CN110518150B - Display substrate, manufacturing method thereof and display device - Google Patents
Display substrate, manufacturing method thereof and display device Download PDFInfo
- Publication number
- CN110518150B CN110518150B CN201910844152.2A CN201910844152A CN110518150B CN 110518150 B CN110518150 B CN 110518150B CN 201910844152 A CN201910844152 A CN 201910844152A CN 110518150 B CN110518150 B CN 110518150B
- Authority
- CN
- China
- Prior art keywords
- packaging
- layer
- area
- display
- flexible substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/844—Encapsulations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/1201—Manufacture or treatment
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Electroluminescent Light Sources (AREA)
Abstract
The application discloses a display substrate, a manufacturing method thereof and a display device. The display substrate comprises a flexible substrate, a plurality of pixel islands are arranged on the flexible substrate in a spaced array mode, each pixel island comprises a display area and a packaging area surrounding the display area, a first packaging layer and a second packaging layer are sequentially formed on one side, back to the flexible substrate, of each pixel island, the first packaging layer is a transparent packaging layer, and the second packaging layer is a metal packaging layer. A display device includes a display substrate. The manufacturing approach of the display base plate, provide a flexible substrate; forming a plurality of pixel islands of a spaced array on a flexible substrate, the pixel islands including a display area and an encapsulation area surrounding the display area; forming a first encapsulation layer in the encapsulation area of each pixel island; and forming a second packaging layer on one side of the flexible substrate, wherein the first packaging layer is formed on the flexible substrate, the second packaging layer is a patterned metal packaging film layer, and the second packaging layer covers the edge area of the first packaging layer and a packaging area around the edge area. The resolution of the display device can be improved.
Description
Technical Field
The invention relates to the technical field of display, in particular to the technical field of flexible display, and particularly relates to a display substrate, a manufacturing method of the display substrate and a display device.
Background
Organic Light Emitting Diode (OLED) has become the mainstream of the display field due to its excellent properties such as low power consumption, high color saturation, wide viewing angle, thin thickness, and flexibility, and can be widely applied to terminal products such as smart phones, tablet computers, and televisions. Among them, flexible OLED products are the most prominent, and gradually become the mainstream of OLED display because they can satisfy various special structures. With the development of flexible technology, the requirements on the flexibility of the device are gradually increased from bending (Bendable), bending (Foldable), and gradually transitioning to elastic flexibility (Stretchable). Elastically flexible devices have entered the field of vision of large people.
In the prior stretchable device, an island-bridge-vacancy structure is generally adopted. Whereas in the island-bridge-void configuration, each island needs to be individually encapsulated. The existing island packaging mode is pure inorganic packaging, and the packaging area of the pure inorganic packaging occupies a larger proportion of the island, so that the proportion of the display area is reduced, and the resolution ratio is insufficient.
Disclosure of Invention
In view of the above-mentioned drawbacks and deficiencies of the prior art, it is desirable to provide a display substrate, a method of manufacturing the same, and a display device, which reduce the length of the package area.
In a first aspect, the display substrate of the present invention includes a flexible substrate, a plurality of pixel islands are arranged on the flexible substrate at intervals, each pixel island includes a display area and a packaging area surrounding the display area, a first packaging layer and a second packaging layer are sequentially formed on one side of the pixel island facing away from the flexible substrate, the first packaging layer covers the display area and the packaging area located at the edge of the display area, the second packaging layer covers the edge area of the first packaging layer and the packaging area located around the edge area, the first packaging layer is a transparent packaging layer, and the second packaging layer is a metal packaging layer.
In a second aspect, the display device of the present invention includes a display substrate.
In a third aspect, a method for manufacturing a display substrate of the present invention includes:
providing a flexible substrate;
forming a plurality of pixel islands of a spaced array on the flexible substrate, wherein the pixel islands include a display area and an encapsulation area surrounding the display area;
forming a first packaging layer on one side, opposite to the flexible substrate, of each pixel island, wherein the first packaging layer covers the display area and the packaging area located at the edge of the display area, and the first packaging layer is a transparent packaging layer;
and forming a second packaging layer on one side of the flexible substrate on which the first packaging layer is formed, wherein the second packaging layer is a patterned metal packaging film layer, and the second packaging layer covers the edge area of the first packaging layer and the packaging area around the edge area.
According to the technical scheme that this application embodiment provided, through setting up the second encapsulated layer into the metal encapsulation layer, improved display substrate's packaging strength, for pure inorganic encapsulation, when guaranteeing that packaging strength is the same, can reduce the length in encapsulation district to reduce the proportion of the shared pixel island in encapsulation district, also improve the proportion of the shared pixel island in display area, thereby improve display device's resolution ratio, can solve the not enough problem of current device resolution ratio of can stretching.
Drawings
Other features, objects and advantages of the present application will become more apparent upon reading of the following detailed description of non-limiting embodiments thereof, made with reference to the accompanying drawings in which:
FIG. 1 is a schematic structural diagram of a display substrate according to an embodiment of the invention;
fig. 2 is a schematic structural diagram of a flexible substrate, a first encapsulation layer and a second encapsulation layer of a display substrate according to an embodiment of the present invention;
fig. 3 is a schematic structural diagram of the display substrate according to the embodiment of the present invention, in which the inorganic film layer provided with the groove, the first encapsulation layer, and the second encapsulation layer are combined;
FIG. 4 is a schematic structural diagram illustrating a distribution of grooves on an inorganic encapsulation film of a display substrate according to an embodiment of the present invention;
fig. 5 is a schematic structural diagram of another distribution of the grooves on the inorganic encapsulation film of the display substrate according to the embodiment of the invention.
Detailed Description
The present application will be described in further detail with reference to the following drawings and examples. It is to be understood that the specific embodiments described herein are merely illustrative of the relevant invention and not restrictive of the invention. It should be noted that, for convenience of description, only the portions related to the present invention are shown in the drawings.
It should be noted that the embodiments and features of the embodiments in the present application may be combined with each other without conflict. The present application will be described in detail below with reference to the embodiments with reference to the attached drawings.
In one embodiment of the present invention, referring to fig. 1, a display substrate includes a flexible substrate 10, a plurality of pixel islands 20 are arranged on the flexible substrate 10 at intervals, each pixel island 20 includes a display area 21 and a package area 22 surrounding the display area 21, a first package layer 23 and a second package layer 24 are sequentially formed on a side of the pixel island 20 facing away from the flexible substrate 10, the first package layer 23 covers the display area 21 and the package area 22 located at an edge of the display area 21, the second package layer 24 covers an edge area of the first package layer 23 and the package area 22 located at a periphery of the edge area, the first package layer 23 is a transparent package layer, and the second package layer 24 is a metal package layer.
In an embodiment of the invention, the first encapsulation layer is an inorganic encapsulation layer, and the second encapsulation layer is a metal encapsulation layer. The metal packaging layer has better bonding effect relative to the inorganic packaging layer, has less defects of pinholes and the like, and can improve the packaging strength. Compared with pure inorganic packaging, the length of the packaging area can be reduced while the packaging strength is ensured to be the same, so that the proportion of the packaging area to the pixel island is reduced, namely the proportion of the display area to the pixel island is improved. In the pixel island with the same area, a display area with a larger area can be obtained by adopting a composite packaging mode of a metal packaging layer and an inorganic packaging layer, so that the resolution of the display device is improved, the display device obtains a better display effect, and the user experience is improved. The first packaging layer covers the display area and the packaging area located at the edge of the display area, the first packaging layer is a transparent packaging layer, the display area can display normally, the second packaging layer covers the edge area of the first packaging layer and the packaging area located around the edge area, the packaging effect of the first packaging layer and the second packaging layer can be guaranteed, and the reliability of the display substrate is improved.
Referring to fig. 2, further, the second encapsulation layer 24 includes a first encapsulation portion 241 and a second encapsulation portion 242, the first encapsulation portion 241 is located on a side of the first encapsulation layer 23 facing away from the flexible substrate 10, and a region of the encapsulation region 22 where the first encapsulation layer 23 is not located is formed with the second encapsulation portion 242.
In the embodiment of the invention, the first packaging part is positioned on one side of the first packaging layer, which is opposite to the flexible substrate, so that the packaging effect of the first packaging layer and the second packaging layer can be ensured, and the reliability of the display substrate is improved. And a second packaging part is formed in the region without the first packaging layer in the packaging region. That is to say, the second encapsulating layer can cover the edge that first encapsulating layer kept away from display area one side and fill up the region that does not cover first encapsulating layer in the encapsulating area, the inside degree of difficulty that has improved steam and has got into display substrate from the edge that first encapsulating layer kept away from display area one side, the inside possibility that steam enters into display substrate from the edge that first encapsulating layer kept away from display area one side has been reduced, the encapsulation effect of first encapsulating layer and second encapsulating layer has been guaranteed, display substrate has been protected effectively, display substrate's reliability has been improved.
Referring to fig. 3, further, the flexible substrate 10 is formed with an inorganic film layer 11, the inorganic film layer 11 is located between the flexible substrate 10 and the first encapsulation layer 23, a side of the inorganic film layer 11 facing away from the flexible substrate 10 is formed with a groove 12, and the groove 12 is located in the encapsulation region 22.
In the embodiment of the invention, a buffer layer, an active layer, a first gate insulating layer, a first gate layer, a second gate insulating layer, a second gate layer, a spacing layer, a source drain layer, a planarization layer, an anode layer, a pixel definition layer, a supporting layer and the like are sequentially formed on a flexible substrate, and the manufacturing of an array structure is completed on the flexible substrate. The inorganic film layer may include, but is not limited to, a buffer layer, a first gate insulating layer, a second gate insulating layer, an intermediate dielectric layer, and the like. The specific content of the inorganic film layer may vary according to the structure of the array. The groove is formed in the inorganic film layer, so that influence on the display substrate can be reduced. Set up the recess in the region that corresponds with the encapsulated area on inorganic rete, when inorganic rete forms first encapsulated layer and second encapsulated layer in the one side of flexible substrate dorsad, first encapsulated layer and second encapsulated layer can produce the undulation in the recess region, the effective encapsulation length of first encapsulated layer and second encapsulated layer can increase, can improve the encapsulation intensity and the encapsulation effect of first encapsulated layer and second encapsulated layer, further reduce the length of encapsulated area, thereby reduce the proportion of the shared pixel island in encapsulated area, improve the proportion of the shared pixel island in display area, thereby improve display device's resolution ratio. Meanwhile, at the position where the groove is arranged, water vapor is more difficult to enter the inside of the display substrate from the first packaging layer and the second packaging layer.
Further, the effective package length along the first direction 25 in the package region 22 is equal, and the first direction 22 is a direction from the inside of the display region 21 to the outside of the display region 21 and perpendicular to the package region 22.
In the embodiment of the present invention, referring to fig. 4, the effective package length at a certain position in the package region is taken as a path length of the first package layer in the cross section, and the effective package length of the second package layer in the package region is taken as a path length of the second package layer in the cross section, where the package region is taken along the first direction, that is, the package region is taken along a direction from the inside of the display region to the outside of the display region and perpendicular to the package region.
When the grooves are formed in the local part of the inorganic film layer, the packaging lengths and the packaging strengths of the first packaging layer and the second packaging layer are increased at the positions corresponding to the grooves, however, the packaging lengths and the packaging strengths of the first packaging layer and the second packaging layer are not changed in the areas where the grooves are not formed, and the possibility that water vapor enters the interior of the display substrate is high in the areas where the grooves are not formed, namely, the reliability of the display substrate is not obviously improved. Guarantee in the encapsulation district along the effective encapsulation length of first direction equal or equal, guarantee that inorganic rete can set up the recess on certain first direction promptly, also can set up the recess on another first direction, the position of recess on inorganic rete can change, as long as guarantee that effective encapsulation length equals or equal can, can increase the effective encapsulation length in encapsulation district on the whole to improve display substrate's reliability.
Referring to fig. 4 and 5, further, in the first direction 25, the inorganic film layer 11 is formed with a plurality of grooves 12 disposed at intervals.
In the embodiment of the invention, the plurality of grooves are arranged in the first direction, so that the difficulty of water vapor entering the display substrate from the first packaging layer and the second packaging layer is further improved. The effective encapsulation length and the encapsulation strength of the first encapsulation layer and the second encapsulation layer are further increased, and the length of the encapsulation area is further reduced, so that the proportion of the encapsulation area to the pixel island is reduced, the proportion of the display area to the pixel island is improved, and the resolution of the display device is improved.
Referring to fig. 5, further, in a second direction 26, the inorganic film layer 11 is formed with a plurality of grooves 12 arranged at intervals, and the second direction 26 is perpendicular to the first direction 25.
In the embodiment of the invention, in the second direction, the grooves are arranged at intervals, after a certain groove is invaded by water vapor, the first packaging layer or the second packaging layer formed in the groove can block the water vapor, and the water vapor can not invade nearby grooves quickly, fig. 5 shows that the grooves which are connected together in the second direction relative to fig. 4 are arranged at intervals in the second direction, and the grooves arranged at intervals can reduce the spreading speed of the water vapor and improve the reliability of the display substrate.
Further, the depth of the groove 12 is 5-80% of the thickness of the inorganic film layer.
In the embodiment of the invention, the depth of the groove is 5-80% of the thickness of the inorganic film layer, but not limited to, the depth of the groove is 30-60% of the thickness of the inorganic film layer. The effective encapsulation length and encapsulation strength of the first encapsulation layer and the second encapsulation layer can be increased on the premise that the grooves formed on the inorganic film layer do not influence other structures of the display substrate, and the reliability of the display substrate is guaranteed.
Further, the second encapsulation layer 24 is reused as a touch layer.
In the embodiment of the invention, the metal packaging layer can be reused as a touch layer to realize a touch function. Generally, a bridge is arranged between adjacent pixel islands, a conductive wire is arranged in the bridge, the adjacent pixel islands are electrically connected through the conductive wire, and the metal packaging layers on the plurality of pixel islands can be electrically connected through the conductive wire to form a metal grid for touch control. The metal packaging layer is reused as the touch layer, and when the display device is required to realize a touch function, the touch layer is not required to be additionally arranged, so that the structure of the display device is simplified, the processing difficulty of the display device is reduced, and the production and manufacturing cost of the display device is reduced.
Another embodiment of the present invention is a display device including a display substrate.
In an embodiment of the invention, the first encapsulation layer is an inorganic encapsulation layer, and the second encapsulation layer is a metal encapsulation layer. The metal packaging layer has better bonding effect relative to the inorganic packaging layer, has less defects of pinholes and the like, and can improve the packaging strength. Compared with pure inorganic packaging, the length of the packaging area can be reduced while the packaging strength is ensured to be the same, so that the proportion of the packaging area to the pixel island is reduced, and the proportion of the display area to the pixel island is improved. In other words, in the pixel islands with the same area, a display area with a larger area can be obtained by adopting a composite packaging mode of the metal packaging layer and the inorganic packaging layer, so that the resolution of the display device is improved, the display device obtains a better display effect, and the user experience is improved. The second packaging layer is at least partially positioned on one side of the first packaging layer, which is opposite to the flexible substrate, so that the packaging effect of the first packaging layer and the second packaging layer can be ensured, and the reliability of the display device is improved.
Another embodiment of the present invention is a method for manufacturing a display substrate, referring to fig. 1, including the steps of:
providing a flexible substrate 10;
forming a plurality of pixel islands 20 in a spaced array on a flexible substrate 10, wherein the pixel islands 20 include a display area 21 and an encapsulation area 22 surrounding the display area 21;
forming a first packaging layer 23 on a side of each pixel island 20 opposite to the flexible substrate 10, wherein the first packaging layer 23 covers the display area 21 and the packaging area 22 at the edge of the display area 21, and the first packaging layer 23 is a transparent packaging layer;
and forming a second packaging layer 24 on the flexible substrate 10 at the side where the first packaging layer 23 is formed, wherein the second packaging layer 24 is a patterned metal packaging film layer, and the second packaging layer 24 covers the edge area of the first packaging layer 23 and the packaging area 22 around the edge area.
In the embodiment of the invention, a buffer layer, an active layer, a first gate insulating layer, a first gate layer, a second gate insulating layer, a second gate layer, a spacing layer, a source drain layer, a planarization layer, an anode layer, a pixel definition layer, a supporting layer and the like are sequentially formed on a flexible substrate, and the manufacturing of an array structure is completed on the flexible substrate. Then, EL (electroluminescence) evaporation is completed. The encapsulation area of the pixel island is typically at the edge portion of the pixel island. A first encapsulation layer is formed in the encapsulation region, which may be, but is not limited to, an inorganic encapsulation layer. After the first packaging layer is formed, the patterned metal packaging film layer, namely the second packaging layer, is formed continuously. The patterned metal packaging film layer can be directly formed by deposition in an FMM Mask mode; or depositing the metal packaging film layer first and then patterning the metal packaging film layer to obtain a patterned metal packaging film layer. The patterning process may be, but is not limited to, performing a photolithography, etching, ashing, or stripping process.
The above description is only a preferred embodiment of the application and is illustrative of the principles of the technology employed. It will be appreciated by a person skilled in the art that the scope of the invention as referred to in the present application is not limited to the embodiments with a specific combination of the above-mentioned features, but also covers other embodiments with any combination of the above-mentioned features or their equivalents without departing from the inventive concept. For example, the above features may be replaced with (but not limited to) features having similar functions disclosed in the present application.
Claims (7)
1. A display substrate is characterized by comprising a flexible substrate, wherein a plurality of pixel islands are arranged on the flexible substrate at intervals in an array mode, each pixel island comprises a display area and a packaging area surrounding the display area, a first packaging layer and a second packaging layer are sequentially formed on one side, back to the flexible substrate, of each pixel island, the first packaging layer covers the display area and the packaging area located at the edge of the display area, the second packaging layer covers the edge area of the first packaging layer and the packaging area located around the edge area, the first packaging layer is a transparent packaging layer, and the second packaging layer is a metal packaging layer;
an inorganic film layer is formed on the flexible substrate and is positioned between the flexible substrate and the first packaging layer, a groove is formed on one side, back to the flexible substrate, of the inorganic film layer, and the groove is positioned in the packaging area;
the effective packaging lengths in the packaging areas along a first direction are equal, and the first direction is a direction from the inside of the display area to the outside of the display area and is perpendicular to the packaging areas;
and a bridge is arranged between the adjacent pixel islands, a conductive wire is arranged in the bridge, the second packaging layers are reused as touch control layers, and the second packaging layers on the plurality of pixel islands are electrically connected through the conductive wire to form a metal grid for touch control.
2. The display substrate according to claim 1, wherein the second encapsulation layer comprises a first encapsulation portion and a second encapsulation portion, the first encapsulation portion is located on a side of the first encapsulation layer facing away from the flexible substrate, and the second encapsulation portion is formed in a region of the encapsulation region where the first encapsulation layer is not located.
3. The display substrate according to claim 1, wherein the inorganic film layer is formed with a plurality of the grooves arranged at intervals in the first direction.
4. The display substrate of claim 1, wherein the inorganic film layer is formed with a plurality of the grooves spaced apart in a second direction, the second direction being perpendicular to the first direction.
5. The display substrate of claim 1, wherein the groove depth is 5-80% of the thickness of the inorganic film layer.
6. A display device comprising the display substrate according to any one of claims 1 to 5.
7. A method for manufacturing a display substrate is characterized by comprising the following steps:
providing a flexible substrate;
forming a plurality of pixel islands of a spaced array on the flexible substrate, wherein the pixel islands include a display area and an encapsulation area surrounding the display area;
forming a first packaging layer on one side, opposite to the flexible substrate, of each pixel island, wherein the first packaging layer covers the display area and the packaging area located at the edge of the display area, and the first packaging layer is a transparent packaging layer;
forming a second packaging layer on one side of the flexible substrate, where the first packaging layer is formed, wherein the second packaging layer is a patterned metal packaging film layer, and covers an edge area of the first packaging layer and the packaging area around the edge area; wherein the content of the first and second substances,
an inorganic film layer is formed on the flexible substrate and is positioned between the flexible substrate and the first packaging layer, a groove is formed on one side, back to the flexible substrate, of the inorganic film layer, and the groove is positioned in the packaging area;
the effective packaging lengths in the packaging areas along a first direction are equal, and the first direction is a direction from the inside of the display area to the outside of the display area and is perpendicular to the packaging areas;
and a bridge is arranged between the adjacent pixel islands, a conductive wire is arranged in the bridge, the second packaging layers are reused as touch control layers, and the second packaging layers on the plurality of pixel islands are electrically connected through the conductive wire to form a metal grid for touch control.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910844152.2A CN110518150B (en) | 2019-09-06 | 2019-09-06 | Display substrate, manufacturing method thereof and display device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910844152.2A CN110518150B (en) | 2019-09-06 | 2019-09-06 | Display substrate, manufacturing method thereof and display device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN110518150A CN110518150A (en) | 2019-11-29 |
| CN110518150B true CN110518150B (en) | 2022-04-26 |
Family
ID=68631601
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910844152.2A Active CN110518150B (en) | 2019-09-06 | 2019-09-06 | Display substrate, manufacturing method thereof and display device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110518150B (en) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111029484B (en) * | 2019-12-20 | 2022-07-01 | 上海天马微电子有限公司 | Display panel and display device |
| CN111162197B (en) * | 2020-01-02 | 2023-02-03 | 京东方科技集团股份有限公司 | Display substrate, preparation method thereof and display device |
| CN111525047A (en) * | 2020-05-08 | 2020-08-11 | 京东方科技集团股份有限公司 | Display substrate, preparation method thereof and display device |
| CN111916484B (en) * | 2020-07-27 | 2022-09-13 | 昆山国显光电有限公司 | Display panel and preparation method thereof |
| CN113471223B (en) * | 2021-07-05 | 2024-05-24 | 京东方科技集团股份有限公司 | Display substrate and display device |
| CN114665041A (en) * | 2022-03-16 | 2022-06-24 | 深圳市华星光电半导体显示技术有限公司 | Display panel and preparation method thereof |
| CN115275052B (en) * | 2022-07-26 | 2023-09-26 | 武汉华星光电半导体显示技术有限公司 | Display panel and display device |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104750285A (en) * | 2013-12-27 | 2015-07-01 | 昆山工研院新型平板显示技术中心有限公司 | Touch display device and preparation method thereof |
| CN205609529U (en) * | 2016-01-20 | 2016-09-28 | 上海天马微电子有限公司 | Compound encapsulating film and flexible display |
| CN107046051A (en) * | 2017-04-19 | 2017-08-15 | 上海天马有机发光显示技术有限公司 | A kind of manufacture method of display panel, display device and display panel |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100466328C (en) * | 2003-10-29 | 2009-03-04 | 铼宝科技股份有限公司 | Organic light-emitting display panel |
| KR101926526B1 (en) * | 2016-06-30 | 2018-12-10 | 엘지디스플레이 주식회사 | Organic light emitting display and fabricating method thereof |
| KR102066099B1 (en) * | 2016-07-29 | 2020-01-14 | 엘지디스플레이 주식회사 | Organic light emitting display and fabricating method thereof |
| KR20180076688A (en) * | 2016-12-28 | 2018-07-06 | 엘지디스플레이 주식회사 | Display device |
| US20180308902A1 (en) * | 2017-04-19 | 2018-10-25 | Superc-Touch Corporation | Oled touch display device |
| CN108198953B (en) * | 2018-02-13 | 2019-09-10 | 武汉华星光电半导体显示技术有限公司 | OLED encapsulation method and OLED encapsulating structure |
| CN110277424B (en) * | 2018-03-14 | 2021-08-17 | 昆山工研院新型平板显示技术中心有限公司 | Stretchable display device, manufacturing method thereof and electronic equipment |
| CN109256481B (en) * | 2018-08-30 | 2020-09-11 | 云谷（固安）科技有限公司 | Display panel and display device |
| CN109390359B (en) * | 2018-10-25 | 2021-02-09 | 京东方科技集团股份有限公司 | Display substrate, manufacturing method thereof and display device |
| CN109491159B (en) * | 2018-11-21 | 2022-02-08 | 厦门天马微电子有限公司 | Array substrate and display panel |
| CN109920334B (en) * | 2019-03-27 | 2021-04-27 | 京东方科技集团股份有限公司 | Array substrate and display device |
-
2019
- 2019-09-06 CN CN201910844152.2A patent/CN110518150B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104750285A (en) * | 2013-12-27 | 2015-07-01 | 昆山工研院新型平板显示技术中心有限公司 | Touch display device and preparation method thereof |
| CN205609529U (en) * | 2016-01-20 | 2016-09-28 | 上海天马微电子有限公司 | Compound encapsulating film and flexible display |
| CN107046051A (en) * | 2017-04-19 | 2017-08-15 | 上海天马有机发光显示技术有限公司 | A kind of manufacture method of display panel, display device and display panel |
Also Published As
| Publication number | Publication date |
|---|---|
| CN110518150A (en) | 2019-11-29 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN110518150B (en) | Display substrate, manufacturing method thereof and display device | |
| US11737311B2 (en) | Organic light-emitting display apparatus and fabrication method thereof | |
| US20190024469A1 (en) | Flexible display apparatus and an encapsulation method thereof | |
| US20220263048A1 (en) | Display substrate and method of manufacturing the same, and display apparatus | |
| US9231036B2 (en) | Organic electroluminescence display device | |
| US20220085124A1 (en) | Display panel and method for manufacturing the same, and display apparatus | |
| WO2019019655A1 (en) | Touch control display panel and manufacturing method therefor, and touch control display apparatus | |
| CN108091675B (en) | Display substrate and manufacturing method thereof | |
| US11785821B2 (en) | Display substrate and related device | |
| US10872941B2 (en) | Display panel, manufacture method thereof and display device | |
| CN110491929B (en) | Display substrate, preparation method and display device | |
| US20230049009A1 (en) | Flexible display device and electronic device | |
| US11563064B2 (en) | Array substrate, display device, and method for fabricating an array substrate | |
| US9099404B2 (en) | Array substrate and manufacturing method thereof, OLED display device | |
| KR102651358B1 (en) | Methods of manufacturing a mirror substrate and display devices including the same | |
| JP6359650B2 (en) | Array substrate, display device, and method of manufacturing array substrate | |
| KR102016070B1 (en) | Flexible organic luminescence emitted diode device and method for fabricating the same | |
| US11133488B2 (en) | Display substrate, display apparatus, and method of fabricating display substrate having enclosure ring in buffer area | |
| KR102212764B1 (en) | Organic light emitting display device and method of manufacturing the same | |
| WO2018205587A1 (en) | Display substrate and manufacturing method therefor, and display device | |
| EP3399555B1 (en) | Flexible display apparatus and manufacturing method therefor | |
| CN210926022U (en) | Display substrate and display device | |
| CN110212111B (en) | Display substrate, manufacturing method, display panel and display device | |
| US11974482B2 (en) | Display substrate and related devices | |
| CN114127945B (en) | Organic light-emitting display substrate, manufacturing method thereof and organic light-emitting display device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |