CN110571323A - Light-gathering nixie tube and processing technology thereof - Google Patents

Light-gathering nixie tube and processing technology thereof Download PDF

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Publication number
CN110571323A
CN110571323A CN201910858566.0A CN201910858566A CN110571323A CN 110571323 A CN110571323 A CN 110571323A CN 201910858566 A CN201910858566 A CN 201910858566A CN 110571323 A CN110571323 A CN 110571323A
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CN
China
Prior art keywords
light
shell
pcb
baking
gathering
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CN201910858566.0A
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Chinese (zh)
Inventor
陈星棉
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Foshan Xindi Electronic Technology Co Ltd
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Foshan Xindi Electronic Technology Co Ltd
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Priority to CN201910858566.0A priority Critical patent/CN110571323A/en
Publication of CN110571323A publication Critical patent/CN110571323A/en
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    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H01L33/54—Encapsulations having a particular shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H01L2933/005—Processes relating to semiconductor body packages relating to encapsulations

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)

Abstract

The invention discloses a light-gathering nixie tube, which comprises a shell and a PCB (printed circuit board), wherein the shell is provided with an installation cavity for accommodating the PCB, the bottom of the installation cavity is provided with a plurality of light-emitting channels, the PCB is correspondingly provided with a wafer at the position corresponding to the plurality of light-emitting channels, and the plurality of light-emitting channels form a display pattern; the shell is provided with a display surface, the display surface is arranged opposite to the installation cavity, and a display surface film and a light-transmitting protective film are sequentially pasted on the display surface; the mounting cavity and the light-emitting channel thereof are filled with light-gathering colloid, and the PCB is relatively fixed on the shell in a glue-pouring manner through the light-gathering colloid; and PIN needles are welded on the PCB and exposed through the light-gathering colloid to serve as PIN lines. The invention has simple structure, convenient operation of process flow and high automation degree, improves the light-gathering performance of the nixie tube from the aspects of both structure and process and optimizes the display effect.

Description

Light-gathering nixie tube and processing technology thereof
Technical Field
the invention belongs to the technical field of nixie tubes, and particularly relates to a light-gathering nixie tube and a processing technology thereof.
Background
With the development of technology, nixie tubes are widely applied in the field of digital display. The circuit board of the prior nixie tube is arranged on the outer shell or the display panel, and light rays are emitted through the channel on the outer shell or the display panel, so that the light rays are dispersed, the display effect is poor, and the overall performance of the nixie tube is reduced. Therefore, a digital tube with good light-gathering property is needed to improve the display effect.
disclosure of Invention
the invention provides a light-gathering nixie tube and a processing technology thereof, which improve the light-gathering property of the nixie tube from the aspects of the structure and the processing technology thereof and improve the display effect of a product.
in order to solve the technical problem, the light-gathering nixie tube provided by the invention comprises a shell and a PCB (printed circuit board), wherein the shell is provided with an installation cavity for accommodating the PCB, the bottom of the installation cavity is provided with a plurality of light-emitting channels, the PCB is correspondingly provided with a wafer corresponding to the positions of the light-emitting channels, and the light-emitting channels form display patterns; the shell is provided with a display surface, the display surface is arranged opposite to the installation cavity, and a display surface film and a light-transmitting protective film are sequentially pasted on the display surface; the mounting cavity and the light-emitting channel thereof are filled with light-gathering colloid, and the PCB is relatively fixed on the shell in a glue-pouring manner through the light-gathering colloid; and PIN needles are welded on the PCB and exposed through the light-gathering colloid to serve as PIN lines.
A processing technology of a light-gathering nixie tube comprises the following steps:
(1) Jumping the PIN;
(2) Pressing PIN: pressing the PIN needle into a PIN hole of the PCB;
(3) And (3) crystal solidification: after the wafer is subjected to wafer expansion, carrying out die bonding on the PCB through a die bonding machine;
(4) Pre-baking: setting the baking temperature of an oven, and timing and baking the PCB after die bonding;
(5) welding wires: bonding wires on the wafer by using a wire bonding machine;
(6) Front measurement: sequentially carrying out electrical property test and optical property test on the PCB by an electrical property test machine and a photochromic test machine; the qualified good products enter the next procedure, and the unqualified defective products are sent to the repair treatment;
(7) Blowing dust by the shell: blowing dust to the shell by using an air gun;
(8) Tape pasting: applying an adhesive tape on the display surface of the shell;
(9) preheating the shell: and putting the shell into an oven, setting the preheating temperature, and preheating for a certain preheating time.
(10) Preparing a light-gathering colloid: preheating and glue preparation;
(11) Glue pouring: adjusting the working state and the glue filling parameters of the glue filling nozzle, and filling glue into the shell;
(12) Plate assembling: the method comprises the following steps of vacuum defoaming, plate sleeving: inserting the PCB into the glue solution, and pressing the PCB;
(13) Post-baking: setting the baking temperature of the oven, and baking the product which is assembled into the plate in a timing manner;
(14) And (3) post measurement: sequentially carrying out electrical property test and optical property test on the PCB by an electrical property test machine and a photochromic test machine; qualified good products enter the next procedure, and unqualified products are recycled;
(15) film pasting: sequentially pasting a display surface film and a light-transmitting protective film on the display surface of the shell;
(16) and (7) packaging and warehousing.
Therefore, the light-gathering colloid is used, and the panel assembly packaging is carried out through the glue pouring process, so that the light-gathering property of the nixie tube is improved. By adopting the mode of controlling the process operation temperature, the preheating temperature of the shell, the preheating temperature of the light-gathering colloid, the post-baking temperature and the like are well regulated and controlled, so that the light-gathering colloid can show better service performance on the product from the aspects of light gathering performance, service life and the like.
further, in the pre-baking in the step (4), the baking temperature is 150 +/-5 ℃, and the baking time for timing baking is 2 hours.
Further, in the pre-baking in the step (4), before the PCB is placed, the oven is preheated to more than 100 ℃; after preheating, putting the PCB which finishes die bonding into an oven, and turning on a timing switch to start timing baking when the display temperature reaches the set baking temperature.
Further, in the step (7), during dust blowing of the shell, the shell is lightly arranged on the steel mesh according to the downward direction of the installation cavity, and meanwhile, a basin with water is arranged below the steel mesh; clamping the shell through a steel mesh and overturning the shell, so that one surface of an installation cavity of the shell faces upwards; and then, using an air gun to aim at each shell to blow dust in all directions, and repeatedly blowing the dust for 2-3 times.
a water basin is arranged under the steel mesh, so that dust blown down from the shell can be adsorbed, and secondary pollution caused by the dust flying in the air is avoided; when water in the basin floats an excessively thick layer of foreign matter, the water should be replaced in time, the water layer is guaranteed to hold the dust, and then the surface cleanliness reaches the production standard after the shell blows the dust.
Further, in the step (9), in the preheating of the shell, the preheating temperature is 75 +/-5 ℃, and the preheating time is at least 2 hours.
further, in the step (11), the distance between the glue injection nozzles and the shell are adjusted to ensure that each shell in a row is allocated with the same number of glue injection nozzles, the central point between the glue injection nozzles corresponds to the corresponding central line of the shell, and the vertical distance between each glue injection nozzle and the plane at the top end of the shell is the height of any finger.
further, in the step (11), the glue injection and delivery amount is adjusted to be 0.01-5.5 g, the glue discharging speed is 6ml/s, and the drip-proof time is 0.1s
Further, in the baking after the step (13), the baking temperature is 60-90 ℃, and the baking time is 6-9 hours.
The invention has simple structure, convenient operation of process flow and high automation degree, improves the light-gathering performance of the nixie tube from the aspects of both structure and process and optimizes the display effect.
Drawings
fig. 1 is a schematic cross-sectional view of a light-gathering nixie tube according to the present invention.
Detailed Description
the present invention is described in further detail below with reference to the attached drawings.
As shown in fig. 1, the light-gathering nixie tube of the present invention includes a casing 1 and a PCB 2, wherein the casing 1 is provided with an installation cavity 3 for accommodating the PCB 2, the bottom of the installation cavity 3 is provided with a plurality of light-emitting channels 31, the PCB 2 is provided with a wafer corresponding to the plurality of light-emitting channels 31, and the plurality of light-emitting channels 31 form a display pattern of the nixie tube; the shell 1 is provided with a display surface 4, and the display surface 4 is arranged back to the mounting cavity 3; a display surface film and a light-transmitting protective film (not shown) are sequentially applied to the display surface 4; the mounting cavity 3 and the light-emitting channel 31 thereof are filled with light-gathering colloid 5, and the PCB 2 is fixed on the shell 1 by adopting the light-gathering colloid 5 in a glue filling manner; specifically, the shell 1 is provided with a positioning column 6, the PCB 2 is provided with a matched positioning hole, and the positioning hole is sleeved on the positioning column 6 when the PCB 2 is placed, so that the alignment rate of a wafer on the PCB 2 and the light-emitting channel 31 is improved; the PCB 2 is welded with PIN needles 7, and the PIN needles 7 penetrate through the light-gathering colloid 5 to be exposed as PIN lines. Specifically, in the present embodiment, the light-gathering colloid 5 is made of epoxy resin or a certain amount of diffusant mixed, and the component ratio of the diffusant is specifically determined according to the demand of the product, i.e. production.
The processing technology of the light-gathering nixie tube comprises the following steps:
(1) Skip PIN
the method comprises the steps of placing PIN needles in a PIN jumping box, arranging PIN grooves of a PCB corresponding to a die, covering the die with a die cover, locking the die cover on the PIN jumping box, placing the whole PIN jumping box into a PIN jumping machine corresponding to a rotary rod groove, finally starting a power supply to start PIN jumping, and controlling the PIN jumping time to be 25-45 seconds. Note that the remaining PIN PINs in the PIN slot need to be replaced every approximately one hour.
(2) Press PIN
And pushing the PCB which finishes the PIN jumping to a jig of the PIN pressing machine from the jig groove, and enabling the PCB to correspond to the center position of the upper pressing die and the lower pressing die. The PCB board at this moment closely pastes the tool, and operating personnel both hands press down hydraulic switch simultaneously, go up the moulding-die and push down and press into the PIN hole of PCB board with the PIN needle.
Accomplish and press PIN, go up the moulding-die and rise, use the PCB board that the PIN was pressed to next PCB board that will have accomplished to press PIN to release, the PCB board that the PIN was pressed to next simultaneously is pushed the tool of pressing the PIN machine, begins the work of next round pressure PIN, so circulation work.
after pressing PIN, PIN needle pressed into one end of PCB board and PCB board parallel and level, this tip carries out soldering tin, and the soldering tin height is 0.15 ± 0.03 mm.
(3) die bonding
Before die bonding, the wafer is subjected to die expanding treatment, and the grain spacing of the wafer is expanded to 1-3 grain widths by a die expanding machine. During crystal expansion, the temperature of a lower platform of the crystal expansion machine is controlled to be 45-70 ℃, and the air pressure is controlled to be 0.4-0.8 mpa.
And discharging the PCB to a die bonding fixture, brushing plates and removing dust by using a brush from left to right and from top to bottom, and then performing die bonding operation by using a die bonding machine. Controlling the slurry taking height of the solid crystal to be-500-6000 mu m, the solid slurry height to be-3000-900 mu m, the single step adjustment to be 10 mu m, the thimble height to be 50-1500 mu m, the single step adjustment to be 1-50 mu m, the solid crystal height to be-4000-10000 mu m, the single step adjustment to be 50-200 mu m, the crystal taking height to be-11100-6000 mu m, the single step adjustment to be 50-200 mu m, and specific parameter values are determined according to actual production conditions. The height of the die bond is 1/3-1/2 of the height of the wafer, preferably 1/3. Specifically, in this embodiment, the die attach adhesive is silver adhesive.
(4) Front roasting
Setting the baking temperature of the oven to be 150 +/-5 ℃, and preheating the oven to be more than 100 ℃ before putting the PCB. After preheating, putting the PCB which is finished with die bonding into an oven, turning on a timing switch when the displayed temperature reaches the set baking temperature, starting timing baking, and making a baking record, wherein the heating baking time is 2 hours.
and after the timing baking is finished, the oven automatically stops heating, and the PCB is taken out after the temperature is reduced for 10-15 minutes.
Note that in the process of temperature rise and constant temperature, the air inlet on the side of the oven is half opened, and the air outlet is connected with an air exhaust pipeline. The overtemperature protection knob is 20 ℃ higher than the set baking temperature, the operation is completed by a technician, and the operator is responsible for checking and cannot adjust the overtemperature protection knob randomly.
(5) Bonding wire
And adjusting a product clamp, installing a PCB (printed Circuit Board), putting the product clamp into a clamp platform of the wire bonding machine after the clamp platform is adjusted, clamping, setting corresponding parameters, observing and trial-welding a product under a microscope, and performing wire bonding after QC (quality control) detection reaches the standard. Specifically to this embodiment, aluminum wire is used for the welding. The PCB with the welded wires is arranged in the anti-static black box in rows, and the row spacing is suitable for being held by just putting a finger.
During wire bonding, the power of the wire bonding is 70-110 w, the pressure is 80-160 g, and the time is 10-30 seconds. The first welding point sphere is required to be within the aluminum pad of the wafer, the second welding point sphere is required to be at the flat part of the PCB, the diameter of the welding point sphere is 1.3-1.8 times of the wire diameter of the welding wire, the radian of the welding wire is 1.2-2 times, preferably 1.5 times of the height of the wafer, and specifically, the radian of the welding wire is the vertical distance from the bottom surface of the wafer to the peak point of the welding wire.
(6) Front side survey
Adjusting the distance between the locking seats to be suitable for the distance between the two rows of PIN needles of the PCB to be tested; and inserting the PCB to be tested into the locking seat according to a specified direction, clamping, starting the testing machine, repeating the operation, and sequentially carrying out electrical test and optical performance test on the PCB through the electrical testing machine and the photochromic testing machine.
After testing, putting qualified good products into a good product tray, marking, and waiting for entering the next processing procedure; judging products with uneven brightness and color according to limit samples, and carrying out extinction treatment by adopting an extinction stylus; and picking out the welding lines or picking out the crystal grains, classifying the crystal grains, putting the crystal grains into a defective product box, marking the crystal grains, and sending the defective product to repair.
(7) Dust blowing of shell
according to the direction that the installation cavity faces downwards, the shells are lightly arranged on the steel mesh, and meanwhile, a basin with water is arranged below the steel mesh; clamping the shell through a steel mesh and overturning the shell, so that one surface of an installation cavity of the shell faces upwards; and then, using an air gun to aim at each shell to blow dust in all directions, and repeatedly blowing the dust for 2-3 times. And after dust blowing is finished, turning the shell again to enable the installation cavity of the shell to face downwards, then taking the layered leatheroid as an interval, and discharging the shell in a layered mode by taking one layer of shell which blows dust once as a unit to wait for the use of the next procedure.
and in the dust blowing process, controlling the air pressure of the air gun to be 0.4-0.8 mpa. A water basin is arranged under the steel mesh, so that dust blown down from the shell can be adsorbed, and secondary pollution caused by the dust flying in the air is avoided; when water in the basin floats an excessively thick layer of foreign matter, the water should be replaced in time, the water layer is guaranteed to hold the dust, and then the surface cleanliness reaches the production standard after the shell blows the dust.
(8) adhesive tape
The shell is arranged on the tape sticking mould according to the direction of the positioning gap of the jig, then the tape sticking mould with the shell arranged is placed on the table board of the tape sticking machine according to the same direction, the shell is tightly attached to the positioning strip, then the power switch is started, the tape sticking is completed for one time, the adhesive tape is stuck on the display surface of the shell, the phenomenon that the pattern display surface is scraped in the subsequent processing procedure is avoided, the luminous through hole is sealed, and preparation is made for subsequent glue pouring. The shell bodies which are pasted with the tapes are placed to the transfer paper boards in rows by taking a row of shell bodies which finish the tape pasting process at one time as a unit, the adhesive tapes which leak from the edges of two sides of each row of shell bodies are pasted and connected into a whole, and after the transfer paper boards are placed on one board, a piece of interlayer paper is laid. Each board of the shell is stacked in layers and transferred to the next process in units of stacks, specifically, no more than 20 layers of shell per stack.
And in the working process of the tape sticking machine, controlling the air pressure of the machine to be 0.1-0.4 m Pa.
(9) Preheating of shells
Putting the shell into an oven, and preheating the shell to obtain no more than 10 layers of shells each time; setting the preheating temperature to be 75 +/-5 ℃ and the preheating time to be at least 2 hours, recording, and adjusting the specific preheating temperature and the specific preheating time according to the air temperature change of the working environment. When the temperature of the working environment is lower than 20 ℃, the preheating temperature is 80 ℃, and the preheating time is at least 2.5 hours; and the preheated shell is taken out and then must be filled with glue within 60 minutes, otherwise, the shell must be preheated again before being used next time.
(10) Preparation of light-focusing colloid
First, preheating
Setting the preheating temperature of the oven to 65 +/-5 ℃, and putting the epoxy resin and the diffusant into the oven for preheating for at least 1 hour. Specifically, in the embodiment, the epoxy resin adopts the glue A and the glue B, and the preheating temperature of the epoxy resin cannot be higher than 80 ℃.
② preparing glue
mixing the glue A in parts by weight: b, glue B: 100 parts of dispersing agent: and (5) 100:4, respectively weighing a certain amount of glue A, glue B and a dispersing agent by using an electronic scale according to the size of the product, and then pouring the glue A, the glue B and the dispersing agent into the mixed solution to stir for 7-10 minutes. Note that the amount of the A glue weighed each time can not exceed 2500g, and waste caused by the fact that the glue preparation amount is too large and the glue cannot be used in time is avoided.
When the temperature of the working environment is lower than 20 ℃, the prepared light-gathering colloid is placed in an oven, and is preheated for 10 minutes again at the preheating temperature of 65 ℃ until the next working procedure.
(11) glue filling
Preparing the preheated shell, and keeping the temperature of the shell at 25-45 ℃ to finish glue pouring. The distance between the glue injection nozzles and the shell are adjusted to ensure that the same number of glue injection nozzles are distributed to each shell in a row, the central point between the glue injection nozzles corresponds to the corresponding central line of the shell, and the vertical distance between each glue injection nozzle and the plane of the top end of the shell is the height of any finger.
Pouring the prepared light-gathering colloid into a glue filling bottle, adjusting the glue filling and conveying amount to be 0.01-5.5 g, the glue discharging speed to be 6ml/s and the drip-proof time to be 0.1s, and starting automatic glue filling. The air pressure of the machine is controlled to be 0.4-0.8 mpa in the glue pouring process, specific glue pouring parameters are adjusted according to different products, and the specific glue conveying amount is based on the height of a glue layer after glue pouring and a positioning column of the shell.
(12) Combined board
□ vacuum defoaming
Setting the temperature of the inner cavity of the vacuum box to be 55-65 +/-5 ℃, horizontally and tidily placing the filled shell on an inner layer frame of the vacuum box in a single layer manner, screwing down an air inlet valve, opening equipment and performing vacuum defoaming. And (4) when the air pressure in the vacuum box reaches-0.1 mpa (observing a vacuum meter), starting timing and defoaming, wherein the defoaming time is 15-35 minutes, and preferably 30 minutes. After timing, the air inlet valve is opened slowly, the power supply of the vacuum pump is closed when the air pressure in the vacuum box is reduced, the shell is taken out after the air pressure in the vacuum box is restored to the atmospheric value, and the shell is orderly stacked for use in the next procedure.
When the shell is placed in a vacuum box, the shell is required to be placed layer by layer from top to bottom; and when the defoaming is finished, taking out the materials layer by layer from bottom to top. The operation sequence of the vacuum defoaming process directly influences the defoaming effect of the shell and finally influences the quality of the product.
② nest plate
Preparing a PCB qualified by previous measurement, discharging the debubbled shell into an aluminum plate in a uniform direction, clamping the PCB, soaking the surface of one side of the PCB, which is not provided with a pin wire, in the debubbling liquid to ensure that the contact surface is completely soaked and is stained with the debubbling liquid, and then putting the PCB into an installation cavity of the shell. When the PCB is placed in the shell, one side edge of the PCB is inserted into the glue solution of the shell according to the positioning column, and then the other side edge is slowly put down by taking the side edge as an axis, so that bubbles are prevented from being generated in the process.
When the PCB is clamped, attention should be paid to the fact that the PIN needle of the PCB is grabbed by two fingers without touching the rest parts of the PCB, and product pollution is avoided.
Thirdly, pressing plate
And pressing the semi-finished product after board sleeving to enable the PCB to be tightly pressed on the shell, and placing the PCB in an oven which is heated and preheated in advance within 10 minutes.
(13) After roasting
Setting the baking temperature of the oven to be 60-90 ℃, putting products into an interlayer steel frame of the oven from bottom to top in layers, putting three layers of products at most every two layers, starting timing baking after the baking is finished, and making a baking record, wherein the baking time is 6-9 hours. And after the timing is finished, closing the heating power supply for about half an hour, opening the oven door, and taking out the product.
Before taking out the product, pressing or scratching the colloid by fingers or a blade, and baking after confirming that the colloid is completely cured and has no large-area cracks.
(14) rear measurement
adjusting the distance between the locking seats to be suitable for the distance between the two rows of PIN needles of the product to be tested; and inserting the product to be tested into the locking seat according to a specified direction, clamping, starting the testing machine, repeating the operation, and sequentially carrying out electrical property test and optical property test on the product through the electrical property testing machine and the light color testing machine. And (5) the qualified product is detected to enter the next procedure, and the unqualified product is recycled.
(15) Adhesive film
And tearing off the adhesive tape of the product, sequentially applying the display mask and the light-transmitting protective film according to requirements, and lightly pressing with fingers.
(16) Packaging and warehousing
What has been described above are merely some embodiments of the present invention. It will be apparent to those skilled in the art that various changes and modifications can be made without departing from the inventive concept thereof, and these changes and modifications can be made without departing from the spirit and scope of the invention.

Claims (9)

1. the light-gathering nixie tube is characterized by comprising a shell (1) and a PCB (printed circuit board) (2), wherein the shell (1) is provided with an installation cavity (3) for accommodating the PCB (2), the bottom of the installation cavity (3) is provided with a plurality of light-emitting channels (31), the PCB (2) is correspondingly provided with a wafer corresponding to the positions of the light-emitting channels (31), and the light-emitting channels (31) form display patterns; the shell (1) is provided with a display surface (4), the display surface (4) is arranged opposite to the installation cavity (3), and a display surface film and a light-transmitting protective film are sequentially pasted on the display surface (4); the mounting cavity (3) and the light-emitting channel (31) thereof are filled with light-gathering colloid (5), and the PCB (2) is relatively fixed on the shell (1) in a glue-pouring manner through the light-gathering colloid (5); the PCB (2) is welded with PIN needles (7), and the PIN needles (7) penetrate through the light-gathering colloid (5) to be exposed to serve as PIN lines.
2. The processing technology of the light-gathering nixie tube as claimed in claim 1, comprising the steps of:
(1) Jumping the PIN;
(2) Pressing PIN: pressing the PIN needle into a PIN hole of the PCB;
(3) And (3) crystal solidification: after the wafer is subjected to wafer expansion, carrying out die bonding on the PCB through a die bonding machine;
(4) pre-baking: setting the baking temperature of an oven, and timing and baking the PCB after die bonding;
(5) Welding wires: bonding wires on the wafer by using a wire bonding machine;
(6) Front measurement: sequentially carrying out electrical property test and optical property test on the PCB by an electrical property test machine and a photochromic test machine; the qualified good products enter the next procedure, and the unqualified defective products are sent to the repair treatment;
(7) Blowing dust by the shell: blowing dust to the shell by using an air gun;
(8) Tape pasting: applying an adhesive tape on the display surface of the shell;
(9) Preheating the shell: and putting the shell into an oven, setting the preheating temperature, and preheating for a certain preheating time.
(10) Preparing a light-gathering colloid: preheating and glue preparation;
(11) Glue pouring: adjusting the working state and the glue filling parameters of the glue filling nozzle, and filling glue into the shell;
(12) Plate assembling: the method comprises the following steps of vacuum defoaming, plate sleeving: inserting the PCB into the glue solution, and pressing the PCB;
(13) Post-baking: setting the baking temperature of the oven, and baking the product which is assembled into the plate in a timing manner;
(14) And (3) post measurement: sequentially carrying out electrical property test and optical property test on the PCB by an electrical property test machine and a photochromic test machine; qualified good products enter the next procedure, and unqualified products are recycled;
(15) Film pasting: sequentially pasting a display surface film and a light-transmitting protective film on the display surface of the shell;
(16) And (7) packaging and warehousing.
3. the process for manufacturing a light-concentrating digital tube according to claim 2, wherein the baking temperature in the pre-baking of step (4) is 150 ± 5 ℃, and the baking time for the timed baking is 2 hours.
4. The process according to claim 3, wherein in the pre-baking step (4), the oven is preheated to a temperature of 100 ℃ or higher before the PCB is placed; after preheating, putting the PCB which finishes die bonding into an oven, and turning on a timing switch to start timing baking when the display temperature reaches the set baking temperature.
5. the process for manufacturing a light-gathering nixie tube as claimed in claim 2, wherein in the step (7), in the dust blowing of the shell, the shell is lightly arranged on the steel mesh with the installation cavity facing downwards, and a basin with water is arranged below the steel mesh; clamping the shell through a steel mesh and overturning the shell, so that one surface of an installation cavity of the shell faces upwards; and then, using an air gun to aim at each shell to blow dust in all directions, and repeatedly blowing the dust for 2-3 times.
6. The process according to claim 2, wherein the preheating of the housing in step (9) is performed at a temperature of 75 ± 5 ℃ for at least 2 hours.
7. the process according to claim 2, wherein in the step (11), the distance between the glue injection nozzles and the housing are adjusted to ensure that each housing in a row is allocated with the same number of glue injection nozzles, the center point between the glue injection nozzles corresponds to the corresponding center line of the housing, and the vertical distance between each glue injection nozzle and the top plane of the housing is equal to the height of any finger.
8. The processing technology of the light-concentrating digital tube as claimed in claim 2, wherein in the step (11), the glue injection amount is adjusted to be 0.01-5.5 g, the glue discharging speed is 6ml/s, and the drip-proof time is 0.1 s.
9. the process for manufacturing a light-concentrating digital tube according to claim 2, wherein the baking temperature in the baking step (13) is 60-90 ℃ and the baking time is 6-9 hours.
CN201910858566.0A 2019-09-11 2019-09-11 Light-gathering nixie tube and processing technology thereof Pending CN110571323A (en)

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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104411111A (en) * 2014-12-17 2015-03-11 江苏稳润光电有限公司 Packaging process for LED nixie tubes
CN107424526A (en) * 2017-08-10 2017-12-01 天津美森电子有限公司 A kind of digital display tube and its production technology of uniformly astigmatism
CN107680502A (en) * 2017-11-17 2018-02-09 江门市蓬江区精汇电子科技有限公司 A kind of novel LED digital pipe
CN207558321U (en) * 2017-11-17 2018-06-29 江门市蓬江区精汇电子科技有限公司 LED charactrons

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104411111A (en) * 2014-12-17 2015-03-11 江苏稳润光电有限公司 Packaging process for LED nixie tubes
CN107424526A (en) * 2017-08-10 2017-12-01 天津美森电子有限公司 A kind of digital display tube and its production technology of uniformly astigmatism
CN107680502A (en) * 2017-11-17 2018-02-09 江门市蓬江区精汇电子科技有限公司 A kind of novel LED digital pipe
CN207558321U (en) * 2017-11-17 2018-06-29 江门市蓬江区精汇电子科技有限公司 LED charactrons

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