CN110572926B

CN110572926B - RF functionality and electromagnetic radiation shielding in a component carrier

Info

Publication number: CN110572926B
Application number: CN201910438887.5A
Authority: CN
Inventors: 马库斯·莱特格布; 马丁·施雷姆斯; 埃里克·施拉费尔; 史蒂夫·安德森
Original assignee: AT&S Austria Technologie und Systemtechnik AG
Current assignee: AT&S Austria Technologie und Systemtechnik AG
Priority date: 2018-06-06
Filing date: 2019-05-24
Publication date: 2022-11-01
Anticipated expiration: 2039-05-24
Also published as: US20190378801A1; EP3579334B1; EP4102639A1; US11201119B2; CN110572926A; EP3579334A1

Abstract

Component carriers, electronic devices including component carriers, and methods of manufacturing component carriers are provided. The component carrier includes: i) An electronic component embedded in the component carrier, ii) an antenna structure arranged at an area of the first main surface of the component carrier, iii) a shielding structure made of an electrically conductive material and configured for preventing electromagnetic radiation from propagating between the antenna structure and the electronic component. Here, the shielding structure is arranged at least partially between the antenna structure and the electronic component. Furthermore, the component carrier comprises electrically conductive structures for electrically connecting the electronic component with the antenna structure via the shielding structure. The shielding structure is not perforated at least in a plane located between the antenna structure and the electronic component.

Description

RF functionality and electromagnetic radiation shielding in a component carrier

Technical Field

The invention relates to a component carrier, an electronic apparatus including the component carrier, and a method of manufacturing the component carrier.

Background

Against the background of increasing product functionality and increasing miniaturization of component carriers equipped with one or more electronic components, as well as increasing number of electronic components to be mounted on component carriers such as printed circuit boards, more and more powerful matrix-type components or packages with several electronic components are increasingly used, which have a plurality of contacts or connections, the spacing between which is increasingly smaller. The removal of heat generated by such electronic components and component carriers themselves during operation is an increasingly significant problem. At the same time, the component carrier should be mechanically robust and electrically and magnetically reliable in order to be operable even under severe conditions.

The common data rates provided by the 4G standard may not support communication requirements for future developments such as internet of things (IoT) and baseband applications. Therefore, the upcoming 5G solutions must provide high Gbit/s data rates to overcome the losses in the so-called sub-6 Ghz and "millimeter wave" spectral ranges (i.e. between 1Ghz to 300 Ghz). Future technical developments will require continuous miniaturization and improvement with regard to the signal integrity of the component carrier. Magnetic shielding and induction can be considered to be very important for millimeter wave development as signal strength may become smaller.

Fig. 4 shows an example in the prior art, according to which a carrier board 400 comprises a digital Integrated Circuit (IC) 410 and an antenna module 420 mounted on its surface. The antenna module 420 may be equipped with a Radio Frequency (RF) -IC. The two entities, IC 410 and antenna module 420, are mounted separate from each other and connected, for example, with bonding wires. Such systems are not cost effective and are difficult to manufacture. Furthermore, these structures have high requirements with regard to space occupation. Further, the antenna structure 420 and the IC 410 are performed on the same main surface (top surface). Thus, shielding electromagnetic radiation propagating between the antenna structure 420 and the IC 410 is difficult and signal integrity is degraded.

These disadvantages are also true for other prior art examples using, for example, hybrid board or dual board solutions. Furthermore, such carrier plate structures are asymmetric and therefore tend to warp. Furthermore, stacked (bumped) antennas require non-copper materials for bonding metals, which can further degrade signal integrity due to signal interference, such as at the Cu-Sn interface.

In particular, it is a challenge to provide antenna structures and IC structures, embedded antenna tuners or antenna ICs, and miniaturization in relation to component carriers with respect to effective electromagnetic radiation shielding.

Disclosure of Invention

It may be desirable to integrate electromagnetic radiation shielding in RF-enabled component carriers in a manner that allows for efficient and reliable operation.

A component carrier, an electronic device including the component carrier, and a method of manufacturing the component carrier according to example embodiments of the invention are provided.

According to an exemplary embodiment of the invention, a component carrier is provided, comprising: i) An electronic component embedded in the component carrier, ii) an antenna structure arranged at an area of the first main surface of the component carrier, iii) a shielding structure made of an electrically conductive material and configured for preventing electromagnetic radiation from propagating between the antenna structure and the electronic component. Here, the shielding structure is arranged at least partially between the antenna structure and the electronic component. Further, the component carrier includes: iv) a conductive structure for electrically connecting the electronic component and the antenna structure via the shielding structure. The shielding structure is not perforated at least in a plane located between the antenna structure and the electronic component.

According to another exemplary embodiment of the present invention, an electronic device is provided. The electronic device includes: a module having 4G and/or 5G functionality; and a component carrier as described above.

According to another exemplary embodiment of the invention, a method of manufacturing a component carrier is provided, wherein the method comprises: i) Providing a preform of the component carrier, ii) embedding the electronic component in the component carrier, iii) forming a shielding structure made of an electrically conductive material and configured for preventing electromagnetic radiation from propagating between the antenna structure and the electronic component, iv) forming the antenna structure at a region of the first main surface of the component carrier at least partially over the shielding structure, and v) forming the electrically conductive structure for electrically connecting the electronic component and the antenna structure through the shielding structure. The shielding structure is not perforated at least in a plane located between the antenna structure and the electronic component.

In the context of the present application, the term "component carrier" may particularly denote any support structure capable of accommodating one or more components thereon and/or therein for providing mechanical support and/or electrical connection. In other words, the component carrier may be configured as a mechanical and/or electronic carrier for the component. In particular, the component carrier may be one of a Printed Circuit Board (PCB), an organic interposer, a substrate-based PCB (SLP) and an IC (integrated circuit) substrate. The component carrier may also be a hybrid board combining different ones of the above-mentioned types of component carriers.

In the context of the present application, the term "antenna structure" may particularly denote an arrangement of metallic conductor elements which are electrically connected to a receiver or transmitter, for example by a transmission line. Thus, the antenna structure may be represented as the following electrical components: the electrical component converts electrical energy into radio waves and/or vice versa. The antenna structure may be used with a controller (e.g., a control chip), such as a radio transmitter and/or a radio receiver. In transmission, the radio transmitter may supply a current oscillating at a radio frequency (i.e., a high-frequency alternating current) to a terminal of the antenna structure, and the antenna structure may radiate energy from the current as an electromagnetic wave (particularly, a radio wave). In the receiving mode, the antenna structure may intercept some energy of the electromagnetic wave in order to generate a slight voltage at its terminals, which may for example be supplied to a receiver to be amplified. In an embodiment, the antenna structure may be configured as a receiver antenna structure, a transmitter antenna structure, or a transceiver (i.e., transmitter and receiver) antenna structure. In an embodiment, the antenna structure may be used for radar applications. The antenna structure may, for example, comprise a dipole antenna, a folded dipole antenna, a loop antenna, a rectangular loop antenna, a patch antenna, or a coplanar antenna. The antenna structure may also include a yagi antenna or a fractal antenna. The yagi antenna may be a multi-beam directional antenna for so-called millimeter wave applications. The fractal antenna may be another type of antenna that uses a self-similar design to maximize the length of material in the total surface area. Fractal antennas can be compact and broadband, and can be used as antennas for many different frequencies.

In the context of the present application, the term "shielding structure" may refer to the following structure: the structure is configured for preventing electromagnetic radiation from propagating between two different entities, e.g. the antenna structure and another part of the component carrier such as an embedded electronic component. Such an electromagnetic radiation shielding structure may prevent undesired cross-talk of electromagnetic radiation between, on the one hand, the antenna structure and, on the other hand, at least one component of the component carrier (which may, for example, be embedded in the component carrier) and/or the electronic environment and/or another antenna structure of the component carrier. The shielding structure is preferably made of an electrically conductive material, such as a metal, in particular copper. The shielding structure may be of different shapes, such as a layer or a rectangle. The shielding structure may also be made of a magnetically conductive material.

In the context of the present application, the term "unperforated shielding structure" may refer to the case where the shielding structure is not perforated. The perforations may be small holes in a thin material such as a layer. The process of creating the perforation may include piercing the workpiece with a tool or cutting with a laser. In addition, photoimageable dielectrics may be used. The process of creating the perforations may also include depositing material only at certain areas such that perforations are created at other areas where no material is deposited. For example, the shielding structure may be created by depositing copper to form a copper layer. When copper is deposited only at a specific area without depositing copper on other areas, the other areas may be referred to as through-holes of the shielding structure. The shielding structure that is not perforated may also be denoted as a continuous shielding structure, meaning that no holes, cavities or perforations are present in the structure.

In the context of the present application, the term "plane" may denote an imaginary plane area oriented parallel to the two main extension directions of the shielding structure. In case the shielding structure is formed as a layer, both main directions of extension can be easily defined. The plane may be bounded laterally by many objects (delimit, demarcating …). For example, the plane may be laterally delimited by the antenna structure and the electronic components arranged above/below the shielding structure. Since the shielding structure is at least partially arranged between the antenna structure and the electronic component, a portion of the plane is also arranged between the antenna structure and the electronic component. Here, the boundaries of the plane may be defined by the boundaries of the antenna structure and the electronic components in a direction perpendicular to the two main directions of extension of the plane. In other words, if there is no antenna structure above the shielding structure and/or no electronic component below the shielding structure in said direction, the plane is delimited on this side. Furthermore, the plane may be delimited by the first portion of the electrically conductive structure. In this case, the plane is laterally delimited by the boundaries of the antenna structure, the electronic components and said first structure. In case a further first part of the further conductive structure is present, the plane may also be delimited by a boundary of said further first part. When considering the boundaries of a plane, one edge of the object that causes a larger definition of the plane may be taken into account. Furthermore, an edge of the object that leads to a smaller definition of the plane may also be taken into account. This is also true if a magnetically permeable structure is used.

In the context of the present application, the term "conductive structure" may denote any structure suitable for electrically connecting an electronic component with an antenna structure. The conductive structures may include interconnect vias and/or planar metal layers. The conductive structure may comprise several parts, for example for connecting an electronic component with a conductive layer, such as a redistribution layer, or for connecting a conductive layer with a shielding layer. In this way, at least a portion of the conductive structure may be oriented at a lateral side of the electronic component, thereby partially surrounding the electronic component. Just like the shielding structure, the conductive layer may be unperforated. For example, a first portion of the conductive structure that at least partially surrounds the electronic component may be unperforated.

In the context of the present application, the term "4G and/or 5G functionality" may refer to a known wireless system standard. 4G (or LTE) is an established standard, while 5G is an upcoming technology that may be standardized in the near future. Electronic devices may also be suitable for future developments such as 6G. Further, the electronic device may comply with WiFi standards such as 2.4GHz, 5GHz, and 60GHz. The "module" of the electronic device may be, for example, a so-called wireless complex (integrated with WiFi, bluetooth, GPS … …), radio Frequency Front End (RFFE), or Low Power Wide Area (LPWA) network module. The electronic device may be, for example, a laptop, a notebook, a smartphone, a portable WiFi dongle, a smart appliance, or a machine-to-machine network. The described component carrier may be integrated into the module or may be arranged separately from the module. Although the described module usually comprises a separate antenna, the described component carrier may be realized to be provided with an electronic device, wherein the antenna structure is arranged within the module, for example in an embedded manner. Furthermore, the electronic device can be used for radar applications, for example in the industrial field (industrial radar) or in the automotive field. Here, the antenna structure and/or the electronic component may be configured for radar applications. In the case of an automobile, there may be more necessary electronic components (e.g., at least three) depending on the orientation and desired channel.

In the context of the present application, the term "radar" may refer to object detection that uses electromagnetic waves to determine the range, angle, or velocity of one or more objects. The radar arrangement may comprise a transmitter that transmits electromagnetic waves (e.g. in the radio or microwave range). Electromagnetic waves from the transmitter reflect off the object and return to the receiver. Here, one antenna structure may be used for transmission and reception. Further, a processor, such as an electronic component, may be used to determine properties of the object, such as position and velocity, based on the received electromagnetic waves.

According to an exemplary embodiment of the present invention, a component carrier is provided with an integrated antenna function and embedded electronic components, in particular High Frequency (HF) chips (e.g. HF-CMOS, siGe BiCMOS, gaN, gaAs, inP), in which the electronic components (e.g. MEMS devices) are effectively shielded from electromagnetic radiation propagating from the antenna structure to the electronic components. The conductive shielding structure connects the electronic component to the antenna structure. Furthermore, the conductive structure is connected to the antenna structure by a shielding structure, wherein the shielding structure is not perforated. In this way, the conductive structure together with the shielding structure forms an unperforated electromagnetic radiation shielding region around the electronic component.

In this way, a fully integrated RF function is provided in the component carrier with effective and robust shielding. Because the shield structure is not perforated, the shield is very effective to ensure optimal signal integrity. In particular in the field of HF applications, a high degree of signal integrity is mandatory, for example for 5G modules. Furthermore, the component carrier may comprise advantageous thermal management. The shielding structure and the electrically conductive structure may be assembled and may be made of a material having a very high thermal conductivity, such as copper. In this way, the combined shielding/conductive structure may provide efficient heat dissipation. Thus, not only is a very effective electromagnetic shielding achieved, but at the same time, a very effective thermal management is also achieved. The provided laminated layers of the component carrier may be arranged in a symmetrical manner, wherein the antenna structure is on a first main surface of the component carrier and the fan-out region (e.g. a redistribution layer) is on a second main surface (opposite to the first main surface) of the component carrier. The component carrier is adapted to fine line structures to produce optimal signal characteristics and to produce integrated thermal management by using suitable materials (see below). Furthermore, the described component carrier allows the use of a single metal, for example copper, so that warping can be avoided, in particular in the case of symmetrical lamination layers. The described component carrier can also minimize manufacturing complexity and cost.

According to further embodiments, the described component carrier may be applied in the context of radar applications. In particular with respect to industrial and/or automotive radar applications. Radar applications can be performed in the frequency range of 65GHz and higher frequencies in the medium or long range, which today is usually from 77GHz to 81GHz, but can be increased to 90GHz and even higher in the long run as technology capabilities will advance. For automotive (e.g. range radar) or industrial applications (e.g. level indicators), radar applications may be performed in the millimeter wave range in particular. In these instances, the antenna structure and electronic components (e.g., HF components for radar applications) may advantageously be arranged in close spatial proximity without undesirable parasitic effects.

In the following, further exemplary embodiments of the method and the component carrier will be explained.

In an embodiment, the first portion of the electrically conductive structure at least partially surrounds the electronic component in a lateral direction. This has the advantage that a more effective shielding can be provided, since the electronic components are also shielded in the lateral direction.

In an embodiment, the shielding structure is not perforated at least in a plane located between the antenna structure, the electronic component and the first portion of the conductive structure. In this way an even more effective shielding is provided, since the shielding structure forms a continuous layer extending up to the first part of the lateral shielding of the conductive structure.

In an embodiment, the shielding structure is formed as a layer and comprises a metal, in particular copper. This has the advantage that the shielding structure can be efficiently manufactured using known and well-established processes.

There are many mature techniques for forming layer structures of metals, such as copper, in component carriers. When the electrically conductive structures in the component carrier are made of the same material, for example copper, warping can be avoided and the manufacturing effort is reduced.

In an embodiment, the electronic component comprises at least one terminal at a region of the main surface facing away from the antenna structure, wherein the terminal is connected to a second part of the conductive structure, which second part of the conductive structure extends away from the terminal. This has the advantage that the embedded electronic components can be electrically connected to the antenna structure in a robust manner without additional equipment.

Terminals for electronic components are well known, and many kinds of terminals are suitable as long as they can be electrically connected to conductive structures that may include interconnect vias and/or metal layers.

In an embodiment, the electrically conductive structure comprises a redistribution layer arranged at the second main surface of the component carrier, in particular wherein the second main surface is the opposite side to the first main surface of the component carrier. This has the advantage that a flexible fan-out area is provided, while at the same time the first and second parts of the conductive structure can be connected in an efficient and robust manner.

A redistribution layer (RDL) may be an additional layer (e.g. a metal layer) comprising electrically conductive material on the electronic component or component carrier, which makes I/O (internal/external) pads (pads) of the integrated circuit available elsewhere. When an integrated circuit is fabricated, it typically has a set of I/O pads electrically connected (e.g., wire bonded) to the pins of the package structure. The redistribution layer may be a layer routed over the chip, enabling simpler chip-to-chip, chip-to-component carrier, or component carrier-to-component carrier bonding. In an embodiment, the terminals on the redistribution layer side of the component carrier are smaller than the terminals on the side of the component carrier opposite the redistribution layer. For example, the redistribution layer may include solder balls and/or copper pillars on a side facing away from the embedded component so as to be connectable to another entity.

In an embodiment, the second portion of the conductive structure is disposed between and electrically connects the terminal and the redistribution layer. Since the second portion extends away from the embedded component and the first portion laterally surrounds the electronic component, an optimal shielding is provided.

In an embodiment, the first portion of the conductive structure is disposed between and electrically connects the redistribution layer and the shielding structure. This has the advantage that a very efficient electrical connection is established from the electronic component to the redistribution layer and from the redistribution layer to the shielding structure. The functional layer/structure is directly included into the electrical connection structure, thereby saving cost and effort. Furthermore, in the described manner, the conductive structure forms a shielding region around the electronic component in order to optimize signal integrity.

In an embodiment, a conductive structure includes: at least one interconnect via, in particular a micro via; and at least one conductive layer, in particular a planar metal layer. This has the advantage that known and mature structures can be used for manufacturing the component carrier. Particularly micro-vias for wafer interconnects, provide optimal signal integrity. Planar copper layers and via vias may be used to create a shielded region around an electronic component. In a preferred embodiment, the shielding region is not perforated.

Vias (vertical interconnect vias) are electrical connections between layers in a physical electronic circuit that passes through the plane of one or more adjacent layers. The term via may include through-hole vias, buried vias and blind vias. Micro-vias are used as interconnect structures between High Density Interconnect (HDI) substrates and layers in Printed Circuit Boards (PCBs) to accommodate advanced packaging structures with high I/O density. The micro-vias may be defined, for example, by IPC standard (2013) as holes having an aspect ratio of 1:1, which is the ratio of the diameter to the depth of the hole (no more than 0.25 mm).

In an embodiment, the component carrier comprises at least one further electrically conductive structure having a further first portion of the electrically conductive structure, which further first portion at least partially surrounds the electronic component, such that the electrically conductive structure and the further electrically conductive structure form an electromagnetic radiation shielding region around the electronic component. The shielding structure is not perforated in a plane between the antenna structure, the electronic component, the first part of the electrically conductive structure and the further first part of the further electrically conductive structure. This has the advantage that an even more effective shielding can be provided.

The further electrically conductive structure may, for example, be arranged on an opposite side of the electrically conductive structure with respect to the electronic component. A plurality of further conductive structures may be arranged, for example four or more. The more additional conductive structures are applied, the more dense the shielding area and the better the shielding of the electronic component may be. In an embodiment, the electronic component may be at least partially, securely sealed using a plurality of additional conductive structures. In a further preferred embodiment, each of the conductive structures of the shielding region is not perforated.

In an embodiment, the electrically conductive structure comprises an electrically conductive portion arranged at the area of the first main surface of the component carrier, wherein the electrically conductive portion is electrically connected to the antenna structure. This has the advantage that the antenna structure can be contacted in a flexible manner.

The portion may be formed as a layer, a pad, or a terminal. Many other implementations of this portion are possible. The portion may comprise a conductive material and may establish a connection between the conductive structure and the antenna structure. The portion and the antenna structure may be connected by wire bonds, conductive layers or conductor tracks. However, many other implementations are possible.

In an embodiment, the component carrier comprises a dielectric layer arranged at the antenna structure, in particular a dielectric layer having a dissipation factor of not more than 0.0008 at 80 GHz. In another embodiment, the dissipation factor is no greater than 0.005, specifically no greater than 0.003, more specifically no greater than 0.0015 at 10 GHz. According to further embodiments, no greater than 0.00015 at 100 GHz. This has the advantage that high frequency losses are reduced.

The dielectric layer comprises an electrically insulating material. In a preferred embodiment, the dielectric layer comprises a low df (dissipation factor) value and/or a low dk (relative permeability) value. The dielectric layer may be a high frequency dielectric. The term "high-frequency dielectric" may particularly denote the following electrically insulating materials: the electrically insulating material has low loss properties when high frequency or radio frequency signals propagate from or to the antenna structure in the direct environment of the high frequency dielectric. In particular, the high frequency dielectric may have lower losses than a standard prepreg material of the stack of component carrier materials. As an example, RO3003, commercially available from the company Rogers Corporation^TMThe material may be used as a high frequency dielectric. Another example is a material having Dk less than 3.0 or Df less than 0.001 (e.g. PTFE or LCP (liquid crystal polymer)). For example, the high-frequency dielectric material may have a dissipation factor of not more than 0.005, particularly not more than 0.003, more particularly not more than 0.0015 at 10 GHz. The mentioned high frequency circuit material may be, for example, a ceramic-filled PTFE (polytetrafluoroethylene) composite.

In an embodiment, the shielding structure is at least partially integrated in the high frequency dielectric. This allows to combine an efficient electromagnetic radiation shielding function with a compact design. Furthermore, this ensures that the shielding is implemented very close in space to the antenna structure and thus very effectively to the source or destination of the radio frequency waves.

In an embodiment, the electronic component is embedded in an electrically insulating material, in particular a dielectric material having a matched Coefficient of Thermal Expansion (CTE), in particular a dielectric material having a CTE between 1 and 10ppm, more in particular a dielectric material having a CTE between 3 and 7 ppm. In the case of gallium nitride, the CTE may be about 6ppm, in particular. This has the advantage that the electronic components can be encapsulated with a high degree of reliability.

In an embodiment, the component carrier further comprises a core structure, in particular a central core structure, wherein the core structure comprises a cavity, and wherein the electronic component is at least partially arranged inside the cavity. This has the advantage that a robust component carrier with high signal integrity properties can be provided.

The core may be made of an electrically insulating material (see materials listed below). The core may also comprise the same materials as the dielectric layers described above. The term "center" may in the present context refer to a symmetrical build-up of the component carrier with respect to the core.

In an embodiment, the horizontal layup of the component carrier is symmetrical with respect to the embedded electronic component, in particular with respect to the embedded electronic component in the cavity of the core structure. This has the advantage that the risk of warpage is reduced, while manufacturing is simplified and signal integrity can be improved.

In an embodiment, the conductive structure is made of a single metal, in particular copper. This also has the following advantages: warpage is reduced while manufacturing is simplified (no additional material is required) and signal integrity is improved.

In an embodiment, the electronic component is a high frequency HF component. This has the advantage that the electronic components can operate at very high data rates. The HF components may be chips or chipsets for so-called "millimeter wave" applications. The HF component may be one of the group consisting of: HF-CMOS, siGe, biCMOS, gaN, gaAs, and InP. Further, the HF component may be configured for radar applications.

At least one component may be embedded in the component carrier. The at least one component may be selected from the group consisting of: a non-conductive inlay, a conductive inlay (such as a metal inlay, preferably comprising copper or aluminum), a heat transfer unit (e.g., a heat pipe), a light guide element (e.g., a light guide or light conductor connection structure), an electronic component, or a combination thereof. For example, the component may be an active electronic component, a passive electronic component, an electronic chip, a storage device (e.g., a DRAM or another data storage), a filter, an integrated circuit, a signal processing component, a power management component, an optical-electrical interface element, a voltage converter (e.g., a DC/DC converter or an AC/DC converter), an encryption component, a transmitter and/or receiver, an electromechanical transducer, a sensor, an actuator, a micro-electromechanical system (MEMS), a microprocessor, a capacitor, a resistor, an inductance, a battery, a switch, a camera, a logic chip, a light guide, and an energy harvesting unit. However, other components may also be embedded in or surface mounted on the component carrier. For example, a magnetic element may be used as the component. Such a magnetic element may be a permanent magnetic element (such as a ferromagnetic element, an antiferromagnetic element or a ferromagnetic element, e.g. a ferrite coupling structure) or may be a paramagnetic element. However, the component may also be a further component carrier, for example in the construction of a plate in a plate. Furthermore, the component may be an optimal magnetic material even in specific areas of the structure.

In an embodiment, a cut-out portion is arranged below the antenna structure, wherein the cut-out portion is formed with a cavity, and wherein the cavity is at least partially filled with a gas, in particular air. This has the advantage that the cavity allows electromagnetic waves to propagate into close proximity of the antenna structure, while the electrically conductive material provided on the cavity surface provides an effective electromagnetic shielding.

In an embodiment, the component carrier comprises a first component carrier portion having a first cut portion and the component carrier comprises a second component carrier portion having a second cut portion. The first cut portion and the second cut portion face opposite major surfaces of the antenna structure. An electrically conductive material is disposed on a surface of the first cut portion and on a surface of the second cut portion. The first and second cut portions form first and second cavities, respectively, on opposite sides of the antenna structure, and the first and second cavities are at least partially filled with a gas, in particular air. This has the advantage of providing a similar positive effect as a Suspended Stripline Structure (SSS), while the package is more compact without the need for an external metal casing and the cost and labor associated with installing the external metal casing.

The cavity is preferably filled with air of another medium suitable for propagating electromagnetic waves. The cavity allows electromagnetic waves to propagate into the vicinity of the antenna structure, while the conductive material provided on the cavity surface may provide an effective electromagnetic shielding.

In an embodiment, the at least one electrically insulating layer structure comprises at least one of the group consisting of: a resin (such as a reinforcing resin or a non-reinforcing resin, for example an epoxy resin or a bismaleimide-triazine resin, more specifically FR-4 or FR-5); a cyanate ester; a polyphenylene derivative; glass (especially fiberglass, multiple layer glass, glass-type materials); a prepreg material; a polyimide; a polyamide; liquid Crystal Polymers (LCP); an epoxy-based laminate film; polytetrafluoroethylene (teflon); a ceramic; and metal oxides. Reinforcing materials such as meshes, fibers or spheres, for example made of glass (multiple layers of glass), may also be used. While prepreg or FR4 is generally preferred, other materials may be used. For high frequency applications, high frequency materials such as polytetrafluoroethylene, liquid crystal polymers and/or cyanate ester resins may be implemented as electrically insulating layer structures in the component carrier.

In an embodiment, the method further comprises: i) Providing a core structure, in particular a central core structure, ii) removing material from the core structure so as to form a cavity in the core structure, and iii) placing the electronic component at least partially in the cavity before the electronic component is embedded. This has the advantage that mature and reliable manufacturing techniques can be applied to provide a robust and efficient component carrier.

In an embodiment, removing material includes a subtractive process and/or a modified semi-additive process (mSAP). This has the advantage that straight side walls can be created and thus signal characteristics, power delivery and thermal management can be improved.

Subtractive methods remove metal (e.g., copper) from the metal coated component carrier to leave only the desired metal pattern. By using the mSAP, a very thin metal layer (copper) can be applied to the component carrier and plated in the areas where no resist is applied. The thin metal remaining in the spaces between the conductive structures is then etched away. In this way, the conductive structure can be formed with better precision, with straight vertical lines, resulting in a rectangular shaped cross section that maximizes circuit density and enables low signal loss. In addition, there is low roughness on the sidewall plating.

In an embodiment, forming the conductive structure includes a semi-additive process (SAP). This has the advantage that fine line structures and straight sidewalls can be efficiently produced, which provide a high level of signal integrity and minimize signal loss. Furthermore, a lower roughness on the track footprint is possible.

Standard SAP processes for obtaining the conductive pattern may include seed layer (e.g. electroless metal) deposition and etching and/or electroplating. The unpatterned component carrier may have a thin metal (copper) layer already thereon. A reverse mask is then applied (unlike the subtractive process mask, which exposes those portions of the substrate that will eventually become traces). Additional metal may then be plated onto the component carrier plates in the unmasked areas. The metal may then be plated to any desired weight. Tin-lead or other surface plating may then be applied. The mask may be removed and a brief etching step may remove the now exposed bare original metal laminate from the component carrier, thereby isolating the individual traces. Some single side plates with plated through holes can be made in this way. The (semi) additive process can also be used for multilayer boards because it facilitates plating through of holes to create conductive vias in the circuit board.

In an embodiment, the antenna structure is formed as at least a part of one of the plurality of conductive layer structures patterned. Integrating the antenna structure in the electrically conductive part of the component carrier material renders the component carrier as a highly compact whole.

In an embodiment, the antenna structure is configured as a directional antenna structure. The directional antenna structure may be represented as the following antenna structure: which radiates or receives more power in a particular direction, allowing for increased characteristics and reduced interference from unwanted sources. Directional antennas provide increased performance over dipole or omni-directional antennas when greater radiation concentration in a certain direction is desired. Here, both a vertical and a horizontal configuration may be desired for optimal signals.

In an embodiment, the component carrier comprises a further antenna structure. One of the antenna structure and the further antenna structure is configured for a first function, in particular near field communication, and the other of the antenna structure and the further antenna structure is configured for a second function, in particular wide range communication. Thus, a plurality of different RF functions can be compactly integrated in a common component carrier.

In an embodiment, the component carrier comprises a plurality of cells. An example of one unit is shown in fig. 2, for example. One unit may include one or more antenna structures. Correspondingly, the unit may also comprise a shielding structure. An element may not include an antenna structure. The units may be arranged adjacent to one another or may be spatially separated within the component carrier. The component carrier may comprise a plurality of cells arranged laterally with respect to each other. This may provide the advantage that component carriers with multiple functions may be designed in a very flexible manner.

As mentioned above, the component carrier may comprise a stack of at least one electrically insulating layer structure and/or at least one electrically conductive layer structure. For example, the component carrier can be a laminate of the mentioned electrically insulating layer structure and electrically conductive layer structure, which is formed in particular by applying mechanical pressure, if desired supported by thermal energy. The mentioned stack may provide a plate-like component carrier which is able to provide a large mounting surface for further components and which is still very thin and compact. The term "layer structure" may particularly denote a continuous layer, a patterned layer or a plurality of discontinuous islands in a common plane.

In an embodiment, the component carrier is shaped as a plate. This contributes to a compact design, wherein, however, the component carrier provides a large base for mounting components thereon. Further, in particular, a bare chip as an example of an embedded electronic component can be easily embedded in a thin plate such as a printed circuit board owing to its small thickness.

In an embodiment, the component carrier is configured as one of the group consisting of a printed circuit board, a substrate-type printed circuit board and a substrate (in particular an IC substrate).

In the context of the present application, the term "printed circuit board" (PCB) may particularly denote a component carrier (which may be plate-shaped (i.e. planar), three-dimensionally curved (e.g. when manufactured using 3D printing) or which may have any other shape) formed by laminating several electrically conductive layer structures with several electrically insulating layer structures, the lamination being performed, for example, by applying pressure, if desired accompanied by a supply of thermal energy. As a preferred material for PCB technology, the electrically conductive layer structure is made of copper, while the electrically insulating layer structure may comprise resin and/or glass fibres, so-called prepreg or FR4 material. The conductive layer structures can be connected to each other in a desired manner by forming a through hole through the laminate, for example by laser drilling or mechanical drilling, and by filling the through hole with a conductive material, in particular copper, thereby forming a via as a through hole connection structure. In addition to one or more components that may be embedded in a printed circuit board, printed circuit boards are typically configured to accommodate one or more components on one surface or two opposing surfaces of a board-like printed circuit board. They may be attached to the respective major surfaces by welding. The dielectric portion of the PCB may be composed of a resin with reinforcing fibers, such as glass fibers.

In the context of the present application, the term "substrate" may particularly denote a component carrier having a component (particularly an electronic component) to be mounted thereon. More specifically, a baseplate may be understood as a carrier for an electrical connection structure or electrical network and a component carrier comparable to a Printed Circuit Board (PCB) but with a substantially high density of laterally and/or vertically arranged connection structures. The transverse connections are, for example, conductive paths, while the vertical connections may be, for example, boreholes. These lateral and/or vertical connection structures are arranged within the substrate and may be used to provide electrical and/or mechanical connection structures of the accommodated or not accommodated component (such as a bare wafer), in particular of an IC chip, with the printed circuit board or an intermediate printed circuit board. Thus, the term "substrate" also includes "IC substrates". The dielectric portion of the substrate may be composed of a resin with reinforcing spheres, such as glass spheres.

Further, the component carrier may be configured as a substrate type printed circuit board (SLP).

In an embodiment, the at least one electrically insulating layer structure and/or electrically conductive structure comprises at least one of the group consisting of: copper, aluminum, nickel, silver, gold, palladium, cobalt, and tungsten. Although copper is generally preferred, other materials or coated versions thereof are possible, particularly coated with superconducting materials such as graphene.

In an embodiment, the electrically conductive structure, in particular the shielding structure, is at least partially coated with and/or at least partially composed of a superconducting material. The superconducting material may be a material in which the electrical resistance is not measurable, i.e., the electrical resistance is about zero. The further electrically conductive structure may also at least partly comprise superconducting material.

In an embodiment, the component carrier is a laminate. In such an embodiment, the component carrier is a composite of a multilayer structure which is stacked and connected together by applying a pressing force, if desired with heat.

The aspects defined above and further aspects of the invention are apparent from the examples of embodiment to be described hereinafter and are explained with reference to these examples of embodiment.

Drawings

Fig. 1a to 1c each illustrate a sectional view of a component carrier according to an exemplary embodiment of the present invention.

Fig. 2 illustrates a cross-sectional view of a component carrier comprising a core structure according to an exemplary embodiment of the present invention.

Fig. 3a to 3e respectively show cross-sectional views of structures obtained during implementation of a method of manufacturing a component carrier comprising a core structure according to an exemplary embodiment of the present invention.

Fig. 4 illustrates an example of the prior art.

The illustration in the drawings is schematically. In different drawings, similar or identical elements are provided with the same reference signs.

Detailed Description

Before describing exemplary embodiments in further detail with reference to the accompanying drawings, some basic considerations upon which exemplary embodiments of the present invention are developed will be outlined.

According to an exemplary embodiment of the present invention, a component carrier with a highly reliable integrated radio frequency area is provided. More specifically, a protected highly reliable integrated high frequency region in such a component carrier is foreseen.

According to an exemplary embodiment, the following advantages are provided, which are packaging solutions for: RF chip, fine line fan-out for optimal signal performance, integrated shielding, integrated thermal management, power supply, connections to digital parts, antenna function for multi-beam, integrated inductor/magnetics for optimal performance, and Z-direction connection structure for connecting multi-beam elements and tuning.

According to an exemplary embodiment, a fully integrated RF package may be provided with integrated shielding, thermal management, and symmetric buildup layers, with the antenna on the surface (bottom side) and the fan-out (e.g., redistribution layer) on the surface (top side). This allows the use of a single metal (copper) and optimal shielding of the component to ensure optimal signal integrity, avoid warpage and minimize manufacturing complexity and cost by symmetric build-up.

The integration of radio frequency functions in a component carrier such as a Printed Circuit Board (PCB) involves certain requirements in terms of dielectric materials. For example, high frequency materials provided by Rogers Corporation, which are typically required to be used as a complete layer, may be used. This involves a considerable cost outlay and also creates a material bridge which extends spatially along a large part of the component carrier. Typically, such antenna structures are arranged on the outer surface of the component carrier, which makes the antenna structures prone to malfunction due to mechanical damage. These and other drawbacks typically limit the reliability of component carriers with integrated antenna structures.

In all embodiments of the present invention, one or more shielded vias may be additionally provided in order to additionally protect the antenna signal. It is also possible to integrate one or more air chambers.

According to an exemplary embodiment, one or more additional shielding structures are provided for shielding the cavity, in particular the electronic components within the cavity. The cavity is formed in an electrically insulating core structure and the core structure may be at least partially surrounded by an electrically conductive material, such as copper. The conductive material may thus serve as an additional shielding structure. In another embodiment, the additional conductive structures may be arranged such that a side shield for the cavity is provided.

Furthermore, the so-called "x-in-board" technique may be used for partially integrating the board comprising the antenna structure into the component carrier. X in the plate is a localized sub-component carrier region using a different material and/or stacking pattern and/or design rule than the rest of the component carrier. It can be used to integrate different materials and to manage pitch changes between substrates. X in the panel is also focused on cost optimization as it provides integration of two cost-optimal material structures.

Fig. 1a illustrates an exemplary embodiment of a component carrier 100, the component carrier 100 comprising an electronic component 110 embedded in an electrically insulating material 105 of the component carrier. The electronic component 110 is here a High Frequency (HF) chip. The component carrier 100 comprises a first main surface 102 and a second main surface 101 opposite to the first main surface 102. The planar antenna structure 120 is arranged at the area of the first main surface 102 of the component carrier 100. The antenna structure 120 is disposed at or embedded in the dielectric layer 106, which includes a low Dk value and/or a low Df value. Below the dielectric layer 106, an electromagnetic radiation shielding structure 130 is arranged, which is formed as a layer and is made of a conductive metal, such as copper. The shielding structure 130 is configured to prevent electromagnetic radiation from propagating between the antenna structure 120 and the electronic component 110. The shielding structure 130 is arranged in a plane located between the antenna structure 120 and the electronic component 110 in order to provide a maximum shielding effect between the antenna structure 120 and the electronic component 110. Furthermore, the component carrier 100 comprises a conductive structure 150 for electrically connecting the electronic component 110 and the antenna structure 120 via the shielding structure 130. The conductive structure 120 includes three main portions: a first portion 153, a second portion 152, and a third portion configured as a redistribution layer 155. Even though the redistribution layer 155 is schematically illustrated as a complete layer, one skilled in the art will appreciate that the redistribution layer 155 may be perforated and/or separated into different portions depending on the respective application. The first portion 153 of the conductive structure is formed by a plurality of interconnect vias 153a and a planarization layer 153 b. Both the via 153a and the planar layer 153b are made of the same metal, e.g., copper. The first portion 153 of the conductive structure is oriented in a lateral direction of the electronic component 110 so as to at least partially surround the electronic component 110 in the lateral direction. The redistribution layer 155 is arranged at a second major surface 101 of the component carrier 100, which is opposite to the first major surface 102. The redistribution layer 155 is electrically connected to the first portion 153 of the conductive structure. The second portion 152 of the conductive structure is disposed between the electronic component 110 and the redistribution layer 155. Like the first portion 153 of the conductive structure, the second portion 152 of the conductive structure also includes interconnect vias 152a and a planarization layer 152b. The electronic component 110 comprises terminals 151 on a main surface area 110a facing away from the antenna structure 120. The terminal 151 is connected to a second portion 152 of the conductive structure that extends away from the terminal 151. In the manner described, conductive structure 150 electrically connects electronic component 110 to redistribution layer 155 via second portion 152 of the conductive structure. The conductive structure 153 also connects the redistribution layer 155 to the shielding structure 130 via the first portion 153 of the conductive structure. Here, the shielding structure 130 is not perforated at least in a plane P (shown in dashed lines) parallel to the shielding structure 130 and located between the antenna structure 120, the electronic component 110 and the first portion 153 of the conductive structure. The shielding structure 130 is also connected to the conductive portion 122, which is also connected to the antenna structure 120. The laminated layers of the component carrier 100 include: i) A central electrically insulating material 105 in which the electronic component 110 is embedded, ii) a conductive shielding structure 130 on top of the electrically insulating material 105, and iii) a conductive redistribution layer 155 under the electrically insulating material 105. Thus, the component carrier 100 is laminated in a symmetrical manner. Furthermore, the component carrier 100 comprises further electrically conductive structures 160. The further conductive structure 160 comprises a further first portion 163 which laterally at least partially surrounds the electronic component 110. In this way, the conductive structure 150 and the further conductive structure 160 form a shielding region around the electronic component 110 in order to shield the electronic component 110 from electromagnetic radiation from the antenna structure 120.

Fig. 1b illustrates a top view in cross-section of an exemplary embodiment of a component carrier 100. The electronic components 110 are embedded in the electrically insulating material 105 of the component carrier 100. The component carrier 100 comprises a plurality of further electrically conductive structures 160. Each further conductive structure 160 comprises a further first portion 163 which at least partially surrounds the electronic component 110 in a lateral direction. In this way, the conductive structure 150 and the further conductive structure 160 form a shielding region around the electronic component 110 in order to shield the electronic component 110 from electromagnetic radiation from the antenna structure 120. The size of the plane P, in which the shielding structure is not perforated, is shown by the dashed line and which is laterally delimited by the first partially

conductive structures

153, 163.

Fig. 1c illustrates a cross-sectional view of another exemplary embodiment of a component carrier 100. The component carrier 100 is very similar to the component carrier 100 of fig. 1a, with the difference that a plurality of electronic components 110 are embedded in the component carrier 100 and the component carrier 100 comprises further electrically conductive structures 160. The further conductive structure 160 comprises a further first portion 163 which laterally at least partially surrounds the electronic component 110. In this way, a plurality of different electronic components 110 may be arranged in the shielding area delimited by the shielding structure 130, the conductive structure 150 and the further conductive structure 160. Here, the shielding structure 130 and the redistribution layer 155 are shared by the conductive structure 150 and the further conductive structure 160. The second portions 152, 162 connecting the electronic component 110 with the redistribution layer are also shared between the conductive structure 150 and the further conductive structure 160. Also in this embodiment, the shielding structure 130 is not perforated in a plane P (shown by dashed lines) located between the antenna structure 120, the plurality of electronic components 110, the first portion 153 of the conductive structure and the further first portion 163 of the further conductive structure. The laminated layers of the component carrier 100 comprise: i) A central electrically insulating material 105 in which the electronic component 100 is embedded, ii) an electrically conductive shielding structure 130 on top of the electrically insulating material 105, and iii) an electrically conductive redistribution layer 155 below the electrically insulating material 105. Thus, the component carrier 100 is laminated in a symmetrical manner.

Fig. 2 illustrates a cross-sectional view of a component carrier 200 according to an exemplary embodiment of the invention. The component carrier 200 comprises a central core structure 205, which is arranged in the center of the electrically insulating material 105. The core structure 205 comprises a cavity 206, in which cavity 206 the electronic component 110 is arranged. The core structure 205 is surrounded by a conductive material. In this way, the cavity 206, and in particular the electronic component 110 within the cavity 206, is additionally shielded. The electronic component 110 is embedded in an electrically insulating material 105 and the cavity 206 between the electronic component 110 and the core structure 205 is also filled with the electrically insulating material 105. The laminated layers of the component carrier 200 include: i) A central core structure 205 embedded in the electrically insulating material 105, ii) an electrically conductive shielding structure 130 arranged on top of the electrically insulating material 105, and iii) an electrically conductive redistribution layer 155 arranged below the dielectric material 105. Thus, the component carriers 200 are laminated in a symmetrical manner. The shielding structure 130 is perforated in an area which is not in a plane P between the antenna structure 120, the electronic component 110, the first part 153 of the conductive structure and the further first part 163 of the further conductive structure.

According to an exemplary embodiment, the structure depicted in fig. 2 represents one unit that can be arranged more than once within the component carrier 200. For example, the component carrier 200 comprises at least two units as described in fig. 2 arranged laterally with respect to each other. The units may be arranged adjacent to each other or within a certain distance. Furthermore, the unit shown in fig. 2 may be arranged without the antenna structure 120. In this way, the following component carrier 200 can be provided, which has: i) One or more elements according to fig. 2 with an antenna structure 120, and ii) one or more elements according to fig. 2 without an antenna structure 120. Here, the units may be arranged laterally with respect to each other.

Fig. 3a to 3e show cross-sectional views of structures obtained during implementation of a method of manufacturing a component carrier 100 according to an exemplary embodiment of the invention.

Fig. 3a illustrates a step of providing a preform of the component carrier 100. The preform includes a core structure 205 and interconnect vias 153a.

Fig. 3b illustrates a step of removing material from the core structure 205 in order to form a cavity 206 in the core structure 205.

Fig. 3c illustrates a step of placing the electronic component 110 inside the cavity 206. Furthermore, fig. 3c illustrates a step of encapsulating the electronic component 110 in the dielectric material 105.

Fig. 3d illustrates a step of forming a second part 152 of the electrically conductive structure by making electrical contact to the electronic component 110. Further, the via 153a is extended so as to form a first portion 153 of the conductive structure.

Fig. 3e illustrates the step of forming the shielding structure 130 and the antenna structure 120 to complete the component carrier 200 (see fig. 2). It should be noted that the conductive structure 150 and the shielding structure 130 are made of the same material, in particular copper.

It should be noted that the term "comprising" does not exclude other elements or steps and the "a" or "an" does not exclude a plurality. Also elements described in association with different embodiments may be combined.

It should also be noted that reference signs in the claims shall not be construed as limiting the scope of the claims.

The embodiments of the invention are not limited to the preferred embodiments shown in the drawings and described above. Instead, it is possible to use the illustrated solution and many variants according to the principles of the invention even in the case of fundamentally different embodiments.

Reference numerals

100. 200 parts carrier

101. Second main surface

102. First main surface

105. Electrical insulation material

106. Dielectric layer

110. Electronic component

110a major surface of electronic component

120. Antenna structure

122. Conductive part

130. Shielding structure

150. Conductive structure

151. Terminal with a terminal body

152. Second part of the conductive structure

152a, 153a, 163a interconnect vias

152b, 153b, 163b metal layer

153. First part of conductive structure

155. Redistribution layer

160. Additional conductive structure

163. Further first part of the conductive structure

205. Core structure

206. Cavities in core structures

400. Carrier plate of the prior art

410. Digital IC of prior art

420. Antenna module of the prior art

And (4) a P plane.

Claims

1. A component carrier (100), comprising:

an electronic component (110) embedded in the component carrier (100);

an antenna structure (120) arranged at the area of the first main surface (102) of the component carrier (100);

a shielding structure (130) made of an electrically conductive material and configured for preventing electromagnetic radiation from propagating between the antenna structure (120) and the electronic component (110), wherein the shielding structure (130) is arranged at least partially between the antenna structure (120) and the electronic component (110);

a conductive structure (150) to electrically connect the electronic component (110) with the antenna structure (120) through the shielding structure (130), and

a central core structure (205) having a core structure,

wherein the central core structure (205) comprises a cavity (206),

wherein the electronic component (110) is at least partially arranged in the cavity (206), an

Wherein the central core structure (205) is arranged in the center of an electrically insulating material (105) of the component carrier (100) such that the central core structure (205) is embedded in the electrically insulating material (105),

wherein the shielding structure (130) is not perforated at least in a plane (P) located between the antenna structure (120) and the electronic component (110),

wherein the electronic component (110) comprises at least one terminal (151) at a main surface area (110 a) facing away from the antenna structure (120), and

wherein the terminal (151) is connected to a second portion of the conductive structure (150) extending away from the terminal (151).

2. The component carrier of claim 1, wherein the first portion of the electrically conductive structure laterally at least partially surrounds the electronic component.

3. The component carrier according to claim 2, wherein the shielding structure is not perforated at least in a plane between the antenna structure, the electronic component and the first portion of the electrically conductive structure.

4. The component carrier of claim 1, wherein the shielding structure is formed as a layer and comprises a metal.

5. The component carrier of claim 1, wherein the shielding structure is formed as a layer and comprises copper.

6. The component carrier of claim 1, wherein the electrically conductive structure comprises a redistribution layer disposed at a second major surface of the component carrier, wherein the second major surface is an opposite side of the first major surface of the component carrier.

7. The component carrier of claim 6, wherein the second portion of the electrically conductive structure is disposed between and electrically connects the terminal and the redistribution layer.

8. The component carrier of claim 6, wherein a first portion of the conductive structure laterally at least partially surrounds the electronic component, the first portion of the conductive structure being disposed between and electrically connecting the redistribution layer and the shielding structure.

9. The component carrier of claim 1, wherein the electrically conductive structure comprises: at least one interconnect via; and at least one conductive layer.

10. The component carrier of claim 9, wherein the interconnect via is a micro via.

11. The component carrier of claim 9, wherein the electrically conductive layer is a planar metal layer.

12. The component carrier according to claim 2, comprising at least one further electrically conductive structure comprising a further first portion of the further electrically conductive structure, which further first portion at least partially surrounds the electronic component, such that the electrically conductive structure and the further electrically conductive structure form an electromagnetic radiation shielding region around the electronic component.

13. The component carrier according to claim 12, wherein the shielding structure is not perforated in a plane between the antenna structure, the electronic component, the first part of the conductive structure and the further first part of the further conductive structure.

14. The component carrier according to claim 1, wherein the electrically conductive structure comprises an electrically conductive portion arranged at an area of the first main surface of the component carrier, wherein the electrically conductive portion is electrically connected to the antenna structure.

15. The component carrier of claim 1, comprising a dielectric layer.

16. The component carrier of claim 1, comprising a dielectric layer having a dissipation factor of no greater than 0.0008 at 80 GHz.

17. The component carrier according to claim 1, wherein the electronic component is embedded in an electrically insulating material.

18. The component carrier of claim 17, wherein the electrically insulating material is a dielectric material having a matched Coefficient of Thermal Expansion (CTE).

19. The component carrier of claim 17, wherein the electrically insulating material is a dielectric material having a CTE in a range of 1ppm to 10 ppm.

20. The component carrier of claim 17, wherein the electrically insulating material is a dielectric material having a CTE in a range of 3ppm to 7 ppm.

21. The component carrier of claim 1, wherein the horizontal layup of the component carrier is symmetrical about the embedded electronic component.

22. The component carrier of claim 1, wherein the horizontal layers of the component carrier are symmetric about the embedded electronic component in the cavity of the central core structure.

23. The component carrier of claim 1, wherein the electrically conductive structure is comprised of a single metal.

24. The component carrier of claim 1, wherein the electrically conductive structure is comprised of copper.

25. The component carrier of claim 1, comprising at least one of the following features:

the electronic component is a high frequency HF component;

a cut portion is disposed beneath the antenna structure and forms a cavity that is at least partially filled with a gas;

the component carrier comprises a first component carrier portion having a first cut portion and the component carrier comprises a second component carrier portion having a second cut portion,

the first cut portion and the second cut portion face opposite major surfaces of the antenna structure,

a conductive material is disposed on a surface of the first cut portion and on a surface of the second cut portion,

the first and second cut portions form first and second cavities, respectively, on opposite sides of the antenna structure, and

the first and second cavities are at least partially filled with a gas;

the component carrier comprises at least one electrically insulating layer structure comprising at least one of the group consisting of: resin, FR-4, FR-5; a cyanate ester; a polyphenylene derivative; glass; a prepreg material; a polyimide; a polyamide; a liquid crystalline polymer; an epoxy-based laminate film; polytetrafluoroethylene; a ceramic; and a metal oxide;

the component carrier is configured as a printed circuit board;

the conductive structure is at least partially coated with a superconducting material.

26. The component carrier according to claim 1, wherein the electronic component is an active electronic component or a passive electronic component.

27. The component carrier according to claim 1, wherein the electronic component is a non-conductive inlay and/or a conductive inlay.

28. The component carrier of claim 1, wherein the electronic component is an energy harvesting unit, a signal processing component, or an electromechanical transducer.

29. The component carrier of claim 1, wherein the electronic component is a storage device, a power management component, an encryption component, or a magnetic element.

30. The component carrier according to claim 1, wherein the electronic component is a filter, an optoelectronic interface element, a voltage converter, an actuator, a capacitor, a resistor, an inductance, an accumulator, a switch or a camera.

31. The component carrier of claim 1, wherein the electronic component is an integrated circuit.

32. The component carrier according to claim 1, wherein the electronic component is an electronic chip.

33. The component carrier according to claim 1, wherein the electronic component is a logic chip.

34. The component carrier of claim 1, wherein the electronic component is a microelectromechanical system.

35. The component carrier of claim 1, wherein the electronic component is a microprocessor.

36. The component carrier according to claim 1, wherein the electronic component is a heat transfer unit, a light guiding element, an emitter and/or a receiver, or another component carrier.

37. The component carrier of claim 25, wherein the gas at least partially filled in the cavity formed by the cut portion is air.

38. The component carrier of claim 25, wherein the gas at least partially filled in the first and second cavities is air.

39. The component carrier of claim 25, wherein the resin is a reinforced resin or a non-reinforced resin.

40. The component carrier of claim 25, wherein the resin is an epoxy resin or a bismaleimide-triazine resin.

41. The component carrier according to claim 1, wherein the component carrier is configured as a baseboard printed circuit board.

42. The component carrier of claim 1, wherein the component carrier is configured as a substrate.

43. The component carrier of claim 1, wherein the electrically conductive structure is at least partially composed of a superconducting material.

44. An electronic device, comprising:

a module having 4G and/or 5G functionality, an

The component carrier of claim 1.

45. Method of manufacturing a component carrier (100), comprising:

providing a preform of a component carrier (100);

embedding an electronic component (110) in the component carrier (100);

forming a shielding structure (130) made of an electrically conductive material and configured for preventing electromagnetic radiation from propagating between an antenna structure (120) and the electronic component (110);

forming the antenna structure (120) at least partially over the shielding structure (130) at a region of a first main surface (102) of the component carrier (100); and

forming a conductive structure (150) for electrically connecting the electronic component (110) with the antenna structure (120) through the shielding structure (130),

wherein the terminal (151) is connected to a second portion of the conductive structure (150) extending away from the terminal (151);

the method further comprises the following steps:

providing a central core structure;

removing material from the central core structure to form a cavity in the central core structure; and

positioning the electronic component at least partially in the cavity before the electronic component is embedded,

wherein the central core structure (205) is arranged in the center of an electrically insulating material (105) of the component carrier (100) such that the central core structure (205) is embedded in the electrically insulating material (105).

46. The method of claim 45, wherein,

removing material includes a subtractive process and/or a modified semi-additive process.

47. The method of claim 45, wherein,

forming the conductive structure includes a semi-additive process.