CN110519502A - A kind of sensor and implementation method having merged depth camera and general camera - Google Patents
A kind of sensor and implementation method having merged depth camera and general camera Download PDFInfo
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- CN110519502A CN110519502A CN201910902929.6A CN201910902929A CN110519502A CN 110519502 A CN110519502 A CN 110519502A CN 201910902929 A CN201910902929 A CN 201910902929A CN 110519502 A CN110519502 A CN 110519502A
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- 238000000034 method Methods 0.000 title claims abstract description 16
- 230000003287 optical effect Effects 0.000 claims abstract description 69
- 230000004075 alteration Effects 0.000 claims description 5
- 238000005457 optimization Methods 0.000 claims description 5
- 230000010354 integration Effects 0.000 claims description 3
- 230000008569 process Effects 0.000 abstract description 4
- 230000008901 benefit Effects 0.000 abstract description 3
- 238000010586 diagram Methods 0.000 description 6
- 241000208340 Araliaceae Species 0.000 description 4
- 235000005035 Panax pseudoginseng ssp. pseudoginseng Nutrition 0.000 description 4
- 235000003140 Panax quinquefolius Nutrition 0.000 description 4
- 235000008434 ginseng Nutrition 0.000 description 4
- 238000001228 spectrum Methods 0.000 description 2
- 238000013461 design Methods 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
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Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
- G01S17/00—Systems using the reflection or reradiation of electromagnetic waves other than radio waves, e.g. lidar systems
- G01S17/02—Systems using the reflection of electromagnetic waves other than radio waves
- G01S17/06—Systems determining position data of a target
- G01S17/08—Systems determining position data of a target for measuring distance only
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
- G01S17/00—Systems using the reflection or reradiation of electromagnetic waves other than radio waves, e.g. lidar systems
- G01S17/88—Lidar systems specially adapted for specific applications
- G01S17/89—Lidar systems specially adapted for specific applications for mapping or imaging
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
- G01S7/00—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00
- G01S7/48—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00 of systems according to group G01S17/00
- G01S7/481—Constructional features, e.g. arrangements of optical elements
- G01S7/4816—Constructional features, e.g. arrangements of optical elements of receivers alone
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/10—Cameras or camera modules comprising electronic image sensors; Control thereof for generating image signals from different wavelengths
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N5/00—Details of television systems
- H04N5/30—Transforming light or analogous information into electric information
- H04N5/33—Transforming infrared radiation
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Multimedia (AREA)
- Signal Processing (AREA)
- Computer Networks & Wireless Communication (AREA)
- Electromagnetism (AREA)
- General Physics & Mathematics (AREA)
- Radar, Positioning & Navigation (AREA)
- Remote Sensing (AREA)
- Studio Devices (AREA)
- Color Television Image Signal Generators (AREA)
Abstract
A kind of sensor and implementation method having merged depth camera and general camera.Including optical lens, Amici prism, sensitive chip and electronic circuit, integrated support；Optical lens, Amici prism, sensitive chip and electronic circuit are separately fixed in integrated support；Amici prism includes spectroscope and prism；Sensitive chip includes TOF depth camera chip and common color camera chip；The power supply circuit of electronic circuit provides power supply to infrared light supply, TOF depth camera chip and common color camera chip, and TOF depth camera chip and common color camera chip, which receive control signal respectively and send data, is transferred to mould group external interface.The advantages of more compact with optical system and whole structural system, two sensor chips share same camera lens, and cost is lower, avoid the process of calibration, do not need the computing resource outside consumption.
Description
Technical field
The invention belongs to Instrument technology field, it is related to a kind of sensor for having merged depth camera and general camera and realization
Method.
Background technique
With business machine people, domestic robot, the rise of industrial robot, the demand to machine vision is higher and higher.
General camera (2D camera) has been widely applied in robotic vision system at present, completes the various function such as recognition detection
Energy.3D camera (camera with depth information) is also more and more obtained using providing depth avoidance, building map etc. simultaneously
Function.Both camera sensors generally require to use simultaneously, provide depth information, while providing color abundant and 2D letter
Breath, to complete complicated function, such as the natural navigation as people.
The depth camera of ToF (Timeofflight) principle is one of depth camera, by measure light flight when
Between come detecting object to camera distance.This depth camera includes transmitting terminal and the receiving end of light.The structure of receiving end and general
Logical camera is very similar, includes optical lens and sensitive chip.Unlike common color camera, TOF depth camera is usual
It is used as using infrared light and actively emits light.
The integrated mould group for being integrated with depth camera and colored general camera at present has become trend.As shown in figure 4, this
Two kinds of mould group single modules have camera lens independent, and are imaged respectively, are then bound together by rigid structure.Simultaneously
Because their visual field is different, the outer ginseng calibration for carrying out two cameras is generally required.Because physically two cameras have certain
Distance will form blind area on hand；It is also required to consume a large amount of computing resource by the alignment that calibrating parameters carry out pixel scale.
In the prior art, hardware components have generally required two sets of optical systems, and a set of is colored general camera system, and one
Set is TOF depth camera system.Each system has the camera lens for having imaging respectively and photosensitive chip.This two systems passes through just again
Body fixed plate is fixed, and does not have the pose variation of two systems after guarantee in operational process.
As shown in figure 5, this two sets of optical systems have the light path system of oneself, if it is desired to obtain a width and incorporate 2 dimension face
The image of color information and 3 dimension depth informations, it is also necessary to carry out the processing of software.Process is as follows: 1. demarcate two sets of optical systems respectively
The internal reference of system；2. demarcating the outer ginseng (rotation and translation matrix etc.) of two sets of optical systems；3. combining the internal reference of two sets of optical systems
With outer ginseng, two width data are merged by geometric projection relationship, needs to carry out the basic calculating of pixel among these, compares and disappear
Computing resource outside consumption.
The prior art, which has the disadvantage that, closely blind area；It needs to carry out calibration calibration；Need to consume external calculating
Resource.
Summary of the invention
The present invention solves technical problem of the existing technology, a kind of has merged depth camera and general camera to provide
Sensor and implementation method.
A kind of sensor having merged depth camera and general camera, including optical lens, Amici prism, sensitive chip and
Electronic circuit, integrated support；Optical lens, Amici prism, sensitive chip and electronic circuit are separately fixed in integrated support；Point
Light prism includes spectroscope and prism；Sensitive chip includes TOF depth camera chip and common color camera chip；Electronic circuit
Power supply circuit give infrared light supply, TOF depth camera chip and common color camera chip provide power supply, TOF depth camera core
Piece and common color camera chip, which receive control signal respectively and send data, is transferred to mould group external interface.
Visible light and infrared light are separated into two-way by Amici prism；Amici prism includes combined prism device；Combined prism
Device includes infrared emission and pentaprism reflection unit, and infrared emission and pentaprism reflection unit are located at the ground of lens interface
Side, light penetrate optical lens by infrared emission film, and a part of light penetrates infrared emission film and beats in common color phase machine core
On piece, another part light refraction is in pentaprism reflection unit, through the reflection of pentaprism reflection unit in infrared emission, this
Some light is received by infrared emission by TOF depth camera chip.
Light penetrates optical lens, passes through pentaprism device through the light of optical lens, has on pentaprism device infrared
Visible light and infrared light are separated into two-way by transmitting and infrared emission film, infrared emission film；Infrared anaclasis is in infrared hair all the way
It penetrates, is received by TOF depth camera chip, another way visible light penetrates infrared emission film and connect by common color camera chip
It receives.
Amici prism includes pentaprism device；By infrared emission film infrared light reflection to the side vertical with visible light
To；Visible light optical path is constant, in the common color camera chip that direction of travel reaches common color camera；Infrared light passes through five
On the TOF depth camera chip for reaching TOF depth camera after two secondary reflection of prism.
Optical lens can penetrate the light of 400nm-950nm, while the optimization of aberration is spectrally carried out at these.
A kind of sensor implementation method having merged depth camera and general camera, contains following steps；
The sensor module of integrated two kinds of cameras, optically carries out optical center alignment, and two sets of optical systems of integration arrive
In a set of optical system, the acquisition of depth image and the acquisition of ordinary optical image are realized by a set of optical system.
Light penetrates the infrared emission film that optical lens passes through optical system, and a part of light penetrates infrared emission film and beats
In common color camera chip, another part light refraction is existed in pentaprism reflection unit by the reflection of pentaprism reflection unit
In infrared emission, this some light is received by infrared emission by TOF depth camera chip.
Through optical lens light by the pentaprism device of optical system, have infrared emission and red on pentaprism device
Visible light and infrared light are separated into two-way by outer transmitting film, infrared emission film；Infrared anaclasis passes through in infrared emission all the way
TOF depth camera chip receives, and another way visible light penetrates infrared emission film and received by common color camera chip.
The infrared emission film of optical system is infrared light reflection to the direction vertical with visible light；Visible light optical path is constant,
In the common color camera chip that direction of travel reaches common color camera；Infrared light reaches after passing through two secondary reflection of pentaprism
On the TOF depth camera chip of TOF depth camera.
The present invention provide it is a kind of be integrated with the sensor module of two kinds of cameras, can reduce integral sensors mould group feelings
Under condition, outer ginseng calibration is exempted from realization, optically carries out optical center alignment.Novel depth color sensor mould group is not blind
Area, while not needing computing resource needed for rear end provides pixel alignment.
The present invention solves the problems, such as the optical calibrating and alignment of two kinds of mould groups by optical design.Improve mould group
Integrated level and external computational efficiency.
It is an advantage of the invention that being realized by a set of optical system deep in two sets of optical systems to a set of optical system of integration
Spend the acquisition of image and the acquisition of ordinary optical image.
It is had the following advantages relative to traditional method:
Optical system and whole structural system are more compact, and two sensor chips share same camera lens, and cost is lower,
Avoid the process of calibration；The computing resource outside consumption is not needed.
Detailed description of the invention
In order to more clearly explain the embodiment of the invention or the technical proposal in the existing technology, to embodiment or will show below
There is attached drawing needed in technical description to be briefly described, it should be apparent that, the accompanying drawings in the following description is only this
Some embodiments of invention for those of ordinary skill in the art without creative efforts, can be with
It obtains other drawings based on these drawings.As schemed wherein:
Fig. 1 is structural schematic diagram one of of the invention.
Fig. 2 is two structural schematic diagrams of the invention.
Fig. 3 is three structural schematic diagrams of the invention.
Fig. 4 is one of the structure of prior art schematic diagram.
Fig. 5 is two schematic diagrames of the structure of the prior art.
Fig. 6 is control circuit schematic diagram of the invention.
Present invention will be further explained below with reference to the attached drawings and examples.
Specific embodiment
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation description, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.It is based on
Embodiment in the present invention, it is obtained by those of ordinary skill in the art without making creative efforts every other
Embodiment shall fall within the protection scope of the present invention.
Embodiment 1: shown in as shown in Figure 1, Figure 2, Fig. 3 and Fig. 6, a kind of sensor having merged depth camera and general camera,
Including optical lens 2, Amici prism 3, sensitive chip and electronic circuit, integrated support 1.
Optical lens 2, Amici prism 3, sensitive chip and electronic circuit are separately fixed in integrated support 1.
Optical lens 2 can penetrate the light of 400nm-950nm, while the optimization of aberration etc. is spectrally carried out at these.
For Amici prism 3 it will be seen that light and infrared light are separated into two-way, Amici prism 3 includes spectroscope and prism.
Sensitive chip includes TOF depth camera chip 5 and common color camera chip 4, TOF depth camera chip 5 and general
Logical color camera chip 4 is prior art products.
The power supply circuit of electronic circuit is provided to infrared light supply, TOF depth camera chip 5 and common color camera chip 4
Power supply, TOF depth camera chip 5 and common color camera chip 4, which receive control signal respectively and send data, is transferred to mould group
External interface.
Embodiment 2: shown in as shown in Figure 1, Figure 2, Fig. 3 and Fig. 6, a kind of sensor having merged depth camera and general camera,
Including optical lens 2, Amici prism 3, sensitive chip and electronic circuit, integrated support 1.
Optical lens 2, Amici prism 3, sensitive chip and electronic circuit are separately fixed in integrated support 1.Or it is whole
1 connection support optical lens 2 of support, light splitting optical path 3, sensitive chip and electronic circuit.
Optical lens 2 can penetrate the light of 400nm-950nm, while the optimization of aberration etc. is spectrally carried out at these.
For Amici prism 3 it will be seen that light and infrared light are separated into two-way, Amici prism 3 includes spectroscope and prism.
Sensitive chip includes TOF depth camera chip 5 and common color camera chip 4, TOF depth camera chip 5 and general
Logical color camera chip 4 is prior art products.
The power supply circuit of electronic circuit is provided to infrared light supply, TOF depth camera chip 5 and common color camera chip 4
Power supply, TOF depth camera chip 5 and common color camera chip 4, which receive control signal respectively and send data, is transferred to mould group
External interface.
Optical lens: TOF depth camera generallys use infrared light, and spectrum is generally all used between 850nm-950nm
Narrow-band, such as 918nm.Common color camera uses visible light, and spectrum is between 400nm-760nm.Optical lens 2 needs together
When through 400nm-950nm light, while spectrally carrying out at these optimization of aberration etc..
Visible light and infrared light are separated into two-way by Amici prism 3.Amici prism 3 is filled comprising combined prism in this scheme
It sets.Infrared light reflection is gone back using infrared reflection film in the place of two lens interfaces, it is seen that light part can penetrate, and reach general
On the sensitive chip of logical color camera；Infrared light is reached on the sensitive chip of TOF depth camera by reflection twice.
As shown in Fig. 2, combined prism device includes infrared emission 6 and pentaprism reflection unit 7, infrared emission 6 and five ribs
Mirror reflection unit 7 is located at the place of lens interface, and light penetrates optical lens 2 and passes through infrared emission film 8, a part of light
It penetrates infrared emission film 8 to beat in common color camera chip 4, another part light refraction passes through in pentaprism reflection unit 7
Pentaprism reflection unit 7 reflects in infrared emission 6, this some light is by infrared emission 6 by TOF depth camera chip 5
It receives.
Embodiment 3: as shown in Figure 1, Figure 2, Figure 3 shows, a kind of sensor having merged depth camera and general camera includes four
Part: optical lens, light splitting optical path, sensitive chip and electronic circuitry part, integrated support structure part, structure is such as embodiment
1 and embodiment 2.
As shown in figure 3, light penetrates optical lens 2, pass through pentaprism device 9, pentaprism through the light of optical lens 2
There are infrared emission 6 and infrared emission film 8 on device 9, visible light and infrared light are separated into two-way by infrared emission film 8.It is red all the way
Outer anaclasis in infrared emission 6, by TOF depth camera chip 5 receive, another way visible light penetrate infrared emission film 8 by
Common color camera chip 4 receives.
Amici prism 3 includes pentaprism device 9.By infrared emission film 8 infrared light reflection to and visible light it is vertical
Direction.Visible light optical path is constant, in the common color camera chip 4 that direction of travel reaches common color camera.Infrared light is logical
It crosses after two secondary reflection of pentaprism on the TOF depth camera chip 5 for reaching TOF depth camera.
The foregoing is merely illustrative of the preferred embodiments of the present invention, is not intended to limit the invention, all in essence of the invention
Made any modifications, equivalent replacements, and improvements etc., should all be included in the protection scope of the present invention within mind and principle.
Claims (9)
1. a kind of sensor for having merged depth camera and general camera, it is characterised in that including optical lens, Amici prism, sense
Optical chip and electronic circuit, integrated support；Optical lens, Amici prism, sensitive chip and electronic circuit are separately fixed at entirety
In support；Amici prism includes spectroscope and prism；Sensitive chip includes TOF depth camera chip and common color phase machine core
Piece；The power supply circuit of electronic circuit provides power supply, TOF to infrared light supply, TOF depth camera chip and common color camera chip
Depth camera chip and common color camera chip, which receive control signal respectively and send data, is transferred to mould group external interface.
2. a kind of sensor for having merged depth camera and general camera according to claim 1, it is characterised in that light splitting
Visible light and infrared light are separated into two-way by prism；Amici prism includes combined prism device；Combined prism device includes infrared
Transmitting and pentaprism reflection unit, infrared emission and pentaprism reflection unit are located at the place of lens interface, and light penetrates
Optical lens is penetrated infrared emission film and is beaten in common color camera chip by infrared emission film, a part of light, another portion
Light splitter refraction is in pentaprism reflection unit, through the reflection of pentaprism reflection unit in infrared emission, this some light warp
Infrared emission is crossed to be received by TOF depth camera chip.
3. a kind of sensor for having merged depth camera and general camera according to claim 1, it is characterised in that light
Optical lens is penetrated, passes through pentaprism device through the light of optical lens, has infrared emission and infrared hair on pentaprism device
Film is penetrated, visible light and infrared light are separated into two-way by infrared emission film；Infrared anaclasis passes through TOF in infrared emission all the way
Depth camera chip receives, and another way visible light penetrates infrared emission film and received by common color camera chip.
4. a kind of sensor for having merged depth camera and general camera according to claim 1, it is characterised in that light splitting
Prism includes pentaprism device；By infrared emission film infrared light reflection to the direction vertical with visible light；Visible light optical path
It is constant, in the common color camera chip that direction of travel reaches common color camera；Infrared light passes through two secondary reflection of pentaprism
On the TOF depth camera chip for reaching TOF depth camera afterwards.
5. a kind of sensor for having merged depth camera and general camera according to claim 1, it is characterised in that optics
Camera lens can penetrate the light of 400nm-950nm, while the optimization of aberration is spectrally carried out at these.
6. a kind of sensor implementation method for having merged depth camera and general camera, it is characterised in that contain following steps；
The sensor module of integrated two kinds of cameras, optically carries out optical center alignment, and two sets of optical systems of integration are to a set of
In optical system, the acquisition of depth image and the acquisition of ordinary optical image are realized by a set of optical system.
7. a kind of sensor implementation method for having merged depth camera and general camera according to claim 6, feature
It is that light penetrates the infrared emission film that optical lens passes through optical system, a part of light penetrates infrared emission film and beats common
On color camera chip, another part light refraction is reflected by pentaprism reflection unit infrared in pentaprism reflection unit
In transmitting, this some light is received by infrared emission by TOF depth camera chip.
8. a kind of sensor implementation method for having merged depth camera and general camera according to claim 6, feature
It is to pass through the pentaprism device of optical system through the light of optical lens, has infrared emission and infrared hair on pentaprism device
Film is penetrated, visible light and infrared light are separated into two-way by infrared emission film；Infrared anaclasis passes through TOF in infrared emission all the way
Depth camera chip receives, and another way visible light penetrates infrared emission film and received by common color camera chip.
9. a kind of sensor implementation method for having merged depth camera and general camera according to claim 6, feature
It is the infrared emission film of optical system infrared light reflection to the direction vertical with visible light；Visible light optical path is constant, along row
In the common color camera chip for reaching common color camera into direction；Infrared light reaches TOF after passing through two secondary reflection of pentaprism
On the TOF depth camera chip of depth camera.
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Cited By (5)
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| CN110798675A (en) * | 2019-12-16 | 2020-02-14 | 宁波为森智能传感技术有限公司 | Camera module |
| CN111458890A (en) * | 2020-04-12 | 2020-07-28 | 国科天成（北京）科技有限公司 | True-color double-light night vision device system and implementation method |
| CN112907559A (en) * | 2021-03-16 | 2021-06-04 | 湖北工程学院 | Monocular camera-based depth map generation device and method |
| CN113687369A (en) * | 2021-07-14 | 2021-11-23 | 南京大学 | Synchronous acquisition system and method for spectral information and depth information |
| WO2021238389A1 (en) * | 2020-05-29 | 2021-12-02 | Oppo广东移动通信有限公司 | Optical module and electronic apparatus |
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