CN110551373A - High-performance halogen-free flame-retardant PC conductive material and product thereof - Google Patents
High-performance halogen-free flame-retardant PC conductive material and product thereof Download PDFInfo
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- CN110551373A CN110551373A CN201810554912.1A CN201810554912A CN110551373A CN 110551373 A CN110551373 A CN 110551373A CN 201810554912 A CN201810554912 A CN 201810554912A CN 110551373 A CN110551373 A CN 110551373A
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L69/00—Compositions of polycarbonates; Compositions of derivatives of polycarbonates
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/02—Flame or fire retardant/resistant
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/22—Halogen free composition
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- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
The invention relates to the technical field of high polymer materials, in particular to a high-performance halogen-free flame-retardant PC conductive material and a product thereof, wherein the high-performance halogen-free flame-retardant PC conductive material comprises PC resin, carbon black, a hypophosphite flame retardant, a phosphate flame retardant, an organosilicon flame retardant and a toughening agent, the product is a product generated after the high-performance halogen-free flame-retardant PC conductive material is molded, the high-performance halogen-free flame-retardant PC conductive material can be prepared by adding a compounded flame retardant and toughening agent, the flame retardant grade can reach 0.8mmV-0 grade, the impact strength can reach 20KJ/m 2, the volume resistance of the conductive material can be reduced to 10^4 Ohm-10 ^6ohm.cm, and the conductive material has high flame retardance and high performance.
Description
[ technical field ] A method for producing a semiconductor device
The invention relates to the technical field of high polymer materials, in particular to a high-performance halogen-free flame-retardant PC conductive material and a product thereof.
[ background of the invention ]
With the multifunction of plastic products and the high integration of electronic circuits, materials with conductive properties are more and more widely applied, and PC materials (Polycarbonate) have high impact strength, flame retardant rating of the PC materials can reach V-2, and good weather resistance, and are widely applied to electronic and electrical products.
The surface resistance of pure PC material is more than 10^14 (14 th power of 10) ohm, and the PC conductive material is obtained by adding carbon black or carbon fiber. However, carbon fiber is expensive and the surface is difficult to meet the requirements of the appearance during molding, so most of the conductive media in the conductive material are carbon black.
When carbon black is used as a conductive medium, the flame retardancy of the conductive material is difficult to achieve due to the burning characteristic of the carbon black and the wick effect generated by the carbon black structure (like the burning of a candle wick when a candle burns). The flame-retardant conductive material needs to be added with a large amount of flame retardant, but the addition of the flame retardant can lower the physical properties of the material, so that the high flame retardance and the excellent physical properties cannot be compatible.
In view of the above, there is a need to develop a high-performance halogen-free flame-retardant PC conductive material to solve the problem that the PC conductive material in the prior art cannot have both high flame retardancy and excellent physical properties.
[ summary of the invention ]
Therefore, the invention aims to provide a high-performance halogen-free flame-retardant PC conductive material so as to obtain the halogen-free flame-retardant and high-performance PC conductive material.
In order to achieve the purpose, the high-performance halogen-free flame-retardant PC conductive material disclosed by the invention comprises the following components in parts by weight:
Optionally, the PC resin is at least one of bisphenol a polycarbonate, polyester polycarbonate, silicone copolymer polycarbonate, cyclohexane bisphenol a polycarbonate, bisphenol a-organosiloxane copolymer polycarbonate, bisphenol TMC synthesized polycarbonate.
Alternatively, the PC resin may have a melt mass flow rate of 3 to 50g/10min at a temperature of 300 ℃ and a load of 1.2 Kg.
Optionally, the silicone copolymerized polycarbonate content in the PC resin is 0-82 parts.
Optionally, the hypophosphite flame retardant is a vinyl aluminum hypophosphite flame retardant.
Optionally, the phosphate flame retardant is at least one of 1,3 phenylene phosphate (2, 6-tolyl) tetraester, tetraphenyl bisphenol a diphosphate, tetraphenyl resorcinol diphosphate, and triphenyl phosphate.
Optionally, the silicone flame retardant is at least one of polysilazane, polymethoxyphenylsilane, hydroxymethylsilane, cross-linked Polydimethylsiloxane (PDMS).
Optionally, the toughening agent is at least one of a crosslinked methacrylate-methyl methacrylate toughening agent, a butadiene-styrene-methyl methacrylate toughening agent, and an organosilicon rubber-methyl methacrylate toughening agent.
Optionally, the high-performance halogen-free flame-retardant PC conductive material further comprises at least one of an anti-dripping agent, an antibacterial agent, an ultraviolet absorber and a release agent.
In addition, the invention also provides a product which is produced by molding the high-performance halogen-free flame-retardant PC conductive material.
Compared with the prior art, the high-performance halogen-free flame-retardant PC conductive material can be prepared by adding the compounded flame retardant and the toughening agent, the flame retardant grade can reach 0.8mmV-0 grade, the impact strength can reach 20KJ/m 2, the volume resistance of the conductive material can be reduced to 10^4 ohm.cm-10 ^6ohm.cm, and the conductive material has high flame retardancy and high performance.
[ detailed description ] embodiments
The invention discloses a high-performance halogen-free flame-retardant PC conductive material which comprises the following components in parts by weight:
30-90 parts of PC resin, wherein the PC resin is at least one of bisphenol A polycarbonate, polyester polycarbonate, organosilicon copolymerization polycarbonate, cyclohexane bisphenol A polycarbonate, bisphenol A-organosiloxane copolymerization polycarbonate and polycarbonate synthesized by bisphenol TMC, the melt mass flow rate of the PC is 3-50g/10min at the temperature of 300 ℃ and the load of 1.2Kg, the content of the organosilicon copolymerization polycarbonate in the PC resin is 0-82 parts, the impact strength of the material can be improved by adding the organosilicon copolymerization polycarbonate, and the flame retardance of the material can be improved by matching with a flame retardant.
16-30 parts of carbon black, wherein the carbon black is acetylene carbon black and is a conductive medium of the material, the oil absorption value of the carbon black is more than 150ml/100g, the nitrogen adsorption BET specific surface area (the total surface area occupied by 1g of solid is the specific surface area of the material) is more than 50m 2/g, and the volume resistance is less than 10ohm.
0.2-5 parts of hypophosphite flame retardant, wherein the hypophosphite flame retardant can be vinyl aluminum hypophosphite flame retardant.
1-20 parts of phosphate flame retardant, wherein the phosphate flame retardant is at least one of 1,3 phenylene phosphoric acid (2, 6-tolyl) tetraester, tetraphenyl bisphenol A diphosphate (BDP for short), tetraphenyl resorcinol diphosphate (RDP for short) and triphenyl phosphate (TPP).
0-3 parts of an organic silicon flame retardant, wherein the organic silicon flame retardant is at least one of polysilane, polymethoxyphenyl silane, hydroxymethyl silane and crosslinked Polydimethylsiloxane (PDMS).
1-15 parts of a toughening agent, wherein the toughening agent can ensure that the material has good impact performance, and can be at least one of a cross-linked methacrylate-methyl methacrylate toughening agent, a butadiene-styrene-methyl methacrylate toughening agent (MBS) and an organic silicon rubber-methyl methacrylate toughening agent.
In order to obtain the functional composite material, on the premise of not influencing the functional effect, the high-performance halogen-free flame-retardant PC conductive material further comprises at least one of an anti-dripping agent, an antibacterial agent, an ultraviolet absorbent and a release agent.
For further understanding of the objects, effects and technical means of the present invention, the following description is given with reference to the comparative examples and specific examples.
Example 1
The PC resin-1 is a PC resin other than the silicone copolymer polycarbonate. Weighing the components in corresponding weight; then, stirring the components by using a single-shaft stirring barrel; and respectively adding the mixture into a double-screw extruder to perform melt extrusion granulation.
Example 2
PC resin-1 is a PC resin other than silicone copolymer polycarbonate; the PC resin-2 is organic silicon copolymerization type polycarbonate. Weighing the components in corresponding weight; then, stirring the components by using a single-shaft stirring barrel; and respectively adding the mixture into a double-screw extruder to perform melt extrusion granulation.
Comparative example 1
the PC resin-1 is a PC resin other than the silicone copolymer polycarbonate. Weighing the components in corresponding weight; then, stirring the components by using a single-shaft stirring barrel; and respectively adding the mixture into a double-screw extruder to perform melt extrusion granulation.
Comparative example 2
PC resin-1 is a PC resin other than silicone copolymer polycarbonate; the PC resin-2 is organic silicon copolymerization type polycarbonate. Weighing the components in corresponding weight; then, stirring the components by using a single-shaft stirring barrel; and respectively adding the mixture into a double-screw extruder to perform melt extrusion granulation.
After melt extrusion granulation of the above examples and comparative examples, the particles in each example were injection molded into standard test bars on an injection molding machine, and the mechanical properties of the resulting materials were tested according to the standard, with the test results shown in table 1:
Table 1: test results of examples and comparative examples
| test items | Test standard | Example 1 | Comparative example 1 | Example 2 | Comparative example 2 |
| Tensile Strength (MPa) | ISO1183 | 56.5 | 47.2 | 58.3 | 46.1 |
| Elongation at Break (%) | ISO527-1,-2 | 10 | 1.2 | 13 | 12 |
| Flexural Strength (MPa) | ISO 178 | 87 | 92 | 85 | 86 |
| Flexural modulus (MPa) | ISO 178 | 2220 | 2350 | 2150 | 2120 |
| Impact Strength (KJ/m)2) | ISO 180 | 9 | 2.3 | 20 | 5.7 |
| Flame retardant rating | UL-94 | 1.0mm V-0 | 1.0mmV grade no more than | 0.8mm V-0 | 1.0mm V-1 |
| Volume resistance (ohm. cm) | IEC60093 | 10^4 | 10^4 | 10^4 | 10^4 |
From the above, it can be seen that: compared with the comparative example 1 and the comparative example 2, the toughening agent and the three flame retardants are added into the PC resin, so that the mechanical property is improved, particularly the elongation at break and the impact strength are improved to a great extent, the flame retardant property is also greatly improved, and the V-grade can be improved to 1.0mm V-0 grade from the V-grade. In addition, in example 1, compared with example 2, the addition of the silicone-containing copolymerized polycarbonate to the material can improve the impact strength and flame retardancy compared with the case where the silicone-containing copolymerized polycarbonate is not added.
In addition, the invention also provides a product which is produced by molding the high-performance halogen-free flame-retardant PC conductive material, and the product can be widely applied to electronic and electrical products, such as printers, computer CPU conductive parts and other fields.
Claims (10)
1. The high-performance halogen-free flame-retardant PC conductive material is characterized by comprising the following components in parts by weight:
2. The high-performance halogen-free flame-retardant PC conductive material according to claim 1, wherein the PC resin is at least one of bisphenol A polycarbonate, polyester polycarbonate, cyclohexane bisphenol A polycarbonate, and polycarbonate synthesized by bisphenol TMC.
3. the high performance halogen-free flame retardant PC conductive material according to claim 1 or 2, wherein the melt mass flow rate of the PC resin is 3-50g/10min at 300 ℃ and 1.2Kg of load.
4. The high-performance halogen-free flame-retardant PC conductive material as claimed in claim 1, wherein the content of the silicone copolymerized polycarbonate in the PC resin is 0-82 parts.
5. The high performance halogen-free flame retardant PC conductive material of claim 1, wherein the hypophosphite flame retardant is an ethylene aluminum hypophosphite flame retardant.
6. The high-performance halogen-free flame-retardant PC conductive material according to claim 1, wherein the phosphate flame retardant is at least one of 2, 6-methylphenyl-1, 3-phenylene phosphate, tetraphenyl bisphenol A diphosphate, tetraphenyl resorcinol diphosphate and triphenyl phosphate.
7. The high-performance halogen-free flame-retardant PC conductive material according to claim 1, wherein the organosilicon flame retardant is at least one of polysilazane, polymethoxyphenylsilane, hydroxymethylsilane and cross-linked polydimethylsiloxane.
8. The high-performance halogen-free flame-retardant PC conductive material as claimed in claim 1, wherein the toughening agent is at least one of a cross-linked methacrylate-methyl methacrylate toughening agent, a butadiene-styrene-methyl methacrylate toughening agent and an organosilicon rubber-methyl methacrylate toughening agent.
9. The high performance halogen-free flame retardant PC conductive material of claim 1, further comprising at least one of an anti-dripping agent, an antibacterial agent, an ultraviolet absorber and a mold release agent.
10. A product produced by molding the high-performance halogen-free flame-retardant PC conductive material according to any one of claims 1 to 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810554912.1A CN110551373A (en) | 2018-06-01 | 2018-06-01 | High-performance halogen-free flame-retardant PC conductive material and product thereof |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810554912.1A CN110551373A (en) | 2018-06-01 | 2018-06-01 | High-performance halogen-free flame-retardant PC conductive material and product thereof |
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| CN110551373A true CN110551373A (en) | 2019-12-10 |
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| CN201810554912.1A Pending CN110551373A (en) | 2018-06-01 | 2018-06-01 | High-performance halogen-free flame-retardant PC conductive material and product thereof |
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102250460A (en) * | 2011-05-22 | 2011-11-23 | 迈士通集团有限公司 | Halogen-free inflaming-retarding conductive PC resin composition, and preparation method thereof |
| CN106221035A (en) * | 2016-08-29 | 2016-12-14 | 四川金开特种电线电缆有限公司 | A kind of flame-retardant cable material |
| CN107541034A (en) * | 2016-06-27 | 2018-01-05 | 汉达精密电子(昆山)有限公司 | High tenacity fire-retardant polycarbonate thin-film material and its products formed |
| CN107663366A (en) * | 2016-07-27 | 2018-02-06 | 汉达精密电子(昆山)有限公司 | CNT strengthens halogen-free flame retardant PC/ABS composite material and its products formed |
-
2018
- 2018-06-01 CN CN201810554912.1A patent/CN110551373A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102250460A (en) * | 2011-05-22 | 2011-11-23 | 迈士通集团有限公司 | Halogen-free inflaming-retarding conductive PC resin composition, and preparation method thereof |
| CN107541034A (en) * | 2016-06-27 | 2018-01-05 | 汉达精密电子(昆山)有限公司 | High tenacity fire-retardant polycarbonate thin-film material and its products formed |
| CN107663366A (en) * | 2016-07-27 | 2018-02-06 | 汉达精密电子(昆山)有限公司 | CNT strengthens halogen-free flame retardant PC/ABS composite material and its products formed |
| CN106221035A (en) * | 2016-08-29 | 2016-12-14 | 四川金开特种电线电缆有限公司 | A kind of flame-retardant cable material |
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Application publication date: 20191210 |
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