration component's hot junction detachably assembles in the inside of upper cover for the inside of pot carries out cooling treatment in to.
in this technical scheme, through locating the lower diapire of upper cover with refrigeration subassembly to with the inside setting of semiconductor refrigeration component's cold junction towards interior pot, can make semiconductor refrigeration component's cold junction direct with eat the material contact, further improve refrigeration efficiency.
specifically, based on the working principle of the Peltier effect, when voltage is applied to the semiconductor refrigeration element, electrons are transferred from the cold end to the hot end, the temperature of the cold end is reduced, and the temperature of the hot end is increased, in the technical scheme of the invention, the cold end of the semiconductor refrigeration element cools the inside of the inner pot, so that the loss of cold energy on the inner pot is reduced, the freshness and the eating taste of food are improved by reducing the working condition temperature of the inside of the inner pot to the refrigeration temperature, on the other hand, because the heating component of the cooking appliance is usually arranged on the cooker body, the temperature of the upper cover of the cooking appliance is usually lower than the temperature of the cooker body, further, the hot end temperature of the semiconductor refrigeration element is arranged in the upper cover, so that the semiconductor refrigeration element can be promoted to quickly dissipate heat, meanwhile, the potential safety hazard of an electric appliance caused by overhigh temperature of the hot end can be reduced, on, or the cooker body is screwed on, so that when the refrigerating assembly breaks down, the cost for replacing or maintaining the refrigerating assembly is lower, and the disassembling mode is simpler.
In order to further improve the reliability of the semiconductor refrigeration element, the semiconductor refrigeration element and the fan can be set to start to work simultaneously, and after the semiconductor refrigeration element stops working, the fan is controlled to continue working for a preset time period so as to promote the elimination of the residual heat of the semiconductor refrigeration element.
in addition, semiconductor materials such as silicon, germanium and gallium nitride are generally used as the materials of the semiconductor refrigeration element, so that the manufacturing cost of the cooking utensil is reduced.
In any of the above technical solutions, preferably, the refrigeration assembly further includes: and the cold guide structure is detachably assembled below the cold end of the semiconductor refrigeration element and extends towards the inner bottom wall of the inner pot, and is used for guiding cold generated by the cold end of the semiconductor refrigeration element out of a cooking area of the inner pot.
in this technical scheme, through assembling the below in semiconductor refrigeration component's cold junction with leading cold structure detachably to the interior diapire of inside pot extends the setting, can directly transmit cold volume to eating the material in through leading cold structure, reduces cold volume in the loss of transmission course, simultaneously, promotes the cooling efficiency to eating the material.
Wherein, lead cold structure and select the lower metal material of heat capacity usually, can set up to lead cold structure and be one or more to can stretch out and draw back in vertical direction, when confirming the refrigeration subassembly promptly and need cooling down to eating the material, control is led cold structure and is stretched into inside the edible material of interior pot, and when confirming the refrigeration subassembly need not cool down to eating the material, control is led cold structure and is shrunk to the lower bottom wall of upper cover, with the reduction to leading cold structure and colliding and the mechanical damage that leads to.
In addition, lead cold structure and can also set up to the structure that is similar to the rib, including a center umbrella pole and a plurality of umbrella stand promptly, center umbrella pole is vertical setting, and the lower extreme and the umbrella stand of center umbrella pole are connected, the upper end of center umbrella pole contacts with semiconductor refrigeration component's cold junction, when confirming that refrigeration component needs to lower the temperature to eating the material, control a plurality of umbrella stand and open, in order to increase and lead the area of contact between cold structure and the edible material, and when confirming that refrigeration component need not lower the temperature to eating the material, control a plurality of umbrella stand and close, in order to reduce to leading cold structure to collide and the mechanical damage that leads to.
in any of the above technical solutions, preferably, the refrigeration assembly further includes: and the food-grade coating is coated on the outer side of the cold guide structure and used for isolating direct contact between the cold guide structure and food materials.
in this technical scheme, set up the food level coating through the outside cladding at cold conduction structure, on the one hand, because the thickness of food level coating can be nanometer, micron order or millimeter level, consequently, can not influence the conduction of cold volume, on the other hand, food level coating can guarantee effectively that eat the health and the health of material.
In any of the above technical solutions, preferably, the refrigeration assembly further includes: the fan is matched with the semiconductor refrigeration element and is arranged in the upper cover and used for blowing and radiating the hot end of the semiconductor refrigeration element; and the air duct hole penetrates through the shell of the upper cover and is matched with the fan, and the air duct hole is used for discharging hot air with blast heat dissipation to the atmospheric environment.
In this technical scheme, through set up fan and wind channel hole in the refrigeration subassembly, on the one hand, the fan can promote the heat dissipation of semiconductor refrigeration component's hot junction, and on the other hand, because upper cover inner space is narrow and small, through setting up the wind channel hole at the upper cover casing, can discharge the heat that semiconductor refrigeration component's hot junction produced to atmospheric environment through the wind channel hole effectively to improve the radiating efficiency, and then promote semiconductor refrigeration component's stability, reliability and electric safety.
In any of the above technical solutions, preferably, the method further includes: and the air channel is communicated with the air outlet of the air channel hole and the fan and is used for blowing hot air blown out by the fan to the air channel hole and entering the atmospheric environment through the air channel hole, wherein the air channel is an elastic pipeline or a pipeline formed by injection molding in the upper cover.
In this technical scheme, especially in the great environment of humidity, if the air of hot tide is scattered on upper cover inside non-directionally, then probably lead to the dust to stain the inner wall in upper cover, and difficult to clean, in addition, also lead to the bacterium to nourish in the upper cover easily, this will seriously influence user's culinary art experience and health, through set up the wind channel of intercommunication between wind channel hole and fan, can carry out the water conservancy diversion to hot-air effectively, adopt the wind channel of shorter route as far as possible with hot-air by in the upper cover discharge to atmospheric environment in to promote semiconductor refrigeration component's radiating efficiency, cooking utensil's cleanliness and food hygiene.
In any of the above technical solutions, preferably, the refrigeration assembly further includes: and one end of the radiating fin is arranged close to the hot end of the semiconductor refrigerating element, and the other end of the radiating fin is arranged close to the fan and used for guiding heat emitted by the hot end of the semiconductor refrigerating element out to the fan.
In the technical scheme, the radiating fins are arranged at the hot ends of the semiconductors, and the radiating fins are generally large in surface-to-body ratio, so that the radiating efficiency of the radiating fins is high, namely the heat generated by the hot ends of the semiconductor refrigerating elements is led out through the radiating fins and is continuously blown to the atmospheric environment through the fan, and the radiating effect of the hot ends of the semiconductor refrigerating elements is further improved.
in any of the above technical solutions, preferably, the refrigeration assembly further includes: the heat insulation parts are arranged on two sides of the semiconductor refrigeration element, the heat insulation parts and the radiating fins are detachably assembled, the heat insulation parts are provided with limiting through holes matched with the shape of the semiconductor refrigeration element, and the limiting through holes are used for placing the semiconductor refrigeration element.
In the technical scheme, the heat insulation parts are arranged on the two sides of the semiconductor refrigeration element, and the semiconductor refrigeration element and the radiating fin are assembled through the heat insulation parts, so that the medium conduction of the assembly element, the radiating fin and the fan is mainly realized for reducing the hot end of the semiconductor refrigeration element, namely, the heat of the semiconductor refrigeration element is radiated through the air circulation, and the electrical safety potential and the hardware failure rate of the cooking appliance are reduced.
In addition, the heat insulation part is provided with the limiting through hole matched with the shape of the semiconductor refrigeration element, so that the horizontal position of the semiconductor refrigeration element can be limited through the limiting through hole, and the structural reliability and stability of the semiconductor refrigeration element are improved.
In any of the above technical solutions, preferably, the refrigeration assembly further includes: the bearing piece is detachably assembled on the lower portion of the heat insulation portion, the upper portion of the bearing piece is used for bearing the semiconductor refrigeration element, the lower portion of the bearing piece is used for detachably assembling the cold guide structure, the horizontal position of the semiconductor refrigeration element is limited by the limiting through hole, and the vertical position of the semiconductor refrigeration element is limited by the radiating fin and the bearing piece together.
In this technical scheme, through set up detachable support in the lower part of thermal-insulated portion, on the one hand, be used for bearing semiconductor refrigeration component, in order to improve structural reliability, on the other hand, the lower part of support can detachably assemble lead cold structure, convenient to detach or change lead cold structure, for example, when confirming that need the refrigeration subassembly to cool down the edible material, assemble lead cold structure to support, and when not needing the refrigeration subassembly to cool down the edible material, with leading cold structure dismantlement, and because the lower part of semiconductor refrigeration component is wrapped by support and thermal-insulated portion this moment, consequently, the gas molecule in the cooking utensil can not stain or corrode semiconductor refrigeration component yet, and then promoted semiconductor refrigeration component's structural reliability, the fault rate of cooking utensil has been reduced.
In any of the above technical solutions, preferably, the refrigeration assembly further includes: the shape of the limiting protrusion is matched with that of the limiting groove, one of the limiting protrusion and the limiting groove is arranged at the lower part of the bearing piece, and the other of the limiting protrusion and the limiting groove is arranged at the upper part of the cold guide structure and used for detachably assembling the cold guide structure and the bearing piece.
In this technical scheme, through setting up spacing arch and the spacing groove that the shape matches and is fit for to with leading cold structure equipment in the supporting piece, the simple and assembly structure of equipment mode is reliable and stable, and wherein, spacing arch can be protruding along structure, hangers structure and buckle structure etc..
In any of the above technical solutions, preferably, the method further includes: the temperature sensor is arranged on the outer side wall of the inner pot and/or the inner side wall of the inner pot and/or the upper cover of the inner pot, and is electrically connected to the refrigeration assembly, the temperature sensor is used for detecting the working condition temperature of the inner pot in a specified working mode and triggering the refrigeration assembly to cool the inner pot when the working condition temperature is higher than a preset working condition temperature.
in the technical scheme, the working condition temperature of the inner pot is detected by arranging the temperature sensor, and whether the inner pot is triggered to be cooled or not is determined according to the working condition temperature, so that the energy efficiency of the refrigeration assembly can be effectively improved.
According to an aspect of the second aspect of the present invention, there is provided a cooking method including: detecting the working condition temperature of the inner pot according to a preset time interval in a specified working mode; when the detected working condition temperature is higher than the preset working condition temperature, the refrigeration assembly is triggered to cool the inner pot.
In this technical scheme, through when detecting operating mode temperature and being higher than preset operating mode temperature, trigger the refrigeration subassembly and cool down the processing to the inside of interior pot, can make semiconductor refrigeration component's cold junction direct with eat the material contact, further improve refrigeration efficiency and food sanitation safety.
In any one of the above technical solutions, under the designated operating mode, the operating condition temperature of the inner pot is detected according to the preset time interval, which specifically includes: determining a preset appointed cooking time; determining a preset time interval corresponding to the appointed cooking time according to the first preset relation; and under the standby working mode, detecting the working condition temperature of the inner pot according to a preset time interval.
in the technical scheme, the preset time interval corresponding to the reserved cooking time is determined according to the first preset relation, so that the energy efficiency of the refrigeration assembly can be improved, namely when the reserved cooking time is detected to be longer, the refrigeration assembly is triggered to cool the inner pot in the standby working mode, so that the material to be cooked is at the refrigeration temperature (0 ℃ -10 ℃), and the food safety and the edible mouthfeel are further improved.
In any of the above technical solutions, preferably, in the designated operating mode, the detecting of the operating condition temperature of the inner pot according to the preset time interval specifically includes: determining the ambient temperature of the cooking appliance in a standby working mode; and when the detected ambient temperature is greater than or equal to the preset ambient temperature, detecting the working condition temperature of the inner pot according to the preset time interval.
In this technical scheme, through when detecting that ambient temperature is greater than or equal to preset ambient temperature, according to the operating mode temperature of pot in the time interval that predetermines, likewise, be favorable to improving the efficiency of refrigeration subassembly, for example in winter, the indoor ambient temperature in some areas is less than 15 ℃, then need not to control the interior pot of refrigeration subassembly and cool down to reduce the consumption, but, then need strictly control the refrigeration subassembly and cool down the processing to interior pot when summer, take place with the condition that reduces rotten or bacterial growing of food.
In any of the above technical solutions, preferably, the method further includes: when the refrigeration assembly is triggered to cool the interior of the inner pot, the fan is controlled to blast and dissipate heat; when the refrigeration assembly is controlled to stop cooling the interior of the inner pot, the fan is controlled to continue to operate for a preset time.
In this technical scheme, through when triggering the cooling subassembly and carrying out the cooling treatment to the inside of interior pot, the control fan carries out the blast air heat dissipation, can improve semiconductor refrigeration component's radiating efficiency, and then promotes device reliability and stability, in addition, for further improving semiconductor refrigeration component's reliability, after semiconductor refrigeration component stop work, the control fan continues to work for a section and presets for a long time to promote the waste heat of eliminating semiconductor refrigeration component.
According to an aspect of the third aspect of the present invention, there is provided a computer-readable storage medium having stored thereon a computer program which, when executed, implements the cooking method as defined in any one of the aspects of the second aspect.
additional aspects and advantages of the invention will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the invention.
drawings
The above and/or additional aspects and advantages of the present invention will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:
Fig. 1 shows a schematic view of a cooking appliance according to an embodiment of the invention;
Fig. 2 shows a schematic view of a cooking appliance according to another embodiment of the invention;
Fig. 3 shows a schematic flow diagram of a cooking method according to an embodiment of the invention.
Detailed Description
in order that the above objects, features and advantages of the present invention can be more clearly understood, a more particular description of the invention will be rendered by reference to the appended drawings. It should be noted that the embodiments and features of the embodiments of the present application may be combined with each other without conflict.
In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention, however, the present invention may be practiced in other ways than those specifically described herein, and therefore the scope of the present invention is not limited by the specific embodiments disclosed below.
A cooking scheme according to an embodiment of the present invention will be specifically described with reference to fig. 1 to 3.
Fig. 1 shows a schematic view of a cooking appliance according to an embodiment of the present invention.
Fig. 2 shows a schematic view of a cooking appliance according to another embodiment of the present invention.
as shown in fig. 1 and 2, a cooking appliance 100 according to an embodiment of the present invention includes: refrigeration subassembly, locate the lower bottom wall of upper cover 102, refrigeration subassembly includes: the cold end of the semiconductor refrigeration element 106 faces the inside of the inner pot 104, and the hot end of the semiconductor refrigeration element 106 is detachably assembled inside the upper cover 102 and used for cooling the inside of the inner pot 104.
In this technical scheme, through locating the lower bottom wall of upper cover 102 with refrigeration subassembly to set up the cold junction of semiconductor refrigeration component 106 towards the inside of interior pot 104, can make the cold junction of semiconductor refrigeration component 106 directly contact with eating material 200, further improve refrigeration efficiency.
specifically, based on the operating principle of the peltier effect, when a voltage is applied to the semiconductor refrigeration element 106, electrons are transferred from the cold end to the hot end, the temperature of the cold end is reduced, and the temperature of the hot end is increased, in the technical scheme of the invention, the cold end of the semiconductor refrigeration element 106 performs cooling treatment on the inside of the inner pot 104, so that the loss of cold energy on the inner pot 104 is reduced, the freshness and the eating mouthfeel of food are improved by reducing the working condition temperature inside the inner pot 104 to the refrigeration temperature, on the other hand, because the heating component of the cooking appliance 100 is usually arranged on the pot body, the temperature of the upper cover 102 of the cooking appliance 100 is usually lower than the temperature of the pot body, and further, by arranging the temperature of the hot end of the semiconductor refrigeration element 106 in the upper cover 102, the rapid heat dissipation of the semiconductor refrigeration element 106 can be promoted, and meanwhile, the potential safety hazard of an, on the other hand, since the upper lid 102 is usually connected to the pot body by a hinge or screwed to the pot body, when the refrigerating assembly fails, the cost for replacing or repairing the refrigerating assembly is low, and the disassembling manner is simple.
In order to further improve the reliability of the semiconductor cooling element 106, the semiconductor cooling element 106 and the fan 110 may be set to start to operate simultaneously, and after the semiconductor cooling element 106 stops operating, the fan 110 is controlled to continue to operate for a preset time period to facilitate removing the residual heat of the semiconductor cooling element 106.
In addition, semiconductor materials such as silicon, germanium and gallium nitride are generally used as the material of the semiconductor refrigeration element 106, so as to reduce the manufacturing cost of the cooking utensil 100.
In any of the above technical solutions, preferably, the refrigeration assembly further includes: and the cold guide structure 108 is detachably assembled below the cold end of the semiconductor refrigeration element 106 and extends towards the inner bottom wall of the inner pot 104, and is used for guiding cold generated by the cold end of the semiconductor refrigeration element 106 out to the cooking area of the inner pot 104.
In this technical scheme, through leading cold structure 108 detachably to assemble in the below of the cold junction of semiconductor refrigeration component 106 to the interior diapire extension setting of interior pot 104, can directly transmit cold volume to eating material 200 in through leading cold structure 108, reduce cold volume in the loss of transmission process, simultaneously, promote the cooling efficiency to eating material 200.
Wherein, lead cold structure 108 and select the lower metal material of heat capacity usually, can set up and lead cold structure 108 and be one or more to can stretch out and draw back in vertical direction, when confirming that the refrigeration subassembly needs to lower the temperature to eating material 200 promptly, control and lead cold structure 108 and stretch into in the edible material 200 of pot 104 inside, and when confirming that the refrigeration subassembly need not lower the temperature to eating material 200, control and lead cold structure 108 and shrink to the lower bottom wall of upper cover 102, with the reduction to leading cold structure 108 and collide and the mechanical damage that leads to.
In addition, lead cold structure 108 and can also set up to the structure similar to the rib, include a center umbrella pole and a plurality of umbrella stand promptly, center umbrella pole is vertical setting, and the lower extreme and the umbrella stand of center umbrella pole are connected, the upper end of center umbrella pole contacts with the cold junction of semiconductor refrigeration component 106, when confirming that refrigeration component needs to cool down edible material 200, control a plurality of umbrella stand and open, in order to increase and lead the area of contact between cold structure 108 and the edible material 200, and when confirming that refrigeration component need not cool down edible material 200, control a plurality of umbrella stand and close, in order to reduce to leading cold structure 108 and collide and the mechanical damage that leads to.
In any of the above technical solutions, preferably, the refrigeration assembly further includes: and the food-grade coating 124 is coated on the outer side of the cold guide structure 108 and used for isolating the direct contact between the cold guide structure 108 and the food material 200.
In the technical scheme, the food-grade coating 124 is coated on the outer side of the cold guide structure 108, so that on one hand, the thickness of the food-grade coating 124 can be in a nanometer level, a micron level or a millimeter level, and therefore, the conduction of cold energy cannot be influenced, and on the other hand, the food-grade coating 124 can effectively guarantee the health and hygiene of the food material 200.
In any of the above technical solutions, preferably, the refrigeration assembly further includes: a fan 110, which is disposed inside the upper cover 102 in a manner matching with the semiconductor cooling element 106, and is used for blowing and radiating the hot end of the semiconductor cooling element 106; and an air duct hole 112 penetrating the housing of the upper cover 102 and disposed in cooperation with the fan 110, wherein the air duct hole 112 is used for discharging hot air generated by air blowing and heat dissipation to the atmosphere.
In this technical scheme, through setting up fan 110 and wind channel hole 112 in the refrigeration subassembly, on the one hand, fan 110 can promote the heat dissipation of the hot end of semiconductor refrigeration component 106, and on the other hand, because upper cover 102 inner space is narrow and small, through setting up wind channel hole 112 at upper cover 102 casing, can discharge the heat that the hot end of semiconductor refrigeration component 106 produced to atmospheric environment through wind channel hole 112 effectively to improve the radiating efficiency, and then promote stability, reliability and the electric safety of semiconductor refrigeration component 106.
As shown in fig. 2, the upper cover 102, the fan 110 and the heat sink 116 are assembled by screws 132.
In any of the above technical solutions, preferably, the method further includes: and an air duct 114, which is communicated with the air duct hole 112 and the air outlet of the fan 110, and is used for blowing the hot air blown out by the fan 110 to the air duct hole 112 and entering the atmosphere environment through the air duct hole 112, wherein the air duct 114 is an elastic pipeline, or the air duct 114 is a pipeline injection-molded in the upper cover 102.
in this technical solution, especially in an environment with a high humidity, if hot air diffuses in a non-directional manner inside the upper cover 102, it may cause dust to stain the inner wall of the upper cover 102 and is difficult to clean, and in addition, it may also easily cause bacteria to breed in the upper cover 102, which will seriously affect the cooking experience and the health of the user, by providing the air duct 114 communicating between the air duct hole 112 and the fan 110, it is possible to effectively guide the hot air, and the air duct with a short path is adopted as much as possible to exhaust the hot air from the inside of the upper cover 102 to the atmosphere, so as to improve the heat dissipation efficiency of the semiconductor cooling element 106, the cleanliness of the cooking appliance 100, and the food hygiene.
in any of the above technical solutions, preferably, the refrigeration assembly further includes: and one end of the heat sink 116 is arranged close to the hot end of the semiconductor refrigeration element 106, and the other end of the heat sink 116 is arranged close to the fan 110, and is used for guiding heat emitted by the hot end of the semiconductor refrigeration element 106 out to the fan 110.
In this technical solution, by providing the heat sink 116 at the hot end of the semiconductor, because the heat sink 116 is generally larger in surface-to-body ratio, the heat dissipation efficiency of the heat sink 116 is larger, that is, the heat generated at the hot end of the semiconductor cooling element 106 is conducted out by the heat sink 116 and is continuously blown to the atmosphere by the fan 110, so that the heat dissipation effect at the hot end of the semiconductor cooling element 106 is further improved.
in any of the above technical solutions, preferably, the refrigeration assembly further includes: the heat insulation part 118 is arranged on two sides of the semiconductor refrigeration element 106, the heat insulation part 118 and the radiating fins 116 are detachably assembled, the heat insulation part 118 is provided with a limiting through hole 126 matched with the shape of the semiconductor refrigeration element 106, and the limiting through hole 126 is used for placing the semiconductor refrigeration element 106.
In the technical scheme, the heat insulation parts 118 are arranged on the two sides of the semiconductor refrigeration element 106, and the semiconductor refrigeration element 106 and the heat radiating fins 116 are assembled through the heat insulation parts 118, so that the medium conduction of the hot end of the semiconductor refrigeration element 106 to the assembly element, the heat radiating fins 116 and the fan is mainly reduced, namely the heat of the semiconductor refrigeration element 106 is radiated through air circulation, and the electrical safety hazard and the hardware failure rate of the cooking appliance 100 are reduced.
In addition, the heat insulation part 118 is provided with the limiting through hole 126 matched with the shape of the semiconductor refrigeration element 106, so that the horizontal position of the semiconductor refrigeration element 106 can be limited through the limiting through hole 126, and the structural reliability and stability of the semiconductor refrigeration element 106 are improved.
In any of the above technical solutions, preferably, the refrigeration assembly further includes: the supporting piece 120 is detachably assembled at the lower part of the thermal insulation part 118, the upper part of the supporting piece 120 is used for bearing the semiconductor refrigeration element 106, the lower part of the supporting piece 120 is used for detachably assembling the cold guide structure 108, wherein the horizontal position of the semiconductor refrigeration element 106 is limited by the limiting through hole 126, and the vertical position of the semiconductor refrigeration element 106 is limited by the heat sink 116 and the supporting piece 120 together.
In this technical solution, the detachable support 120 is disposed at the lower portion of the heat insulation portion 118, on one hand, the detachable support is used for supporting the semiconductor refrigeration element 106 to improve structural reliability, and on the other hand, the cold guide structure 108 can be detachably assembled at the lower portion of the support 120, so that the cold guide structure 108 can be conveniently detached or replaced, for example, when it is determined that the refrigeration assembly is required to cool the food material 200, the cold guide structure 108 is assembled to the support 120, and when the refrigeration assembly is not required to cool the food material 200, the cold guide structure 108 is detached, and at this time, since the lower portion of the semiconductor refrigeration element 106 is covered by the support 120 and the heat insulation portion 118, gas molecules in the cooking appliance 100 do not stain or corrode the semiconductor refrigeration element 106, thereby improving structural reliability of the semiconductor refrigeration element 106, and reducing failure rate of the cooking appliance 100.
As shown in fig. 2, the heat sink 116, the heat insulating portion 118, and the support member 120 are assembled by screws 134.
In any of the above technical solutions, preferably, the refrigeration assembly further includes: the shape of the limiting protrusion 128 and the limiting groove 130 is matched, one of the limiting protrusion 128 and the limiting groove 130 is arranged at the lower part of the supporting piece 120, and the other of the limiting protrusion 128 and the limiting groove 130 is arranged at the upper part of the cold guide structure 108, so that the cold guide structure 108 and the supporting piece 120 can be detachably assembled.
In this technical solution, by providing the limiting protrusion 128 and the limiting groove 130 with matching shapes to assemble the cold guide structure 108 to the support member 120, the assembly method is simple and the assembly structure is stable and reliable, wherein the limiting protrusion 128 may be a protruding edge structure, a hanging lug structure, a buckle structure, etc.
In any of the above technical solutions, preferably, the method further includes: the temperature sensor 122 is disposed on an outer side wall of the inner pot 104, and/or on an inner side wall of the inner pot 104, and/or on the upper cover 102 of the inner pot 104, and is electrically connected to the refrigeration assembly, and is used for detecting the working condition temperature of the inner pot 104 in a specific working mode, and when detecting that the working condition temperature is higher than a preset working condition temperature, triggering the refrigeration assembly to cool the inner pot 104.
In the technical scheme, the working condition temperature of the inner pot 104 is detected by arranging the temperature sensor 122, and whether the refrigeration assembly is triggered to cool the inner pot 104 is determined according to the working condition temperature, so that the energy efficiency of the refrigeration assembly can be effectively improved.
Example three:
as shown in fig. 3, a cooking method according to an embodiment of the present invention includes: step S302, detecting the working condition temperature of the inner pot according to a preset time interval in a specified working mode; and S304, when the working condition temperature is detected to be higher than the preset working condition temperature, triggering the refrigeration assembly to cool the inner pot.
In this technical scheme, through when detecting operating mode temperature and being higher than preset operating mode temperature, trigger the refrigeration subassembly and cool down the processing to the inside of interior pot, can make semiconductor refrigeration component's cold junction direct with eat the material contact, further improve refrigeration efficiency and food sanitation safety.
In any one of the above technical solutions, under the designated operating mode, the operating condition temperature of the inner pot is detected according to the preset time interval, which specifically includes: determining a preset appointed cooking time; determining a preset time interval corresponding to the appointed cooking time according to the first preset relation; and under the standby working mode, detecting the working condition temperature of the inner pot according to a preset time interval.
In the technical scheme, the preset time interval corresponding to the reserved cooking time is determined according to the first preset relation, so that the energy efficiency of the refrigeration assembly can be improved, namely when the reserved cooking time is detected to be longer, the refrigeration assembly is triggered to cool the inner pot in the standby working mode, so that the material to be cooked is at the refrigeration temperature (0 ℃ -10 ℃), and the food safety and the edible mouthfeel are further improved.
In any of the above technical solutions, preferably, in the designated operating mode, the detecting of the operating condition temperature of the inner pot according to the preset time interval specifically includes: determining the ambient temperature of the cooking appliance in a standby working mode; and when the detected ambient temperature is greater than or equal to the preset ambient temperature, detecting the working condition temperature of the inner pot according to the preset time interval.
In this technical scheme, through when detecting that ambient temperature is greater than or equal to preset ambient temperature, according to the operating mode temperature of pot in the time interval that predetermines, likewise, be favorable to improving the efficiency of refrigeration subassembly, for example in winter, the indoor ambient temperature in some areas is less than 15 ℃, then need not to control the interior pot of refrigeration subassembly and cool down to reduce the consumption, but, then need strictly control the refrigeration subassembly and cool down the processing to interior pot when summer, take place with the condition that reduces rotten or bacterial growing of food.
In any of the above technical solutions, preferably, the method further includes: when the refrigeration assembly is triggered to cool the interior of the inner pot, the fan is controlled to blast and dissipate heat; when the refrigeration assembly is controlled to stop cooling the interior of the inner pot, the fan is controlled to continue to operate for a preset time.
In this technical scheme, through when triggering the cooling subassembly and carrying out the cooling treatment to the inside of interior pot, the control fan carries out the blast air heat dissipation, can improve semiconductor refrigeration component's radiating efficiency, and then promotes device reliability and stability, in addition, for further improving semiconductor refrigeration component's reliability, after semiconductor refrigeration component stop work, the control fan continues to work for a section and presets for a long time to promote the waste heat of eliminating semiconductor refrigeration component.
Example four:
A computer-readable storage medium according to an embodiment of the present invention, having stored thereon a computer program that, when executed, implements: detecting the working condition temperature of the inner pot according to a preset time interval in a specified working mode; when the detected working condition temperature is higher than the preset working condition temperature, the refrigeration assembly is triggered to cool the inner pot.
In this technical scheme, through when detecting operating mode temperature and being higher than preset operating mode temperature, trigger the refrigeration subassembly and cool down the processing to the inside of interior pot, can make semiconductor refrigeration component's cold junction direct with eat the material contact, further improve refrigeration efficiency and food sanitation safety.
In any one of the above technical solutions, under the designated operating mode, the operating condition temperature of the inner pot is detected according to the preset time interval, which specifically includes: determining a preset appointed cooking time; determining a preset time interval corresponding to the appointed cooking time according to the first preset relation; and under the standby working mode, detecting the working condition temperature of the inner pot according to a preset time interval.
In the technical scheme, the preset time interval corresponding to the reserved cooking time is determined according to the first preset relation, so that the energy efficiency of the refrigeration assembly can be improved, namely when the reserved cooking time is detected to be longer, the refrigeration assembly is triggered to cool the inner pot in the standby working mode, so that the material to be cooked is at the refrigeration temperature (0 ℃ -10 ℃), and the food safety and the edible mouthfeel are further improved.
In any of the above technical solutions, preferably, in the designated operating mode, the detecting of the operating condition temperature of the inner pot according to the preset time interval specifically includes: determining the ambient temperature of the cooking appliance in a standby working mode; and when the detected ambient temperature is greater than or equal to the preset ambient temperature, detecting the working condition temperature of the inner pot according to the preset time interval.
In this technical scheme, through when detecting that ambient temperature is greater than or equal to preset ambient temperature, according to the operating mode temperature of pot in the time interval that predetermines, likewise, be favorable to improving the efficiency of refrigeration subassembly, for example in winter, the indoor ambient temperature in some areas is less than 15 ℃, then need not to control the interior pot of refrigeration subassembly and cool down to reduce the consumption, but, then need strictly control the refrigeration subassembly and cool down the processing to interior pot when summer, take place with the condition that reduces rotten or bacterial growing of food.
In any of the above technical solutions, preferably, the method further includes: when the refrigeration assembly is triggered to cool the interior of the inner pot, the fan is controlled to blast and dissipate heat; when the refrigeration assembly is controlled to stop cooling the interior of the inner pot, the fan is controlled to continue to operate for a preset time.
In this technical scheme, through when triggering the cooling subassembly and carrying out the cooling treatment to the inside of interior pot, the control fan carries out the blast air heat dissipation, can improve semiconductor refrigeration component's radiating efficiency, and then promotes device reliability and stability, in addition, for further improving semiconductor refrigeration component's reliability, after semiconductor refrigeration component stop work, the control fan continues to work for a section and presets for a long time to promote the waste heat of eliminating semiconductor refrigeration component.
the technical scheme of the invention is explained in detail in the above with reference to the accompanying drawings, and the invention provides a cooking appliance, a cooking method and a computer readable storage medium.
The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the present invention, and it is apparent to those skilled in the art that various modifications and variations can be made in the present invention. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (15)
1. A cooking appliance, comprising:
Refrigeration subassembly locates the lower diapire of upper cover, refrigeration subassembly includes:
The cold end of the semiconductor refrigeration element faces the inner part of the inner pot, and the hot end of the semiconductor refrigeration element is detachably assembled in the upper cover and used for cooling the inner part of the inner pot.
2. The cooking appliance of claim 1, wherein the refrigeration assembly further comprises:
and the cold guide structure is detachably assembled below the cold end of the semiconductor refrigeration element, extends towards the inner bottom wall of the inner pot, and is used for guiding cold energy generated by the cold end of the semiconductor refrigeration element out of the cooking area of the inner pot.
3. The cooking appliance of claim 2, wherein the refrigeration assembly further comprises:
And the food-grade coating is coated on the outer side of the cold guide structure and used for isolating the direct contact between the cold guide structure and food materials.
4. The cooking appliance of claim 3, wherein the refrigeration assembly further comprises:
The fan is matched with the semiconductor refrigerating element and is arranged inside the upper cover, and is used for blowing and radiating the hot end of the semiconductor refrigerating element;
And the air duct hole penetrates through the shell of the upper cover and is matched with the fan, and the air duct hole is used for discharging the hot air subjected to blast heat dissipation to the atmospheric environment.
5. The cooking appliance of claim 4, further comprising:
An air duct, which is communicated with the air duct hole and the air outlet of the fan, and is used for blowing the hot air blown out by the fan to the air duct hole and entering the atmospheric environment through the air duct hole,
Wherein, the wind channel is the pipeline that has elasticity, perhaps the wind channel does the injection moulding in the upper cover pipeline.
6. the cooking appliance of claim 4, wherein the refrigeration assembly further comprises:
And one end of the radiating fin is arranged close to the hot end of the semiconductor refrigerating element, and the other end of the radiating fin is arranged close to the fan and used for guiding heat emitted by the hot end of the semiconductor refrigerating element out of the fan.
7. the cooking appliance of claim 6, wherein the refrigeration assembly further comprises:
The heat insulation part is arranged on two sides of the semiconductor refrigeration element, the heat insulation part and the radiating fins are detachably assembled, the heat insulation part is provided with a limiting through hole matched with the semiconductor refrigeration element in shape, and the limiting through hole is used for placing the semiconductor refrigeration element.
8. The cooking appliance of claim 7, wherein the refrigeration assembly further comprises:
The bearing piece is detachably assembled at the lower part of the heat insulation part, the upper part of the bearing piece is used for bearing the semiconductor refrigeration element, the lower part of the bearing piece is used for detachably assembling the cold guide structure,
The horizontal position of the semiconductor refrigeration element is limited by the limiting through hole, and the vertical position of the semiconductor refrigeration element is limited by the radiating fin and the supporting piece together.
9. The cooking appliance of claim 8, wherein the refrigeration assembly further comprises:
The shape of the limiting protrusion and the limiting groove are matched, one of the limiting protrusion and the limiting groove is arranged at the lower part of the bearing piece, and the other of the limiting protrusion and the limiting groove is arranged at the upper part of the cold guide structure and used for detachably assembling the cold guide structure and the bearing piece.
10. The cooking appliance of any one of claims 1 to 9, further comprising:
Temperature sensor locates the lateral wall of interior pot, and/or locate the inside wall of interior pot, and/or locate on the upper cover of interior pot, and the electricity is connected to the refrigeration subassembly for detect under appointed mode the operating mode temperature of interior pot, and detect when operating mode temperature is higher than predetermineeing operating mode temperature, trigger the refrigeration subassembly is right interior pot carries out cooling treatment.
11. A cooking method applied to the cooking appliance according to any one of claims 1 to 10, further comprising:
Detecting the working condition temperature of the inner pot according to a preset time interval in a specified working mode;
When the working condition temperature is detected to be higher than the preset working condition temperature, the refrigeration assembly is triggered to cool the inner part of the inner pot.
12. The cooking method according to claim 11, wherein the detecting of the operating temperature of the inner pot at a preset time interval in the designated operating mode specifically comprises:
Determining a preset appointed cooking time;
Determining a preset time interval corresponding to the reserved cooking time according to a first preset relation;
And under the standby working mode, detecting the working condition temperature of the inner pot according to a preset time interval.
13. the cooking method according to claim 11 or 12, wherein the detecting of the operating temperature of the inner pot at preset time intervals in the designated operating mode specifically comprises:
Determining the ambient temperature of the cooking appliance in a standby working mode;
and when the environment temperature is detected to be greater than or equal to the preset environment temperature, detecting the working condition temperature of the inner pot according to a preset time interval.
14. the cooking method according to claim 11 or 12, further comprising:
when the refrigeration assembly is triggered to cool the interior of the inner pot, the fan is controlled to blast and dissipate heat;
and when the refrigeration assembly is controlled to stop cooling the interior of the inner pot, the fan is controlled to continuously run for a preset time.
15. A computer-readable storage medium, on which a computer program is stored, which, when being executed by a processor, carries out a cooking method according to any one of claims 11 to 14.
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| CN201810582254.7A CN110575073B (en) | 2018-06-07 | 2018-06-07 | Cooking appliance, cooking method, and computer-readable storage medium |
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| CN201810582254.7A CN110575073B (en) | 2018-06-07 | 2018-06-07 | Cooking appliance, cooking method, and computer-readable storage medium |
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| CN110575073B (en) | 2022-07-08 |
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