CN110536537B - Three-dimensional electromagnetic energy gap circuit - Google Patents
Three-dimensional electromagnetic energy gap circuit Download PDFInfo
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- CN110536537B CN110536537B CN201810509925.7A CN201810509925A CN110536537B CN 110536537 B CN110536537 B CN 110536537B CN 201810509925 A CN201810509925 A CN 201810509925A CN 110536537 B CN110536537 B CN 110536537B
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0236—Electromagnetic band-gap structures
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Abstract
The invention provides a three-dimensional electromagnetic energy gap circuit, comprising: a dielectric layer having a first surface and an opposing second surface; a helical element located on the first surface; a first encircling element on the first surface and encircling around, but not contacting, the helical element; a planar element located on the second surface and including a notch; the second surrounding element is positioned on the second surface and surrounds the periphery of the planar element without contacting the planar element, wherein the second surrounding element further comprises a protruding part extending towards the notch; a first via penetrating the dielectric layer, the spiral element and the protrusion; a second via penetrating the dielectric layer, the planar element, and the first surrounding element; and a third via penetrating the dielectric layer, the planar element, and the first surrounding element.
Description
Technical Field
The present invention relates to an electromagnetic bandgap (electromagnetic bandgap) structure, and more particularly, to a three-dimensional electromagnetic bandgap circuit (3D electromagnetic bandgap circuit).
Background
The electromagnetic energy gap structure can be used to suppress the transmission of electromagnetic wave noise, but the conventional electromagnetic energy gap structure is mostly a planar structure and needs to occupy more circuit area.
When the circuit space inside the electronic device is not sufficient, it is difficult to provide a sufficient number of electromagnetic gap structure units, which reduces the ability to suppress the propagation of electromagnetic wave noise.
Disclosure of Invention
In view of this, how to effectively reduce the circuit area occupied by the electromagnetic energy gap structure is a problem to be solved.
The present specification provides an embodiment of a three-dimensional electromagnetic bandgap circuit, comprising: a dielectric layer having a first surface and an opposite second surface; a spiral element located on the first surface, wherein a head of the spiral element is located inside the spiral element and a tail of the spiral element is located outside the spiral element; a first surrounding element located on the first surface and surrounding the spiral element without contacting the spiral element; a first gap between the spiral element and the first surrounding element; a planar element located on the second surface and including a notch; a second surrounding element located on the second surface and surrounding the planar element without contacting the planar element, wherein the second surrounding element further comprises a protrusion extending toward the gap; a second gap between the planar element and the second surrounding element; a first via penetrating the dielectric layer, the head and the protrusion; a second via passing through the dielectric layer, the planar device, and the first surrounding device; and a third via penetrating the dielectric layer, the planar element, and the first surrounding element.
One of the advantages of the above-mentioned embodiment is that the three-dimensional electromagnetic bandgap circuit is implemented by using a three-dimensional structural design, which can effectively reduce the circuit area occupied by the three-dimensional electromagnetic bandgap circuit.
Another advantage of the above embodiments is that a single three-dimensional electromagnetic bandgap circuit can suppress electromagnetic noise in two frequency bands simultaneously.
Another advantage of the above embodiments is that the three-dimensional electromagnetic bandgap circuit can provide a good electromagnetic noise suppression effect without periodic arrangement, and can greatly improve the flexibility of the overall circuit design.
Another advantage of the above embodiment is that it can be applied to a circuit board with a double-layer structure.
Other advantages of the present invention will be explained in more detail with reference to the following description and accompanying drawings.
Drawings
Fig. 1 is a simplified structural diagram of a three-dimensional electromagnetic bandgap circuit according to an embodiment of the present invention.
Fig. 2 is an exploded schematic diagram of the three-dimensional electromagnetic bandgap circuit of fig. 1.
Fig. 3 is a simplified schematic diagram of a first embodiment of a first layer structure of a three-dimensional electromagnetic bandgap circuit.
Fig. 4 is a simplified schematic diagram of a first embodiment of a second layer structure of a three-dimensional electromagnetic bandgap circuit.
Fig. 5 is a simplified schematic diagram of a second embodiment of a second layer structure of a three-dimensional electromagnetic bandgap circuit.
Fig. 6 is a simplified schematic diagram of a second embodiment of a first layer structure of a three-dimensional electromagnetic bandgap circuit.
Fig. 7 is a simplified schematic diagram of a third embodiment of a second layer structure of a three-dimensional electromagnetic bandgap circuit.
Fig. 8 is a simplified schematic diagram of a third embodiment of a first layer structure of a three-dimensional electromagnetic bandgap circuit.
Description of the symbols
100 three-dimensional electromagnetic band gap circuit (3D electromagnetic band circuit)
110 dielectric layer (dielectric layer)
112 first surface (first surface)
114 second surface (second surface)
120 first layer structure (first layer structure)
121 helical element (helical element)
123 first surround element (first surround element)
125 first gap (first gap)
130 second layer structure (second layer structure)
131 plane element (plane element)
133 second surrounding element (second surrounding element)
135 second gap (second gap)
141 first via hole (first via hole)
143 second via (second via)
145 third via hole (third via hole)
322 head (head port)
324 tail (rear port)
Gap 410 (notch)
430 projection (projection port)
747 fourth via hole (four via)
749 fifth via hole (fifth via)
A1 first axis (first axis)
A2 second axis (second axis)
W1-W9 average width (average width)
Detailed Description
Embodiments of the present invention will be described below with reference to the accompanying drawings. In the drawings, like numbering represents the same or similar elements.
Please refer to fig. 1 to fig. 4. Fig. 1 is a simplified structural diagram of a three-dimensional electromagnetic bandgap circuit 100 according to an embodiment of the present invention. Fig. 2 is an exploded schematic diagram of the three-dimensional electromagnetic bandgap circuit 100. Fig. 3 is a simplified schematic diagram of a first embodiment of a first layer structure 120 of a three-dimensional electromagnetic bandgap circuit. Fig. 4 is a simplified schematic diagram of a first embodiment of a second layer structure 130 of a three-dimensional electromagnetic bandgap circuit.
The three-dimensional electromagnetic bandgap circuit 100 can be disposed in a circuit board having a double-layer board structure to suppress the propagation of electromagnetic wave noise. As shown, the three-dimensional electromagnetic bandgap circuit 100 includes a dielectric layer 110, a first layer structure 120, a second layer structure 130, a first via 141, a second via 143, and a third via 145.
The dielectric layer 110 has a first surface 112 and an opposite second surface 114. The first layer structure 120 is located on the first surface 112 of the dielectric layer 110, and includes a spiral element 121, a first surrounding element 123, and a first gap 125. The second layer structure 130 is located on the second surface 114 of the dielectric layer 110 and includes a planar element 131, a second surrounding element 133, and a second gap 135.
As shown in fig. 1-3, one end of helical element 121 in first layer 120 is located inside helical element 121, hereinafter referred to as head 322, and the other end of helical element 121 is located outside helical element 121, hereinafter referred to as tail 324. First surrounding element 123 surrounds helix element 121, but does not contact helix element 121. The first gap 125 is located between the spiral element 121 and the first surrounding element 123 as an isolation structure therebetween.
In the three-dimensional electromagnetic bandgap circuit 100, the width of the inner portion of the spiral element 121 is intentionally designed to be larger than the width of the outer portion of the spiral element 121. The foregoing embodiments are designed to allow the three-dimensional electromagnetic bandgap circuit 100 to simultaneously suppress electromagnetic wave noise in two frequency bands.
For example, as shown in FIG. 3, the width of head portion 322 of helical element 121 is significantly greater than the width of tail portion 324 of helical element 121. In fig. 3, W1-W6 are used to represent the average width of several coil segments closer to the inner portion of helix element 121 (i.e., closer to head 322), and W7-W9 are used to represent the average width of several coil segments closer to the outer portion of helix element 121 (i.e., closer to tail 324).
In practice, the widths W1 to W6 may be all the same or may be slightly different. Similarly, the widths W7 to W9 may be all designed to be the same or may be slightly different.
As can be seen in fig. 3, the average widths W1-W6 of the coil segments closer to the inner portion of helical element 121 are substantially greater than the average widths W7-W9 of the coil segments closer to the outer portion of helical element 121.
As shown in fig. 4, the planar element 131 in the second layer 130 includes a gap 410. Second surrounding element 133 surrounds planar element 131 but does not contact planar element 131. In addition, the second surrounding element 133 further includes a protrusion 430 extending toward the notch 410. The second gap 135 is located between the planar element 131 and the second surrounding element 133 as an isolation structure therebetween.
As shown in fig. 1 to 4, the first via 141 penetrates the dielectric layer 110, the head 322 of the spiral element 121, and the protrusion 430 of the planar element 131 to electrically connect the head 322 and the protrusion 430. The second via 143 penetrates through the dielectric layer 110, the planar element 131, and the first surrounding element 123 for electrically connecting the planar element 131 and the first surrounding element 123. The third via 145 penetrates through the dielectric layer 110, the planar element 131, and the first surrounding element 123 to electrically connect the planar element 131 and the first surrounding element 123.
In practice, the position of the first via 141 may be (but is not limited to) set at the midpoint of the first layer structure 120. For example, as shown in fig. 3, the first via 141 in the present embodiment is located in the central region of the first layer structure 120, but is not located at the midpoint of the first layer structure 120.
As shown in FIG. 4, notch 410 of planar element 131 extends from the edge of planar element 131 toward the inner portion of planar element 131 substantially along a first axis A1. Viewed from another perspective, the protrusion 430 of the second surrounding element 133 also extends from the inner edge of the second surrounding element 133 toward the notch 410 substantially along the first axis a 1.
In the present embodiment, the second guide hole 143 and the third guide hole 145 are respectively located at two sides of the first axis a1 and respectively close to two ends of one diagonal line of the planar element 131.
In practice, the dielectric layer 110 may be made of various insulating materials. The spiral element 121, the first surrounding element 123, the planar element 131, and the second surrounding element 133 can be made of suitable conductive materials.
In addition, the first gap 125 and the second gap 135 may be implemented by a void structure (void structure) or a solid spacer structure made of an insulating material.
When the three-dimensional electromagnetic bandgap circuit 100 is disposed on a circuit board, the spiral element 121 or the second surrounding element 133 can be used for coupling a ground voltage, and the first surrounding element 123 or the planar element 131 can be used for coupling a power voltage.
After the first layer structure 120 and the second layer structure 130 are coupled to each other through the vias 141-145, a flip-type electromagnetic energy gap resonance structure can be formed, so that the three-dimensional electromagnetic energy gap circuit 100 can be used to suppress electromagnetic wave noise in two frequency bands.
For example, if the three-dimensional electromagnetic bandgap circuit 100 is to simultaneously suppress electromagnetic noise in two frequency bands of 2.45GHz and 5.3GHz, the length of the first surrounding element 123 is set to be 3.75-5.5 millimeters (mm), the width thereof is set to be 4.5-6.5 mm, and the length of the second surrounding element 133 is set to be 4.5-6.5 mm, and the width thereof is set to be 4.5-6.5 mm.
As can be seen from the foregoing description, the three-dimensional electromagnetic bandgap circuit 100 is implemented by a three-dimensional multi-layer structure, so that the occupied circuit area can be effectively reduced.
In addition, the single three-dimensional electromagnetic bandgap circuit 100 can simultaneously suppress electromagnetic noise in two frequency bands, and is suitable for being installed in an electronic device that needs to transmit and receive signals in two different frequency bands.
The three-dimensional electromagnetic energy gap circuit 100 adopts a turnover structure, so that the three-dimensional electromagnetic energy gap circuit can be applied to a circuit board with a double-layer structure without increasing the layer number of the circuit board.
Furthermore, the three-dimensional electromagnetic bandgap circuit 100 can provide a good electromagnetic noise suppression effect without periodic arrangement, and can greatly improve the flexibility of the overall circuit design. For example, a plurality of three-dimensional electromagnetic bandgap circuits 100 may be disposed near a noise source in an electronic device, thereby greatly improving the ability of the electronic device to suppress electromagnetic noise propagation.
Note that the number of coil segments of the helical element 121 near the inner portion and the number of coil segments of the helical element 121 near the outer portion are not limited to the embodiment of fig. 3. In practice, the number of coil segments in the inner portion of the spiral element 121 and the number of coil segments in the outer portion of the spiral element 121 may be flexibly adjusted according to the frequency band for suppressing the electromagnetic wave noise.
In addition, the positions and the number of the vias in the three-dimensional electromagnetic bandgap circuit 100 are not limited to the embodiments of fig. 1 to 4.
For example, in the embodiment of fig. 5 and 6, the second guiding hole 143 and the third guiding hole 145 are respectively disposed on the left and right sides of the planar element 131, and both are located on a second axis a2 perpendicular to the first axis a 1.
For another example, in the embodiment of fig. 7 and 8, the three-dimensional electromagnetic bandgap circuit 100 further includes a fourth via 747 and a fifth via 749 in addition to the first via 141, the second via 143 and the third via 145.
As shown in fig. 7 and 8, the fourth via 747 and the fifth via 749 penetrate through the dielectric layer 110, the planar element 131 and the first surrounding element 123.
In the embodiment of fig. 7 and 8, the second guiding hole 143 and the third guiding hole 145 are respectively located at two sides of the first axis a1 and respectively close to two ends of one diagonal line of the planar element 131, and the fourth guiding hole 747 and the fifth guiding hole 749 are also respectively located at two sides of the first axis a1 but respectively close to two ends of the other diagonal line of the planar element 131. In other words, the fourth guide hole 747 and the second guide hole 143 are located on one side of the first axis A1, and the fifth guide hole 749 and the third guide hole 145 are located on the other side of the first axis A1.
It should be noted that the plurality of coil segments of the helical element 121 may be designed to have a relatively smooth serpentine shape, and is not limited to the embodiments in the foregoing embodiments.
In addition, the shapes and sizes of the first surrounding element 123 and the second surrounding element 133 are not limited to be the same as each other.
For example, the first surrounding element 123 and the second surrounding element 133 may be designed to have square shapes but different side lengths.
For another example, the first surrounding element 123 and the second surrounding element 133 can be designed to have different lengths and/or different widths.
Certain terms are used throughout the description and claims to refer to particular elements, and those skilled in the art may refer to like elements by different names. The present specification and claims do not intend to distinguish between components that differ in name but not function. In the description and claims, the terms "include" and "comprise" are used in an open-ended fashion, and thus should be interpreted to mean "include, but not limited to. Also, the term "coupled" is intended to include any direct or indirect connection. Therefore, if a first element is coupled to a second element, the first element can be directly connected to the second element through an electrical connection or a signal connection such as wireless transmission or optical transmission, or indirectly connected to the second element through another element or a connection means.
The description of "and/or" as used in this specification is inclusive of any combination of one or more of the items listed. In addition, any reference to singular is intended to include the plural unless the specification specifically states otherwise.
The term "element" as referred to in the specification and claims includes a concept of a component, a layer, or a region.
The dimensions and relative sizes of some of the elements in the figures may be exaggerated or the shape of some of the elements simplified to more clearly illustrate the content of the embodiments. Accordingly, unless otherwise indicated by the applicant, the shapes, sizes, relative positions and the like of the elements in the drawings are merely for convenience of description, and should not be used to limit the claims of the present invention. Furthermore, the present invention may be embodied in many different forms and should not be construed as limited to the embodiment set forth herein.
In the specification and claims, if a first element is described as being on, over, connected, joined, coupled, or connected to a second element, it is intended that the first element can be directly on, connected, joined, coupled, or coupled to the second element, or that there are other elements between the first and second elements. In contrast, if a first element is described as being directly on, directly connected to, directly engaged with, directly coupled to, or directly connected to a second element, that means that there are no other elements present between the first and second elements.
The above are only preferred embodiments of the present invention, and all equivalent changes and modifications made by the claims of the present invention should be covered by the present invention.
Claims (7)
1. A three-dimensional electromagnetic bandgap circuit, comprising:
a dielectric layer having a first surface and an opposite second surface;
a spiral element located on the first surface, wherein a head of the spiral element is located inside the spiral element and a tail of the spiral element is located outside the spiral element;
a first surrounding element located on the first surface and surrounding the spiral element without contacting the spiral element;
a first gap between the spiral element and the first surrounding element;
a planar element located on the second surface and including a notch;
a second surrounding element located on the second surface and surrounding the planar element without contacting the planar element, wherein the second surrounding element further comprises a protrusion extending toward the gap;
a second gap between the planar element and the second surrounding element;
a first via penetrating the dielectric layer, the head and the protrusion;
a second via passing through the dielectric layer, the planar device, and the first surrounding device; and
a third via passing through the dielectric layer, the planar device, and the first surrounding device;
wherein the width of the inner portion of the helical element is greater than the width of the outer portion of the helical element.
2. The three-dimensional electromagnetic bandgap circuit of claim 1, wherein the gap extends from the edge of the planar element towards the inner side of the planar element substantially along a first axis, and the second via and the third via are respectively located at two sides of the first axis.
3. The stereoscopic electromagnetic bandgap circuit of claim 2, further comprising:
a fourth via passing through the dielectric layer, the planar device, and the first surrounding device;
a fifth via passing through the dielectric layer, the planar device, and the first surrounding device;
the fourth guide hole and the second guide hole are positioned on one side of the first axis, and the fifth guide hole and the third guide hole are positioned on the other side of the first axis.
4. The three-dimensional electromagnetic bandgap circuit of claim 1, wherein the protrusion extends from an inner side of the second surrounding element towards the gap substantially along a first axis, and the second via and the third via are respectively located at two sides of the first axis.
5. The stereoscopic electromagnetic bandgap circuit of claim 4, further comprising:
a fourth via passing through the dielectric layer, the planar device, and the first surrounding device; and
a fifth via passing through the dielectric layer, the planar device, and the first surrounding device;
the fourth guide hole and the second guide hole are positioned on one side of the first axis, and the fifth guide hole and the third guide hole are positioned on the other side of the first axis.
6. The three dimensional electromagnetic bandgap circuit of claim 1, wherein the width of the head portion is greater than the width of the tail portion.
7. The three-dimensional electromagnetic band gap circuit according to any one of claims 1 to 6, wherein the spiral element or the second surrounding element is coupled to a ground voltage, and the first surrounding element or the planar element is coupled to a power voltage.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201810509925.7A CN110536537B (en) | 2018-05-24 | 2018-05-24 | Three-dimensional electromagnetic energy gap circuit |
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| CN201810509925.7A CN110536537B (en) | 2018-05-24 | 2018-05-24 | Three-dimensional electromagnetic energy gap circuit |
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| CN110536537A CN110536537A (en) | 2019-12-03 |
| CN110536537B true CN110536537B (en) | 2021-04-23 |
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| CN113015313A (en) * | 2019-12-18 | 2021-06-22 | 瑞昱半导体股份有限公司 | Electromagnetic energy gap structure device |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20100041252A (en) * | 2008-10-13 | 2010-04-22 | 삼성전기주식회사 | Electro-magnetic bandgap structure |
| CN101714681A (en) * | 2008-10-08 | 2010-05-26 | 三星电机株式会社 | Electro-magnetic bandgap structure |
| CN102065632A (en) * | 2009-11-18 | 2011-05-18 | 三星电机株式会社 | Electromagnetic bandgap structure and printed circuit board comprising the same |
| CN102510658A (en) * | 2011-09-26 | 2012-06-20 | 北京邮电大学 | Implementation method of H-type groove fractal UC-EBG (Uniplanar Compact Electromagnetic Band Gap) structure oriented to multifrequency antenna substrate |
| JP2016082072A (en) * | 2014-10-16 | 2016-05-16 | 富士通株式会社 | Choke coil, bias t circuit and communication device |
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2018
- 2018-05-24 CN CN201810509925.7A patent/CN110536537B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101714681A (en) * | 2008-10-08 | 2010-05-26 | 三星电机株式会社 | Electro-magnetic bandgap structure |
| KR20100041252A (en) * | 2008-10-13 | 2010-04-22 | 삼성전기주식회사 | Electro-magnetic bandgap structure |
| CN102065632A (en) * | 2009-11-18 | 2011-05-18 | 三星电机株式会社 | Electromagnetic bandgap structure and printed circuit board comprising the same |
| CN102510658A (en) * | 2011-09-26 | 2012-06-20 | 北京邮电大学 | Implementation method of H-type groove fractal UC-EBG (Uniplanar Compact Electromagnetic Band Gap) structure oriented to multifrequency antenna substrate |
| JP2016082072A (en) * | 2014-10-16 | 2016-05-16 | 富士通株式会社 | Choke coil, bias t circuit and communication device |
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