CN110539070A - 激光加工方法及激光加工装置 - Google Patents
激光加工方法及激光加工装置 Download PDFInfo
- Publication number
- CN110539070A CN110539070A CN201910972904.3A CN201910972904A CN110539070A CN 110539070 A CN110539070 A CN 110539070A CN 201910972904 A CN201910972904 A CN 201910972904A CN 110539070 A CN110539070 A CN 110539070A
- Authority
- CN
- China
- Prior art keywords
- laser
- processing
- processing method
- laser processing
- beams
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/067—Dividing the beam into multiple beams, e.g. multifocusing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/362—Laser etching
Abstract
Description
Claims (10)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201910972904.3A CN110539070A (zh) | 2019-10-14 | 2019-10-14 | 激光加工方法及激光加工装置 |
PCT/CN2020/120536 WO2021073485A1 (zh) | 2019-10-14 | 2020-10-13 | 激光加工方法及激光加工装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201910972904.3A CN110539070A (zh) | 2019-10-14 | 2019-10-14 | 激光加工方法及激光加工装置 |
Publications (1)
Publication Number | Publication Date |
---|---|
CN110539070A true CN110539070A (zh) | 2019-12-06 |
Family
ID=68715722
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201910972904.3A Pending CN110539070A (zh) | 2019-10-14 | 2019-10-14 | 激光加工方法及激光加工装置 |
Country Status (2)
Country | Link |
---|---|
CN (1) | CN110539070A (zh) |
WO (1) | WO2021073485A1 (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2021073485A1 (zh) * | 2019-10-14 | 2021-04-22 | 颀中科技(苏州)有限公司 | 激光加工方法及激光加工装置 |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2032323A (en) * | 1978-09-20 | 1980-05-08 | Philip Morris Inc | Light energy perforation apparatus and system |
CN1644297A (zh) * | 2003-09-12 | 2005-07-27 | 奥博泰克有限公司 | 多米束显微机械加工系统及方法 |
CN1650678A (zh) * | 2002-04-30 | 2005-08-03 | 西门子公司 | 用于在聚合物基底上产生沟状结构的方法 |
US7638729B2 (en) * | 2004-11-05 | 2009-12-29 | Lg Display Co., Ltd. | Apparatus for cutting substrate and method using the same |
CN201702512U (zh) * | 2010-06-28 | 2011-01-12 | 苏州市博海激光科技有限公司 | 薄型材料激光在线打孔装置 |
CN103286441A (zh) * | 2012-02-29 | 2013-09-11 | 三星钻石工业股份有限公司 | 激光加工装置 |
CN207534187U (zh) * | 2017-10-24 | 2018-06-26 | 袁卉 | 激光打孔装置 |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110539070A (zh) * | 2019-10-14 | 2019-12-06 | 颀中科技(苏州)有限公司 | 激光加工方法及激光加工装置 |
-
2019
- 2019-10-14 CN CN201910972904.3A patent/CN110539070A/zh active Pending
-
2020
- 2020-10-13 WO PCT/CN2020/120536 patent/WO2021073485A1/zh active Application Filing
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2032323A (en) * | 1978-09-20 | 1980-05-08 | Philip Morris Inc | Light energy perforation apparatus and system |
CN1650678A (zh) * | 2002-04-30 | 2005-08-03 | 西门子公司 | 用于在聚合物基底上产生沟状结构的方法 |
CN1644297A (zh) * | 2003-09-12 | 2005-07-27 | 奥博泰克有限公司 | 多米束显微机械加工系统及方法 |
US7638729B2 (en) * | 2004-11-05 | 2009-12-29 | Lg Display Co., Ltd. | Apparatus for cutting substrate and method using the same |
CN201702512U (zh) * | 2010-06-28 | 2011-01-12 | 苏州市博海激光科技有限公司 | 薄型材料激光在线打孔装置 |
CN103286441A (zh) * | 2012-02-29 | 2013-09-11 | 三星钻石工业股份有限公司 | 激光加工装置 |
CN207534187U (zh) * | 2017-10-24 | 2018-06-26 | 袁卉 | 激光打孔装置 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2021073485A1 (zh) * | 2019-10-14 | 2021-04-22 | 颀中科技(苏州)有限公司 | 激光加工方法及激光加工装置 |
Also Published As
Publication number | Publication date |
---|---|
WO2021073485A1 (zh) | 2021-04-22 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US11090766B2 (en) | Laser processing apparatus | |
TWI543833B (zh) | 將半導體基板輻射開槽之方法 | |
CN106363823A (zh) | 晶片的薄化方法 | |
KR20030064808A (ko) | 반도체 재료의 레이저 기계 가공 | |
US20160121426A1 (en) | Laser fiber array for singulating semiconductor wafers | |
TWI576191B (zh) | 分割薄半導體襯底的方法 | |
CN212569305U (zh) | 一种激光光束整形装置 | |
US20190067049A1 (en) | Radiative wafer cutting using selective focusing depths | |
CN109676269A (zh) | 一种led晶圆片的激光预分割方法及装置 | |
KR20170096812A (ko) | 다기능 레이저 가공장치 및 이를 이용한 레이저 가공방법 | |
US20100044590A1 (en) | Laser processing method | |
CN110539070A (zh) | 激光加工方法及激光加工装置 | |
CN108500477A (zh) | Led晶圆片的切割方法及切割装置 | |
CN111230288A (zh) | 激光加工装置以及被加工物的加工方法 | |
KR20130006045A (ko) | 레이저 가공장치 및 가공 방법 | |
CN212687898U (zh) | 一种玻璃基板侧面加工装置 | |
KR100887245B1 (ko) | 레이저 빔 분할을 이용한 레이저 가공 장치 및 방법 | |
EP3085487B1 (en) | Brittle object cutting apparatus and cutting method thereof | |
CN113800758A (zh) | 一种玻璃模组的激光切割方法及激光切割装置 | |
US20160311060A1 (en) | Brittle object cutting apparatus and cutting method thereof | |
KR100987699B1 (ko) | 레이저 빔의 온/오프 제어가 가능한 레이저 가공 장치 | |
US11420894B2 (en) | Brittle object cutting apparatus and cutting method thereof | |
KR102654348B1 (ko) | 홈 형성 장치 및 홈 형성 방법 | |
KR20100023930A (ko) | 레이저 빔 분할을 이용한 레이저 가공 장치 및 방법 | |
KR101828242B1 (ko) | 선형 레이저 가공 장치 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
CB02 | Change of applicant information |
Address after: No. 166 Fengli Street, Suzhou Industrial Park, Jiangsu Province Applicant after: CHIPMORE TECHNOLOGY Corp.,Ltd. Applicant after: Xi'an yisiwei Material Technology Co.,Ltd. Address before: No. 166 Fengli Street, Suzhou Industrial Park, Jiangsu Province Applicant before: CHIPMORE TECHNOLOGY Corp.,Ltd. Applicant before: Beijing yisiwei Technology Co.,Ltd. |
|
CB02 | Change of applicant information | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20210617 Address after: 215000 No.166, Fengli street, Suzhou Industrial Park, Jiangsu Province Applicant after: CHIPMORE TECHNOLOGY Corp.,Ltd. Applicant after: Hefei Qizhong Sealing Technology Co.,Ltd. Address before: 215000 No.166, Fengli street, Suzhou Industrial Park, Jiangsu Province Applicant before: CHIPMORE TECHNOLOGY Corp.,Ltd. Applicant before: Xi'an yisiwei Material Technology Co.,Ltd. |
|
TA01 | Transfer of patent application right | ||
CB02 | Change of applicant information |
Address after: 215000 No.166, Fengli street, Suzhou Industrial Park, Jiangsu Province Applicant after: CHIPMORE TECHNOLOGY Corp.,Ltd. Applicant after: Hefei Qizhong Technology Co.,Ltd. Address before: 215000 No.166, Fengli street, Suzhou Industrial Park, Jiangsu Province Applicant before: CHIPMORE TECHNOLOGY Corp.,Ltd. Applicant before: Hefei Qizhong Sealing Technology Co.,Ltd. |
|
CB02 | Change of applicant information | ||
RJ01 | Rejection of invention patent application after publication |
Application publication date: 20191206 |
|
RJ01 | Rejection of invention patent application after publication |