CN110524081A - Camera module solution tin method and solder sucker - Google Patents
Camera module solution tin method and solder sucker Download PDFInfo
- Publication number
- CN110524081A CN110524081A CN201810507461.6A CN201810507461A CN110524081A CN 110524081 A CN110524081 A CN 110524081A CN 201810507461 A CN201810507461 A CN 201810507461A CN 110524081 A CN110524081 A CN 110524081A
- Authority
- CN
- China
- Prior art keywords
- tin
- camera module
- solder sucker
- section
- pin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/018—Unsoldering; Removal of melted solder or other residues
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
Abstract
The present invention relates to a kind of camera module solution tin method and solder suckers.The camera module solution tin method, includes the following steps: the solid-state tin at the pin of the circuit board of camera module becoming liquid tin；And the liquid tin at pin is siphoned away using vacuum adsorption principle using solder sucker.In above-mentioned camera module solution tin method, the liquid tin at pin is siphoned away using solder sucker, liquid tin is recovered in the built-in cavity of solder sucker, it can be to avoid camera module appearance scruff residue problem, completely remove the scolding tin of solder joint, liquid tin pollution clean room environment can also be avoided, so that liquid tin be avoided to influence Health Status For Workers Exposed.
Description
Technical field
The present invention relates to field of camera technology, more particularly to a kind of camera module solution tin method and solder sucker.
Background technique
There is the contact that is electrically connected in camera module, for example, circuit board is equipped with the pin being electrically connected with image sensor, circuit board
Equipped with the pin being electrically connected with voice coil motor, pin is usually connect by way of scolding tin with image sensor or voice coil motor,
Solid scolding tin can be formed at pin.When needing to disassemble camera module, after the fixed camera module of jig, operator
It takes soldering iron another hand to take air pressure gun on the other hand, tin is melted by heating method using soldering iron, is blown liquid tin with air pressure gun after thawing
It is scattered to periphery.Using aforesaid way solution tin, have the following problems: camera module spot area is there are tin residual, the liquid that dispels
Tin can pollute clean room environment, and the liquid tin dispelled has an impact to Health Status For Workers Exposed.
Summary of the invention
Based on this, it is necessary to provide it is a kind of be avoided that tin residual, pollution dust free room and influence Health Status For Workers Exposed take the photograph
As mould group solution tin method and solder sucker.
A kind of camera module solution tin method, includes the following steps:
Solid-state tin at the pin of the circuit board of camera module is become into liquid tin；And
The liquid tin at the pin is siphoned away using vacuum adsorption principle using solder sucker.
In above-mentioned camera module solution tin method, the liquid tin at pin is siphoned away using solder sucker, liquid tin is recovered to suction
In the built-in cavity of tinware, the scolding tin of solder joint can be completely removed, can also be kept away to avoid camera module appearance scruff residue problem
Exempt from liquid tin pollution clean room environment, so that liquid tin be avoided to influence Health Status For Workers Exposed.
In one of the embodiments, in the step that the solid-state tin at the pin of the circuit board of camera module is become to liquid tin
In rapid, the solid-state tin at the pin is heated using the solder sucker, so that the solid-state tin at the pin becomes liquid
State tin.Namely solder sucker integrate heating and inhale two kinds of functions of tin, can to avoid melt tin after-blow tin moment because soldering iron displacement due to
Cause product periphery scald and caused by product appearance it is bad.
The solid-state tin at pin for making camera module described in the progress in one of the embodiments, becomes liquid tin
Before step, the camera module is fixed in jig, so that the camera module is fixed relative to the jig, and is made
The pin for obtaining the circuit board of the camera module exposes.In this way, can be more conducive to carry out solution process of tin.
A kind of solder sucker, the solder sucker is used to siphon away the liquid tin at the pin using vacuum adsorption principle, described
Solder sucker includes ontology and suction nozzle, and the suction nozzle includes connected linkage section and active section, the linkage section and the ontology
Connection, the outer diameter of the active section are less than 0.74mm, and the internal diameter of the active section is less than 0.5mm.The minimum of traditional solder sucker
The outer diameter of suction nozzle be 2mm, internal diameter 0.8mm, and camera module welding pin only has the space of 0.74*0.5mm, so traditional
Suction nozzle solution can also scald camera module less than tin.And in above-mentioned solder sucker, the outer diameter R1 of active section is less than 0.74mm,
The internal diameter R2 of suction nozzle is less than 0.5mm, so as to siphon away the liquid tin at camera module pin.
The linkage section is detachably connected with the ontology in one of the embodiments,.In this way, being conveniently replaceable suction nozzle.
The ontology has open end in one of the embodiments, and the inner wall of the open end is equipped with internal screw thread, described
The outer wall of linkage section is equipped with external screw thread, and the linkage section connects with the ontology screw thread.In this way, being highly convenient for dismounting suction nozzle.
In one of the embodiments, on the active section to the direction of the linkage section, the outer diameter of the linkage section
It is gradually reduced.In this way, be not only convenient for heat transfer so that active section is rapidly heated to preset temperature, be also convenient for camera module into
Row solution process of tin.
The linkage section includes multiple sequentially connected segmentations in one of the embodiments, each segmentation it is outer
Diameter is continuously gradually reduced or remains unchanged.In this way, being not only convenient for heat transfer, so that active section is rapidly heated to preset temperature, go back
Convenient for carrying out solution process of tin to camera module.
The linkage section includes sequentially connected first segment, second segment and third section in one of the embodiments, described
First segment is connect with the active section, and the third section is connect with the ontology, and the first segment and the second segment are in rotary table
Shape, and the bus of the first segment is greater than the bus phase of the second segment relative to the tilt angle of the center line of the linkage section
For the tilt angle of the center line of the linkage section, the third section is cylindrical.In this way, it is not only convenient for heat transfer, so that
Active section is rapidly heated to preset temperature, is also convenient for carrying out solution process of tin to camera module.
The active section, which can be warming up to, in one of the embodiments, melts tin temperature, and solid-state tin is become Molten Tin.
When i.e. solder sucker integrates heating and inhales two kinds of functions of tin, it can cause to produce to avoid tin after-blow tin moment is melted because of soldering iron displacement
Product periphery scald and caused by product appearance it is bad.
Detailed description of the invention
Fig. 1 is the structural schematic diagram for the solder sucker that one embodiment of the invention provides；
Fig. 2 is the suction nozzle in Fig. 1 from workshop section's section to the schematic top plan view on the direction of linkage section.
Specific embodiment
To facilitate the understanding of the present invention, a more comprehensive description of the invention is given in the following sections with reference to the relevant attached drawings.In attached drawing
Give preferred embodiment of the invention.But the invention can be realized in many different forms, however it is not limited to herein
Described embodiment.On the contrary, purpose of providing these embodiments is keeps the understanding to the disclosure more saturating
It is thorough comprehensive.
It should be noted that it can directly on the other element when element is referred to as " being fixed on " another element
Or there may also be elements placed in the middle.When an element is considered as " connection " another element, it, which can be, is directly connected to
To another element or it may be simultaneously present centering elements.Term as used herein " vertical ", " horizontal ", " left side ",
" right side " and similar statement are for illustrative purposes only.
Unless otherwise defined, all technical and scientific terms used herein and belong to technical field of the invention
The normally understood meaning of technical staff is identical.Term as used herein in the specification of the present invention is intended merely to description tool
The purpose of the embodiment of body, it is not intended that in the limitation present invention.Term " and or " used herein includes one or more phases
Any and all combinations of the listed item of pass.
The camera module solution tin method that one embodiment of the invention provides, includes the following steps:
Step S110, camera module is fixed in jig, so that camera module is fixed relative to jig, and to take the photograph
As the pin of the circuit board of mould group exposes.
Solid-state tin at the pin of the circuit board of camera module is become liquid tin by step S120.
Step S130 siphons away using vacuum adsorption principle the liquid tin at pin using solder sucker.
In the present embodiment, camera module is zoom camera mould group, and camera module includes the voice coil with circuit board electrical connection
Motor.In step s 110, the circuit board of camera module is fixed in jig, so that camera module is solid relative to jig
It is fixed, and make being exposed with the pin being electrically connected with voice coil motor for circuit board, Xie Xihou is carried out to the scolding tin at the pin, so that
Voice coil motor is separated with bracket, then again bracket is separated with circuit board so that circuit board with image sensor electricity
The pin of connection exposes, and carries out solution tin to the scolding tin at the pin.
More specifically, in the present embodiment, voice coil motor is connect by the way of gluing with bracket, bracket and circuit board
It is connected by the way of gluing, when separating voice coil motor and bracket and separating support and circuit board, by the way of heating
After softening glue-line, separation can be realized.
In other embodiments, when camera module is fixed-focus camera module, microscope base substitutes voice coil motor, at this time, it may be necessary to
Camera module is handled in advance, so that after bracket is separated with circuit board, then the circuit board of image sensor will be connected with
It is fixed in jig, so that camera module is fixed relative to jig, and the pin for connecting circuit board with image sensor
Expose.
In the present embodiment, if the temperature of solder sucker, which can be warming up to, melts tin temperature, solid-state tin is become into Molten Tin, in step
In rapid S110, the solid-state tin at the pin of circuit board can be heated using solder sucker, solid-state tin is become into Molten Tin.
At this point, solder sucker integrates heating and inhales two kinds of functions of tin.In this way, being more convenient for carrying out solution process of tin.Certainly, in step S110
In, the solid-state tin at the pin of circuit board can also be heated using the soldering iron relatively independent with solder sucker, by solid-state
Tin becomes Molten Tin.
In above-mentioned camera module solution tin method, the liquid tin at pin is siphoned away using solder sucker, liquid tin is recovered to suction
In the built-in cavity of tinware, the scolding tin of solder joint can be completely removed, can also be kept away to avoid camera module appearance scruff residue problem
Exempt from liquid tin pollution clean room environment, so that liquid tin be avoided to influence Health Status For Workers Exposed.Moreover, when solder sucker collection heats and inhales
Two kinds of functions of tin when integrated, can to avoid melt tin after-blow tin moment because soldering iron displacement due to cause product periphery scald and caused by
Product appearance is bad.
As shown in Figures 1 and 2, the solder sucker 20 that one embodiment of the invention provides, the solder sucker 20 can apply to camera shooting mould
It, will be in the liquid tin sucking solder sucker 20 at the pin of camera module in the solution process of tin of group.
Solder sucker 20 includes ontology 100 and suction nozzle 200.Component necessary to existing solder sucker is integrated on ontology 100,
For example, being used for so that suction nozzle 200 is in vacuum state, in the built-in cavity of liquid tin sucking ontology 100.Suction nozzle 200 includes
Connected linkage section 210 and active section 220, linkage section 210 are connect with ontology 100.Wherein, the outer diameter R1 of active section 220 is small
It is less than 0.5mm in the internal diameter R2 of 0.74mm, suction nozzle 200.
The outer diameter of the smallest suction nozzle of traditional solder sucker is 2mm, internal diameter 0.8mm, and camera module welding pin is only
There is the space of 0.74*0.5mm, so conventional suction nozzle solution is less than tin, while can also scald camera module.And in above-mentioned solder sucker 20
In, the outer diameter R1 of active section 220 is less than 0.74mm, and the internal diameter R2 of suction nozzle 200 is less than 0.5mm, so as to siphon away camera module
Liquid tin at pin.
Further, in the present embodiment, the outer diameter R1 of active section 220 is 0.6-0.7mm, and the internal diameter R2 of active section 220 is
0.4-0.49mm.In this way, more conducively solder sucker 20 siphons away the liquid tin at camera module pin.Preferably, in the present embodiment,
The outer diameter R1 of active section 220 is 0.6mm, and the internal diameter R2 of active section 220 is 0.4mm.Specifically, in the present embodiment, the copper pipe
Outer diameter R1 be 0.6mm, internal diameter R2 be 0.4mm.
Further, in the present embodiment, the length L1 of suction nozzle 200 is 8mm, and the length L2 of active section 220 is 2mm.In this way,
More conducively solder sucker 20 siphons away the liquid tin at camera module pin.
Further, in the present embodiment, active section 220, which can be warming up to, melts tin temperature, and solid-state tin is become Molten Tin.
When i.e. solder sucker 20 integrates heating and inhales two kinds of functions of tin, it can cause to avoid tin after-blow tin moment is melted because of soldering iron displacement
Product periphery scald and caused by product appearance it is bad.It should be noted that when active section 220 can be warming up to and melt tin temperature,
The heating element for heating work section 220 is also integrated on ontology 100.
Further, in the present embodiment, active section 200 can be warming up to 350 DEG C or more.Preferably, in the present embodiment, work
Can be warming up to by making section 200 by 350 DEG C -400 DEG C.Become Molten Tin in this way, solid-state tin can not only be heated, moreover it is possible to reduce active section
220 requirements resistant to high temperature, the selection for active section 220 of being more convenient for.
Further, in the present embodiment, linkage section 210 is detachably connected with ontology 100.In this way, being conveniently replaceable suction nozzle
200.Specifically, in the present embodiment, ontology 100 has open end (not shown), and the inner wall of open end is equipped with internal screw thread, and (figure is not
Show), the outer wall of linkage section 210 is equipped with external screw thread, and linkage section 210 connects with 100 screw thread of ontology.It is inhaled in this way, being highly convenient for dismounting
Mouth 200.
Further, in the present embodiment, on active section 220 to the direction of linkage section 210, the outer diameter of linkage section 210 by
It is decrescence small.In this way, be not only convenient for heat transfer so that active section 220 is rapidly heated to preset temperature, be also convenient for camera module into
Row solution process of tin.
Further, in the present embodiment, linkage section 210 includes multiple sequentially connected segmentations, and the outer diameter of each segmentation connects
It is continuous to be gradually reduced or remain unchanged.Specifically, in the present embodiment, linkage section 210 includes sequentially connected first segment 212, the
Two section 214 and third section 216, first segment 212 are connect with active section 220, and third section 216 is connect with ontology 100, first segment 212
And second segment 214 is in a circular table shape, and the bus of first segment 212 is greater than the relative to the tilt angle of the center line of linkage section 210
Tilt angle of two section 214 of the bus relative to the center line of linkage section, third section 216 are cylindrical.
Further, in the present embodiment, active section 220, first segment 212, second segment 214 and third section 216 are integrally formed.
In this way, can to need that there is longer service life often in the suction nozzle 200 under the condition of high temperature.
Each technical characteristic of embodiment described above can be combined arbitrarily, for simplicity of description, not to above-mentioned reality
It applies all possible combination of each technical characteristic in example to be all described, as long as however, the combination of these technical characteristics is not deposited
In contradiction, all should be considered as described in this specification.
The embodiments described above only express several embodiments of the present invention, and the description thereof is more specific and detailed, but simultaneously
It cannot therefore be construed as limiting the scope of the patent.It should be pointed out that coming for those of ordinary skill in the art
It says, without departing from the inventive concept of the premise, various modifications and improvements can be made, these belong to protection of the invention
Range.Therefore, the scope of protection of the patent of the invention shall be subject to the appended claims.
Claims (10)
1. a kind of camera module solution tin method, which comprises the steps of:
Solid-state tin at the pin of the circuit board of camera module is become into liquid tin；And
The liquid tin at the pin is siphoned away using vacuum adsorption principle using solder sucker.
2. camera module solution tin method according to claim 1, which is characterized in that in drawing the circuit board of camera module
In the step of solid-state tin at foot becomes liquid tin, the solid-state tin at the pin is heated using the solder sucker, is made
It obtains the solid-state tin at the pin and becomes liquid tin.
3. camera module solution tin method according to claim 2, which is characterized in that make drawing for camera module described in the progress
Before the step of solid-state tin at foot becomes liquid tin, the camera module is fixed in jig, so that the camera shooting mould
Group is fixed relative to the jig, and the pin of the circuit board of the camera module is exposed.
4. a kind of solder sucker, which is characterized in that the solder sucker is used to siphon away the liquid at the pin using vacuum adsorption principle
State tin, the solder sucker include ontology and suction nozzle, and the suction nozzle includes connected linkage section and active section, the linkage section with
The ontology connection, the outer diameter of the active section are less than 0.74mm, and the internal diameter of the active section is less than 0.5mm.
5. solder sucker according to claim 4, which is characterized in that the linkage section is detachably connected with the ontology.
6. solder sucker according to claim 5, which is characterized in that the ontology have open end, the open end it is interior
Wall is equipped with internal screw thread, and the outer wall of the linkage section is equipped with external screw thread, and the linkage section connects with the ontology screw thread.
7. solder sucker according to claim 4, which is characterized in that on the active section to the direction of the linkage section,
The outer diameter of the linkage section is gradually reduced.
8. solder sucker according to claim 7, which is characterized in that the linkage section includes multiple sequentially connected segmentations,
The outer diameter of each segmentation is continuously gradually reduced or remains unchanged.
9. solder sucker according to claim 8, which is characterized in that the linkage section includes sequentially connected first segment,
Two sections and third section, the first segment are connect with the active section, and the third section is connect with the ontology, the first segment and
The second segment is in a circular table shape, and the bus of the first segment is greater than institute relative to the tilt angle of the center line of the linkage section
The tilt angle of the bus of second segment relative to the center line of the linkage section is stated, the third section is cylindrical.
10. the solder sucker according to any one of claim 4-9, which is characterized in that the active section, which can be warming up to, melts tin
Solid-state tin is become Molten Tin by temperature.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810507461.6A CN110524081A (en) | 2018-05-24 | 2018-05-24 | Camera module solution tin method and solder sucker |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810507461.6A CN110524081A (en) | 2018-05-24 | 2018-05-24 | Camera module solution tin method and solder sucker |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110524081A true CN110524081A (en) | 2019-12-03 |
Family
ID=68657371
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810507461.6A Withdrawn CN110524081A (en) | 2018-05-24 | 2018-05-24 | Camera module solution tin method and solder sucker |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110524081A (en) |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| AT285704B (en) * | 1967-05-06 | 1970-11-10 | Hans Krieg | Device for soldering, in particular for desoldering electrical connection connections in printed circuits |
| US3910479A (en) * | 1972-12-16 | 1975-10-07 | Sachs Ersa Kg | De-soldering apparatus |
| CN2081329U (en) * | 1990-04-03 | 1991-07-24 | 李志刚 | Tin-sucking unit |
| CN2782280Y (en) * | 2005-04-20 | 2006-05-24 | 康彦军 | Self-sucking tin sucking solder iron |
| CN202667859U (en) * | 2012-07-05 | 2013-01-16 | 上海大学 | Replaceable multipurpose manual desoldering device |
| CN106624247A (en) * | 2017-01-11 | 2017-05-10 | 东莞市崴泰电子有限公司 | Anti-clogging tin removing head |
| CN206839359U (en) * | 2017-01-25 | 2018-01-05 | 彭海龙 | A kind of band inhales the soldering iron device of tin |
-
2018
- 2018-05-24 CN CN201810507461.6A patent/CN110524081A/en not_active Withdrawn
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| AT285704B (en) * | 1967-05-06 | 1970-11-10 | Hans Krieg | Device for soldering, in particular for desoldering electrical connection connections in printed circuits |
| US3910479A (en) * | 1972-12-16 | 1975-10-07 | Sachs Ersa Kg | De-soldering apparatus |
| CN2081329U (en) * | 1990-04-03 | 1991-07-24 | 李志刚 | Tin-sucking unit |
| CN2782280Y (en) * | 2005-04-20 | 2006-05-24 | 康彦军 | Self-sucking tin sucking solder iron |
| CN202667859U (en) * | 2012-07-05 | 2013-01-16 | 上海大学 | Replaceable multipurpose manual desoldering device |
| CN106624247A (en) * | 2017-01-11 | 2017-05-10 | 东莞市崴泰电子有限公司 | Anti-clogging tin removing head |
| CN206839359U (en) * | 2017-01-25 | 2018-01-05 | 彭海龙 | A kind of band inhales the soldering iron device of tin |
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| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
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| WW01 | Invention patent application withdrawn after publication |
Application publication date: 20191203 |
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| WW01 | Invention patent application withdrawn after publication |