CN110554989A - Embedded core board and equipment - Google Patents

Abstract

the present application relates to an embedded core board and an apparatus. The embedded core board comprises a substrate body, a processor, a first connector, a second connector, a third connector, a fourth connector, a memory module and a memory module, wherein the substrate body of the embedded core board is provided with the processor, the first connector, the second connector, the third connector, the fourth connector, the memory module and the memory module. The processor is respectively connected with the first connector, the second connector, the third connector, the fourth connector, the memory module and the memory module; the first type of connector is used for transmitting communication interface signals; the second type of connector is used for transmitting high-speed signals; the third type connector is used for transmitting multimedia signals and storing signals; the fourth type of connector is used to transmit PRU signals. Based on the structure, the embedded core board has the basic functional requirements of the embedded product, so that the repeated design of the embedded product during development can be avoided, and the waste of manpower and material resources is avoided; in addition, the design risk of the product is reduced, the product development time is shortened, the product development speed is accelerated, and the product development efficiency is improved.

Description

Embedded core board and equipment

Technical Field

the present application relates to the field of core board technology, and more particularly, to an embedded core board and an embedded device.

background

when an embedded product is designed, the embedded product is generally designed from beginning to end according to product requirements, but as the product functions are more and more complex, the applications are more and more, and the required processing capacity is higher and higher. The product development period is shorter and shorter, and if all design methods from zero are adopted like before, the development efficiency is very low.

For embedded products with complex functions, core functions such as memory, storage and the like are basically available in every product and belong to necessary functions. The design requirement of the core function is higher, if each product is redesigned once, not only is the manpower wasted seriously, but also the design success rate cannot be guaranteed, and the design efficiency is greatly reduced.

Disclosure of Invention

In view of the above, it is necessary to provide an embedded core board and an embedded device, which are directed to the problem of low design efficiency in developing embedded products.

in order to achieve the above object, in one aspect, an embodiment of the present application provides an embedded core board, including: a substrate body.

the substrate body is provided with:

the first type of connector is used for transmitting communication interface signals.

And the second type of connector is used for transmitting high-speed signals.

And the third type of connector is used for transmitting multimedia signals and storing signals.

And a fourth type connector for transmitting the PRU signal.

And a memory module.

A memory module.

A processor; the processor is respectively connected with the first type connector, the second type connector, the third type connector, the fourth type connector, the memory module and the memory module.

In one embodiment, the first type connector includes any one or any combination of the following signal pins: an ADC pin, an RGMII pin, an MDIO pin, an SPI pin, a UART pin, a CAN pin, and an OSPI pin.

In one embodiment, the second type connector includes any one or any combination of the following signal pins: a USB pin, a PCIe pin, an SGMII pin, a JTAG pin, a UART pin, an SPI pin, a power pin, and a reset pin.

In one embodiment, the third type connector includes any one or any combination of the following signal pins: MMCSD pin, I2C pin, GPMC pin, LCD pin, VIP pin, MIPI-CSI pin, and LVDS pin.

in one embodiment, the fourth type connector includes any one or any combination of the following signal pins: ethernet RGMII and MDIO pins, UART pin, PWM pin, audio MCASP pin, and GPIO pin.

in one embodiment, the first type of connector is connector A of DF12A (3.0) -80DS-0.5V (81) male; the second type of connector is connector B of AXK680337 YG;

The third type of connector is connector C of DF12A (3.0) -80DS-0.5V (81) male socket; the fourth type of connector is configured as connector D and connector E; connectors D and E are each of the type DF12A (3.0) -60DS-0.5V (81).

In one embodiment, the substrate body is a square plate.

The connector a and the connector B are disposed adjacent to a first side of the square plate body. The connector C, the connector D and the connector E are arranged close to the second side of the square plate body; the second side is the other side opposite to the first side.

the value range of the long edge of the square plate body is 70 mm to 80 mm; the short side of the square plate body ranges from 50 mm to 60 mm; the square plate body is provided with a fixing hole; the aperture of the fixed hole ranges from 2 mm to 2.4 mm.

In one embodiment, the substrate body is further provided with a power supply module; and at least one of a reset circuit, a watchdog circuit and an encryption chip is also arranged on the substrate body.

The processor is respectively connected with the power module, the reset circuit, the watchdog circuit and the encryption chip.

In one embodiment, the processor is an AM65x family of processors.

The memory module is a DDR memory.

the memory module is an eMMC memory.

On the other hand, the embodiment of the present application further provides an apparatus, including the embedded core board as described above.

one of the above technical solutions has the following advantages and beneficial effects:

on the embedded core board, the processor is respectively connected with a first connector, a second connector, a third connector, a fourth connector, a memory module and a memory module; the first type of connector is used for transmitting communication interface signals; the second type of connector is used for transmitting high-speed signals; the third type connector is used for transmitting multimedia signals and storing signals; the fourth type of connector is used to transmit PRU signals. Based on the structure, the embedded core board has the basic functional requirements of the embedded product, so that the repeated design of the embedded product during development can be avoided, and the waste of manpower and material resources is avoided; in addition, the design risk of the product is reduced, the product development time is shortened, the product development speed is accelerated, and the product development efficiency is improved.

Drawings

The foregoing and other objects, features and advantages of the application will be apparent from the following more particular description of preferred embodiments of the application, as illustrated in the accompanying drawings. Like reference numerals refer to like parts throughout the drawings, and the drawings are not intended to be drawn to scale in actual dimensions, emphasis instead being placed upon illustrating the subject matter of the present application.

FIG. 1 is a first schematic block diagram of an embedded core board in one embodiment;

FIG. 2 is a second schematic block diagram of an embedded core board in one embodiment;

FIG. 3 is a third schematic block diagram of an embedded core board in one embodiment;

Fig. 4 is a fourth schematic block diagram of an embedded core board in one embodiment.

Detailed Description

To facilitate an understanding of the present application, the present application will now be described more fully with reference to the accompanying drawings. Preferred embodiments of the present application are shown in the drawings. This application may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.

It will be understood that when an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present; in addition, the connected elements can also be in signal connection. The terms "pin", "first side", "second side" and the like are used herein for illustrative purposes only.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein in the description of the present application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.

The functions and interfaces of the embedded product used in the industrial field are various, and the embedded product is personalized and diversified in requirements; after the product requirement is determined, the material type selection can be carried out, a processor, a memory, a power supply, peripheral interface components and the like are selected, then a circuit is designed, the layout and wiring are carried out, and finally a prototype debugging machine is manufactured. The core function circuit is the part with the highest design requirement. Therefore, the core function is abstracted out and is designed into an independent module in the embodiment of the application; when designing products, the module is directly used, and necessary peripheral circuits and equipment are added, so that the products can be rapidly developed, and the development efficiency is improved. Based on this, can solve the problem of nuclear core plate redevelopment design, product core function need not redesign, has also reduced the design risk of product, raises the efficiency.

In one embodiment, there is provided an embedded core board, as shown in fig. 1, comprising: a substrate body. The substrate body is provided with:

The first type of connector is used for transmitting communication interface signals.

And the second type of connector is used for transmitting high-speed signals.

And the third type of connector is used for transmitting multimedia signals and storing signals.

And a fourth type connector for transmitting the PRU signal.

And a memory module.

a memory module.

A processor; the processor is respectively connected with the first type connector, the second type connector, the third type connector, the fourth type connector, the memory module and the memory module.

Specifically, a processor, a first connector, a second connector, a third connector, a fourth connector, a memory module and a memory module are arranged on a substrate body of the embedded core board; the processor is respectively connected with the first connector, the second connector, the third connector, the fourth connector, the memory module and the memory module; the first connector is mainly used for transmitting communication transmission interface signals; the second type of connector is mainly used for transmitting high-speed signals; the third type of connector is mainly used for transmitting multimedia signals and storing signals; the fourth type of connector is mainly used for transmitting PRU (Programmable read-time unit and Industrial Communication Subsystem) signals. Namely, each connector on the embedded core board can be used for leading out signals of the processor, and the embedded core board has peripheral resources with rich functions.

it should be noted that the first connector can be matched with the processor to realize the transmission of the communication interface signal; the communication interface signal comprises any one or any combination of the following signals: RGMII (Reduced Gigabit Media Independent Interface) signals, MDIO (Management Data Input/Output) signals, SPI (Serial Peripheral Interface) signals, UART (Universal Asynchronous Receiver/Transmitter) signals, CAN (Controller Area Network) signals, CAN-FD (CAN With flexible Data-Rate) signals, and the like. That is, the first type connector can lead out various communication interface signals, is suitable for the requirements of various industrial occasions, and can support various communication protocols; and the developer can complete the development of the corresponding part by selecting the corresponding interface signal pin according to the actual requirement. Alternatively, the first type connector may be constituted by one connector or a plurality of sub-connectors. Further, the first type of connector may also be used for transmitting analog acquisition signals, OSPI (Octal Serial peripheral interface) signals, and the like.

the second connector can be matched with the processor to realize the transmission of high-speed signals; wherein the high speed signal may be primarily a SerDes signal. The SerDes signals are flexible, and different interface types can be configured; optionally, any one or any combination of the following signals may be configured: USB (Universal Serial Bus) signals, PCIe (peripheral component interconnect express) signals, and SGMII (Serial Gigabit Media Independent Interface) signals. In addition, the second type of connector may also be used to extract any one or any combination of the following signals: a JTAG (Joint test action Group) signal, a UART signal, an SPI signal, a power signal, a Reset signal, and the like. The second type of connector may be a unique high-speed connector on the embedded core board, may support a communication rate of 8Gbps (gigabits per second), and may be used to extract a high-speed signal, and meanwhile, based on the division of the connectors and the transmission signals, the high-speed signal and other signals may be extracted through different connectors, respectively. Namely, the high-speed signal is only led out by the high-speed connector, so that the quality of the high-speed signal is prevented from being influenced, and other signals can be led out by the high-speed connector or a common connector; therefore, the crosstalk of signals can be avoided, and the reliability of the core board is improved. Alternatively, the second type connector may be constituted by one connector or a plurality of sub-connectors.

The third connector can be matched with the processor to realize the transmission of multimedia signals and storage signals; the multimedia signal may include any one or any combination of the following signals: LCD (Liquid Crystal Display) signals, VIP (Video Input Port) signals, MIPI (Mobile Industry processor Interface) -CSI (CMOS Sensor Interface) signals, LVDS (Low-Voltage Differential Signaling) signals, and the like.

The storage signal may be, for example, an MMCSD (MultiMedia Card/Secure Digital Interface) signal or the like. Based on the above, the third type connector can be used for multimedia function extension of the core board, and meets the design requirements of developers. Alternatively, the third type connector may be constituted by one connector or a plurality of sub-connectors. Further, the third type of connector can also be used for transmitting I2C (Inter-Integrated Circuit) signals, GPMC (General Purpose memory Controller) signals and the like. The GPMC signal, the LCD signal and the VIP signal can be configured on the same pin, and further can be configured into different signal types through software.

The fourth type connector can be matched with the processor to realize the transmission of PRU signals; specifically, the PRU signal may be extended to a gigabit ethernet RGMII signal and an MDIO signal, a UART signal, a PWM (Pulse width modulation) signal, an audio MCASP signal, a GPIO signal, and the like. Based on this, the fourth type connector can be used for the function extension of the core board, and the design requirements of developers are met. Alternatively, the fourth type connector may be constituted by one connector or a plurality of sub-connectors.

it should be noted that the number of pins of the connector mentioned in the embodiments of the present application may be selected according to actual design requirements, for example, 40 pins, 60 pins, 80 pins, or 100 pins, and is not limited herein. The memory module can be used for being matched with the processor to realize the operation and processing of data. The memory module can be used for storing data, protocol stacks or related running programs, and meets the application scene requirements of the core board.

Based on the structure, the embedded core board has the basic functional requirements of the embedded product, so that the repeated design of the embedded product during development can be avoided, and the waste of manpower and material resources is avoided; in addition, the design risk of the product is reduced, the product development time is shortened, the product development speed is accelerated, and the product development efficiency is improved. Illustratively, the processor may be provided on a first side of the substrate body; the first type connector, the second type connector, the third type connector and the fourth type connector can be arranged on the second surface of the substrate body; therefore, the installation and the use of the core board can be facilitated, and the product reliability is improved. It should also be noted that for the same signal, multiple pins may be provided on one connector to facilitate the function expansion of the core board; meanwhile, the connector may be used to extract functional signals such as a power signal, a reset signal, or an encryption signal, in addition to the corresponding signal, and is not limited specifically here.

In one embodiment, the first type of connector includes any one or any combination of the following signal pins: an ADC (Analog-to-Digital Converter) pin, an RGMII pin, an MDIO pin, an SPI pin, a UART pin, a CAN pin, and an OSPI pin.

Specifically, the connector may be provided with at least one of an ADC pin, an RGMII pin, an SPI pin, a UART pin, a CAN pin, and an OSPI pin according to a communication interface signal transmitted by the connector of the first type. It should be noted that the number and position of the sub-connectors, the selection and allocation of the pin types, and the like may be set according to the signal reliability design, and are not limited herein. Illustratively, the first type of connector is configured as 1 connector provided with all of the pins described above; in another example, the first type of connector may be configured as 2 connectors, one of which is provided with an ADC pin, an RGMII pin, and an SPI pin, and the other of which is provided with a UART pin, a CAN pin, and an OSPI pin. Based on the structure, the embedded core board can provide various types, each embedded core board can focus on interfaces of different types, and requirements of different application environments can be met. In addition, the first type of connector can be used for leading out signals of the same core in the processor, so that the signal leading-out of different cores can be distinguished conveniently, the wiring of the substrate body is facilitated, and the condition of signal line crossing is reduced.

In one embodiment, the second type of connector includes any one or any combination of the following signal pins: a USB pin, a PCIe pin, an SGMII pin, a JTAG pin, a UART pin, an SPI pin, a power pin, and a reset pin.

Specifically, the second type connector may be provided with corresponding high-speed signal pins and functional pins. The signals of different paths or different types can be isolated through the grounding pin, so that signal crosstalk is prevented, and the Signal Integrity (SI) and the reliability of the core board are improved. Furthermore, still can be equipped with SPI pin, GPIO pin and watchdog pin etc. on the second type connector, use when can supplying product development, improve the space utilization on the nuclear core plate.

In one embodiment, the third type of connector includes any one or any combination of the following signal pins: MMCSD pin, I2C pin, GPMC pin, LCD pin, VIP pin, MIPI-CSI pin, and LVDS pin.

Specifically, the third type connector is mainly used for extracting multimedia signals and storage signals of the processor, and specifically, the third type connector may be configured with a camera interface, an RGB liquid crystal display interface, a differential liquid crystal display interface, and the like. Based on this, this application embodiment can be applicable to multiple multimedia application environment, satisfies different multimedia show demands. It should be noted that, in the same connector, different pins of the same signal can be intensively arranged on one side of the connector; and different paths of signals or different types of signals can be isolated through the grounding pins, so that signal crosstalk is prevented, and the signal integrity and reliability of the core board are improved.

In one embodiment, the fourth type of connector includes any one or any combination of the following signal pins: ethernet RGMII and MDIO pins, UART pin, PWM pin, audio MCASP pin, and GPIO (General-purpose input/output) pin.

Specifically, on the fourth type connector, the PRU extension interface may be extended to ethernet RGMII and MDIO interfaces, a UART interface, a PWM interface, an audio MCASP interface, a GPIO interface, and the like. Based on the structure, the function expansion can be carried out through the fourth connector, and the embedded product can conveniently carry out function development and expansion on the basis of the core board.

In one embodiment, the first type of connector is DF12A (3.0) -80DS-0.5V (81) male connector A. The second type of connector is connector B of AXK680337 YG.

The third type of connector is connector C with a male socket of DF12A (3.0) -80DS-0.5V (81).

in particular, the first type connector and the third type connector may be the same model 80pin connectors. The second type of connector may be a high speed connector that can be used to extract USB3.1 signals and PCIe 3.1 signals and SGMII signals, etc.

In one embodiment, the fourth type of connector is configured as connector D and connector E.

connectors D and E are each of the type DF12A (3.0) -60DS-0.5V (81).

Specifically, the number of pins of both connectors is 60; and, the signals from the connectors D and E are mainly PRUs, so the pins on the connectors can be extended to ethernet RGMII and MDIO pins, UART pins, PWM pins, audio MCASP pins, and GPIO pins. Specifically, the connector D may include any one or any combination of the following signal pins: ethernet RGMII and MDIO pins, UART pin, PWM pin, audio MCASP pin, and GPIO pin. The connector E includes any one or any combination of the following signal pins: ethernet RGMII and MDIO pins, UART pin, PWM pin, audio MCASP pin, and GPIO pin.

In one example, the pin description for connector a may be as shown in table 1.

TABLE 1

In one example, the pin description for the second type of connector (connector B) may be as shown in table 2.

TABLE 2

In one example, the pin description for connector C may be as shown in table 3.

TABLE 3

In one example, the pin description for connector D may be as shown in table 4.

TABLE 4

in one example, the pin description for connector E may be as shown in table 5.

TABLE 5

In one embodiment, the substrate body is a square plate. The connector a and the connector B are disposed adjacent to a first side of the square plate body. The connector C, the connector D and the connector E are arranged close to the second side of the square plate body; the second side is the other side opposite to the first side.

Specifically, FIG. 2 is a top view of an embedded core board in one embodiment. The embedded core board may be a square board body, wherein the connector a and the connector B may be disposed near a first long side of the square board body, i.e., a first side; meanwhile, the connector C, the connector D, and the connector E may be disposed near the second long side of the square plate body, i.e., the second side. Furthermore, each connector can be arranged on the same surface of the square plate body; the connector A and the connector B are arranged at intervals with the first side at a first interval; the connector C, the connector D and the connector E are arranged at intervals from the second side at a second interval; wherein the first pitch may be the same as the second pitch. Based on above-mentioned structure, be close to the side setting of nuclear core plate with the connector, the drawing forth of the signal of being convenient for reduces the degree of difficulty of product development.

In one embodiment, the long side of the square plate body ranges from 70 mm to 80 mm; such as 72 mm, 75 mm, 78 mm, etc.

The short side of the square plate body ranges from 50 mm to 60 mm; such as 53 mm, 55 mm, 57 mm, etc.

In one embodiment, the square plate body is provided with a fixing hole; the aperture of the fixed hole ranges from 2 mm to 2.4 mm; such as 2.1 mm, 2.2 mm, 2.3 mm, etc. Furthermore, the fixing holes can be arranged near the corners of the square plate body; specifically, the number of fixing holes may be 2, 3, or 4.

In one example, the core plate body has a dimension of 75 mm x 55 mm, the four fixation holes have a square profile dimension (i.e., fixation hole center-to-center spacing) of 69.4 mm x 49.4 mm, and the fixation holes have a hole diameter dimension of 2.2 mm. Wherein, the tolerance is: the tolerance of the length and the width is +/-0.15 mm, and the tolerance of the aperture of the fixed hole is +/-0.1 mm.

In one embodiment, the square plate body is further provided with a direction mark. Alternatively, the direction indicator may be a triangular direction indicator, an arrow indicator, a notch indicator, or the like.

In one embodiment, as shown in fig. 3, a power module is further disposed on the substrate body. The processor is connected with the power supply module.

Specifically, the embedded core board is also provided with a power supply module connected with the processor; the power supply module can be used for voltage conversion, power supply and the like; in particular, the power module may be used to supply corresponding standard voltages to the processor, the memory module, and the memory module. In addition, the power module may also provide power to other modules on the core board, such as reset and watchdog modules and encryption modules. Based on the structure, the design of core functions can be further reduced in the development process of the embedded product, and the design success rate and the design efficiency are improved.

In one embodiment, as shown in fig. 3, at least one of a reset circuit, a watchdog circuit and a cryptographic chip is further disposed on the substrate body. The processor is respectively connected with the reset circuit, the watchdog circuit and the encryption chip.

Specifically, the embedded core board is further provided with a reset circuit, a watchdog circuit and an encryption chip, wherein the reset circuit, the watchdog circuit and the encryption chip are connected with the processor. The reset and watchdog circuit can be used for resetting and monitoring the processor; the encryption chip can be used for encrypting products and firmware, and can also be used for encrypting user firmware to protect property rights; based on this, can further perfect the function of nuclear core plate, improve the design efficiency of product development.

In one embodiment, the processor is an AM65x family processor.

Specifically, in the embodiment of the present application, the model of the processor may be AM65x series, including but not limited to AM6526, AM6548, and the like. Specifically, the AM65x processor is a multi-core processor including at least two cores, one being a Cortex-a53 core, e.g., the AM6526 processor has two a53 cores, and the AM6548 has four a53 cores; the other is the Cortex-R5F kernel, and the AM65x series are both R5F kernels. The A53 core and the R5F core have corresponding pins to be led out, and all signals on the connector A are led out from the R5F core; the signals on connector BCDE may all be taken from the a53 core. Based on the structure, the wiring is smoother and the crossing of excessive signal lines can not occur in the aspect of circuit board layout and wiring.

In one embodiment, the processor is an AM6526 processor.

Specifically, the AM6526 processor is provided with two Cortex-A53 cores with dominant frequencies up to 1.1GHz (gigahertz) and two Cortex-R5F cores with dominant frequencies of 400MHz (megahertz), can provide enough data processing speed, scale and real-time performance, and can meet the design requirements of various products.

In one embodiment, the memory module is a DDR (Double Data Rate) memory; specifically, the memory module may be a DDR3L memory, a DDR4 memory, an lpddr 4 memory, or the like, such as a 1GB (gigabit) or 2GB DDR3L memory. Further, the memory module may be a memory supporting ECC (Error Correcting Code); for example, one slice of DDR3L die in a memory module is dedicated to support ECC functions.

In one embodiment, the memory module is an emmc (embedded Multi Media card) memory; such as 4GB or 8GB eMMC memory, etc.

In one embodiment, the embedded core board is a core board that supports multiple industrial real-time ethernet protocols.

Specifically, based on the above structure, the embodiment of the present application can be applied to various industrial environments, and can simultaneously support various industrial real-Time EtherNet protocols, such as an EtherCAT protocol, a TSN (Time Sensitive Networking) protocol, an EtherNet/IP protocol, a ProfiNet protocol, and a ProfiBus protocol, and is not limited specifically here.

in one embodiment, as shown in fig. 4, an AM6526 processor is used for an embedded core board, which is developed to meet the complex processing requirements of industrial 4.0 embedded products, and the core board mainly includes a processor, a DDR memory, an eMMC memory, a power supply, a reset and watchdog, an encryption chip, a connector, and other main components.

specifically, the M6526 series core board has peripheral resources with rich functions, and is led out from 5 connectors; specifically, 1-way gigabit RGMII real-time Ethernet, 3-way UART, 4-way SPI, 2-way CAN-FD, 16-way ADC, 2-way OSPI interface, 2-way USB 2.0 (where 1-way CAN be used for USB 3.1), 1-way PCIe 3.1, 1-way SD card, 3-way I2C, 1-way Mipi-CSI, 1-way LVDS, 1-way GPMC/LCD, and 3-way PRU expansion interface (expandable 6-way gigabit RGMII real-time Ethernet interface, multi-way UART, CAN interface, and audio and PWM interface functions) CAN be included. In addition, the M6526 core board can simultaneously provide a plurality of industrial real-time Ethernet protocols, such as EtherCAT, TSN, EtherNet/IP, ProfiNet and ProfiBus.

Further, the M6526 series core board has 5 external connectors, and is distributed on two sides of the core board, wherein one side of the core board is 2, and the other side of the core board is 3. The 5 connectors are numbered from A to E; wherein A, B, C the 3 connectors are 80pin connectors, and the A and C connector models are identical; b is a unique high-speed connector which can support the communication speed of 8Gbps and is used for leading out USB3.1 and PCIe 3.1 signals; D. e these 2 connectors are 60pin connectors, all of the same type, for pulling out the PRU signal. Specifically, the A connector is an 80pin connector, and the signals that are pulled are essentially all connected directly to the R5F core of the processor.

In one embodiment, there is provided an apparatus comprising an embedded core board as described above.

In particular, the device may be an electronic device.

The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.

The above-mentioned embodiments only express several embodiments of the present application, and the description thereof is more specific and detailed, but not construed as limiting the scope of the present application. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the concept of the present application, which falls within the scope of protection of the present application. Therefore, the protection scope of the present application shall be subject to the appended claims.

Claims (10)

1. An embedded core board, comprising: a substrate body;

The substrate body is provided with:

the first connector is used for transmitting communication interface signals;

The second type connector is used for transmitting high-speed signals;

A third type connector for transmitting multimedia signals and storing signals;

A fourth type connector for transmitting PRU signals;

A memory module;

A memory module;

a processor; the processor is connected with the first connector, the second connector, the third connector, the fourth connector, the memory module and the memory module respectively.

2. The embedded core board of claim 1, wherein the first type of connector comprises any one or any combination of the following signal pins:

an ADC pin, an RGMII pin, an MDIO pin, an SPI pin, a UART pin, a CAN pin, and an OSPI pin.

3. The embedded core board of claim 1, wherein the second type of connector comprises any one or any combination of the following signal pins:

A USB pin, a PCIe pin, an SGMII pin, a JTAG pin, a UART pin, an SPI pin, a power pin, and a reset pin.

4. The embedded core board of claim 1, wherein the third type of connector comprises any one or any combination of the following signal pins:

MMCSD pin, I2C pin, GPMC pin, LCD pin, VIP pin, MIPI-CSI pin, and LVDS pin.

5. the embedded core board of claim 1, wherein the fourth type of connector comprises any one or any combination of the following signal pins:

ethernet RGMII and MDIO pins, UART pin, PWM pin, audio MCASP pin, and GPIO pin.

6. The embedded core board according to any one of claims 1 to 5,

The first type of connector is a connector A of a DF12A (3.0) -80DS-0.5V (81) male seat;

the second type connector is connector B of AXK680337 YG;

The third type of connector is a connector C of a DF12A (3.0) -80DS-0.5V (81) male socket;

The fourth type of connector is configured as connector D and connector E;

the connector D and the connector E are both DF12A (3.0) -60DS-0.5V (81).

7. The embedded core board of claim 6, wherein the substrate body is a square plate;

The connector A and the connector B are arranged close to the first side of the square plate body;

The connector C, the connector D and the connector E are arranged close to the second side of the square plate body; the second side is the other side opposite to the first side;

The value range of the long edge of the square plate body is 70 mm to 80 mm;

the short side of the square plate body ranges from 50 mm to 60 mm;

The square plate body is provided with a fixing hole; the aperture of the fixed hole ranges from 2 mm to 2.4 mm.

8. The embedded core board of any one of claims 1 to 5, wherein the substrate body is further provided with a power module; in addition, at least one of a reset circuit, a watchdog circuit and an encryption chip is also arranged on the substrate body;

The processor is respectively connected with the power module, the reset circuit, the watchdog circuit and the encryption chip.

9. The embedded core board according to any one of claims 1 to 5,

The processor is an AM65x series processor;

The memory module is a DDR memory;

The memory module is an eMMC memory.

10. An apparatus comprising an embedded core board as claimed in any one of claims 1 to 9.