CN110531838A - A kind of radiator structure and server - Google Patents
A kind of radiator structure and server Download PDFInfo
- Publication number
- CN110531838A CN110531838A CN201910701364.5A CN201910701364A CN110531838A CN 110531838 A CN110531838 A CN 110531838A CN 201910701364 A CN201910701364 A CN 201910701364A CN 110531838 A CN110531838 A CN 110531838A
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- CN
- China
- Prior art keywords
- radiator
- processor
- mounting plate
- radiator structure
- elastic component
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/18—Packaging or power distribution
- G06F1/183—Internal mounting support structures, e.g. for printed circuit boards, internal connecting means
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
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- Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Human Computer Interaction (AREA)
- Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
There is provided herein a kind of radiator structure and servers.Radiator structure includes processor, radiator, connector and elastic component, radiator is located at the side of processor, one end of connector pass through radiator connect on a processor, the other end be provided with limiting section, one end of elastic component is pressed on limiting section, the other end is pressed on the side of processor backwards of radiator, radiator is elastic compression, radiator, which is able to carry out, after compaction voluntarily adjusts, and is preferably bonded it together with processor, the heat dissipation effect of radiator is more preferable.
Description
Technical field
This application involves communication equipment field, espespecially a kind of radiator structure and a kind of server.
Background technique
A kind of server, including central processing unit (CPU) and radiator, central processing unit include ontology and heat-conducting silicone grease,
Heat-conducting silicone grease is coated on ontology, and radiator is placed on heat-conducting silicone grease, together with radiator and ontology are locked by screw.
By operator's manual locking and after locking, radiator not can be carried out and voluntarily adjusts screw, cause radiator with it is thermally conductive
Often there is the case where cannot being bonded completely in the opposite flank of silicone grease, in this way, the heat on ontology cannot be rapidly by leading
Hot silicone grease is transferred on radiator, can reduce the heat dissipation effect of radiator, and the service performance of server is caused to decline.
Summary of the invention
This application provides a kind of radiator structure, be able to solve radiator not can be carried out asking of voluntarily adjusting after assembling
Topic, can be with the fitting effect of heat radiation device and processor.
Present invention also provides a kind of servers.
Radiator structure provided in an embodiment of the present invention, including processor, radiator, connector and elastic component, the heat dissipation
Device is located at the side of the processor, one end of the connector pass through the radiator connect on the processor, it is another
End is provided with limiting section, and one end of the elastic component is pressed on the limiting section, the other end is pressed on the back of the radiator
To on the side of the processor, so that the radiator and the processor compress fitting.
Optionally, the radiator includes mounting plate and multiple heating columns, the one side of the mounting plate and the processing
Device fits, and the heating column is erected on the another side of the mounting plate, and one end of the connector passes through the installation
Plate is fixed on the processor.
Optionally, multiple heating columns are arranged in matrix form.
Optionally, the distance between adjacent described heating column is 8~15mm, and the length of any heating column cross section is
10mm~20mm, width are 8~15mm.
Optionally, the mounting plate is rectangular, and the connector and the elastic component include being located at the mounting plate pair
Two groups at angle or four groups.
Optionally, the connector and the elastic component include the multiple groups in the circumferentially-spaced setting of the radiator.
Optionally, the radiator structure further include: gasket is pressed between the elastic component and the radiator.
Optionally, the elastic component is spring, and the connector is screw.
Optionally, the processor includes: ontology；And heat-conducting silicone grease, on the body, the radiator compresses for setting
On the heat-conducting silicone grease, the heat-conducting silicone grease is full of the gap between the ontology and the radiator.
Server provided by the invention, including radiator structure described in any of the above-described embodiment.
Radiator structure provided in an embodiment of the present invention, radiator are located at the side of processor, and one end of connector, which passes through, to be dissipated
The connection of hot device on a processor, the other end be provided with limiting section, one end of elastic component is pressed on limiting section, the other end is pressed on
On the side of processor backwards of radiator, radiator is elastic compression, and radiator, which is able to carry out, after compaction voluntarily adjusts, and is made
It is preferably bonded together with processor, and the heat dissipation effect of radiator is more preferable.
Other features and advantage will illustrate in the following description, also, partly become from specification
It obtains it is clear that being understood and implementing the application.The purpose of the application and other advantages can be by specifications, right
Specifically noted structure is achieved and obtained in claim and attached drawing.
Detailed description of the invention
Attached drawing is used to provide to further understand technical scheme, and constitutes part of specification, with this
The embodiment of application is used to explain the technical solution of the application together, does not constitute the limitation to technical scheme.
Fig. 1 is the schematic view of the front view of radiator structure described in one embodiment of the invention；
Fig. 2 is the decomposition texture schematic diagram of radiator structure shown in Fig. 1, and heat-conducting silicone grease is not shown.
Wherein, the corresponding relationship in Fig. 1 and Fig. 2 between appended drawing reference and component names are as follows:
100 processors, 110 ontologies, 120 heat-conducting silicone greases, 200 radiators, 210 mounting plates, 220 heating columns, 300 connections
Part, 310 limiting sections, 400 elastic components, 500 gaskets.
Specific embodiment
For the purposes, technical schemes and advantages of the application are more clearly understood, below in conjunction with attached drawing to the application
Embodiment be described in detail.It should be noted that in the absence of conflict, in the embodiment and embodiment in the application
Feature can mutual any combination.
Many details are explained in the following description in order to fully understand the application, still, the application may be used also
Implement in a manner of using other than the one described here, therefore, the protection scope of the application is not by following public tool
The limitation of body embodiment.
Radiator structure provided in an embodiment of the present invention, as depicted in figs. 1 and 2, including processor 100, radiator 200, company
Fitting 300 and elastic component 400, radiator 200 are located at the side of processor 100, and one end of connector 300 passes through radiator 200
Be connected on processor 100, the other end is provided with limiting section 310, one end of elastic component 400 is pressed on limiting section 310, is another
End is pressed on the side of processor 100 backwards of radiator 200, so that radiator 200 and processor 100 compress fitting.
The radiator structure, radiator 200 are located at the side of processor 100, and one end of connector 300 passes through radiator 200
Be connected on processor 100, the other end is provided with limiting section 310, one end of elastic component 400 is pressed on limiting section 310, is another
End is pressed on the side of processor 100 backwards of radiator 200, and radiator 200 is elastic compression, after compaction radiator
200 are able to carry out and voluntarily adjust, and are preferably bonded it together with processor 100, the heat dissipation effect of radiator 200 is more preferable.
Wherein, as depicted in figs. 1 and 2, processor 100 includes: ontology 110；With heat-conducting silicone grease 120, it is arranged in ontology 110
On, radiator 200 includes mounting plate 210 and multiple heating columns 220, and the one side of mounting plate 210 is pressed on heat-conducting silicone grease 120
On, it is voluntarily adjusted by mounting plate 210, the one side of mounting plate 210 can be fitted in completely on heat-conducting silicone grease 120, thermally conductive
Silicone grease 120 then full of the gap between ontology 110 and mounting plate 210, can preferably transmit heat from ontology 110 to installation part
Amount, heating column 220 are erected on the another side of mounting plate 210, form wind passage between adjacent heating column 220, more conducively
Heating column 220 and mounting plate 210 radiate, and the heat dissipation performance of radiator 200 is more preferable.One end of connector 300 passes through mounting plate 210
It is fixed on processor 100, realization fits together mounting plate 210 and 110 elasticity of ontology.
Preferably, as depicted in figs. 1 and 2, connector 300 and elastic component 400 include in the circumferentially-spaced of radiator 200
The multiple groups of setting can achieve the effect of seamless connection be bonded mounting plate 210 with heat-conducting silicone grease 120.
Specifically, as depicted in figs. 1 and 2, multiple heating columns 220 are arranged in matrix form, between adjacent heating column 220 away from
It is that 10mm~20mm (is such as set as from the length for 8~15mm (being such as set as 12mm), any 220 cross section of heating column
15mm), width is 8~15mm (being such as set as 12mm), and heating column 220 carries out reasonable layout, is dissipated using made of above-mentioned data
Hot device 200, processor 100 can achieve better heat dissipation effect, and the performance of processor 100 is available sharply to be promoted.It is thermally conductive
The height of column 220 can be reasonably selected according to actual needs, be not limited thereto.
Specifically, as depicted in figs. 1 and 2, mounting plate 210 is rectangular, and connector 300 and elastic component 400 can be set
Being includes two groups of mode for being located at 210 1 groups of diagonal angles of mounting plate, and connector 300 and elastic component 400 may be arranged as wrapping
Four groups etc. of the mode positioned at 210 two groups of diagonal angles of mounting plate is included, the purpose of the application can be achieved, objective is without departing from this hair
Bright design effect, details are not described herein, in the protection scope that should belong to the application.
Preferably, as depicted in figs. 1 and 2, elastic component 400 can be spring, and connector 300 is screw, and radiator structure is also
It include: gasket 500, gasket 500 is pressed between spring and mounting plate 210, and the elastic force of spring is transferred to installation by gasket 500
On plate 210,210 each position stress of mounting plate is consistent, and can further promote mounting plate 210 and heat-conducting silicone grease 120 is bonded effect
Fruit realizes full fitting.
Preferably, processor 100 is central processing unit.
Server (not shown) provided by the invention, the radiator structure including any of the above-described embodiment.
Server provided by the invention has all advantages of radiator structure described in any of the above-described embodiment, herein not
It repeats again.
In conclusion radiator structure provided in an embodiment of the present invention, radiator is located at the side of processor, the one of connector
End across radiator connection on a processor, the other end be provided with limiting section, one end of elastic component is pressed on limiting section, is another
End is pressed on the side of processor backwards of radiator, and radiator is elastic compression, and radiator is able to carry out certainly after compaction
Row adjustment, is preferably bonded it together with processor, the heat dissipation effect of radiator is more preferable.
In the description of the present application, term " installation ", " connected ", " connection ", " fixation " etc. be shall be understood in a broad sense, example
Such as, " connection " may be fixed connection or may be dismantle connection, or integral connection；It can be directly connected, it can also be with
Indirectly connected through an intermediary.For the ordinary skill in the art, above-mentioned art can be understood as the case may be
The concrete meaning of language in this application.
In the description of this specification, the description of term " one embodiment ", " some embodiments ", " specific embodiment " etc.
Mean that particular features, structures, materials, or characteristics described in conjunction with this embodiment or example are contained at least one reality of the application
It applies in example or example.In the present specification, schematic expression of the above terms are not necessarily referring to identical embodiment or reality
Example.Moreover, description particular features, structures, materials, or characteristics can in any one or more of the embodiments or examples with
Suitable mode combines.
Although embodiment disclosed by the application is as above, the content only for ease of understanding the application and use
Embodiment is not limited to the application.Technical staff in any the application fields, is taken off not departing from the application
Under the premise of the spirit and scope of dew, any modification and variation, but the application can be carried out in the form and details of implementation
Scope of patent protection, still should be subject to the scope of the claims as defined in the appended claims.
Claims (10)
1. a kind of radiator structure, which is characterized in that including processor, radiator, connector and elastic component, the radiator is located at
The side of the processor, one end of the connector pass through the radiator connect on the processor, other end setting
There is limiting section, one end of the elastic component is pressed on the limiting section, the other end is pressed on the described backwards of the radiator
On the side of processor, so that the radiator and the processor compress fitting.
2. radiator structure according to claim 1, which is characterized in that the radiator includes mounting plate and multiple thermally conductive
Column, the one side of the mounting plate fit with the processor, and the heating column is erected on the another side of the mounting plate
On, it is fixed on the processor that one end of the connector passes through the mounting plate.
3. radiator structure according to claim 2, which is characterized in that multiple heating columns are arranged in matrix form.
4. radiator structure according to claim 2, which is characterized in that the distance between adjacent described heating column be 8~
15mm, the length of any heating column cross section is 10mm~20mm, width is 8~15mm.
5. radiator structure according to claim 2, which is characterized in that the mounting plate is rectangular, the connector and
The elastic component includes two groups or four groups for being located at the mounting plate diagonal angle.
6. radiator structure according to claim 1, which is characterized in that the connector and the elastic component are included in described
The multiple groups of the circumferentially-spaced setting of radiator.
7. radiator structure according to claim 1, which is characterized in that further include:
Gasket is pressed between the elastic component and the radiator.
8. radiator structure according to claim 1, which is characterized in that the elastic component is spring, and the connector is spiral shell
Nail.
9. radiator structure according to any one of claim 1 to 8, which is characterized in that the processor includes:
Ontology；With
Heat-conducting silicone grease, on the body, the radiator is pressed on the heat-conducting silicone grease, and the heat-conducting silicone grease is full of for setting
Gap between the ontology and the radiator.
10. a kind of server, which is characterized in that include radiator structure as claimed in any one of claims 1-9 wherein.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910701364.5A CN110531838A (en) | 2019-07-31 | 2019-07-31 | A kind of radiator structure and server |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910701364.5A CN110531838A (en) | 2019-07-31 | 2019-07-31 | A kind of radiator structure and server |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110531838A true CN110531838A (en) | 2019-12-03 |
Family
ID=68661049
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910701364.5A Pending CN110531838A (en) | 2019-07-31 | 2019-07-31 | A kind of radiator structure and server |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110531838A (en) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6611431B1 (en) * | 2001-11-30 | 2003-08-26 | Hon Hai Precision Ind. Co., Ltd. | Heat dissipation assembly |
| CN2746529Y (en) * | 2004-10-26 | 2005-12-14 | 东莞莫仕连接器有限公司 | Heat sink device |
| CN203377208U (en) * | 2013-07-10 | 2014-01-01 | 吴江市三元精密电子有限公司 | Radiator |
| CN107105596A (en) * | 2016-02-23 | 2017-08-29 | 中兴通讯股份有限公司 | Radiating subassembly |
| CN207650739U (en) * | 2017-11-13 | 2018-07-24 | 苏州苏众精密金属制品有限公司 | A kind of heat insulation type buffering radiator structure |
| CN208077098U (en) * | 2018-02-28 | 2018-11-09 | 华为技术有限公司 | Cooling mechanism, server, electronic equipment |
-
2019
- 2019-07-31 CN CN201910701364.5A patent/CN110531838A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6611431B1 (en) * | 2001-11-30 | 2003-08-26 | Hon Hai Precision Ind. Co., Ltd. | Heat dissipation assembly |
| CN2746529Y (en) * | 2004-10-26 | 2005-12-14 | 东莞莫仕连接器有限公司 | Heat sink device |
| CN203377208U (en) * | 2013-07-10 | 2014-01-01 | 吴江市三元精密电子有限公司 | Radiator |
| CN107105596A (en) * | 2016-02-23 | 2017-08-29 | 中兴通讯股份有限公司 | Radiating subassembly |
| CN207650739U (en) * | 2017-11-13 | 2018-07-24 | 苏州苏众精密金属制品有限公司 | A kind of heat insulation type buffering radiator structure |
| CN208077098U (en) * | 2018-02-28 | 2018-11-09 | 华为技术有限公司 | Cooling mechanism, server, electronic equipment |
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| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20191203 |