CN110540334A - Electroplating sewage treatment equipment and process thereof - Google Patents
Electroplating sewage treatment equipment and process thereof Download PDFInfo
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- CN110540334A CN110540334A CN201910947658.6A CN201910947658A CN110540334A CN 110540334 A CN110540334 A CN 110540334A CN 201910947658 A CN201910947658 A CN 201910947658A CN 110540334 A CN110540334 A CN 110540334A
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- 239000010865 sewage Substances 0.000 title claims abstract description 139
- 238000009713 electroplating Methods 0.000 title claims abstract description 104
- 238000000034 method Methods 0.000 title claims abstract description 18
- 230000008569 process Effects 0.000 title claims abstract description 14
- 230000007246 mechanism Effects 0.000 claims abstract description 165
- 238000001914 filtration Methods 0.000 claims abstract description 50
- 238000001556 precipitation Methods 0.000 claims abstract description 23
- 238000000926 separation method Methods 0.000 claims abstract description 23
- 229910021645 metal ion Inorganic materials 0.000 claims abstract description 16
- 230000009471 action Effects 0.000 claims abstract description 6
- 230000005484 gravity Effects 0.000 claims abstract description 6
- 239000003814 drug Substances 0.000 claims description 29
- 238000003756 stirring Methods 0.000 claims description 27
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 24
- 239000013043 chemical agent Substances 0.000 claims description 19
- 241001233242 Lontra Species 0.000 claims description 13
- 238000010438 heat treatment Methods 0.000 claims description 11
- 238000006386 neutralization reaction Methods 0.000 claims description 8
- 238000004065 wastewater treatment Methods 0.000 claims description 8
- 238000007599 discharging Methods 0.000 claims description 7
- 238000004062 sedimentation Methods 0.000 claims description 7
- 239000010814 metallic waste Substances 0.000 claims description 4
- 239000003795 chemical substances by application Substances 0.000 claims description 3
- 230000007704 transition Effects 0.000 claims description 3
- 239000012535 impurity Substances 0.000 abstract description 19
- 230000000694 effects Effects 0.000 abstract description 7
- 230000009286 beneficial effect Effects 0.000 abstract description 2
- 239000007787 solid Substances 0.000 abstract description 2
- 230000000903 blocking effect Effects 0.000 description 8
- 238000006243 chemical reaction Methods 0.000 description 7
- 239000002351 wastewater Substances 0.000 description 7
- 229910052751 metal Inorganic materials 0.000 description 6
- 239000002184 metal Substances 0.000 description 6
- 239000000126 substance Substances 0.000 description 6
- 230000004888 barrier function Effects 0.000 description 5
- 241000220317 Rosa Species 0.000 description 4
- 229910001385 heavy metal Inorganic materials 0.000 description 4
- 230000001376 precipitating effect Effects 0.000 description 4
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 3
- 238000010531 catalytic reduction reaction Methods 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 239000002244 precipitate Substances 0.000 description 2
- 239000002699 waste material Substances 0.000 description 2
- 241000894006 Bacteria Species 0.000 description 1
- 230000002159 abnormal effect Effects 0.000 description 1
- 238000009825 accumulation Methods 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 238000005868 electrolysis reaction Methods 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 239000012510 hollow fiber Substances 0.000 description 1
- 230000003116 impacting effect Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 238000000746 purification Methods 0.000 description 1
- 239000000523 sample Substances 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000013049 sediment Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Classifications
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- C—CHEMISTRY; METALLURGY
- C02—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
- C02F—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
- C02F9/00—Multistage treatment of water, waste water or sewage
-
- C—CHEMISTRY; METALLURGY
- C02—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
- C02F—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
- C02F1/00—Treatment of water, waste water, or sewage
- C02F1/001—Processes for the treatment of water whereby the filtration technique is of importance
-
- C—CHEMISTRY; METALLURGY
- C02—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
- C02F—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
- C02F1/00—Treatment of water, waste water, or sewage
- C02F1/02—Treatment of water, waste water, or sewage by heating
-
- C—CHEMISTRY; METALLURGY
- C02—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
- C02F—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
- C02F1/00—Treatment of water, waste water, or sewage
- C02F1/52—Treatment of water, waste water, or sewage by flocculation or precipitation of suspended impurities
-
- C—CHEMISTRY; METALLURGY
- C02—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
- C02F—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
- C02F1/00—Treatment of water, waste water, or sewage
- C02F1/66—Treatment of water, waste water, or sewage by neutralisation; pH adjustment
-
- C—CHEMISTRY; METALLURGY
- C02—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
- C02F—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
- C02F2103/00—Nature of the water, waste water, sewage or sludge to be treated
- C02F2103/16—Nature of the water, waste water, sewage or sludge to be treated from metallurgical processes, i.e. from the production, refining or treatment of metals, e.g. galvanic wastes
Landscapes
- Life Sciences & Earth Sciences (AREA)
- Hydrology & Water Resources (AREA)
- Engineering & Computer Science (AREA)
- Environmental & Geological Engineering (AREA)
- Water Supply & Treatment (AREA)
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Water Treatment By Electricity Or Magnetism (AREA)
Abstract
the invention discloses electroplating sewage treatment equipment and a process thereof, and relates to the technical field of sewage treatment. The invention has the beneficial effects that the separation mechanism, the dosing mechanism and the precipitation mechanism are arranged, solid impurities in the electroplating sewage are separated through the separation mechanism, then metal ions in the electroplating sewage are neutralized and precipitated through the cooperation of the dosing mechanism and the precipitation mechanism, and are separated through the action of gravity, so that the phenomenon that the metal ions block the separator to influence the filtering effect is avoided.
Description
Technical Field
The invention relates to the technical field of sewage treatment, in particular to electroplating sewage treatment equipment and a process thereof.
Background
in the prior art, an electroplating filtering device presses medicine water with impurities into a filter barrel through a pump, the impurities are removed through filtering of a filter element, so that high-precision clean medicine water is obtained, electroplating wastewater contains a large amount of organic matters, the organic matters cannot be treated by using a chemical method, biochemical bacteria cannot survive and cannot degrade the organic matters due to the large amount of heavy metals in the electroplating wastewater, COD (chemical oxygen demand) of the wastewater treated by the chemical method is high, macromolecular complexes or chelates cannot be separated from the heavy metals by using the chemical method, secondary electrolysis treatment is usually adopted, however, a large amount of flocculates are generated in the electroplating wastewater, so that the conventional electroplating wastewater filtering device is easy to cause blockage and the like by using a common filtering mode and cannot well remove the impurities, and the conventional electroplating wastewater treatment equipment usually needs to clean the equipment after being used for a long time, and simultaneously, the impurities in the electroplating sewage are inconvenient to separate.
The invention discloses electroplating sewage treatment equipment with the patent number of CN106277413A in the prior art, which particularly discloses buried electroplating sewage treatment equipment, comprising a reaction kettle, a sewage inlet pipe and the like, and is characterized in that: still including preventing leaking shell, active carbon clarifier, neutralization reaction pond, hollow fiber filter layer, PH meter probe, sensor, catalytic reduction reaction unit, prevent leaking the shell cover outside at reation kettle, be equipped with the grid in the reation kettle, the grid rear is equipped with neutralization reaction pond, catalytic reduction reaction unit is installed at neutralization reaction pond rear. The sealing ring and the activated carbon purifier can adsorb underground moisture, so that the reaction kettle is prevented from being corroded by the moisture, and the service life of equipment is prolonged; when the pH value fluctuates greatly, the sewage leakage is indicated, and wireless sensing is adopted
the device sends out signals, and the staff receives abnormal signals and processes the condition in time, so that the sewage leakage can be effectively avoided to pollute the underground water source. The invention has simple structure, no occupation of ground space, no influence on the surrounding environment, low manual operation intensity, stability, reliability and good treatment effect, solves the problems of large occupation space, poor reliability and influence on the surrounding environment in the electroplating sewage treatment, but carries out the sewage treatment through chemical neutralization reaction, needs to frequently clean a reaction device, and is inconvenient to clean the reaction device and a filter layer.
Disclosure of Invention
The invention aims to provide electroplating sewage treatment equipment and a process thereof, and aims to solve the problems that different impurities are poor in filtering effect, the equipment is inconvenient to clean and easy to block when sewage is treated in the prior art.
The invention provides electroplating sewage treatment equipment and a process thereof, and the electroplating sewage treatment equipment comprises a filtering mechanism, a sewage pump, a separating mechanism, a dosing mechanism and a precipitating mechanism, wherein the filtering mechanism is connected with the separating mechanism through the sewage pump, a water inlet of the sewage pump is communicated with the bottom of the filtering mechanism, a water outlet of the sewage pump is communicated with the bottom of the separating mechanism, the dosing mechanism is arranged above the separating mechanism, the bottom of the side surface of the dosing mechanism is connected with the top of the side surface of the separating mechanism through a pipeline, the precipitating mechanism is arranged at the side of the dosing mechanism, the dosing mechanism is communicated with the top of the precipitating mechanism, and the height of the precipitating mechanism is greater than that of the.
Further, filtering mechanism includes rose box and filter, the rose box bottom is equipped with the delivery port, the delivery port pass through the sewage pump with precipitation mechanism connects, the filter sets up inside the rose box, the filter with the rose box block, the filter height is greater than the delivery port height.
Further, the filter includes main part, buckle and apron, the main part top is equipped with and holds the chamber, it is equipped with the filter layer to hold the intracavity, the buckle sets up around the main part, the buckle will lap the lock and be in hold the chamber top, the main part bottom is equipped with the mesh.
Further, the apron includes frame and otter board, the frame block is in around the otter board, the frame with buckle transition fit, otter board length and width all are greater than hold the length and the width in chamber.
further, separating mechanism includes separator box, outlet, blowdown door and baffler, and the separator box height that separates is less than half of filtering mechanism height, the outlet is equipped with two the outlet all through the pipeline with add medicine mechanism intercommunication, the blowdown door sets up the outlet below, baffler block is in the separator box bottom portion, the baffler height is less than the blowdown door height.
Further, the baffler includes diaphragm, riser and handle, diaphragm riser mutually perpendicular and equidistant setting form the grid structure, divide into a plurality of net chambeies with separator box bottom space through the baffler, the handle setting is in one side that is close to the drain between the riser.
Further, the dosing mechanism comprises a dosing port, a dosing box and a stirring mechanism, the dosing port is arranged above the dosing box, the stirring mechanism is hinged inside the dosing box, and the stirring mechanism is located under the dosing port.
Further, the stirring mechanism comprises a stirring shaft and a forward and reverse rotating motor, the stirring shaft is hinged inside the dosing tank, and the output end of the forward and reverse rotating motor penetrates through the dosing tank and is connected with the stirring shaft.
Further, deposit the mechanism and include settling tank, heating rod, desilting door, inlet tube and outlet pipe, the heating rod is equipped with two, two the heating rod sets up respectively the inside both sides of settling tank, the inlet tube intercommunication the medicine mechanism, the outlet pipe sets up settling tank one side top, the desilting door sets up the settling tank bottom.
The process of electroplating sewage treatment equipment according to any one of claims 1-9, comprising the steps of:
s1: discharging the electroplating sewage from the top of the filtering mechanism into the filtering mechanism for primary filtering;
S2: the sewage pump conveys the electroplating sewage from the filtering mechanism to the inside of the separating mechanism;
S3: the separation mechanism separates the metal waste residue in the electroplating sewage;
S4: the electroplating sewage in the separation mechanism is pressurized by a sewage pump and then is conveyed upwards to the dosing mechanism;
S5: adding a chemical agent into the electroplating sewage through a dosing mechanism and stirring to fully mix the chemical agent with the electroplating sewage;
S6: the electroplating sewage added with the chemical agent flows into a precipitation mechanism under the action of gravity;
s7: the temperature of the precipitation mechanism is raised to heat the electroplating sewage, the chemical agent and the electroplating sewage are neutralized and precipitated, and metal ions in the electroplating sewage are precipitated;
S8: and discharging the neutralized and precipitated electroplating sewage from the upper part of the precipitation mechanism to finish the filtration of the electroplating sewage.
Compared with the prior art, the invention has the beneficial effects that:
Be provided with separating mechanism, add medicine mechanism and deposit the mechanism, through the solid impurity separation of separating mechanism in with electroplating the sewage, later through adding medicine mechanism and depositing the metal ion that the mechanism cooperation made in electroplating the sewage and taking place and deposit, separate through the action of gravity, avoided metal ion to construct the jam to the separator, influence filter effect, the different impurity of electroplating in the sewage that separating mechanism, the setting that adds medicine mechanism and deposit the mechanism realized filters respectively.
drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and other drawings can be obtained by those skilled in the art without creative efforts.
FIG. 1 is a schematic view of the overall structure of the present invention;
FIG. 2 is a schematic view of the filter mechanism;
FIG. 3 is a schematic view of the overall structure of the medicine adding mechanism;
FIG. 4 is a schematic view of the overall structure of the separating mechanism;
FIG. 5 is a schematic view showing an internal structure of the separating mechanism;
FIG. 6 is a schematic view of the internal structure of the medicine adding mechanism;
fig. 7 is a schematic structural view of the precipitation mechanism.
Reference numerals:
the device comprises a filtering mechanism 1, a sewage pump 2, a separating mechanism 3, a dosing mechanism 4, a settling mechanism 5, a filtering box 101, a filtering plate 102, a main body 1021, a buckle 1022, a cover plate 1023, a containing cavity 1024, a separating box 301, a water outlet 302, a sewage discharge door 303, a barrier plate 304, a transverse plate 3041, a vertical plate 3042, a handle 3043, a dosing port 401, a dosing box 402, a stirring mechanism 403, a stirring shaft 4031, a forward and reverse motor 4032, a settling box 501, a heating rod 502, a desilting door 503, a water inlet pipe 504 and a water outlet pipe 505.
Detailed Description
The technical solutions of the present invention will be described clearly and completely with reference to the accompanying drawings, and it should be understood that the described embodiments are some, but not all embodiments of the present invention.
the components of embodiments of the present invention generally described and illustrated in the figures herein may be arranged and designed in a wide variety of different configurations. Thus, the following detailed description of the embodiments of the present invention, presented in the figures, is not intended to limit the scope of the invention, as claimed, but is merely representative of selected embodiments of the invention.
All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplicity of description, but do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; may be directly connected or indirectly connected through intervening agents, or may be internally connected to the two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.
referring to fig. 1 to 7, an embodiment of the present invention provides an electroplating sewage treatment apparatus and a process thereof, including a filtering mechanism 1, a sewage pump 2, a separating mechanism 3, a dosing mechanism 4 and a precipitation mechanism 5, wherein the filtering mechanism 1 and the separating mechanism 3 are connected by the sewage pump 2, a water inlet of the sewage pump 2 is communicated with the bottom of the filtering mechanism 1, a water outlet of the sewage pump 2 is communicated with the bottom of the separating mechanism 3, the dosing mechanism 4 is disposed above the separating mechanism 3, the bottom of the side surface of the dosing mechanism 4 is connected with the top of the side surface of the separating mechanism 3 by a pipeline, the precipitation mechanism 5 is disposed beside the dosing mechanism 4, the dosing mechanism 4 is communicated with the top of the precipitation mechanism 5, and the precipitation mechanism 5 is higher than the dosing mechanism 4. The working principle of the invention is that when electroplating sewage is treated, the electroplating sewage is firstly discharged to a filtering mechanism 1, the electroplating sewage is preliminarily filtered by the filtering mechanism 1, impurities floating on the surface of the electroplating sewage and substances with larger volume are filtered, the filtered sewage falls to the bottom of the filtering mechanism 1, then the sewage after preliminary filtering is sent to a separating mechanism 3 by a sewage pump 2, when the sewage flows in the separating mechanism 3, impurities with large weight in the sewage are precipitated in the separating mechanism 3, thereby realizing the purpose of separating metal waste residues and waste liquid contained in the electroplating sewage, then the sewage is pressurized by the sewage pump 2 and then rises to a dosing device above the separating mechanism 3, chemical agents are added into the sewage by the dosing device and are fully stirred, so that metal ions dissolved in the electroplating sewage are neutralized and precipitated, thereby realize the separation of the metal ion that contains in the electroplating sewage, electroplating sewage after adding the medicine gets into inside 5 mechanisms of deposiing, and electroplating sewage and chemical agent are at the inside abundant reaction of 5 mechanisms of deposiing, and the precipitate after the reaction falls to 5 bottoms of mechanism of deposiing, and the electroplating sewage of accomplishing of processing is discharged from 5 tops of mechanism of deposiing.
specifically, the filtering mechanism 1 comprises a filtering box 101 and a filtering plate 102, wherein a water outlet is formed in the bottom of the filtering box 101 and is connected with the sedimentation mechanism 5 through a sewage pump 2, the filtering plate 102 is arranged inside the filtering box 101, the filtering plate 102 is clamped with the filtering box 101, and the height of the filtering plate 102 is larger than that of the water outlet. Sewage is when arranging filter mechanism 1, at first can pass through filter 102, can filter the floater in the sewage and bulky debris through filter 102's setting, simultaneously filter 102 with filter box 101 block, conveniently pull down filter 102 clean, prevent that filter 102 from taking place to block up after using for a long time and influencing the filter effect, filter 102 highly is greater than the delivery port and highly makes electroplating sewage can discharge from the delivery port after abundant filtration, thereby the delivery port setting has increased the flow velocity of electroplating sewage in filter box 101 bottom simultaneously, avoid electroplating sewage and take place to deposit the gathering in filter box 101 bottom, pollute filter box 101 internal environment.
Specifically, the filter plate 102 of the present invention includes a main body 1021, a buckle 1022 and a cover plate 1023, wherein a receiving cavity 1024 is disposed above the main body 1021, a filter layer is disposed in the receiving cavity 1024, the buckle 1022 is disposed around the main body 1021, the buckle 1022 buckles the cover plate 1023 above the receiving cavity 1024, and a mesh is disposed at the bottom of the main body 1021. The filter layer sets up the chamber 1024 that holds on main part 1021, after the filter layer filter effect descends, can dismantle apron 1023 from main part 1021, make and hold chamber 1024 and open, the convenience is changed the filter layer that holds in the chamber 1024, through the setting of main part 1021 and apron 1023, make filter 102 after long-term the use, can unpack main part 1021 apron 1023 apart and clean, make clean more thoroughly, the setting of filter 102 can effectively filter the debris in the electroplating sewage, simultaneously can also place multiple filter layer in holding chamber 1024, increase filter 102's filter effect.
specifically, the cover plate 1023 of the invention comprises a frame and a screen plate, wherein the frame is clamped around the screen plate, the frame is in transition fit with the buckles 1022, and the length and the width of the screen plate are both greater than those of the accommodating cavity 1024. Frame and otter board's combination for apron 1023 can support the otter board through the frame when using, prevents that the otter board from taking place to warp in the use, and the use of otter board is favorable to electroplating sewage and flows through from the otter board, and the otter board also can be traded as required with the otter board of different mesh diameters simultaneously, thereby changes the filter capacity of apron 1023 or adapts to the electroplating sewage of different consistencies.
specifically, the separating mechanism 3 of the present invention includes a separating box 301, a water outlet 302, a sewage discharging door 303 and a blocking plate 304, wherein the height of the separating box 301 is lower than half of the height of the filtering mechanism 1, the water outlet 302 is provided with two water outlets 302 which are both communicated with the medicine adding mechanism 4 through a pipeline, the sewage discharging door 303 is arranged below the water outlet 302, the blocking plate 304 is clamped at the bottom of the separating box 301, and the height of the blocking plate 304 is smaller than the height of the sewage discharging door 303. When the separating mechanism 3 works, sewage firstly enters the separating box 301, passes through the arrangement of the baffle plate 304, so that when the wastewater contacts the barrier plate 304, the heavy metal impurities are blocked after impacting the barrier plate 304, the light electroplating wastewater can flow through the barrier plate 304, thereby realizing the separation of countless heavy metal impurities in the electroplating, effectively separating the metal impurities carried by the lower layer of the electroplating sewage in the process of electroplating through the arrangement of the baffle plate 304, avoiding the influence of the metal impurities on the subsequent purification work of the electroplating sewage, when the blocking plate 304 blocks the accumulation of metal impurities, after the sewage draining door 303 is opened, the blocking plate 304 can be withdrawn from the waste gate 303, the blocking plate 304 slides along the bottom of the separation tank 301 during withdrawal, thereby taking out the metal impurities deposited at the bottom of the separation box 301 and finishing the cleaning of the bottom of the separation box 301.
Specifically, the blocking plate 304 of the invention includes a horizontal plate 3041, vertical plates 3042 and a handle 3043, the horizontal plate 3041 and the vertical plates 3042 are mutually perpendicular and arranged at equal intervals to form a grid structure, the bottom space of the separation box 301 is divided into a plurality of grid cavities by the blocking plate 304, and the handle 3043 is arranged at one side between the vertical plates 3042 close to the sewage outlet. The horizontal plate 3041 of the barrier plate 304 can separate metal impurities in the electroplating sewage, the horizontal plate 3041 can be supported by the vertical plate 3042, and the horizontal plate 3041 can form a grid cavity in a separating manner, so that resistance of the electroplating sewage when flowing is increased, the metal impurities in the electroplating sewage can be better separated, and the horizontal plate 3041 and the vertical plate 3042 can be conveniently drawn out of the separating mechanism 3 for cleaning through the arrangement of the handle 3043.
Specifically, the medicine adding mechanism 4 of the present invention includes a medicine adding port 401, a medicine adding box 402, and a stirring mechanism 403, wherein the medicine adding port 401 is disposed above the medicine adding box 402, the stirring mechanism 403 is hinged inside the medicine adding box 402, and the stirring mechanism 403 is located right below the medicine adding port 401. Stirring mechanism 403 is located under dosing port 401 for chemical agent can make chemical agent electroplate sewage through stirring mechanism 403 and carry out the intensive mixing of stirring after adding from dosing port 401, avoids the inhomogeneous separation step that influences metal ion in the electroplating sewage of chemical agent mixing.
specifically, the stirring mechanism 403 of the present invention includes a stirring shaft 4031 and a counter-rotating motor 4032, wherein the stirring shaft 4031 is hinged inside the dosing box 402, and an output end of the counter-rotating motor 4032 passes through the dosing box 402 and is connected to the stirring shaft 4031. Due to the arrangement of the forward and reverse rotating motor 4032, the rotation direction of the stirring shaft 4031 can be changed along with the rotation of the forward and reverse rotating motor 4032, so that the stirring of the stirring shaft 4031 is more sufficient.
Specifically, the sedimentation mechanism 5 comprises a sedimentation tank 501, two heating rods 502, a dredging door 503, a water inlet pipe 504 and a water outlet pipe 505, wherein the two heating rods 502 are arranged on two sides inside the sedimentation tank 501 respectively, the water inlet pipe 504 is communicated with the dosing mechanism 4, the water outlet pipe 505 is arranged on the top of one side of the sedimentation tank 501, and the dredging door 503 is arranged at the bottom of the sedimentation tank 501. Deposit 5 during operations of mechanism, it at first gets into in the setting tank 501 to electroplate sewage, later the heating rod 502 begins work and heats the electroplating sewage that has mixed chemical agent, electroplate sewage and chemical agent's reaction rate with higher speed, thereby make the metal ion in the electroplating sewage with deposit, the separation to electroplating metal ion in the sewage of realization, inlet tube 504 and outlet pipe 505 all set up on setting tank 501 upper portion, thereby make the metal ion precipitate can fall to setting tank 501 bottom through the action of gravity at the flow in-process, the metal ion after the sediment can be cleared up away from setting tank 501 through desilting door 503, the convenience is to setting tank 501's cleanness.
The process of electroplating sewage treatment equipment according to any one of claims 1-9, comprising the steps of:
S1: discharging the electroplating sewage from the top of the filtering mechanism 1 into the filtering mechanism 1 for primary filtering;
S2: the sewage pump 2 conveys the electroplating sewage from the filtering mechanism 1 to the inside of the separating mechanism 3;
s3: the separation mechanism 3 separates the metal waste residue in the electroplating sewage;
s4: the electroplating sewage in the separation mechanism 3 is pressurized by the sewage pump 2 and then is conveyed upwards to the dosing mechanism 4;
S5: chemical agents are added into the electroplating sewage through the agent adding mechanism 4 and stirred, so that the chemical agents and the electroplating sewage are fully mixed;
s6: the electroplating sewage added with the chemical agent flows into the precipitation mechanism 5 under the action of gravity;
s7: the precipitation mechanism 5 heats the electroplating sewage when the temperature rises, the chemical agent and the electroplating sewage generate neutralization precipitation, and metal ions in the electroplating sewage generate precipitation;
S8: and the electroplating sewage after neutralization and precipitation is discharged from the upper part of the precipitation mechanism 5 to finish the filtration of the electroplating sewage.
Adopt above-mentioned step, can separate and filter the different impurity in the electroplating sewage respectively to make the metal ion in the electroplating sewage fully separate out from sewage, prevent simultaneously that the metal ion after appearing from blockking up filter equipment, adopt above-mentioned step simultaneously to handle electroplating sewage can make electroplating sewage's processing convenient and fast more, increased the life of equipment simultaneously.
finally, it should be noted that: the above embodiments are only used to illustrate the technical solution of the present invention, and not to limit the same; while the invention has been described in detail and with reference to the foregoing embodiments, those skilled in the art will appreciate that; the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; and the modifications or the substitutions do not make the essence of the corresponding technical solutions depart from the scope of the technical solutions of the embodiments of the present invention.
Claims (10)
1. an electroplating sewage treatment device and a process thereof are characterized in that: including filtering mechanism (1), sewage pump (2), separating mechanism (3), add medicine mechanism (4) and deposit mechanism (5), filtering mechanism (1) with separating mechanism (3) are connected through sewage pump (2), and the water inlet of sewage pump (2) communicates filtering mechanism (1) bottom, and the delivery port of sewage pump (2) communicates separating mechanism (3) bottom, it is in to add medicine mechanism (4) setting separating mechanism (3) top, it passes through the pipe connection to add medicine mechanism (4) side bottom separating mechanism (3) side top, it is in to deposit mechanism (5) setting add medicine mechanism (4) side, add medicine mechanism (4) with deposit mechanism (5) top intercommunication, it highly is greater than to deposit mechanism (5) add medicine mechanism (4) height.
2. the electroplating wastewater treatment equipment according to claim 1, wherein: the filter mechanism (1) comprises a filter box (101) and a filter plate (102), a water outlet is formed in the bottom of the filter box (101), the water outlet is connected with the sedimentation mechanism (5) through a sewage pump (2), the filter plate (102) is arranged inside the filter box (101), the filter plate (102) is clamped with the filter box (101), and the height of the filter plate (102) is larger than that of the water outlet.
3. The electroplating wastewater treatment equipment according to claim 2, characterized in that: the filter (102) includes main part (1021), buckle (1022) and apron (1023), main part (1021) top is equipped with and holds chamber (1024), it is equipped with the filter layer in chamber (1024) to hold, buckle (1022) set up main part (1021) is all around, buckle (1022) will be lapped (1023) lock and be in hold chamber (1024) top, main part (1021) bottom is equipped with the mesh.
4. The electroplating wastewater treatment equipment according to claim 3, characterized in that: apron (1023) include frame and otter board, the frame block is in around the otter board, the frame with buckle (1022) transition fit, otter board length and width all are greater than hold the length and the width in chamber (1024).
5. the electroplating wastewater treatment equipment according to claim 4, wherein: separating mechanism (3) are including separator box (301), outlet (302), blowdown door (303) and separation plate (304), and the separator box (301) height is less than half of filter mechanism (1) height, outlet (302) are equipped with two outlet (302) all through the pipeline with charge mechanism (4) intercommunication, blowdown door (303) set up outlet (302) below, separation plate (304) block is in separator box (301) bottom, separation plate (304) height is less than blowdown door (303) height.
6. the electroplating wastewater treatment equipment according to claim 5, wherein: the separation plate (304) comprises transverse plates (3041), vertical plates (3042) and handles (3043), the transverse plates (3041) and the vertical plates (3042) are perpendicular to each other and are arranged at equal intervals to form a grid structure, the bottom space of the separation box (301) is divided into a plurality of grid cavities through the separation plate (304), and the handles (3043) are arranged on one side, close to a sewage discharge port, between the vertical plates (3042).
7. the electroplating wastewater treatment equipment according to claim 1, wherein: medicine mechanism (4) is including adding medicine mouth (401), dosing tank (402) and rabbling mechanism (403), it sets up to add medicine mouth (401) dosing tank (402) top, rabbling mechanism (403) articulate inside dosing tank (402), rabbling mechanism (403) are located under adding medicine mouth (401).
8. The electroplating sewage treatment equipment and the process thereof according to claim 1, wherein the electroplating sewage treatment equipment comprises: the stirring mechanism (403) comprises a stirring shaft (4031) and a forward and reverse rotation motor (4032), the stirring shaft (4031) is hinged inside the dosing box (402), and the output end of the forward and reverse rotation motor (4032) penetrates through the dosing box (402) and is connected with the stirring shaft (4031).
9. The electroplating wastewater treatment equipment according to claim 1, wherein: deposit mechanism (5) including settling tank (501), heating rod (502), desilting door (503), inlet tube (504) and outlet pipe (505), heating rod (502) are equipped with two, two heating rod (502) set up respectively the inside both sides of settling tank (501), inlet tube (504) intercommunication add medicine mechanism (4), outlet pipe (505) set up settling tank (501) one side top, desilting door (503) set up settling tank (501) bottom.
10. the process of electroplating sewage treatment equipment according to any one of claims 1-9, comprising the steps of:
s1: discharging the electroplating sewage from the top of the filtering mechanism (1) into the filtering mechanism (1) for primary filtering;
S2: the sewage pump (2) conveys the electroplating sewage from the filtering mechanism (1) to the inside of the separating mechanism (3);
s3: the separation mechanism (3) separates the metal waste residue in the electroplating sewage;
S4: the electroplating sewage in the separation mechanism (3) is pressurized by the sewage pump (2) and then is conveyed upwards to the dosing mechanism (4);
S5: chemical agents are added into the electroplating sewage through the agent adding mechanism (4) and stirred, so that the chemical agents and the electroplating sewage are fully mixed;
S6: the electroplating sewage added with the chemical agent flows into the precipitation mechanism (5) under the action of gravity;
S7: the precipitation mechanism (5) heats the electroplating sewage by heating, the chemical agent and the electroplating sewage generate neutralization precipitation, and metal ions in the electroplating sewage generate precipitation;
S8: the electroplating sewage after neutralization and precipitation is discharged from the upper part of the precipitation mechanism (5) to finish the filtration of the electroplating sewage.
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| CN201910947658.6A CN110540334A (en) | 2019-10-08 | 2019-10-08 | Electroplating sewage treatment equipment and process thereof |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201910947658.6A CN110540334A (en) | 2019-10-08 | 2019-10-08 | Electroplating sewage treatment equipment and process thereof |
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| CN110540334A true CN110540334A (en) | 2019-12-06 |
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Application publication date: 20191206 |