CN113913004A - Halogen-free flame-retardant PC conductive material and product thereof - Google Patents
Halogen-free flame-retardant PC conductive material and product thereof Download PDFInfo
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- CN113913004A CN113913004A CN202010660490.3A CN202010660490A CN113913004A CN 113913004 A CN113913004 A CN 113913004A CN 202010660490 A CN202010660490 A CN 202010660490A CN 113913004 A CN113913004 A CN 113913004A
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- retardant
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- conductive material
- polycarbonate
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L69/00—Compositions of polycarbonates; Compositions of derivatives of polycarbonates
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/02—Flame or fire retardant/resistant
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/22—Halogen free composition
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/20—Applications use in electrical or conductive gadgets
Abstract
The invention relates to the technical field of high polymer materials, in particular to a halogen-free flame-retardant PC conductive material and a product thereof. The halogen-free flame-retardant PC conductive material comprises the following components in parts by weight per 100 parts by weight of a finished material product: 55-85 parts of polycarbonate; 8.4 to 30 portions of carbon black; 6.5 to 14 portions of flame retardant; 0.1 to 1 portion of anti-dripping agent. According to the halogen-free flame-retardant PC conductive material and the product thereof, the carbon black, a small amount of flame retardant and anti-dripping agent are added into the material, so that the PC conductive material with high flame retardance can be obtained, the flame retardance can reach UL-941.0 mm V-0 grade, and the requirements of the current market on the conductive material are met.
Description
[ technical field ] A method for producing a semiconductor device
The invention relates to the technical field of high polymer materials, in particular to a halogen-free flame-retardant PC conductive material and a product thereof.
[ background of the invention ]
With the multifunction of plastic products and the high integration of electronic circuits, materials with conductive properties are more and more widely applied, and PC materials (Polycarbonate) have high impact strength, flame retardant rating of the PC materials can reach V-2, and good weather resistance, and are widely applied to electronic and electrical products.
The surface resistance of the pure PC material is more than 10^14 (14 th power of 10) ohm, and the PC conductive material is obtained by adding carbon black, carbon nano tubes or carbon fibers. Carbon fibers and carbon nanotubes are high in cost, and the surface of the carbon fibers and the carbon nanotubes hardly meets the requirements of appearance parts during molding, so most of conductive media in the conductive material are carbon black. However, when carbon black is used as a conductive medium, the carbon formation of the conductive material during combustion is slow due to the addition of 20-30% by weight of carbon black and the combustion characteristic of carbon black, so that the flame retardancy of the conductive material is difficult to achieve.
Therefore, there is a need to develop a halogen-free flame retardant PC conductive material and its product to solve the above problems.
[ summary of the invention ]
The invention aims to provide a halogen-free flame-retardant PC conductive material and a product thereof, so as to obtain the halogen-free flame-retardant PC conductive material.
In order to achieve the purpose, the invention adopts the following technical scheme:
every 100 parts by weight of a finished product of the halogen-free flame-retardant PC conductive material comprises the following components in parts by weight:
55-85 parts of polycarbonate;
8.4 to 30 portions of carbon black;
6.5 to 14 portions of flame retardant;
0.1 to 1 portion of anti-dripping agent.
In the present invention, the polycarbonate is preferably at least one of bisphenol a polycarbonate, polyester polycarbonate, silicone copolymer polycarbonate, cyclohexane bisphenol a polycarbonate, bisphenol a-organosiloxane copolymer polycarbonate, and polycarbonate synthesized by bisphenol TMC.
Furthermore, the content of the organosilicon copolymerized polycarbonate is 10 to 30 parts per 100 parts by weight of the finished product.
Preferably, in the present invention, the polycarbonate has a melt mass flow rate of 3g/10min to 50g/10min at an ambient temperature of 300 ℃ and a load weight of 1.2 Kg.
Preferably, the carbon black has an oil absorption value of 150ml/100g or more and a nitrogen adsorption specific surface area of 50m or more2A volume resistance of 10ohm.cm or less, a surface resistance of 105Ohm is below.
Preferably, the flame retardant comprises a hypophosphite flame retardant, an organic silicon flame retardant and phenoxyl cyclophosphazene.
Furthermore, per 100 parts by weight of a finished material product, the addition amount of the hypophosphite flame retardant is 1-3 parts, the addition amount of the organosilicon flame retardant is 0.5-1 part, and the addition amount of the phenoxy cyclophosphazene flame retardant is 5-10 parts.
Further, the hypophosphite flame retardant is an ethylene aluminum hypophosphite flame retardant; the organic silicon flame retardant is polyborosilazane, polymethoxyphenyl silane, hydroxymethyl silane or cross-linked polydimethylsiloxane.
In the present invention, the anti-dripping agent is preferably coated polytetrafluoroethylene having a particle size of 400 nm or less and a coating content of styrene-acrylonitrile copolymer of 50%.
The invention also provides a halogen-free flame-retardant PC product which is prepared by molding the halogen-free flame-retardant PC conductive material.
The invention has the beneficial effects that: according to the halogen-free flame-retardant PC conductive material and the product thereof, the carbon black, a small amount of flame retardant and anti-dripping agent are added into the material, so that the PC conductive material with high flame retardance can be obtained, the flame retardance can reach UL-941.0 mm V-0 grade, and the requirements of the current market on the conductive material are met.
[ detailed description ] embodiments
The invention provides a halogen-free flame-retardant PC conductive material, wherein each 100 parts by weight of a finished material product comprises the following components in parts by weight:
55-85 parts of polycarbonate;
8.4 to 30 portions of carbon black;
6.5 to 14 portions of flame retardant;
0.1 to 1 portion of anti-dripping agent.
Specifically, in the halogen-free flame-retardant PC conductive material, the polycarbonate is at least one of bisphenol A polycarbonate, polyester polycarbonate, organosilicon copolymerized polycarbonate, cyclohexane bisphenol A polycarbonate, bisphenol A-organosiloxane copolymerized polycarbonate and polycarbonate synthesized by bisphenol TMC. In order to improve the impact property of the material, the content of the organosilicon copolymerized polycarbonate is 10 to 30 parts per 100 parts by weight of the finished product of the material. More specifically, the polycarbonate has a melt mass flow rate of 3g/10min to 50g/10min, preferably 3g/10min, 5g/10min, 10g/10min, 15g/10min, 20g/10min, 25g/10min, 30g/10min, 35g/10min, 40g/10min, 45g/10min or 50g/10min at an ambient temperature of 300 ℃ and a load weight of 1.2 Kg.
Specifically, the oil absorption value of the carbon black is more than 150ml/100g, and the nitrogen adsorption specific surface area is 50m2A volume resistance of 10ohm.cm or less, a surface resistance of 105The conductive material has higher conductivity below Ohm, preferably, the volume resistance of the conductive material can be reduced to 10 by adding 10-20 parts of carbon black into each 100 parts by weight of finished product of the material4Ohm.cm～105Ohm.
In order to make the conductive material have better flame retardance, the flame retardant comprises hypophosphite flame retardant, organic silicon flame retardant and phenoxyl cyclophosphazene. The amount of the flame retardant added is preferably 6.5 parts, 7 parts, 7.5 parts, 8 parts, 8.5 parts, 9 parts, 9.5 parts, 10 parts, 10.5 parts, 11 parts, 11.5 parts, 12 parts, 12.5 parts, 13 parts, 13.5 parts or 14 parts per 100 parts by weight of the finished material. The phosphate flame retardant is added in an amount of 1-3 parts, the organic silicon flame retardant is added in an amount of 0.5-1 part, and the phenoxy cyclophosphazene flame retardant is added in an amount of 5-10 parts. Further, the hypophosphite flame retardant is an ethylene aluminum hypophosphite flame retardant; the organosilicon flame retardant is polyborosilazane, polymethoxyphenylsilane, hydroxymethylsilane or cross-linked polydimethylsiloxane, preferably hydroxyphenylsilane.
Specifically, the anti-dripping agent is coated polytetrafluoroethylene, the particle size of the anti-dripping agent is less than 400 nanometers, and the coating content of the styrene-acrylonitrile copolymer is 50%.
In order to further understand the purpose, technical efficacy and technical means of the present invention, the following embodiments further illustrate the technical solutions of the present invention.
Example 1
Every 100 parts by weight of a finished product of the halogen-free flame-retardant PC conductive material comprises 71 parts of polycarbonate, 18 parts of carbon black, 10.5 parts of a flame retardant and 0.5 part of an anti-dripping agent.
Specifically, in this example 1, the polycarbonate contains 10 parts of an organosiloxane copolycarbonate; the flame retardant consists of 2 parts of vinyl aluminum hypophosphite, 8 parts of phenoxy cyclophosphazene and 0.5 part of hydroxyphenyl silane; the anti-dripping agent is polytetrafluoroethylene.
When the halogen-free flame-retardant PC conductive material is prepared, the components are weighed according to the proportion, and the components are uniformly mixed and then melted, extruded and granulated.
Comparative example 1
A polycarbonate material comprises 66 parts of polycarbonate, 18 parts of carbon black, 15.5 parts of flame retardant and 0.5 part of anti-dripping agent per 100 parts of finished material.
Specifically, in this comparative example 1, the polycarbonate does not contain an organosiloxane copolycarbonate; the flame retardant consists of 2 parts of vinyl aluminum hypophosphite, 13 parts of phosphate flame retardant and 0.5 part of hydroxyphenyl silane; (ii) a The anti-dripping agent is polytetrafluoroethylene.
The polycarbonate material was prepared in the same manner as in example 1.
Example 2
Every 100 parts by weight of a finished product of the halogen-free flame-retardant PC conductive material comprises 81.5 parts of polycarbonate, 18 parts of carbon black, 8 parts of a flame retardant and 0.5 part of an anti-dripping agent.
Specifically, in this example 1, the polycarbonate contains 30 parts of an organosiloxane copolycarbonate; the flame retardant consists of 2 parts of vinyl aluminum hypophosphite, 5 parts of phenoxy cyclophosphazene and 1 part of hydroxyphenyl silane; the anti-dripping agent is polytetrafluoroethylene.
When the halogen-free flame-retardant PC conductive material is prepared, the components are weighed according to the proportion, and the components are uniformly mixed and then melted, extruded and granulated.
Comparative example 2
The polycarbonate material comprises 65.5 parts of polycarbonate, 18 parts of carbon black, 16 parts of flame retardant and 0.5 part of anti-dripping agent per 100 parts of finished material.
Specifically, in this comparative example 1, the polycarbonate contained 30 parts of an organosiloxane copolycarbonate; the flame retardant consists of 15 parts of phosphate flame retardant and 1 part of hydroxyphenyl silane; the anti-dripping agent is polytetrafluoroethylene.
The polycarbonate material was prepared in the same manner as in example 2.
After melt extrusion granulation, the pellets of each example and comparative example were injection molded into standard test bars on an injection molding machine, and the mechanical properties of the resulting materials were tested according to the standard, with the test results shown in table 1:
TABLE 1 test results
| Test items | Test standard | Example 1 | Comparative example 1 | Example 2 | Comparative example 2 |
| Impact Strength (KJ/m)2) | ISO 180 | 3.5 | 1.5 | 5.7 | 2.3 |
| Flame retardant rating | UL-94 | 1.0mm V-0 | 1.0mm V-0 | 1.0mm V-0 | 1.0mm V-0 |
| Volume resistance (ohm. cm) | IEC60093 | 10^4 | 10^4 | 10^4 | 10^4 |
Comparing example 1 with comparative example 1, it can be seen that: by adding the organic silicon copolymerized polycarbonate into the polycarbonate material, the impact strength of the material can be improved; compared with comparative example 1 and comparative example 2, the flame retardant grade of 1.0mmV-0 which is the same as that in comparative example 1 can be achieved by adding a smaller amount of flame retardant compounded by hypophosphite flame retardant, silicon flame retardant and phenoxycyclophosphazene in example 1 and example 2. Thus, it can be seen from examples 1 and 2 that a PC conductive material having high flame retardancy and a volume resistance of 10 can be obtained by adding carbon black and a small amount of a flame retardant to a polycarbonate material4Cm, and the addition of a small amount of flame retardant has little effect on the mechanical properties of the material.
The invention also provides a halogen-free flame-retardant PC product which is prepared by molding the halogen-free flame-retardant PC conductive material, and the product can be widely applied to electronic and electrical products, such as printers, computer CPU conductive parts and other fields.
In conclusion, the halogen-free flame-retardant PC conductive material and the product thereof can obtain the PC conductive material with high flame retardance by adding the carbon black, the flame retardant and the anti-dripping agent into the material, the flame retardance can reach UL-941.0 mm V-0 grade, and the requirements of the current market on the conductive material are met.
The technical principles of the present invention have been described above in connection with specific embodiments, which are intended to explain the principles of the present invention and should not be construed as limiting the scope of the present invention in any way. Based on the explanations herein, those skilled in the art will be able to conceive of other embodiments of the present invention without inventive effort, which would fall within the scope of the present invention.
Claims (10)
1. Every 100 parts by weight of a finished product of the halogen-free flame-retardant PC conductive material is characterized by comprising the following components in parts by weight:
55-85 parts of polycarbonate;
8.4 to 30 portions of carbon black;
6.5 to 14 portions of flame retardant;
0.1 to 1 portion of anti-dripping agent.
2. The halogen-free flame retardant PC conductive material according to claim 1, wherein the polycarbonate is at least one of bisphenol A polycarbonate, polyester polycarbonate, silicone copolymerized polycarbonate, cyclohexane bisphenol A polycarbonate, bisphenol A-organosiloxane copolymerized polycarbonate, and polycarbonate synthesized by bisphenol TMC.
3. The halogen-free flame-retardant PC conductive material according to claim 2, wherein the content of the silicone copolymerized polycarbonate is 10 to 30 parts per 100 parts by weight of the finished material.
4. The halogen-free flame-retardant PC conductive material according to claim 1, wherein the melt mass flow rate of the polycarbonate is 3g/10min to 50g/10min at an ambient temperature of 300 ℃ and a load weight of 1.2 Kg.
5. The halogen-free flame-retardant PC conductive material as claimed in claim 1, wherein the carbon black has an oil absorption value of 150ml/100g or more and a nitrogen adsorption specific surface areaProduct of 50m2A volume resistance of 10ohm.cm or less, a surface resistance of 105Ohm is below.
6. The halogen-free flame retardant PC conductive material according to claim 1, wherein the flame retardant comprises hypophosphite flame retardant, organic and silicon flame retardant and phenoxycyclophosphazene.
7. The halogen-free flame-retardant PC conductive material as claimed in claim 6, wherein the hypophosphite flame retardant is added in an amount of 1-3 parts, the organosilicon flame retardant is added in an amount of 0.5-1 part, and the phenoxy cyclophosphazene flame retardant is added in an amount of 5-10 parts per 100 parts by weight of the finished material.
8. The halogen-free flame retardant PC conducting material according to claim 6, wherein the hypophosphite flame retardant is an ethylene aluminum hypophosphite flame retardant; the organic silicon flame retardant is polyborosilazane, polymethoxyphenyl silane, hydroxymethyl silane or cross-linked polydimethylsiloxane.
9. The halogen-free flame-retardant PC conductive material as claimed in claim 1, wherein the anti-dripping agent is coated polytetrafluoroethylene, the particle size of the coated polytetrafluoroethylene is less than 400 nm, and the coating content of the styrene-acrylonitrile copolymer is 50%.
10. The halogen-free flame-retardant PC product is prepared by molding the halogen-free flame-retardant PC conductive material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010660490.3A CN113913004A (en) | 2020-07-10 | 2020-07-10 | Halogen-free flame-retardant PC conductive material and product thereof |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202010660490.3A CN113913004A (en) | 2020-07-10 | 2020-07-10 | Halogen-free flame-retardant PC conductive material and product thereof |
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| CN113913004A true CN113913004A (en) | 2022-01-11 |
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| WO2010100865A1 (en) * | 2009-03-03 | 2010-09-10 | ソニー株式会社 | Aromatic polycarbonate resin composition and molded article thereof |
| CN102250460A (en) * | 2011-05-22 | 2011-11-23 | 迈士通集团有限公司 | Halogen-free inflaming-retarding conductive PC resin composition, and preparation method thereof |
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| CN109666281A (en) * | 2018-12-28 | 2019-04-23 | 四川中物材料股份有限公司 | High transparency film halogen-free flameproof, which can scald, is moulded into type makrolon material and its preparation method |
| CN110551379A (en) * | 2018-06-01 | 2019-12-10 | 汉达精密电子(昆山)有限公司 | Halogen-free flame-retardant conductive material and product thereof |
-
2020
- 2020-07-10 CN CN202010660490.3A patent/CN113913004A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2010100865A1 (en) * | 2009-03-03 | 2010-09-10 | ソニー株式会社 | Aromatic polycarbonate resin composition and molded article thereof |
| CN102250460A (en) * | 2011-05-22 | 2011-11-23 | 迈士通集团有限公司 | Halogen-free inflaming-retarding conductive PC resin composition, and preparation method thereof |
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| CN109666281A (en) * | 2018-12-28 | 2019-04-23 | 四川中物材料股份有限公司 | High transparency film halogen-free flameproof, which can scald, is moulded into type makrolon material and its preparation method |
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