CN110519673B - Flat module audio - Google Patents
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- CN110519673B CN110519673B CN201810487998.0A CN201810487998A CN110519673B CN 110519673 B CN110519673 B CN 110519673B CN 201810487998 A CN201810487998 A CN 201810487998A CN 110519673 B CN110519673 B CN 110519673B
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Abstract
本发明公开一种平面模块音响,其中包括:一平面安装区域,平面安装区域分割为多个安装区块,每一所述安装区块中分别设置一第一连接装置;多个音响模块,多个音响模块分别能够选择性地设置于多个安装区块中,多个所述音响模块分别设置一第二连接装置,用以和第一连接装置相互连接;一控制主机,控制主机通过连接导线和多个安装区块中的第一连接装置连接;当多个音响模块安装于多个所述安装区块上时,每一安装区块上的第一连接装置和音响模块上的第二连接装置实现电性连接,用以使得多个所述音响模块和所述控制主机连接。
The present invention discloses a planar module audio system, which comprises: a planar installation area, which is divided into a plurality of installation blocks, and a first connecting device is respectively arranged in each of the installation blocks; a plurality of audio modules, which can be selectively arranged in the plurality of installation blocks, and a second connecting device is respectively arranged in the plurality of audio modules for interconnecting with the first connecting device; a control host, which is connected to the first connecting devices in the plurality of installation blocks through connecting wires; when the plurality of audio modules are installed on the plurality of installation blocks, the first connecting device on each installation block and the second connecting device on the audio module are electrically connected to connect the plurality of audio modules to the control host.
Description
技术领域technical field
本发明涉及一种平面模块音响,特别涉及一种能够组装于室内的墙壁、天花板甚至于地板等平面结构物上的平面模块音响。The invention relates to a plane modular sound, in particular to a plane modular sound that can be assembled on plane structures such as indoor walls, ceilings and even floors.
背景技术Background technique
现有的音响系统多数由音源装置、扩大机以及多个不同扬声器所组成,且其中扩大机以及扬声器分别设计成箱体结构,因此只能单独设置在室内空间,而无法整合到室内墙面、天花板或地板等平面安装区域中。Most of the existing audio systems are composed of a sound source device, an amplifier and a number of different speakers, and the amplifier and speakers are designed as box structures, so they can only be set up in the indoor space independently, and cannot be integrated into the indoor wall, In flat installation areas such as ceilings or floors.
现有部分音响系统采用平面式的扬声器,然而现有的平面扬声器因发声组件或单体的限制,具有音频范围过小,且发声效率不佳的问题存在。Some existing audio systems use flat speakers. However, due to the limitation of sound-generating components or monomers, the existing flat-panel speakers have problems that the audio frequency range is too small and the sound production efficiency is poor.
音响系统为塑造出立体音效或者是环场音效,必须要由多个不同的扬声器分别输出不同声道的声音信号,方能够塑造出具有立体临场感的音场。然而现有的音响系统的控制主机和各个扬声器之间必须通过导线连接,因此当组装音响系统时,必须逐一地连接各个扬声器和控制主机之间的信号传输线,因此造成组桩程序困难。In order to create a stereo sound effect or a surround sound effect, the audio system must output sound signals of different channels from multiple different speakers, so as to create a sound field with a three-dimensional presence. However, the control host of the existing audio system and each speaker must be connected by wires, so when assembling the audio system, the signal transmission lines between each speaker and the control host must be connected one by one, thus causing difficulty in the assembly process.
由于以上原因,造成现有的平面音响系统使用上的种种不便,故如何通过结构改良,以解决前述各项问题,已成为该项事业所欲解决的重要课题的一。Due to the above reasons, various inconveniences are caused in the use of the existing flat-panel audio system. Therefore, how to solve the aforementioned problems through structural improvement has become one of the important issues to be solved by this project.
发明内容SUMMARY OF THE INVENTION
本发明实施例提供一种平面模块音响,其中包括:一平面安装区域,所述平面安装区域分割为多个安装区块,每一所述安装区块中分别设置一第一连接装置;多个音响模块,多个所述音响模块分别能够选择性地设置于所述平面安装区域的多个安装区块中,多个所述音响模块对应于每一所述安装区块的所述第一连接装置的位置分别设置一第二连接装置,当多个所述音响模块安装于多个所述安装区块中时,所述第二连接装置能够和所述安装区块上的所述第一连接装置相互连接;一控制主机,所述控制主机通过连接导线和多个所述安装区块中的多个所述第一连接装置连接,当多个所述音响模块安装于多个所述安装区块上时,每一所述安装区块上的所述第一连接装置和所述音响模块上的所述第二连接装置实现电性连接,用以使得多个所述音响模块和所述控制主机连接,所述控制主机能够输出多个对应多个所述音响模块的声音信号,并将多个所述声音信号分别传送至多个所述音响模块,并通过所述音响模块输出所述声音信号。An embodiment of the present invention provides a plane modular audio system, which includes: a plane installation area, the plane installation area is divided into a plurality of installation blocks, each of the installation blocks is respectively provided with a first connection device; a plurality of an audio module, a plurality of the audio modules can be selectively installed in a plurality of installation blocks in the plane installation area, and a plurality of the audio modules are corresponding to the first connection of each of the installation blocks A second connection device is respectively set at the position of the device. When a plurality of the audio modules are installed in a plurality of the installation blocks, the second connection device can be connected with the first connection on the installation block. The devices are connected to each other; a control host, the control host is connected with a plurality of the first connection devices in the plurality of installation blocks through connecting wires, when a plurality of the audio modules are installed in a plurality of the installation areas When installed on the block, the first connection device on each of the installation blocks and the second connection device on the audio module are electrically connected, so that a plurality of the audio modules and the control The host is connected, and the control host can output a plurality of sound signals corresponding to the plurality of sound modules, transmit the plurality of sound signals to the plurality of sound modules respectively, and output the sound signals through the sound modules .
本发明一优选实施例,其中所述第一连接装置和所述第二连接装置具有至少一组音频接点,用以使得所述控制主机输出的声音信号能够经由所述音频接点传导至所述音响模块;所述第一连接装置和第二连接装置分别还具有多个信号接点,用以将所述音响模块的一操作参数传递给所述控制主机,并由所述控制主机依据每一所述音响模块的所述操作参数调整输出到每一所述音响模块的声音信号。A preferred embodiment of the present invention, wherein the first connection device and the second connection device have at least one set of audio contacts, so that the audio signal output by the control host can be conducted to the audio through the audio contacts module; the first connection device and the second connection device respectively also have a plurality of signal contacts for transmitting an operation parameter of the audio module to the control host, and the control host according to each of the The operating parameters of the sound modules adjust the sound signal output to each of the sound modules.
本发明一优选实施例,其中所述第二连接装置上的多个所述信号接点中的一部分为断路状态接点,且多个所述信号接点中的其他部分为通路状态接点,所述第二连接装置通过将多个所述信号接点分别安排为所述通路状态接点或所述断路状态接点的方式,获得多种不同的信号接点组合形态,且每一组不同的所述信号接点组合形态分别代表一组对应的操作参数。In a preferred embodiment of the present invention, a part of the plurality of the signal contacts on the second connection device is an open-circuit state contact, and the other part of the plurality of the signal contacts is an on-state contact, and the second The connection device obtains a variety of different signal contact combinations by arranging a plurality of the signal contacts as the on-state contacts or the open-circuit contacts, and each group of different combinations of the signal contacts is Represents a set of corresponding operating parameters.
本发明一优选实施例,其中多个所述音响模块的所述操作参数至少包括每一所述音响模块的音频特性。In a preferred embodiment of the present invention, the operating parameters of a plurality of the audio modules include at least an audio characteristic of each of the audio modules.
本发明一优选实施例,其中每一所述音响模块分别具有一平面框体以及一发声单元,其中所述平面框体具有相对的前侧面及后侧面,所述后侧面能够贴靠于所述平面安装区域,且所述发声单元设置于所述前侧面;所述平面框体的形状及尺寸和所述平面安装区域的多个所述安装区块的形状及尺寸相配合,使得多个所述平面框体分别能够安装于各个安装区块上。In a preferred embodiment of the present invention, each of the audio modules has a flat frame body and a sound-emitting unit respectively, wherein the flat frame body has opposite front and rear sides, and the rear side can abut against the a plane installation area, and the sound-emitting unit is arranged on the front side; the shape and size of the plane frame are matched with the shapes and sizes of a plurality of the installation blocks in the plane installation area, so that a plurality of all The plane frame bodies can be respectively installed on each installation block.
本发明一优选实施例,其中多个所述音响模块的所述平面框体的形状及尺寸分别具有相对的前侧面及后侧面,所述平面框体的后侧面能够贴靠于每一所述安装区块上,且所述发声单元设置于所述平面框体的前侧面,且所述第二连接装置设置于所述平面框体的后侧面。In a preferred embodiment of the present invention, the shape and size of the planar frame bodies of a plurality of the audio modules respectively have opposite front and rear sides, and the rear side of the planar frame body can abut against each of the On the installation block, the sound-emitting unit is arranged on the front side of the plane frame body, and the second connecting device is arranged on the rear side of the plane frame body.
本发明一优选实施例,其中所述发声单元具有薄膜发声组件、静电发声组件、动圈式发音单体的其中的一或其组合。In a preferred embodiment of the present invention, the sound-generating unit has one or a combination of a thin-film sound-generating component, an electrostatic sound-generating component, and a moving coil sound-generating unit.
本发明一优选实施例,其中所述薄膜发声组件包括:一薄膜基材,所述薄膜基材具有相对的上侧面与下侧面,且所述薄膜基材的上侧面与下侧面分别能够界定出至少一工作区域;两导电层,所述两导电层分别设置于所述薄膜基材的上侧面与下侧面上,且至少覆盖所述薄膜基材位于至少一所述工作区域内的所述上侧面与所述下侧面;两导电条,两所述导电条分别设置于该薄膜基材相对的两侧面;两所述导电条彼此相对且分别沿着至少一所述工作区域的边缘设置于该薄膜基材的侧边;以及两导电组件,两所述导电组件分别设置于两所述导电条相对于该薄膜基材的一侧面,两所述导电组件呈和两所述导电条相对应的形状,且覆盖接触于两所述导电条相对于该薄膜基材的一侧面;两所述导电组件分别和一音源信号电性连接。In a preferred embodiment of the present invention, the thin-film sound-emitting component includes: a thin-film substrate, the thin-film substrate has opposite upper and lower sides, and the upper and lower sides of the thin-film substrate can respectively define at least one working area; two conductive layers, the two conductive layers are respectively disposed on the upper side and the lower side of the film substrate, and at least cover the upper side of the film substrate located in at least one of the working areas The side surface and the lower side surface; two conductive strips, the two conductive strips are respectively arranged on the two opposite sides of the film substrate; the two conductive strips are opposite to each other and are respectively arranged on the edge of at least one of the working areas. The side edge of the film substrate; and two conductive components, the two conductive components are respectively arranged on one side of the two conductive strips opposite to the film substrate, and the two conductive components are corresponding to the two conductive strips. and cover and contact one side of the two conductive strips opposite to the film substrate; the two conductive components are respectively electrically connected with an audio source signal.
本发明一优选实施例,其中所述薄膜发声组件平贴设置于所述平面框体的前侧面上。In a preferred embodiment of the present invention, the thin-film sound-generating component is disposed flat on the front side of the plane frame.
本发明一优选实施例,其中所述薄膜基材为聚偏二氟乙烯(PVDF)薄膜,且两所述导电层为金属薄膜或金属氧化物薄膜。In a preferred embodiment of the present invention, the film substrate is a polyvinylidene fluoride (PVDF) film, and the two conductive layers are metal films or metal oxide films.
本发明一优选实施例,其中两所述导电条为导电胶,或为以电镀方式设置于两所述导电层表面的金属导体层。In a preferred embodiment of the present invention, the two conductive strips are conductive adhesives, or metal conductor layers disposed on the surfaces of the two conductive layers by electroplating.
本发明一优选实施例,其中进一步包括一框体结构,所述框体结构设置于所述薄膜基材位于所述工作区域边缘的位置,所述框体结构包括:一下框体及一上框体,所述上框体与下框体相对地设置于所述薄膜基材工作区域边缘位置的上侧面与下侧面,且相对地夹合于所述薄膜基材的上侧面与下侧面,借此固定所述薄膜基材;其中所述下框体面向所述薄膜基材的一侧具有一顶面,所述顶面中央具有一卡槽,所述上框体面向所述薄膜基材的一侧具有一底面,所述底面具有一和所述卡槽对应的卡合凸缘,所述上框体与所述下框体相对夹合时,所述卡合凸缘能够卡合于所述卡槽中,且将所述薄膜基材对应所述卡合凸缘及所述卡槽位置处的材料挤压卡入于所述卡槽中,且使得所述薄膜基材对应于卡合凸缘及所述卡槽位置处的材料形成与所述卡合凸缘及卡槽相对应的凹凸形状。A preferred embodiment of the present invention further includes a frame structure, the frame structure is disposed at the position of the film substrate at the edge of the working area, and the frame structure includes: a lower frame and an upper frame The upper frame body and the lower frame body are oppositely arranged on the upper side and the lower side of the edge position of the film base material working area, and are relatively sandwiched between the upper side and the lower side of the film base material. This fixes the film substrate; wherein the side of the lower frame facing the film substrate has a top surface, the center of the top surface has a slot, and the upper frame faces the film substrate. One side has a bottom surface, and the bottom surface has an engaging flange corresponding to the card slot. When the upper frame body and the lower frame body are relatively clamped, the engaging flange can be engaged with the into the card slot, and squeeze the film base material corresponding to the engaging flange and the material at the position of the card slot into the card slot, so that the film substrate corresponds to the card slot. The material at the position of the flange and the card groove forms a concave-convex shape corresponding to the engaging flange and the card groove.
本发明一优选实施例,其中所述平面安装区域的多个所述安装区块当中还能够选择性地设置多个功能模块,多个所述功能模块分别具有一平面框体,每一所述功能模块的所述平面框体的形状及尺寸和每一所述安装区块的形状及尺寸配合,且能够和多个所述音响模块的所述平面框体共同地安装于所述平面安装区域的多个所述安装区块中。In a preferred embodiment of the present invention, a plurality of functional modules can be selectively arranged among a plurality of the installation blocks in the plane installation area, and each of the functional modules has a plane frame, and each of the functional modules has a plane frame. The shape and size of the plane frame body of the functional module are matched with the shape and size of each of the installation blocks, and can be installed in the plane installation area together with the plane frame bodies of a plurality of the audio modules in a plurality of said installation blocks.
为使能更进一步了解本发明的特征及技术内容,请参阅以下有关本发明的详细说明与附图,然而所附附图仅提供参考与说明用,并非用来对本发明加以限制者。For a further understanding of the features and technical content of the present invention, please refer to the following detailed description of the present invention and the accompanying drawings, however, the accompanying drawings are only for reference and description, and are not intended to limit the present invention.
附图说明Description of drawings
图1为本发明平面模块音响的组合平面示意图。FIG. 1 is a schematic plan view of the combination of the planar module acoustics of the present invention.
图2为本发明平面模块音响的系统方框示意图。FIG. 2 is a schematic block diagram of the system of the flat module audio system of the present invention.
图3为本发明平面模块音响的一具体实施例的局部立体分解图。FIG. 3 is a partial perspective exploded view of a specific embodiment of the planar module speaker of the present invention.
图3A及图3B分别从图3的III A及III B部分所取的局部放大立体图。FIGS. 3A and 3B are partially enlarged perspective views taken from portions III A and III B of FIG. 3 , respectively.
图4为本发明平面模块音响所使用的音响模块从背面角度所取的立体图。FIG. 4 is a perspective view of the audio module used in the planar module audio of the present invention, taken from the back.
图5为本发明平面模块音响所使用的控制主机以及音响模块的电路系统方框图。FIG. 5 is a block diagram of the circuit system of the control host and the audio module used in the plane module audio of the present invention.
图6为本发明平面模块音响所使用的音响模块的侧剖面图。FIG. 6 is a side sectional view of an audio module used in the flat module audio of the present invention.
图7为本发明平面模块音响所使用的薄膜发声组件的剖面构造示意图。FIG. 7 is a schematic cross-sectional structural diagram of a thin-film sound-generating component used in the planar module acoustics of the present invention.
图8为本发明平面模块音响所使用的薄膜发声组件的立体分解构造示意图。FIG. 8 is a schematic diagram of a three-dimensional exploded structure of a thin-film sound-generating component used in the planar module acoustics of the present invention.
图9为本发明平面模块音响所使用的薄膜发声组件的另一具体实施例的剖面构造示意图。FIG. 9 is a schematic cross-sectional structural diagram of another specific embodiment of the thin-film sound-generating component used in the planar module acoustics of the present invention.
图10为本发明平面模块音响所使用的第一连接装置和第二连接装置的连接端子引脚构造示意图。FIG. 10 is a schematic diagram showing the structure of the connection terminal pins of the first connection device and the second connection device used in the flat module audio of the present invention.
图11为本发明平面模块音响将第二连接装置的多个信号接点其中一部分安排成为断路状态接点的实施例的局部放大立体图。FIG. 11 is a partially enlarged perspective view of an embodiment in which a plurality of signal contacts of the second connection device are arranged as open-circuit contacts in the planar module speaker according to the present invention.
图12为本发明平面模块音响的控制主机进行规划输出到不同音响模块的声音信号的操作流程示意图。FIG. 12 is a schematic diagram of the operation flow of the control host of the flat module audio according to the present invention to plan the audio signals output to different audio modules.
具体实施方式Detailed ways
如图1至图3所示,本发明的平面模块音响1,其中包括一平面安装区域10、多个音响模块30、及一控制主机20。其中多个所述音响模块30分别安装于所述平面安装区域10上,每一个平面安装区域10上分别具有多个安装区块11,每一个安装区块11分别设置一第一连接装置12,且第一连接装置12通过连接导线25和控制主机20连接,当音响模块30安装于每一个安装区块11上时,能够和第一连接装置12连接,并通过第一连接装置12以及连接导线25和控制主机20连接,且由控制主机20通过连接导线25将多个和各个音响模块30相对应的不同声道的声音信号输出到多个所述音响模块30,并由音响模块30将声音信号输出。As shown in FIG. 1 to FIG. 3 , the
且如图2所示,所述控制主机20还能够和一客户端电子设备70(如:手机、遥控器、平板计算机等),或者是一多媒体主机80连接,用户能够通过客户端电子设备70或者是多媒体主机80操作所述控制主机20。And as shown in FIG. 2 , the
如图3所示,其中,所述平面安装区域10为一平板状的结构体,所述平面安装区域10提供一大面积的平面部,且所述平面安装区域10的平面部区隔为多个安装区块11。该实施例中,平面安装区域10可以为室内隔间的墙壁、天花板、甚至于地板等具有大范围平面的结构物,且平面安装区域10的上的多个所述安装区块11分别呈矩形,且每一所述安装区块11的面积彼此相等。As shown in FIG. 3 , wherein, the
该实施例中,每一所述安装区块11朝向音响模块30的一表面分别设置有多个吊挂构件13(如图3A所示),用以将音响模块30定位于各个安装区块11上,同时每一个安装区块11的表面还进一步设置一第一连接装置12(如图3B所示),每一个第一连接装置12分别通过连接导线25和控制主机20连接。In this embodiment, a surface of each
如图1及图2所示,本发明的平面模块音响1能够在平面安装区域10上不同位置处的安装区块11分别设置多个不同的音响模块30。且各个安装区块11上除了设置所述音响模块30外,还能够在各个安装区块11上设置不同的配件模块50。所述配件模块50分别具有一平面框体,且每一配件模块50的平面框体具有和音响模块30的平面框体31相似外型及尺寸,且通过每个安装区块11上的吊挂构件13设置在各个安装区块11中。所述配件模块50有多种选择,例如:所述配件模块50可以为装饰画框、时钟、镜子等类型的结构物或者是装饰物;更进一步地,所述配件模块50可以选用平面式的电子产品,或者是制造成容纳在平面框体结构内的家电,例如:平板光源装置、空气清净机、除湿机等;甚至于所述配件模块50还可以为平板触控计算机、媒体播放器、无线基地台、甚至微型服务器、还有各种类型的物联网感测装置等类型的信息产品。此外,平面安装区域10上的安装区块11也能够安装上一大尺寸的平面显示器60,用以使得本发明具有多媒体播放功能。As shown in FIG. 1 and FIG. 2 , in the
因此本发明的平面模块音响1除了能够作为播放音乐的音响装置外,更能够通过音响模块30和不同的配件模块50组合,而共同构成室内装饰以及智慧家居环境的一部分。Therefore, the
如图3、图4及图6所示,每一所述音响模块30分别具有一平面框体31,该实施例中,所述平面框体31呈矩形板体,且平面框体31的形状及尺寸和每一所述安装区块11相互配合,用以使得每一所述音响模块30能够容置于每一所述安装区块11中。所述平面框体31具有相对的前侧面及后侧面,所述平面框体31的前侧面311设置有一发声单元32,以及一显示单元36。As shown in FIG. 3 , FIG. 4 and FIG. 6 , each of the
所述发音平面框体31能够以后侧面312贴靠于所述平面安装区域10的多个安装区块11。如图3、图3A、图3B及图4所示,该实施例中,平面框体31的后侧面对应多个所述吊挂构件13的位置设置有多个吊挂孔313,通过多个所述吊挂构件13和安装区块11上的吊挂构件13相配合,能够将多个所述音响模块30的平面框体31固定于多个所述安装区块11上。并且平面框体31的后侧面312对应第一连接装置12的位置设置有一第二连接装置37,当平面框体31安装在各个安装区块11上时,第二连接装置37能够和第一连接装置12相互接触而实现电性连接。The
如图5所示,本发明使用的控制主机20的电路结构中包含了一音频处理单元21、一模拟数字转换器22、一控制及处理模块23、及第一通信单元24,其中所述音频处理单元21和所述音源装置40连接,用以将所述音源装置40产生的声音信号译码后,转换为对应多个所述音响模块30的不同声道的声音信号,接着再经由模拟数字转换器22将多个所述不同声道的声音信号转换为数字形式的声音信号后,再经由所述控制及处理模块23以及第一通信单元24输出。所述第一通信单元24通过连接导线25和每一个安装区块11上的第一连接装置12连接。As shown in FIG. 5, the circuit structure of the
每一音响模块30的电路结构包括了一第二通信单元301、控制单元302、数字模拟转换器303、及一放大电路304。其中所述第二通信单元301电连接所述第二连接装置37,通过所述第二连接装置37和所述第一连接装置12相配合,能够使得各个音响模块30和控制主机20连接,用以使得音响模块30能够和控制主机20相互沟通,且控制主机20得以将声音信号传输到每一个音响模块30。所述第二通信单元301和音响模块30的控制单元302相连接,以使得控制主机20对各个音响模块30的控制命令以及输出的声音信号能够传送到音响模块30的控制单元302。所述传送到音响模块30的声音信号为数字形式的声音信号,因此再通过数字模拟转换器303转换为模拟形式的声音信号后,再经由放大电路放大,以驱动发声单元32,将所述声音信号输出,供用户聆听。The circuit structure of each
所述音响模块30的控制单元302还进一步连接一显示单元36以及所述第二连接装置37,其中所述显示单元36设置于平面框体31的前侧面311(如图3所示),所述显示单元36具有至少一显示组件361,用以显示音响模块30的操作状态。该实施例中,显示单元36的显示组件361为多个LED,然而,在本发明进一步实施例中,所述显示组件361也可以为液晶显示器,或者为OLED显示设备等组件。The
如图2及图3所示,当多个所述音响模块30设置于安装区块11上以后,控制主机20便能够进一步地规划输出到每一个不同音响模块30的声音信号,用以塑造出立体音效或环场音效等效果的声场。As shown in FIG. 2 and FIG. 3 , after a plurality of the
请同时参考图2、图3及图12所示,本发明的控制主机20在规划输出到每一不同音响模块30上的声音信号,能够依据每一音响模块30设置的位置,以及每一音响模块30本身的音频特性等操作参数来调整输出到每一所述音响模块30的声音信号,因此能够塑造出一具有立体声或环场音效效果的声场。Please refer to FIG. 2 , FIG. 3 and FIG. 12 at the same time, the
如图12所示,控制主机在进行输出到不同音响模块30的声音信号的操作程序,其中步骤S1为检测所述平面安装区域10装安装有音响模块30的安装区块11。由于每一音响模块30设置于安装区块11上时,能够通过第二连接装置37和安装区块11上的第一连接装置12连接,因此控制主机20能够通过音响模块30上的第二连接装置37和各个安装区块11上的第一连接装置12是否导通的信号,来检测出每个安装区块11上是否有安装音响模块30。As shown in FIG. 12 , the control host is performing an operation procedure of outputting sound signals to
接着步骤S2中取得每个安装有音响模块30上的安装区块11的位置信息。所述控制主机20能够预先将每一个安装区块11的位置信息存储,当检测到每个安装区块11上设置有音响模块30时,便能够将对应于所述安装区块11的位置信息提取,借此取得每一安装区块11的位置信息。Next, in step S2, the position information of each mounting
接着步骤S3中,是由音响模块30将代表每一音响模块的操作参数传递给控制主机20。本发明所述操作参数包括但不限于各个音响模块30的音频特性。Next, in step S3 , the
接着步骤S4中,控制主机20便依据每一音响模块30设置位置的位置信息以及每个音响模块30的操作参数规划输出到每一音响模块30的声音信号。Next, in step S4 , the
以下进一步说明本公开控制主机20和各个音响模块30的信号传递方式及连接方式。如图3B、图4及图10所示,本发明所采用的第一连接装置12和第二连接装置37分别具有多个接触端子121、371,第一连接装置12上的多个接触端子121的位置和第二连接装置37上的多个接触端子371的位置相互对应,当第一连接装置12与第二连接装置37相互接触时,能够通过多个连接端子121、371相互接触而实现电性连接。因此通过第一、二连接装置12、37相互配合,使得音响模块30吊挂在每一安装区块11上时便能够和控制主机20连接,因此简化了音响模块30的构造并使得安装程序变得更为容易。The following further describes the signal transmission method and connection method of the
且如图10所示,且该实施例中,第一连接装置12的多个接触端子121中具有至少两个音频接点122,且第二连接装置37的多个接触端子371中也具有两个音频接点372,其中第一连接装置12的音频接点122和控制主机20连接,当第二连接装置37的音频接点372和第一连接装置12的音频接点122相接触后,控制主机20所输出的声音信号便能够传输到音响模块30。And as shown in FIG. 10 , and in this embodiment, the plurality of
此外,第一连接装置12和第二连接装置37的多个连接端子121、371中,还包括有多个信号接点123、373,当第一连接装置12和第二连接装置37相互接触时,多个信号接点123、373能够相互接触,而使得音响模块30能够通过所述第二连接装置37及第一连接装置12将一操作参数经由连接导线25传送到所述控制主机20。In addition, the plurality of
所述音响模块30传输到所述控制主机20的操作参数可以但不限于为每一所述音响模块30的音频特性。如图1所示,本发明的多个所述音响模块30能够设计为具有不同音频特性,因此当控制主机20在输出对应多个音响模块30的不同声道的声音信号时,能够依据每一音响模块30音频特性的操作参数调整各个不同声道的声音信号,用以使得每一个不同声道的声音信号能够和所对应的音响模块30的音频特性相符合。The operating parameters transmitted by the
本发明的音响模块30和控制主机20之间操作参数的传递,能够但不限于通过下列方式进行,例如:所述音响模块30的控制单元302内具有一用以存储所述操作参数的存储单元,当音响模块30的第二连接装置37和安装区块11上的第一连接装置12实现电性连接时,所述存储单元内存储的操作参数便通过所述第一、二连接装置12、37及连接导线25传输到所述控制主机20。The transmission of operating parameters between the
又例如图11所示,该实施例中,每一所述音响模块30的第二连接装置37的多个信号接点373当中,选择性地将一部分的信号接点373安排为通路状态接点373a,且将多个信号接点373当中其余的接点安排为断路状态接点373b。本发明用以使得多个所述信号接点373成为断路状态的方法,包括但不限于下列方式,例如通过将所述信号接点373不连接导电线路,或者是将预定设定为断路状态接点373b位置处不设置接触端子的方式,使得多个信号接点373当中一部分的接点成为所述断路状态接点373b。For another example, as shown in FIG. 11 , in this embodiment, among the plurality of
因此第二连接装置37能够通过将不同位置处的信号接点373分别安排为所述通路状态接点373a或断路状态接点373b的方式,获得多种不同的信号接点373的组合形态,且每一组不同的信号接点373的组合形态分别代表一组对应的操作参数,因此当音响模块30安装于所述安装区块11上时,安装区块11上的第一连接装置12和音响模块30上的第二连接装置37实现电性连接时,第一连接装置12上的多个信号接点123也会第二连接装置37上的多个信号接点373相对应地成为通路或断路状态,因此控制主机20能够检测到第二连接装置37上的各个信号接点373的通路或断路状态,并进而从各个信号接点373的通路或断路状态的排列组合,而辨别出相对应的音响模块30的操作参数,并且控制主机20进一步通过所述操作参数调整输出到每一个音响模块30的声音信号。Therefore, the second connecting
如图3及图6所示,本发明的每一音响模块30的发声单元32分别设置于平面框体31的前侧面。所述发声单元32能够由一个,或一个以上的发声组件所组成。该实施例中,音响模块30的发声单元32包括有一薄膜发声组件33、一静电发声组件34、以及一动圈式发音单体35所组成。当然,所述发声单元32使用的发声组件并不限于该实施例所公开的种类,凡是结构及空间形态能够适合安装于平面框体31上的发音单体或发声组件,皆可被本发明所使用。As shown in FIG. 3 and FIG. 6 , the
此外,本发明的多个音响模块30采用的发声单元32能够采用由上述薄膜发声组件33、一静电发声组件34、或动圈式发音单体35的其中的一或其组合。例如图1所示实施例中,于平面安装区域10上设置的多个音响模块30分别具有三种不同构造的发声单元32,例如图1中所标示的发声单元32a为一圆形的薄膜发声组件所构成,图1中标示的发声组件32b则由一静电发声组件所构成,而发声组件32b则由多个动圈式发音单体所构成。In addition, the sound-generating
本发明的各个音响模块30通过由不同形状或不同结构的发声组件组成所述发声单元32,能够使得各个不同的音响模块30具有不同音频特性,用以对应不同频率范围的声音信号。Each
如图7及图8所示,本发明采用的薄膜发声组件33的构造主要包括:一薄膜基材331,所述薄膜基材331由具有压电特性的高分子聚合材料制成的薄膜或板片,所述薄膜基材331的上下两侧分别具有一相对的上侧面及下侧面;及两导电层332,两所述导电层332由导电材料制成,且分别设置于所述薄膜基材331的上侧面与下侧面上。As shown in FIG. 7 and FIG. 8 , the structure of the thin-film sound-generating
本发明的薄膜发声组件33选用的薄膜基材331的厚度优选者为小于0.3mm以下。的薄膜基材331用以发出声音的部分的区域定义为一工作区域331a,两所述导电层332至少覆盖于所述薄膜基材331位于所述工作区域331a范围内的上侧面与下侧面。所述薄膜基材331优选者为选用聚偏二氟乙烯(PVDF)材料,或者是其他能够产生压电效应的聚合材料制成的薄膜或板片。The thickness of the
两所述导电层332至少覆盖于所述薄膜基材331位于所述工作区域331a范围内的上表面与下表面。本发明两所述导电层332能够选用自金属材料,例如:铜(Cu)、银(Ag)、铬(Cr)、镍(Ni)、钛(Ti)等金属材料,或者是具有导电性的金属氧化物(Metal Oxide)薄膜,例如:氮化钛(TiN)、氧化铟锡(ITO)薄膜等。两所述导电层332能够通过蒸镀、溅镀、电镀、或者是涂布等方式设置于所述薄膜基材331的表面。The two
所述薄膜基材331位于工作区域331a边缘的上侧面及下侧面还进一步设置两导电条333,两所述导电条333彼此相对且分别沿着所述工作区域331a的边缘设置于薄膜基材331的侧边,且分别和两所述导电层332位于所述工作区域331a外围的边缘连接。本发明两所述导电条333可以选用为导电胶,或者是采用以电镀或涂布等方式设置于导电层332表面上的金属导体所制成。The
两所述导电条333的外侧面进一步设置两导电组件334,两导电组件334的本体具有和两所述导电条333相对应的形状,两所述导电组件334的宽度大于或等于两导电条333的宽度,因此能够覆盖接触于两所述导电条333相对于所述薄膜基材331的一侧面。两所述导电组件334能够为柔性电路板,或者是表面电镀有导体的高分子聚合物所制成的导电体,例如:表面电镀有金属层的聚对苯二甲酸乙二酯(PET)。如图3所示,两所述导电组件334的一侧分别具有一延伸部334a,所述延伸部334a上设置有导电接点334b,用以和一音源信号的两输出电极连接,而使得所述音源信号能够通过两所述导电组件334传导到两所述导电条333,且进一步通过两所述导电条传导到两所述导电层332。The outer sides of the two
本发明的薄膜发声组件33由于所述薄膜基材331选用能够产生压电效应的聚合材料制成,且两所述导电层332分别覆盖于所述薄膜基材331的两侧表面,因此当音源信号的电压传导到两导电层332后,能够使得两导电层332产生电场,进而使得薄膜基材331产生逆压电效应,因此使得薄膜基材331的工作区域331a产生震动,借此将音源信号转换为声音的输出。In the film sound-generating
在此特别说明,本发明采用的薄膜发声单元30的工作区域331a,以及围绕在工作区域331a边缘的导电条333及导电组件334不限于图8中所公开的矩形的结构,其可以依据实际需求而设计为其他形状。It should be noted here that the working
如图9所示,为本发明薄膜发声组件33的一变化实施例,所述实施例中公开的薄膜发声组件33进一步包括一框体结构38,用以支撑薄膜基材331以使得至少于工作区域331a范围内的薄膜基材331形成平面状态。该实施例中,所述框体结构38设置于所述薄膜基材331的工作区域331a的边缘位置,所述框体结构38包括:一上框体381及一下框体382,所述上框体381与下框体382相对地设置于所述薄膜基材331工作区域331a边缘位置的上侧面与下侧面,且相对地夹合于薄膜基材331的两侧面。所述上框体381与下框体382还分别夹持于所述导电条333及两所述导电组件334的外侧面,用以将导电条333及两所述导电组件334紧压接触于两导电层332的外侧面,以提高信号传导的稳定性。As shown in FIG. 9 , which is a modified embodiment of the thin-film sound-generating
所述实施例中,框体结构38的下框体面向所述薄膜基材的一侧具有一顶面,所述顶面中央具有一环状的卡槽382a,同时所述上框体381面向所述薄膜基材331的一侧具有一底面,所述底面具有一和所述下框体382的卡槽382a相互对应的卡合凸缘381a,所述上框体381与所述下框体382相对夹合时,所述卡合凸缘381a能够卡合于所述卡槽382a中,且将所述薄膜基材331对应所述卡合凸缘381a及所述卡槽382a位置处的材料挤压卡入于所述卡槽382a中。In the embodiment, the side of the lower frame of the
如图9所示,由于卡槽382a及卡合凸缘381a分别垂直于所述薄膜基材331的表面,因此当薄膜基材331边缘位置的材料受到卡合凸缘381a带动而卡入到卡槽382a内时,将会使得所述薄膜基材331对应于卡合凸缘381a及所述卡槽382a位置处的材料形成与所述卡合凸缘381a及卡槽382a相对应的凹凸形状,且带动薄膜基材331位于所述工作区域331a边缘位置的材料受到垂直方向的拉力,因此使得薄膜基材331位于工作区域331a范围内的材料产生水平方向的应变,并使薄膜基材331的材料产生拉应力。As shown in FIG. 9 , since the
本发明的薄膜发声组件33采用上述构造的优点,主要在于薄膜基材331的大部分面积均为可震动的发声区域,故能有效提升声音输出效率,并且使得薄膜发声组件33可输出的音频范围增加,而使得薄膜发声组件33输出的声音具有优选的细节及还原度。The advantages of the above-mentioned structure of the film sound-generating
此外,本发明的薄膜发声组件33平贴设置在平面框体31的前侧面311上,且图10所示实施例中,薄膜基材331能够进一步通过框体结构38将薄膜基材331支撑固定,因此使得薄膜发声组件33的薄膜基材331能够获得稳固的支撑,而能够避免薄膜发声组件33松弛,而能够提高薄膜发声组件33输出声音的音质,并避免产生异音。In addition, the film sound-emitting
〔实施例的技术效果〕[Technical effect of the embodiment]
综上所述,本发明的有益效果在于每一个音响模块30安装于平面区块11上时能够通过第一连接装置12及第二连接装置37相互接触,而和控制主机20连接,因此使得平面安装区域10不需设置用以连接音响模块30和控制主机20的信号传输线路,而且控制主机能够依据每一个音响模块30的安装位置及音频特性调整对应每一个音响模块30的声音信号,因此能够容易地调整输出音场的音效,而增进其使用的弹性。To sum up, the beneficial effect of the present invention is that each
此外本发明采用的音响模块30具有平面化的结构,并能够具有良好的音频范围及音质,因此提高了音响系统输出声音的质量。In addition, the
以上所述仅为本发明的优选可行实施例,非因此局限本发明的权利要求,故举凡运用本发明说明书及附图内容所做的等效技术变化,均包含于本发明的保护范围内。The above descriptions are only preferred and feasible embodiments of the present invention, and are not intended to limit the claims of the present invention. Therefore, any equivalent technical changes made by using the contents of the description and drawings of the present invention are included in the protection scope of the present invention.
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