CN110556467A

CN110556467A - LED lamp and manufacturing method thereof

Info

Publication number: CN110556467A
Application number: CN201910949413.7A
Authority: CN
Inventors: 任夏峰; 于涛; 陈文君; 张耀华; 林胜; 张日光
Original assignee: Ningbo Sunpu Opto Co Ltd
Current assignee: Ningbo Sunpu Opto Co Ltd
Priority date: 2019-10-08
Filing date: 2019-10-08
Publication date: 2019-12-10

Abstract

The application discloses LED lamp includes: the substrate with the recess, the luminous wafer of LED, the wire, the packaging body, the substrate includes the support and is located the bowl cup of support upper surface, just the bowl cup with the outward flange of support contact area is located the inboard of the outward flange of support, the luminous wafer of LED is located in the recess, the both ends of wire are connected respectively the luminous wafer of LED with the substrate, the bowl cup completely cladding in the packaging body. It is thus clear that the LED lamp in this application includes basement, the luminous wafer of LED, wire, packaging body four bibliographic categories branch, and the packaging body carries out whole parcel to the bowl cup, makes the leakproofness of LED lamp improve, and inside steam is difficult to permeate the LED lamp, the quality of improvement product. In addition, the application also provides a manufacturing method of the LED lamp with the advantages.

Description

LED lamp and manufacturing method thereof

Technical Field

the application relates to the technical field of light emitting diodes, in particular to an LED lamp and a manufacturing method thereof.

Background

A Light Emitting Diode (LED) is a simple lamp, and the Light Emitting principle is that current passes through a compound semiconductor, and excess energy is released in the form of Light by the combination of electrons and holes, so as to achieve the Light Emitting effect. The patch type LED has the advantages of small volume, large scattering angle, good light emitting uniformity, high reliability and the like.

at present, the structural schematic diagram of a patch type LED is shown in fig. 1, a frame of the patch type LED is a frame with a smooth surface, bowls are stacked on the frame, the outer sides of the bowls are flush with the outer sides of the frame, glue is used for encapsulating the inner portions of the bowls, and the sealing performance is poor. Inside moisture permeates the SMD LED lamp easily under moist, the high temperature environment, receives the high temperature effect during the welding of LED wafer and makes the inside moisture inflation of infiltration produce great stress release, causes the product to become invalid easily.

Therefore, how to improve the sealing performance of the patch LED lamp is a technical problem that needs to be solved urgently by those skilled in the art.

Disclosure of Invention

The application aims to provide an LED lamp and a manufacturing method thereof, so that the sealing performance of the patch type LED lamp is improved.

In order to solve the above technical problem, the present application provides an LED lamp, including: the substrate with the recess, the luminous wafer of LED, the wire, the packaging body, the substrate includes the support and is located the bowl cup of support upper surface, just the bowl cup with the outward flange of support contact area is located the inboard of the outward flange of support, the luminous wafer of LED is located in the recess, the both ends of wire are connected respectively the luminous wafer of LED with the substrate, the bowl cup completely cladding in the packaging body.

Optionally, the bracket has a through hole penetrating the thickness, and the through hole is filled with the package body.

Optionally, the through hole is a convex through hole.

Optionally, the upper surface of the bracket is a roughened surface.

Optionally, the package body is an epoxy glue package body or a silica gel package body.

Optionally, an edge of the package body contacting the upper surface of the substrate is located inside an outer edge of the bracket.

The application also provides a manufacturing method of the LED lamp, which comprises the following steps:

Fixing an LED light-emitting wafer in the groove of a substrate with a groove, wherein the substrate comprises a support and a bowl cup positioned on the upper surface of the support;

Welding two ends of a lead with the LED light-emitting wafer and the substrate respectively;

And integrally encapsulating the upper surface of the substrate by using an encapsulation body to obtain the LED lamp.

Optionally, before the fixing the LED chip in the groove of the substrate with the groove, the method further includes:

And punching the support to enable the support to be provided with a through hole penetrating through the thickness.

and roughening the upper surface of the bracket.

Optionally, the roughening treatment of the upper surface of the support includes:

And roughening the upper surface of the bracket by utilizing an electroplating process or a stamping process.

The application provides an LED lamp includes: the LED light-emitting device comprises a substrate with a groove, an LED light-emitting wafer, a wire and a packaging body, wherein the substrate comprises a support and a bowl cup positioned on the upper surface of the support, the LED light-emitting wafer is positioned in the groove, two ends of the wire are respectively connected with the LED light-emitting wafer and the substrate, and the bowl cup is completely wrapped in the packaging body. It is thus clear that the LED lamp in this application includes basement, the luminous wafer of LED, wire, packaging body four bibliographic categories branch, and the packaging body carries out whole parcel to the bowl cup, makes the leakproofness of LED lamp improve, and inside steam is difficult to permeate the LED lamp, the quality of improvement product. In addition, the application also provides a manufacturing method of the LED lamp with the advantages.

Drawings

For a clearer explanation of the embodiments or technical solutions of the prior art of the present application, the drawings needed for the description of the embodiments or prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present application, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.

Fig. 1 is a schematic structural diagram of a patch LED in the prior art;

fig. 2 is a schematic cross-sectional structure diagram of an LED lamp according to an embodiment of the present disclosure;

FIG. 3 is a schematic cross-sectional view of another LED lamp provided in the embodiments of the present application;

FIG. 4 is a schematic cross-sectional view of another LED lamp provided in the embodiments of the present application;

Fig. 5 is a top view of an LED lamp according to an embodiment of the present disclosure;

Fig. 6 is a flowchart of a method for manufacturing an LED lamp according to an embodiment of the present disclosure;

FIG. 7 is a flow chart of another method for manufacturing an LED lamp according to the embodiment of the present disclosure;

in the figure: 1. the LED chip comprises a substrate with a groove, 2 LED luminous chips, 3 conducting wires, 4 packaging bodies, 5 through holes, 6 identification points, 11 supports and 12 bowls.

Detailed Description

In order that those skilled in the art will better understand the disclosure, the following detailed description will be given with reference to the accompanying drawings. It is to be understood that the embodiments described are only a few embodiments of the present application and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.

In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention, but the present invention may be practiced in other ways than those specifically described and will be readily apparent to those of ordinary skill in the art without departing from the spirit of the present invention, and therefore the present invention is not limited to the specific embodiments disclosed below.

As described in the background art, the frame of the conventional patch LED is a frame with a smooth surface, the frame is stacked with bowls, the outer sides of the bowls are flush with the outer sides of the frame, and the inner sides of the bowls are encapsulated with glue, which results in poor sealing performance. Inside moisture permeates the SMD LED lamp easily under moist, the high temperature environment, receives the high temperature effect during the welding of LED wafer and makes the inside moisture inflation of infiltration produce great stress release, causes the product to become invalid easily.

in view of the above, the present application provides an LED lamp, please refer to fig. 2, and fig. 2 is a schematic cross-sectional structure diagram of an LED lamp according to an embodiment of the present application, the LED lamp includes: substrate 1 with recess, LED luminescence wafer 2, wire 3, packaging body 4, substrate 1 includes support 11 and is located the bowl cup 12 of support 11 upper surface, just bowl cup 12 with support 11 contact area's outward flange is located the inboard of support 11's outward flange, LED luminescence wafer 2 is located in the recess, the both ends of wire 3 are connected respectively LED luminescence wafer 2 with substrate 1, bowl cup 12 completely cladding in packaging body 4.

wherein, the outer edge of the contact area of the bowl 12 and the bracket 11 is positioned at the inner side of the outer edge of the bracket 11, namely, the area outside the groove, and the bowl 12 and the bracket 11 form a downward step.

in this embodiment, the whole of bowl cup 12 is all lived by packaging body 4 parcel, and it can be understood that whole parcel does not include the surface of bowl cup 12 with the contact of support 11 for the inboard and the outside of bowl cup 12 all combine with packaging body 4, and the purpose is the leakproofness that improves the LED lamp, thereby make inside steam is difficult to permeate the LED lamp, improve the quality of product.

the LED light emitting chip 2 is located in the groove of the substrate 1, and specifically, the LED light emitting chip 2 is located on the upper surface of the support 11.

it should be noted that, in this embodiment, the wire 3 is not particularly limited, and the requirement can be satisfied as long as the wire can perform a conductive function, and as the case may be, the wire 3 is generally a metal wire 3. Specifically, one end of the wire 3 is connected to the LED chip 2, and the other end is connected to the support 11 in the substrate 1.

In the present embodiment, the type of the package 4 is not particularly limited, and may be determined as appropriate. For example, the package 4 is an epoxy package 4 or a silicone package 4.

Typically, the bowl 12 is made of a plastic material. The LED lamp that this embodiment provided includes: substrate 1 with recess, LED luminous wafer 2, wire 3, packaging body 4, substrate 1 includes support 11 and is located the bowl cup 12 of support 11 upper surface, LED luminous wafer 2 is located in the recess, the both ends of wire 3 are connected respectively LED luminous wafer 2 with substrate 1, the complete cladding of the upper surface of substrate 1 has packaging body 4. Therefore, the LED lamp in the embodiment comprises the substrate 1, the LED light-emitting wafer 2, the lead 3 and the packaging body 4, the bowl cup 12 is integrally wrapped by the packaging body 4, the sealing performance of the LED lamp is improved, water vapor is not easy to permeate into the LED lamp, and the product quality is improved.

preferably, referring to fig. 3, an edge of the contact area between the package body and the upper surface of the substrate is located inside an outer edge of the bracket, so as to facilitate the glue filling process.

Referring to fig. 4, fig. 4 is a schematic cross-sectional structure view of another LED lamp provided in the embodiments of the present application.

On the basis of the above embodiments, in an embodiment of the present application, the support 11 has a through hole 5 penetrating through the thickness, and the through hole 5 is filled with the package 4.

when the packaging body 4 completely covers the upper surface of the substrate 1, the packaging body is filled into the through hole 5 of the support 11, and the contact area between the packaging body 4 and the support 11 is increased, so that the combination property of the packaging body 4 and the support 11 and the sealing property of the packaging body 4 and the substrate 1 are increased, namely, the sealing property of the LED lamp is further improved, and the product quality is ensured.

Preferably, the through-hole 5 is a convex through-hole.

referring to fig. 5, fig. 5 is a top view of an LED lamp according to an embodiment of the present disclosure.

on the basis of any of the above embodiments, in an embodiment of the present application, the upper surface of the bracket 11 is a roughened surface.

It is understood that the upper surface of the stent 11 is a roughened surface, i.e., the upper surface of the stent 11 is an uneven surface. The purpose of setting up on coarsening type surface is, increase the cohesion of packaging body 4 and support 11 to further strengthen the holistic leakproofness of LED lamp, avoid the easy problem that loses efficacy of LED lamp under humid environment.

It is noted that the function of the identification point 6 is to facilitate the machine determination of the orientation of the LED lamp during its manufacture.

On the basis of any one of the above embodiments, in an embodiment of the present application, the support 11 is a metal support 11, so as to improve the stability of the LED lamp substrate 1 and prolong the service life of the LED lamp.

Referring to fig. 6, fig. 6 is a flowchart of a method for manufacturing an LED lamp according to an embodiment of the present application, where the method includes:

step S101: and fixing the LED light-emitting wafer in the groove of the substrate with the groove, wherein the substrate comprises a support and a bowl cup positioned on the upper surface of the support.

Specifically, a die bond adhesive, such as silver adhesive, epoxy adhesive, or silicone adhesive, is dispensed on the upper surface of the substrate located in the groove, and the LED chip is fixed on the upper surface of the substrate through the die bond adhesive. Specifically, the LED light-emitting wafer is positioned on the upper surface of the bracket.

Step S102: and respectively welding two ends of a lead with the LED light-emitting wafer and the substrate.

Step S103: and integrally encapsulating the upper surface of the substrate by using an encapsulation body to obtain the LED lamp.

specifically, utilize the packaging body to the complete cladding of the upper surface of basement, the whole of bowl cup all is lived by the packaging body parcel promptly and the upper surface of support is detached and is covered by the packaging body equally with the region of bowl cup contact for the inboard and the outside of bowl cup all combine with the packaging body, and the purpose improves the leakproofness of LED lamp, thereby makes inside steam is difficult to the infiltration LED lamp, improves the quality of product.

Optionally, in an embodiment of the present application, the upper surface of the substrate is integrally encapsulated by an epoxy encapsulant, but the present application is not particularly limited thereto, and in another embodiment of the present application, the upper surface of the substrate is integrally encapsulated by a silicone encapsulant.

The LED lamp manufactured by the manufacturing method of the LED lamp in the embodiment comprises a substrate with a groove, an LED light-emitting wafer, a wire and a packaging body, wherein the substrate comprises a support and a bowl cup positioned on the upper surface of the support, the LED light-emitting wafer is positioned in the groove, two ends of the wire are respectively connected with the LED light-emitting wafer and the substrate, and the bowl cup is completely wrapped in the packaging body. Therefore, the LED lamp in the embodiment comprises the substrate, the LED light-emitting wafer, the conducting wire and the packaging body, wherein the packaging body completely covers the upper surface of the substrate, namely the packaging body integrally packages the substrate, so that the sealing performance of the LED lamp is improved, water vapor is not easy to permeate into the LED lamp, and the product quality is improved.

On the basis of the above embodiments, in an embodiment of the present application, before the fixing the LED light emitting chip in the groove of the substrate having the groove, the method further includes:

And punching the support to enable the support to be provided with a through hole penetrating through the thickness. When the packaging body is used for integrally encapsulating the upper surface of the substrate, the packaging body is filled into the through hole, the contact area between the packaging body and the support is increased, the bonding performance between the packaging body and the support and the sealing performance between the packaging body and the substrate are increased, the sealing performance of the LED lamp is further improved, and the quality of a product is guaranteed.

preferably, the shape of the control punch is convex.

Referring to fig. 7, fig. 7 is a flowchart illustrating another method for manufacturing an LED lamp according to an embodiment of the present disclosure, the method includes:

step S201: and punching the support to enable the support to be provided with a through hole penetrating through the thickness.

Step S202: and roughening the upper surface of the bracket.

Optionally, the upper surface of the bracket is roughened by using an electroplating process or a stamping process.

step S203: and fixing the LED light-emitting wafer in the groove of the substrate with the groove, wherein the substrate comprises a support and a bowl cup positioned on the upper surface of the support.

Step S204: and respectively welding two ends of a lead with the LED light-emitting wafer and the substrate.

Step S205: and integrally encapsulating the upper surface of the substrate by using an encapsulation body to obtain the LED lamp.

In the present embodiment, the order of step S201 and step S202 is not particularly limited, and may be interchanged.

In this embodiment, the upper surface of the support is roughened to obtain a support with a roughened upper surface, and the bonding force between the packaging body and the support is increased, so that the overall sealing performance of the LED lamp is further enhanced, and the problem that the LED lamp is prone to failure in a humid environment is avoided.

The embodiments are described in a progressive manner, each embodiment focuses on differences from other embodiments, and the same or similar parts among the embodiments are referred to each other. The device disclosed by the embodiment corresponds to the method disclosed by the embodiment, so that the description is simple, and the relevant points can be referred to the method part for description.

The LED lamp and the method for manufacturing the same provided by the present application are described in detail above. The principles and embodiments of the present application are explained herein using specific examples, which are provided only to help understand the method and the core idea of the present application. It should be noted that, for those skilled in the art, it is possible to make several improvements and modifications to the present application without departing from the principle of the present application, and such improvements and modifications also fall within the scope of the claims of the present application.

Claims

1. An LED lamp, comprising: the substrate with the recess, the luminous wafer of LED, the wire, the packaging body, the substrate includes the support and is located the bowl cup of support upper surface, just the bowl cup with the outward flange of support contact area is located the inboard of the outward flange of support, the luminous wafer of LED is located in the recess, the both ends of wire are connected respectively the luminous wafer of LED with the substrate, the bowl cup completely cladding in the packaging body.

2. The LED lamp of claim 1, wherein the support has a through-hole through the thickness, and the through-hole is filled with the encapsulant.

3. The LED lamp of claim 2, wherein the through-hole is a convex through-hole.

4. The LED lamp of claim 1, wherein the upper surface of the support is a roughened surface.

5. The LED lamp of claim 1, wherein the encapsulant is an epoxy encapsulant or a silicone encapsulant.

6. The LED lamp of any of claims 1 to 5, wherein an edge of the encapsulant in contact with the upper surface of the substrate is located inward of an outer edge of the support.

7. A manufacturing method of an LED lamp is characterized by comprising the following steps:

8. The method for manufacturing an LED lamp according to claim 7, wherein before the step of fixing the LED light emitting chip in the groove of the substrate having the groove, the method further comprises:

9. The method for manufacturing an LED lamp according to claim 7 or 8, wherein before the step of fixing the LED light emitting chip in the groove of the substrate having the groove, the method further comprises:

And roughening the upper surface of the bracket.

10. The method for manufacturing an LED lamp according to claim 9, wherein the roughening the upper surface of the support comprises: