CN110534617A - 小片电池的制备方法 - Google Patents
小片电池的制备方法 Download PDFInfo
- Publication number
- CN110534617A CN110534617A CN201910807889.7A CN201910807889A CN110534617A CN 110534617 A CN110534617 A CN 110534617A CN 201910807889 A CN201910807889 A CN 201910807889A CN 110534617 A CN110534617 A CN 110534617A
- Authority
- CN
- China
- Prior art keywords
- battery
- small pieces
- silicon wafer
- skin material
- preparation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000002360 preparation method Methods 0.000 title claims abstract description 23
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims abstract description 81
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 81
- 239000010703 silicon Substances 0.000 claims abstract description 81
- 239000000463 material Substances 0.000 claims abstract description 46
- 235000008216 herbs Nutrition 0.000 claims description 19
- 210000002268 wool Anatomy 0.000 claims description 19
- 238000005245 sintering Methods 0.000 claims description 18
- 238000009792 diffusion process Methods 0.000 claims description 16
- 239000004484 Briquette Substances 0.000 claims description 15
- 238000002347 injection Methods 0.000 claims description 12
- 239000007924 injection Substances 0.000 claims description 12
- 238000002161 passivation Methods 0.000 claims description 12
- 239000011248 coating agent Substances 0.000 claims description 11
- 238000000576 coating method Methods 0.000 claims description 11
- 238000005086 pumping Methods 0.000 claims description 10
- 101001073212 Arabidopsis thaliana Peroxidase 33 Proteins 0.000 claims description 7
- 101001123325 Homo sapiens Peroxisome proliferator-activated receptor gamma coactivator 1-beta Proteins 0.000 claims description 7
- 102100028961 Peroxisome proliferator-activated receptor gamma coactivator 1-beta Human genes 0.000 claims description 7
- 229910003460 diamond Inorganic materials 0.000 claims description 6
- 239000010432 diamond Substances 0.000 claims description 6
- 238000005520 cutting process Methods 0.000 claims description 5
- 230000005611 electricity Effects 0.000 claims description 4
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims description 3
- 230000007797 corrosion Effects 0.000 claims description 3
- 238000005260 corrosion Methods 0.000 claims description 3
- 239000003292 glue Substances 0.000 claims description 3
- 229910052698 phosphorus Inorganic materials 0.000 claims description 3
- 239000011574 phosphorus Substances 0.000 claims description 3
- 229920002120 photoresistant polymer Polymers 0.000 claims description 3
- 230000001681 protective effect Effects 0.000 claims description 3
- 239000002002 slurry Substances 0.000 claims description 3
- 238000005507 spraying Methods 0.000 claims description 3
- 238000005530 etching Methods 0.000 claims description 2
- 238000007639 printing Methods 0.000 claims description 2
- 238000000137 annealing Methods 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 abstract description 8
- 238000005516 engineering process Methods 0.000 abstract description 3
- 230000002411 adverse Effects 0.000 abstract description 2
- 230000000694 effects Effects 0.000 abstract description 2
- 230000011218 segmentation Effects 0.000 abstract description 2
- 239000002699 waste material Substances 0.000 abstract description 2
- 238000002844 melting Methods 0.000 abstract 1
- 230000008018 melting Effects 0.000 abstract 1
- 239000013078 crystal Substances 0.000 description 4
- 230000007547 defect Effects 0.000 description 3
- 239000000155 melt Substances 0.000 description 3
- 238000000151 deposition Methods 0.000 description 2
- 230000008021 deposition Effects 0.000 description 2
- 230000003628 erosive effect Effects 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 2
- 230000006798 recombination Effects 0.000 description 2
- 238000005266 casting Methods 0.000 description 1
- 239000012634 fragment Substances 0.000 description 1
- 238000000623 plasma-assisted chemical vapour deposition Methods 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 238000005215 recombination Methods 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02002—Preparing wafers
- H01L21/02005—Preparing bulk and homogeneous wafers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
- H01L31/1804—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof comprising only elements of Group IV of the Periodic Table
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
- H01L31/1876—Particular processes or apparatus for batch treatment of the devices
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Electromagnetism (AREA)
- Battery Electrode And Active Subsutance (AREA)
Abstract
本发明公开了一种小片电池的制备方法,将硅棒边皮料切割成小片硅片,再通过匹配的电池生产线完成电池片的生产,可直接得到半片、叠瓦、拼片等组件技术所需要的小片电池。与现有边皮料熔融回炉的方式相比,本发明能更有效地利用边皮料,减少能源浪费,大大节省硅片的制造成本。本发明直接将硅棒边皮料切割成小片硅片,可在电池片的制备过程中去除小片硅片边缘的损伤层,进而消除边缘损伤层的不良影响,避免分割成品电池片而造成小片电池的功率损失。
Description
技术领域
本发明涉及小片电池的制备方法。
背景技术
单晶硅片由单晶硅棒切割而成,一般先将单晶硅棒进行切方,得到用于制备单晶硅片的方棒,再将方棒切片制得单晶硅片。单晶硅棒切方会产生边皮料,而边皮料一般都是回炉或用作高效多晶铸锭籽晶等使用,造成单晶硅棒的利用率较低。
另外,现有的半片、叠瓦、拼片等组件技术都采用小片电池,而现有的小片电池都由成品电池片(方片或准方片)切割而成,需额外增加划片和裂片的设备/步骤,增加了生产成本。
且对成品电池片进行划片和裂片,裂片完成后,小片电池边缘(即整片的断裂处)会产生损伤层,损伤层存在非常高的表面缺陷,表面缺陷会成为载流子复合中心,从而导致小片电池边缘区域少子寿命降低、表面复合电流明显增加,进而导致小片电池的开路电压和短路电流的损失,即导致小片电池的功率损失。
发明内容
为了解决现有技术中的缺陷,本发明提供一种小片电池的制备方法,先将边皮料切割成条状硅片,再将条状硅片制成小片电池;
所述边皮料为单晶硅棒切方产生的边皮料;边皮料分别包括:切方所形成的长方形切割面,以及与切割面相背的弧面;以切割面为基准面;以切割面和弧面的结合部为尖角部;
所述将硅棒边皮料切割成条状硅片,包括如下步骤:
将边皮料截断,得到边皮料小段,且边皮料小段上基准面的长度与条状硅片的预定长度一致;
将边皮料小段两侧的尖角部切除,并将边皮料小段上与基准面相背的弧形凸出部切除,得到用于制备条状硅片的硅块,且硅块上基准面的长宽尺寸与条状硅片的预定长宽尺寸一致;
沿与硅块上基准面相平行的方向对硅块进行切片,得到条状硅片。
优选的,所述条状硅片的四个角为直角或圆角。
优选的,所述条状硅片的宽度为10~160mm。
优选的,所述条状硅片的长度为10~320mm。
优选的,所述条状硅片的厚度为50~240um。
优选的,使用带锯截断机或金刚线截断机将边皮料截断。
优选的,使用金刚线切片机对硅块进行切片。
优选的,所述将条状硅片制成小片电池,包括依次进行的如下步骤:制绒,扩散,刻蚀,镀膜,丝印,烧结。
优选的,所述小片电池为SE电池、BSF电池、PERC电池、SE-PERC电池、PERL电池、PERT电池、TOPCon电池、IBC电池、MWT电池或HIT电池。
优选的,所述将条状硅片制成小片电池,包括依次进行的如下步骤:制绒,扩散,刻蚀,镀膜,丝印,烧结。
优选的,所述小片电池为SE电池;所述将条状硅片制成小片电池,包括依次进行的如下步骤:制绒,扩散,激光掺杂,背面抛光和去PSG,镀膜(正面、背面膜层沉积),丝印,烧结。
优选的,所述小片电池为PERC电池;所述将条状硅片制成小片电池,包括依次进行的如下步骤:制绒,扩散,背面抛光和去PSG,退火,正背面镀膜,激光开孔,丝印,烧结,电注入或光注入钝化。
优选的,所述小片电池为SE-PERC电池;所述将条状硅片制成小片电池,包括依次进行的如下步骤:制绒,扩散,激光掺杂,背面抛光和去PSG,退火,正背面镀膜,激光开孔,丝印,烧结,电注入或光注入钝化。
优选的,所述小片电池为SE-PERC电池;所述将条状硅片制成小片电池,包括依次进行的如下步骤:制绒,局部印刷或喷涂磷浆,扩散,背面抛光和去PSG,退火,正背面镀膜,激光开孔,丝印,烧结,电注入或光注入钝化。
优选的,所述小片电池为SE-PERC电池;所述将条状硅片制成小片电池,包括依次进行的如下步骤:制绒,扩散,背面抛光,局部印刷保护胶,正面PN结腐蚀,去胶,退火,正背面镀膜,激光开孔,丝印,烧结,电注入或光注入钝化。
本发明将硅棒边皮料切割成小片硅片,再通过匹配的电池生产线完成电池片的生产,可直接得到半片、叠瓦、拼片等组件技术所需要的小片电池。
本发明将边皮料切割成可制备小片电池的小片硅片,与现有边皮料熔融回炉的方式相比,本发明能更有效地利用边皮料,减少能源浪费(避免边皮料重新回炉而带来的二次消耗),大大节省硅片的制造成本。尤其在硅片尺寸要求越来越大、形状趋于方形的背景下,边皮料的占比增加,提升硅片产出率变得更有意义。
本发明直接将硅棒边皮料切割成小片硅片,可在电池片的制备过程中去除小片硅片边缘的损伤层,进而消除边缘损伤层的不良影响,避免分割成品电池片(即整片)而造成分片(即小片电池)的功率损失,以本发明的小片电池来制备组件,可提高太阳能组件的功率。
本发明的小片硅片为条状硅片,使用条状硅片,可减少大片(方片或准方片)在电池制备工艺中的电性能不均匀性问题,提高后期组件的综合电性能。
本发明的小片硅片可以是直角硅片,做成小片电池后,可以减少原有单晶倒角在组件方面的功率损失,增加组件发电面积。
具体实施方式
下面结合实施例,对本发明的具体实施方式作进一步描述。以下实施例仅用于更加清楚地说明本发明的技术方案,而不能以此来限制本发明的保护范围。
一种小片电池的制备方法,先将边皮料切割成条状硅片,再将条状硅片制成小片电池;
所述边皮料为单晶硅棒切方产生的边皮料;边皮料分别包括:切方所形成的长方形切割面,以及与切割面相背的弧面;以切割面为基准面;以切割面和弧面的结合部为尖角部;
所述将硅棒边皮料切割成条状硅片,包括如下步骤:
将边皮料截断,得到边皮料小段,且边皮料小段上基准面的长度与条状硅片的预定长度一致;
将边皮料小段两侧的尖角部切除,并将边皮料小段上与基准面相背的弧形凸出部切除,得到用于制备条状硅片的硅块,且硅块上基准面的长宽尺寸与条状硅片的预定长宽尺寸一致;
沿与硅块上基准面相平行的方向对硅块进行切片,得到条状硅片;条状硅片的四个角为直角(如有需要,也可以将条状硅片的四个角加工成圆角)。
上述条状硅片的宽度优选为10~160mm(上述条状硅片的宽度可以是常规方片或准方片宽度的二分之一、三分之一、四分之一、五分之一、六分之一、七分之一、八分之一、九分之一、十分之一、十一分之一或十二分之一)。
上述条状硅片的长度优选为10~320mm。
上述条状硅片的厚度优选为50~240um。
可以使用带锯截断机或金刚线截断机将边皮料截断。
可以使用金刚线切片机对硅块进行切片。
可以将上述条状硅片制成SE电池、BSF电池、PERC电池、SE-PERC电池、PERL电池、PERT电池、TOPCon电池、IBC电池、MWT电池或HIT电池。
其中:
SE电池:(Selective Emitter)选择性发射极电池;
BSF电池:(Back Surface Field Solar)背场太阳电池;
PERC电池:(Passivated Emitter and Rear)钝化发射极及背局域接触电池;
PERL电池:(Passivated Emitter and Rear Locally-diffused)钝化发射极背部局域扩散电池;
PERT电池:(Passivated Emitter,Rear Totally-diffused)钝化发射极背表面全扩散电池;
TOPCon电池:(Tunnel Oxide Passivated Contact)隧穿氧化层钝化接触电池;
IBC电池:(Interdigitated Back Contact)交叉背接触电池;
MWT电池:(Metal Wrap Through)金属穿孔卷绕电池;
HIT电池:(Hetero-junction with Intrinsic Thin-layer)异质结太阳能电池。
将条状硅片制成小片电池,可以采用如下依次进行的步骤:制绒,扩散,刻蚀,镀膜(可以采用PECVD技术),丝印,烧结。
如果将条状硅片制成SE电池,可以采用如下依次进行的步骤:制绒,扩散,激光掺杂,背面抛光和去PSG,镀膜(正面、背面膜层沉积),丝印,烧结。
如果将条状硅片制成PERC电池,可以采用如下依次进行的步骤:制绒,扩散,背面抛光和去PSG,退火,正背面镀膜,激光开孔,丝印,烧结,电注入或光注入钝化。
如果将条状硅片制成SE-PERC电池,可以采用如下依次进行的步骤:制绒,扩散,激光掺杂,背面抛光和去PSG,退火,正背面镀膜,激光开孔,丝印,烧结,电注入或光注入钝化。
将条状硅片制成SE-PERC电池,还可以采用如下依次进行的步骤:制绒,局部印刷或喷涂磷浆,扩散,背面抛光和去PSG,退火,正背面镀膜,激光开孔,丝印,烧结,电注入或光注入钝化。
将条状硅片制成SE-PERC电池,还可以采用如下依次进行的步骤:制绒,扩散,背面抛光,局部印刷保护胶,正面PN结腐蚀,去胶,退火,正背面镀膜,激光开孔,丝印,烧结,电注入或光注入钝化。
以上所述仅是本发明的优选实施方式,应当指出,对于本技术领域的普通技术人员来说,在不脱离本发明技术原理的前提下,还可以做出若干改进和润饰,这些改进和润饰也应视为本发明的保护范围。
Claims (14)
1.小片电池的制备方法,其特征在于,先将边皮料切割成条状硅片,再将条状硅片制成小片电池;
所述边皮料为单晶硅棒切方产生的边皮料;边皮料分别包括:切方所形成的长方形切割面,以及与切割面相背的弧面;以切割面为基准面;以切割面和弧面的结合部为尖角部;
所述将硅棒边皮料切割成条状硅片,包括如下步骤:
将边皮料截断,得到边皮料小段,且边皮料小段上基准面的长度与条状硅片的预定长度一致;
将边皮料小段两侧的尖角部切除,并将边皮料小段上与基准面相背的弧形凸出部切除,得到用于制备条状硅片的硅块,且硅块上基准面的长宽尺寸与条状硅片的预定长宽尺寸一致;
沿与硅块上基准面相平行的方向对硅块进行切片,得到条状硅片。
2.根据权利要求1所述的小片电池的制备方法,其特征在于,所述条状硅片的四个角为直角或圆角。
3.根据权利要求1所述的小片电池的制备方法,其特征在于,所述条状硅片的宽度为10~160mm。
4.根据权利要求1所述的小片电池的制备方法,其特征在于,所述条状硅片的长度为10~320mm。
5.根据权利要求1所述的小片电池的制备方法,其特征在于,所述条状硅片的厚度为50~240um。
6.根据权利要求1所述的小片电池的制备方法,其特征在于,使用带锯截断机或金刚线截断机将边皮料截断。
7.根据权利要求1所述的小片电池的制备方法,其特征在于,使用金刚线切片机对硅块进行切片。
8.根据权利要求1所述的小片电池的制备方法,其特征在于,所述小片电池为SE电池、BSF电池、PERC电池、SE-PERC电池、PERL电池、PERT电池、TOPCon电池、IBC电池、MWT电池或HIT电池。
9.根据权利要求1所述的小片电池的制备方法,其特征在于,所述将条状硅片制成小片电池,包括依次进行的如下步骤:制绒,扩散,刻蚀,镀膜,丝印,烧结。
10.根据权利要求1所述的小片电池的制备方法,其特征在于,所述小片电池为SE电池;所述将条状硅片制成小片电池,包括依次进行的如下步骤:制绒,扩散,激光掺杂,背面抛光和去PSG,镀膜,丝印,烧结。
11.根据权利要求1所述的小片电池的制备方法,其特征在于,所述小片电池为PERC电池;所述将条状硅片制成小片电池,包括依次进行的如下步骤:制绒,扩散,背面抛光和去PSG,退火,正背面镀膜,激光开孔,丝印,烧结,电注入或光注入钝化。
12.根据权利要求1所述的小片电池的制备方法,其特征在于,所述小片电池为SE-PERC电池;所述将条状硅片制成小片电池,包括依次进行的如下步骤:制绒,扩散,激光掺杂,背面抛光和去PSG,退火,正背面镀膜,激光开孔,丝印,烧结,电注入或光注入钝化。
13.根据权利要求1所述的小片电池的制备方法,其特征在于,所述小片电池为SE-PERC电池;所述将条状硅片制成小片电池,包括依次进行的如下步骤:制绒,局部印刷或喷涂磷浆,扩散,背面抛光和去PSG,退火,正背面镀膜,激光开孔,丝印,烧结,电注入或光注入钝化。
14.根据权利要求1所述的小片电池的制备方法,其特征在于,所述小片电池为SE-PERC电池;所述将条状硅片制成小片电池,包括依次进行的如下步骤:制绒,扩散,背面抛光,局部印刷保护胶,正面PN结腐蚀,去胶,退火,正背面镀膜,激光开孔,丝印,烧结,电注入或光注入钝化。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201910807889.7A CN110534617A (zh) | 2019-08-29 | 2019-08-29 | 小片电池的制备方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201910807889.7A CN110534617A (zh) | 2019-08-29 | 2019-08-29 | 小片电池的制备方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
CN110534617A true CN110534617A (zh) | 2019-12-03 |
Family
ID=68665053
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201910807889.7A Pending CN110534617A (zh) | 2019-08-29 | 2019-08-29 | 小片电池的制备方法 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN110534617A (zh) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111916533A (zh) * | 2020-08-28 | 2020-11-10 | 苏州联诺太阳能科技有限公司 | 切片电池的制备方法、切片电池及光伏组件 |
CN111952414A (zh) * | 2020-08-21 | 2020-11-17 | 晶科绿能(上海)管理有限公司 | 硅基半导体器件的切割后钝化方法和硅基半导体器件 |
WO2021022960A1 (zh) * | 2019-08-07 | 2021-02-11 | 常州时创能源股份有限公司 | 硅棒边皮料的利用方法 |
WO2021082514A1 (zh) * | 2019-11-01 | 2021-05-06 | 常州时创能源股份有限公司 | 晶硅边皮料的切割方法 |
CN113206009A (zh) * | 2021-04-16 | 2021-08-03 | 安徽华晟新能源科技有限公司 | 切片硅异质结电池及制备方法、太阳能电池组件 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106113297A (zh) * | 2016-06-24 | 2016-11-16 | 晶科能源有限公司 | 一种多晶循环料的处理方法 |
CN109747055A (zh) * | 2019-03-04 | 2019-05-14 | 常州时创能源科技有限公司 | 单晶硅片的制备方法和应用 |
-
2019
- 2019-08-29 CN CN201910807889.7A patent/CN110534617A/zh active Pending
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106113297A (zh) * | 2016-06-24 | 2016-11-16 | 晶科能源有限公司 | 一种多晶循环料的处理方法 |
CN109747055A (zh) * | 2019-03-04 | 2019-05-14 | 常州时创能源科技有限公司 | 单晶硅片的制备方法和应用 |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2021022960A1 (zh) * | 2019-08-07 | 2021-02-11 | 常州时创能源股份有限公司 | 硅棒边皮料的利用方法 |
WO2021082514A1 (zh) * | 2019-11-01 | 2021-05-06 | 常州时创能源股份有限公司 | 晶硅边皮料的切割方法 |
CN111952414A (zh) * | 2020-08-21 | 2020-11-17 | 晶科绿能(上海)管理有限公司 | 硅基半导体器件的切割后钝化方法和硅基半导体器件 |
CN111952414B (zh) * | 2020-08-21 | 2023-02-28 | 晶科绿能(上海)管理有限公司 | 硅基半导体器件的切割后钝化方法和硅基半导体器件 |
CN111916533A (zh) * | 2020-08-28 | 2020-11-10 | 苏州联诺太阳能科技有限公司 | 切片电池的制备方法、切片电池及光伏组件 |
CN111916533B (zh) * | 2020-08-28 | 2023-03-24 | 苏州联诺太阳能科技有限公司 | 切片电池的制备方法、切片电池及光伏组件 |
CN113206009A (zh) * | 2021-04-16 | 2021-08-03 | 安徽华晟新能源科技有限公司 | 切片硅异质结电池及制备方法、太阳能电池组件 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN110534617A (zh) | 小片电池的制备方法 | |
US9379258B2 (en) | Fabrication methods for monolithically isled back contact back junction solar cells | |
US9515217B2 (en) | Monolithically isled back contact back junction solar cells | |
CN102859707B (zh) | 用于制造具有选择性发射极的太阳能电池的方法 | |
CN109888061A (zh) | 一种碱抛光高效perc电池及其制备工艺 | |
CN110466083A (zh) | 硅棒边皮料的利用方法 | |
CN102623517B (zh) | 一种背接触型晶体硅太阳能电池及其制作方法 | |
CN109747055A (zh) | 单晶硅片的制备方法和应用 | |
CN111029437B (zh) | 一种小片电池的制备方法 | |
CN106876262B (zh) | 一种制作高效玻璃钝化芯片工艺 | |
CN110534616B (zh) | 晶硅电池分片的制备工艺 | |
WO2014127067A1 (en) | Monolithically isled back contact back junction solar cells using bulk wafers | |
CN110085702A (zh) | 一种有效降低激光切割损失的高效光伏电池制作方法 | |
CN110212056A (zh) | 切片太阳能电池片的制备方法 | |
WO2020103195A1 (zh) | 单晶电池片切割方法、单晶电池片、光伏组件及制备方法 | |
CN106158990A (zh) | Ibc电池、电池组及制备方法 | |
CN110854218A (zh) | 栅线结构、太阳能电池片、叠瓦组件、印刷和制造方法 | |
CN113665011A (zh) | 一种硅片的制备方法、硅片及电池 | |
CN112054096A (zh) | 一种切片单晶硅电池的制备方法 | |
CN102569502A (zh) | 一种湿法刻蚀工艺 | |
CN112490312A (zh) | 一种能够降低切割损失的太阳能电池及制备方法 | |
CN113224201A (zh) | 一种切片晶体硅太阳电池制备方法 | |
CN105336812B (zh) | 全背电极接触晶体硅太阳能电池片的切割方法 | |
CN110605794B (zh) | 电池片生产方法、电池片、电池组件 | |
CN110277463B (zh) | 一种太阳能电池结构制作方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
CB02 | Change of applicant information | ||
CB02 | Change of applicant information |
Address after: Liyang City, Jiangsu province 213300 Li Cheng Zhen Wu Changzhou city Tandu Road No. 8 Applicant after: Changzhou Shichuang Energy Co.,Ltd. Address before: Liyang City, Jiangsu province 213300 Li Cheng Zhen Wu Changzhou city Tandu Road No. 8 Applicant before: CHANGZHOU SHICHUANG ENERGY TECHNOLOGY Co.,Ltd. |
|
RJ01 | Rejection of invention patent application after publication | ||
RJ01 | Rejection of invention patent application after publication |
Application publication date: 20191203 |