CN110572955A - Auxiliary installation template and alignment installation method - Google Patents
Auxiliary installation template and alignment installation method Download PDFInfo
- Publication number
- CN110572955A CN110572955A CN201910870662.7A CN201910870662A CN110572955A CN 110572955 A CN110572955 A CN 110572955A CN 201910870662 A CN201910870662 A CN 201910870662A CN 110572955 A CN110572955 A CN 110572955A
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- mounting
- pins
- template
- auxiliary
- ccds
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
- H05K1/184—Components including terminals inserted in holes through the printed circuit board and connected to printed contacts on the walls of the holes or at the edges thereof or protruding over or into the holes
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/306—Lead-in-hole components, e.g. affixing or retention before soldering, spacing means
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Combinations Of Printed Boards (AREA)
Abstract
the invention discloses an auxiliary mounting template and an alignment mounting method, wherein the auxiliary mounting template is applied to alignment mounting of pins of a plurality of spliced CCDs and pad holes of a circuit board, and the auxiliary mounting template comprises: a mounting substrate; the number of the mounting holes is the same as that of the pins of the plurality of CCDs, and the arrangement of the mounting holes on the mounting substrate is the same as that of the pad holes on the circuit board. In the alignment installation process of the pins of the spliced CCDs and the pad holes of the circuit board, firstly, the pins of the spliced CCDs are aligned and installed through the installation holes of the auxiliary installation template, so that the offset condition of the pins of the spliced CCDs is improved; and then the pins of the spliced CCDs and the pad holes of the circuit board are adjusted to be quickly aligned and installed, so that the alignment and installation efficiency of the pins of the spliced CCDs and the pad holes of the circuit board is high.
Description
Technical Field
The invention relates to the technical field of electronic product assembly, in particular to an auxiliary mounting template and an alignment mounting method.
background
At present, a Charge-coupled Device (CCD) has been widely applied to the field of aerospace optical remote sensors, and with the development and practical requirements of satellite remote sensing application technology, a wide-field and high-resolution camera has become a development trend. When the total length of the pixels of the single-chip CCD cannot meet the coverage width of the field of view imaged by the camera, multiple pieces of CCD need to be connected into a wide-field-of-view detector, which is called as the splicing of the CCD. Splicing of CCDs is a special technique developed by CCD cameras, and mechanical splicing is more commonly used. As shown in fig. 1, a schematic diagram of a splicing structure of 5 CCDs is obtained by mounting a plurality of CCDs 10 on a focal plane substrate 20 according to a splicing position required by a design for splicing, and after splicing is completed, a plurality of CCDs 10 and the focal plane substrate 20 form a spliced plurality of CCDs. As shown in fig. 2, in order to implement the camera imaging function, in the following work, the pad holes of the PCB (Printed circuit board) 30 and the pads of the multiple pieces of the CCD40 need to be aligned and mounted, and then soldered, so as to complete the electrical interconnection between the pins of each single piece of the CCD and the pads of the PCB.
the existing alignment installation has a plurality of process difficulties, for example, (1) the situation that individual pins are slightly inclined exists in the process of CCD material supply or splicing, as hundreds or thousands of pins are arranged on the pins after a plurality of CCDs are spliced, if only one pin is not aligned, the PCB cannot be installed in place; (2) a PCB to be installed is welded with a plurality of electronic components such as resistors, capacitors, devices and the like, and in the butt joint process of the PCB and the CCD pins, the PCB pad holes and the CCD pins must be strictly aligned to complete installation. Furthermore, the existing alignment installation efficiency is low.
Disclosure of Invention
in view of this, the invention provides an auxiliary mounting template and an alignment mounting method, which effectively solve the technical problems in the prior art and ensure high alignment mounting efficiency of the pins of the spliced multiple CCDs and the pad holes of the circuit board.
In order to achieve the purpose, the technical scheme provided by the invention is as follows:
The utility model provides an auxiliary erection template, auxiliary erection template is applied to the counterpoint installation of the pad hole of pin and circuit board of the multi-disc CCD of concatenation, auxiliary erection template includes:
A mounting substrate;
The mounting structure comprises a plurality of mounting holes arranged on the mounting substrate, wherein the number of the mounting holes is the same as that of pins of the plurality of CCDs, and the arrangement of the mounting holes on the mounting substrate is the same as that of the pad holes on the circuit board.
optionally, the mounting substrate is a transparent substrate.
Optionally, the mounting substrate is a glass substrate or a resin substrate.
Optionally, the thickness of the mounting substrate is not greater than half of the length of the pins of the CCD.
Optionally, the width of the mounting hole is greater than the width of the pin of the CCD, and the difference between the width of the mounting hole and the width of the pin of the CCD ranges from 0.2mm to 0.4mm, inclusive.
Optionally, the mounting hole has a chamfer on a side facing the CCD.
Correspondingly, the invention also provides an alignment installation method, which is applied to the alignment installation of the pins of the spliced multiple CCDs and the pad holes of the circuit board, and the alignment installation method comprises the following steps:
S1, aligning and mounting the pins of the spliced CCD chips and mounting holes of an auxiliary mounting template, wherein the auxiliary mounting template is the auxiliary mounting template;
s2, judging whether the pins of the spliced CCD chips are offset from the mounting holes, if so, removing the auxiliary mounting template, adjusting the offset pins, and returning to the step S1; if not, go to step S3;
And S3, removing the auxiliary mounting template, and mounting the pins of the spliced multiple CCDs and the pad holes of the circuit board in an alignment manner.
optionally, before step S1, the method further includes:
Performing initial detection on the pins of the spliced CCDs, judging whether the pins of the spliced CCDs are offset, if so, adjusting the offset pins, and then entering the step S1; if not, the process proceeds to step S1.
compared with the prior art, the technical scheme provided by the invention at least has the following advantages:
The invention provides an auxiliary mounting template and a contraposition mounting method, wherein the auxiliary mounting template is applied to contraposition mounting of pins of a plurality of spliced CCDs and pad holes of a circuit board, and the auxiliary mounting membrane plate comprises: a mounting substrate; the mounting structure comprises a plurality of mounting holes arranged on the mounting substrate, wherein the number of the mounting holes is the same as that of pins of the plurality of CCDs, and the arrangement of the mounting holes on the mounting substrate is the same as that of the pad holes on the circuit board.
According to the technical scheme provided by the invention, in the alignment installation process of the pins of the spliced CCDs and the pad holes of the circuit board, the pins of the spliced CCDs are firstly aligned and installed through the installation holes of the auxiliary installation template and the pins of the spliced CCDs, so that the offset condition of the pins of the spliced CCDs is improved; and then the pins of the spliced CCDs and the pad holes of the circuit board are quickly aligned and installed, so that the alignment and installation efficiency of the pins of the spliced CCDs and the pad holes of the circuit board is high, and the yield of alignment and installation is improved.
Drawings
in order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the provided drawings without creative efforts.
FIG. 1 is a schematic structural diagram of a splicing structure of a conventional 5-chip CCD;
Fig. 2 is a schematic structural diagram of alignment installation of pad holes of pins of a conventional multi-chip CCD;
fig. 3 is a schematic structural diagram of an auxiliary installation template provided in an embodiment of the present application;
Fig. 4 is a flowchart of an alignment mounting method according to an embodiment of the present disclosure;
Fig. 5 is a flowchart of another alignment installation method according to an embodiment of the present disclosure;
Fig. 6 is a schematic structural diagram of another mounting template provided in the embodiment of the present application.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
As described in the background art, the existing alignment installation has many process difficulties, such as (1) the situation that individual pins are slightly skewed in the process of feeding or splicing the CCDs, and as the pins of the multi-chip CCDs have hundreds or thousands of points after being spliced, the PCB cannot be installed in place as long as one pin is not aligned; (2) a PCB to be installed is welded with a plurality of electronic components such as resistors, capacitors, devices and the like, and in the butt joint process of the PCB and the CCD pins, the PCB pad holes and the CCD pins must be strictly aligned to complete installation. Furthermore, the existing alignment installation efficiency is low.
Based on this, the embodiment of the application provides an auxiliary mounting template and an alignment mounting method, effectively solves the technical problems existing in the prior art, and ensures that the alignment mounting efficiency of the pins of the spliced multiple CCDs and the pad holes of the circuit board is high. In order to achieve the above object, the technical solutions provided by the embodiments of the present application are described in detail below, specifically with reference to fig. 3 to 6.
referring to fig. 3, a schematic structural diagram of an auxiliary mounting template provided in the embodiment of the present application is shown, where the auxiliary mounting template provided in the embodiment of the present application is applied to alignment mounting of pins of multiple pieces of CCDs and pad holes of a circuit board, and the auxiliary mounting template includes:
A mounting substrate 100;
The mounting structure comprises a plurality of mounting holes 110 arranged on the mounting substrate 100, wherein the number of the mounting holes 110 is the same as that of pins of the plurality of CCDs, and the arrangement of the mounting holes 110 on the mounting substrate 100 is the same as that of the pad holes on the circuit board.
According to the technical scheme provided by the embodiment of the application, in the alignment installation process of the pins of the spliced multiple CCDs and the pad holes of the circuit board, the pins of the spliced multiple CCDs are firstly aligned and installed through the installation holes of the auxiliary installation template and the pins of the spliced multiple CCDs, so that the offset condition of the pins of the spliced multiple CCDs is improved; and then the pins of the spliced CCDs and the pad holes of the circuit board are quickly aligned and installed, so that the alignment and installation efficiency of the pins of the spliced CCDs and the pad holes of the circuit board is high, and the alignment and installation yield of the pins of the spliced CCDs and the pad holes of the circuit board is improved.
in one embodiment of the present application, the mounting substrate provided herein is a transparent substrate,
It can be understood, this application embodiment sets up mounting substrate into transparent substrate, and then when counterpointing the installation with the mounting hole of supplementary erection template and the multi-disc CCD's of concatenation pin, make the installation of counterpointing be in visual state, and then can audio-visually observe that the mounting hole of supplementary erection template and the multi-disc CCD's of concatenation pin counterpoint the installation, which pin and mounting hole have appeared between the condition of skew, so that quick carry out accurate positioning and more quick skew adjustment to the pin that appears the skew, further improve the efficiency of the counterpoint installation of the pad hole of the multi-disc CCD of concatenation and circuit board.
optionally, the mounting substrate provided in the embodiment of the present application may be a glass substrate (such as organic glass) or a resin substrate, and the present application is not particularly limited thereto, and the mounting substrate may also be a transparent substrate made of other materials.
In an embodiment of the present application, the thickness of the mounting substrate may also be optimized, so as to improve the efficiency of accurately positioning the pins with the offset. Referring specifically to fig. 4, a schematic structural diagram of another auxiliary mounting template provided in the embodiment of the present application is shown, wherein a thickness L1 of the mounting substrate 100 provided in the present application is not greater than half of a length L2 of the lead 120 of the CCD.
It can be understood that the thickness of the mounting substrate provided by the embodiment of the application is set to be not more than half of the length of the pins of the CCD, and then when the mounting holes of the auxiliary mounting template and the pins of the spliced multiple CCDs are aligned and mounted, the pins of the CCD can be judged whether to penetrate through the mounting holes on the mounting substrate, so that the pins with deviation can be quickly and accurately positioned.
As shown in fig. 4, in order to ensure smooth alignment and installation of the pins 120 of the CCD and the mounting holes 110, a width d1 of the mounting holes 110 provided in the embodiment of the present application is greater than a width d2 of the pins 120 of the CCD, and a difference between the width of the mounting holes and the width of the pins of the CCD ranges from 0.2mm to 0.4mm, inclusive.
further, as shown in fig. 4, the mounting hole 110 provided in the embodiment of the present application has a chamfer 130 on a side facing the CCD, so as to guide the pin 120 of the CCD into the mounting hole 110.
Correspondingly, the embodiment of the present application further provides an alignment installation method, and the auxiliary installation template provided by the embodiment of the present application is described in more detail below with reference to relevant contents of the alignment installation method. Referring to fig. 4, a flowchart of an alignment mounting method provided in an embodiment of the present application is shown, where the alignment mounting method provided in the embodiment of the present application is applied to alignment mounting of pins of multiple pieces of CCDs and pad holes of a circuit board, and the alignment mounting method includes:
s1, aligning and mounting the pins of the spliced CCD chips and mounting holes of an auxiliary mounting template, wherein the auxiliary mounting template is the auxiliary mounting template provided by any one of the embodiments;
S2, judging whether the pins of the spliced CCD chips are offset from the mounting holes, if so, removing the auxiliary mounting template, adjusting the offset pins, and returning to the step S1; if not, go to step S3;
And S3, removing the auxiliary mounting template, and mounting the pins of the spliced multiple CCDs and the pad holes of the circuit board in an alignment manner.
in this application embodiment, can set up mounting substrate into transparent substrate, and then when counterpointing the installation with the mounting hole of supplementary erection template and the multi-disc CCD's of concatenation pin, make the installation of counterpointing be in visual state, and then can audio-visually observe that the mounting hole of supplementary erection template and the multi-disc CCD's of concatenation pin counterpoint the installation, which pin and mounting hole have appeared between the condition of skew has appeared, so that quick carry out accurate positioning and more quick skew adjustment to the pin that appears the skew, further improve the efficiency of the counterpoint installation of the pad hole of the multi-disc CCD of concatenation and circuit board.
Optionally, the mounting substrate provided in the embodiment of the present application may be a glass substrate (such as organic glass) or a resin substrate, and the present application is not particularly limited thereto, and the mounting substrate may also be a transparent substrate made of other materials.
In an embodiment of the present application, the thickness of the mounting substrate may also be optimized, so as to improve the efficiency of accurately positioning the pins with the offset. Wherein, the thickness of the installation substrate that this application embodiment provided sets up to be not more than the half of the length of CCD's pin, and then when the mounting hole that will assist the installation template and the multi-disc CCD's of concatenation pin carry out counterpoint installation, can see through the mounting hole on the installation substrate through the pin of judging CCD, realize that the pin of skew appears in faster accurate positioning.
and in order to ensure that the alignment installation of the pins and the installation holes of the CCD is smooth, the width of the installation holes is greater than that of the pins of the CCD, and the difference range of the width of the installation holes and the width of the pins of the CCD is 0.2mm-0.4mm, including the endpoint value.
Further, the mounting hole provided by the embodiment of the application is provided with a chamfer facing the side so as to guide the pin of the CCD into the mounting hole.
Referring to fig. 6, a flowchart of another alignment installation method provided in an embodiment of the present application is shown, where the alignment installation method includes:
S1, aligning and mounting the pins of the spliced CCD chips and mounting holes of an auxiliary mounting template, wherein the auxiliary mounting template is the auxiliary mounting template provided by any one of the embodiments;
S2, judging whether the pins of the spliced CCD chips are offset from the mounting holes, if so, removing the auxiliary mounting template, adjusting the offset pins, and returning to the step S1; if not, go to step S3;
and S3, removing the auxiliary mounting template, and mounting the pins of the spliced multiple CCDs and the pad holes of the circuit board in an alignment manner.
And, the alignment installation method provided by the embodiment of the present application further includes, before step S1:
S1', initially detecting the pins of the spliced CCDs, judging whether the pins of the spliced CCDs have deviation, if so, adjusting the deviated pins and then entering the step S1; if not, the process proceeds to step S1.
It can be understood that, according to the alignment installation method provided by the embodiment of the application, before the pins of the spliced multiple CCDs and the installation holes of the auxiliary installation template are aligned and installed, the pins of the CCDs can be initially detected, if the pin offset condition of the CCDs can be visually observed, if the pin offset condition exists, a special tool can be used for adjusting the pins, and then the pins of the spliced multiple CCDs and the installation holes of the auxiliary installation template are aligned and installed.
in any of the above embodiments, the circuit board through which the present application is passed includes, but is not limited to, a printed circuit board.
the embodiment of the application provides an auxiliary mounting template and an alignment mounting method, wherein the auxiliary mounting template is applied to alignment mounting of pins of a plurality of spliced CCDs and pad holes of a circuit board, and the auxiliary mounting of the film board comprises the following steps: a mounting substrate; the mounting structure comprises a plurality of mounting holes arranged on the mounting substrate, wherein the number of the mounting holes is the same as that of pins of the plurality of CCDs, and the arrangement of the mounting holes on the mounting substrate is the same as that of the pad holes on the circuit board.
According to the technical scheme provided by the embodiment of the application, in the alignment installation process of the pins of the spliced multiple CCDs and the pad holes of the circuit board, the pins of the spliced multiple CCDs are firstly aligned and installed through the installation holes of the auxiliary installation template and the pins of the spliced multiple CCDs, so that the offset condition of the pins of the spliced multiple CCDs is improved; and then the pins of the spliced CCDs and the pad holes of the circuit board are quickly aligned and installed, so that the alignment and installation efficiency of the pins of the spliced CCDs and the pad holes of the circuit board is high, and the yield of alignment and installation is improved.
The previous description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the invention. Thus, the present invention is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
Claims (8)
1. The utility model provides an auxiliary erection template, auxiliary erection template is applied to the counterpoint installation of the pad hole of pin and circuit board of the multi-disc CCD of concatenation, its characterized in that, auxiliary erection diaphragm includes:
a mounting substrate;
the mounting structure comprises a plurality of mounting holes arranged on the mounting substrate, wherein the number of the mounting holes is the same as that of pins of the plurality of CCDs, and the arrangement of the mounting holes on the mounting substrate is the same as that of the pad holes on the circuit board.
2. The auxiliary mounting template of claim 1, wherein the mounting substrate is a transparent substrate.
3. The auxiliary mounting template of claim 2, wherein the mounting substrate is a glass substrate or a resin substrate.
4. the secondary mounting template of claim 1, wherein the mounting substrate has a thickness no greater than half the length of the CCD pins.
5. The auxiliary mounting template of claim 1, wherein the width of the mounting hole is greater than the width of the CCD pin, and the difference between the width of the mounting hole and the width of the CCD pin is in the range of 0.2mm-0.4mm, inclusive.
6. The auxiliary mounting template of claim 1, wherein the mounting hole has a chamfer on a side facing the CCD.
7. The alignment installation method is applied to alignment installation of pins of a plurality of spliced CCDs and pad holes of a circuit board, and is characterized by comprising the following steps:
S1, aligning and mounting the pins of the spliced CCD chips and mounting holes of an auxiliary mounting template, wherein the auxiliary mounting template is the auxiliary mounting template of any one of claims 1-6;
s2, judging whether the pins of the spliced CCD chips are offset from the mounting holes, if so, removing the auxiliary mounting template, adjusting the offset pins, and returning to the step S1; if not, go to step S3;
and S3, removing the auxiliary mounting template, and mounting the pins of the spliced multiple CCDs and the pad holes of the circuit board in an alignment manner.
8. The alignment installation method of claim 7, further comprising, before step S1:
performing initial detection on the pins of the spliced CCDs, judging whether the pins of the spliced CCDs are offset, if so, adjusting the offset pins, and then entering the step S1; if not, the process proceeds to step S1.
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| CN201910870662.7A CN110572955B (en) | 2019-09-16 | 2019-09-16 | Auxiliary installation template and alignment installation method |
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| CN201910870662.7A CN110572955B (en) | 2019-09-16 | 2019-09-16 | Auxiliary installation template and alignment installation method |
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| CN110572955A true CN110572955A (en) | 2019-12-13 |
| CN110572955B CN110572955B (en) | 2021-08-03 |
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Cited By (1)
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| CN114745883A (en) * | 2022-03-17 | 2022-07-12 | 深圳市合讯电子有限公司 | Acoustic surface filter with high temperature stability |
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| CN110572955B (en) | 2021-08-03 |
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