CN110514565A - A kind of chip particulate matter sensors ceramic chip and its manufacturing method - Google Patents
A kind of chip particulate matter sensors ceramic chip and its manufacturing method Download PDFInfo
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- 239000000919 ceramic Substances 0.000 title claims abstract description 85
- 239000013618 particulate matter Substances 0.000 title claims abstract description 76
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 13
- 239000011521 glass Substances 0.000 claims abstract description 72
- 239000000758 substrate Substances 0.000 claims abstract description 54
- 238000010438 heat treatment Methods 0.000 claims abstract description 32
- 238000005259 measurement Methods 0.000 claims abstract description 10
- 210000000548 hind-foot Anatomy 0.000 claims abstract description 7
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical group O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 claims description 36
- 239000002002 slurry Substances 0.000 claims description 27
- 238000007650 screen-printing Methods 0.000 claims description 20
- 238000005245 sintering Methods 0.000 claims description 20
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 14
- 238000002791 soaking Methods 0.000 claims description 14
- 230000005611 electricity Effects 0.000 claims description 8
- RUDFQVOCFDJEEF-UHFFFAOYSA-N yttrium(III) oxide Inorganic materials [O-2].[O-2].[O-2].[Y+3].[Y+3] RUDFQVOCFDJEEF-UHFFFAOYSA-N 0.000 claims description 8
- 239000003381 stabilizer Substances 0.000 claims description 6
- ODINCKMPIJJUCX-UHFFFAOYSA-N calcium oxide Inorganic materials [Ca]=O ODINCKMPIJJUCX-UHFFFAOYSA-N 0.000 claims description 5
- CETPSERCERDGAM-UHFFFAOYSA-N ceric oxide Chemical compound O=[Ce]=O CETPSERCERDGAM-UHFFFAOYSA-N 0.000 claims description 5
- 229910000422 cerium(IV) oxide Inorganic materials 0.000 claims description 5
- 229910052593 corundum Inorganic materials 0.000 claims description 5
- 229910001845 yogo sapphire Inorganic materials 0.000 claims description 5
- 238000005530 etching Methods 0.000 claims description 4
- 239000000463 material Substances 0.000 claims description 4
- 238000005507 spraying Methods 0.000 claims description 4
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 claims description 3
- 238000009413 insulation Methods 0.000 claims description 2
- 239000010410 layer Substances 0.000 description 54
- 238000000034 method Methods 0.000 description 8
- 239000002245 particle Substances 0.000 description 7
- 230000003247 decreasing effect Effects 0.000 description 5
- 238000001514 detection method Methods 0.000 description 5
- 239000002356 single layer Substances 0.000 description 5
- 238000009825 accumulation Methods 0.000 description 4
- 238000009826 distribution Methods 0.000 description 4
- 238000013461 design Methods 0.000 description 3
- 239000011267 electrode slurry Substances 0.000 description 2
- 230000008929 regeneration Effects 0.000 description 2
- 238000011069 regeneration method Methods 0.000 description 2
- 230000035939 shock Effects 0.000 description 2
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 description 1
- 239000012491 analyte Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000010344 co-firing Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 230000003137 locomotive effect Effects 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052573 porcelain Inorganic materials 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000004321 preservation Methods 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 229910052726 zirconium Inorganic materials 0.000 description 1
Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N15/00—Investigating characteristics of particles; Investigating permeability, pore-volume or surface-area of porous materials
- G01N15/06—Investigating concentration of particle suspensions
- G01N15/0656—Investigating concentration of particle suspensions using electric, e.g. electrostatic methods or magnetic methods
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- Biochemistry (AREA)
- General Health & Medical Sciences (AREA)
- General Physics & Mathematics (AREA)
- Immunology (AREA)
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- Investigating Or Analyzing Materials By The Use Of Electric Means (AREA)
Abstract
A kind of chip particulate matter sensors ceramic chip and manufacturing method, the chip includes ceramic substrate, first electrode, second electrode, first insulating glass layer and the second insulating glass layer, first insulating glass layer is formed on the upper surface of ceramic substrate, first electrode and second electrode are formed on the upper surface of the first insulating glass layer, and it is separated between first electrode and second electrode by continuous gap, the front section of first electrode and second electrode exposes outward, enable and changes the resistance value between first electrode and second electrode on the gap that falls at the front section of first electrode and second electrode of particulate matter when measurement, it is covered close to the first electrode of measuring signal output end and the hindfoot portion of second electrode by the second insulating glass layer, first electrode and/or second electrode are also as heating electrode, for by heating to remove Particulate matter.The present invention can propose the efficiency that sensor chip heating removes particulate matter, and facilitating chip structure and its production.
Description
Technical field
The present invention relates to vehicle maintenance service field, especially a kind of chip particulate matter sensors ceramic chip and its manufacture
Method.
Background technique
With increasingly sharpening for environmental problem, the emission regulation of Vehicular exhaust becomes more stringent.Diesel-engine vehicles
Contain a large amount of particulate matter (PM) in the gas of discharge, to reduce discharge quantity of particulate matter, meets existing regulation, diesel particulate mistake
Filter (DPF) is widely used on diesel engine locomotive.Particulate matter sensors are captured in detection diesel particulate filter
Particulate matter quantity while, remove particulate matter by conducting self-heating particulate matter sensors, accomplish Reusability.
Current existing particulate matter sensors, are monolithic multilayer structure mostly, and general use first laminates rear high temperature co-firing
Technique preparation, but structure is complicated for existing particulate matter sensors, and heats the low efficiency of degranulation object, in addition, thermal shock resistance
And intensity etc. is to be improved.
Summary of the invention
It is a primary object of the present invention to overcome the deficiencies of the prior art and provide a kind of chip particulate matter sensors ceramic core
Piece and its manufacturing method, to improve the efficiency that the heating of particulate matter sensors ceramic chip removes particulate matter, and facilitating chip structure
And its production.
To achieve the above object, the invention adopts the following technical scheme:
A kind of chip particulate matter sensors ceramic chip, including ceramic substrate, first electrode, second electrode, the first insulation
Glassy layer and the second insulating glass layer, first insulating glass layer is formed on the upper surface of the ceramic substrate, described
First electrode and the second electrode are formed on the upper surface of first insulating glass layer, and the first electrode and described
It being separated between second electrode by continuous gap, the front section of the first electrode and the second electrode exposes outward,
Enable when measurement particulate matter to fall on the gap at the front section of the first electrode and the second electrode and
Change the resistance value between the first electrode and the second electrode, close to measuring signal output end the first electrode and
The hindfoot portion of the second electrode is covered by second insulating glass layer, and the first electrode and/or second electrode are also made
To heat electrode, for by heating to remove particulate matter.
Further:
First insulating glass layer and/or second insulating glass layer with a thickness of 20~40 μm.
The front end of the front section close to the first electrode and the second electrode of second insulating glass layer is
Arc.
The first electrode and/or second electrode are also used as thermometric electrode, for measuring the temperature of heating.
The ceramic substrate is zirconia ceramics substrate or aluminium oxide ceramic substrate, with a thickness of 200~3000 μm.
The continuous gap is regularly or irregularly snakelike, spiral shape or rectangle, and the width in the gap is 30
~500 μm, it is preferable that the continuous gap includes along the multiple tracks square waveform gap that the length of the ceramic substrate is arranged.
The zirconia ceramics substrate is stably-doped dose of zirconia ceramics substrate, the stabilizer be Y2O3, MgO,
One or more of Al2O3, CaO, CeO2.
A kind of production method of the chip particulate matter sensors ceramic chip, comprising the following steps:
Prepare the ceramic substrate；
First insulating glass layer is formed on the upper surface of the ceramic substrate；
Form the first electrode and the second electrode on the upper surface of first insulating glass layer, described first
It is separated between electrode and the second electrode by continuous gap；
Described in the covering in the first electrode of measuring signal output end and the hindfoot portion of the second electrode
Second insulating glass layer, and the front section of the first electrode and the second electrode exposes outward, so that particle when measurement
Object can fall on the gap at the front section of the first electrode and the second electrode and change first electricity
Resistance value between pole and the second electrode.
Further:
First insulating glass layer and second insulating glass layer are with glass material with silk-screen printing or spraying side
Formula coating, 400 DEG C~1200 DEG C, soaking time 0.1~3.0 hour of sintering temperature.
The first electrode and the second electrode be by Pt slurry, Au slurry, Pd-Au slurry, Pd-Ag slurry one of sintering and
At 800 DEG C~1200 DEG C of sintering temperature；The continuous gap is formed by etching or screen printing mode.
The invention has the following beneficial effects:
Chip particulate matter sensors ceramic chip of the present invention is equipped with two layers of insulating glass, particulate matter in ceramic base plate surface
Detection unit includes the first electrode and second electrode on the same datum level in ceramic substrate, this single layer electrode structure energy
The function of realizing particle concentration detection simultaneously and remove particulate matter from ceramic chip.Compared to traditional particulate matter sensors core
Piece, the present invention can not only quickly and accurately measure the particle concentration in environment, and since single layer electrode structure is in
It between layer glass and is protected by it, the thermal coefficient of glass is low so that heating region temperature is uniform, is conducive to quickly higher
The particulate matter of effect ground burning accumulation, to improve the efficiency of removal particulate matter, the rapid regeneration for promoting particulate matter sensors is used
Performance.Meanwhile chip particulate matter sensors ceramic chip structure of the invention is relatively easy, it is easy that production is got up, and reduces
The cost of manufacture of grain object sensor ceramic chip.
The scheme of the preferred embodiment of the present invention can also obtain further advantage, will be described in detail below.
Detailed description of the invention
Fig. 1 is the dimensional decomposition structure figure of the chip particulate matter sensors ceramic chip of an embodiment of the present invention.
Fig. 2 is the top view of the heating electrode and thermometric electrode of an embodiment of the present invention.
Specific embodiment
It elaborates below to embodiments of the present invention.It is emphasized that following the description is only exemplary,
The range and its application being not intended to be limiting of the invention.
Refering to fig. 1 and Fig. 2, in one embodiment, a kind of chip particulate matter sensors ceramic chip, including ceramic substrate
10, electrode layer 17, the first insulating glass layer 18 and the second insulating glass layer 15, first insulating glass layer 18 are formed in institute
On the upper surface for stating ceramic substrate 10, electrode layer 17 is formed on the upper surface of first insulating glass layer 18, electrode layer 17
Including first electrode 11,12 (label 11 and 12 respectively refers at the both ends of first electrode in figure), (the figure acceptance of the bid of second electrode 13,14
Note 13 and 14 respectively refers at the both ends of second electrode), and between the first electrode 11,12 and the second electrode 13,14 by
Continuous gap 16 separates, the front section of the front section of the first electrode 11,12 and the second electrode 13,14 to
Outer exposure enables particulate matter when measurement to fall in the front section and the second electrode 13,14 of the first electrode 11,12
Front section at the gap 16 on and change the electricity between the first electrode 11,12 and the second electrode 13,14
Resistance value, close to the hindfoot portion of the first electrode 11,12 of measuring signal output end and the back segment of the second electrode 13,14
Part is covered by second insulating glass layer 15, and the first electrode 11,12 and/or second electrode 13,14 are also as heating
Electrode, for by heating to remove particulate matter.
Chip particulate matter sensors ceramic chip of the invention uses 10 overlay electrode layer of single layer chip ceramic substrate and two
The design of layer glassy layer, structure is simple, makes easy, the first electrode 11,12 and second as particulate matter detection unit
Electrode 13,14 is distributed in same level, can be with heated particle while for measuring the particle concentration in measurement environment
Object sensor removes the particulate matter accumulated on sensor.Since electrode is between layer glass, the thermally conductive system of glass is utilized
Number is low so that heating region temperature is uniform, and the particulate matter for the accumulation that is conducive to more efficiently to burn is to remove particulate matter, to be promoted
The rapid regeneration service performances of particulate matter sensors.
In a preferred embodiment, the thickness of first insulating glass layer 18 and/or second insulating glass layer 15
It is 20~40 μm.
In a preferred embodiment, second insulating glass layer 15 close to the first electrode 11,12 and described the
The front end of the front section of two electrodes 13,14 is arc, the arc especially to concave.The heat distribution region of front end heating is presented
Approximate round, cambered design is more advantageous to identical heat distribution, so that the whole heat distribution of the front end of exposure is more preferable.As replacing
Generation, the front end are also possible to rectangle etc..
In a preferred embodiment, the first electrode 11,12 and/or second electrode 13,14 are also used as thermometric electrode, use
In the temperature of measurement heating.The structure design of preferred embodiment can meet heating function, temp sensing function simultaneously and rapidly examine
It surveys particulate matter and removes the function of particulate matter.By the realization of temp sensing function, keep computer heating control more accurate.
In a preferred embodiment, the ceramic substrate 10 be zirconia ceramics substrate or aluminium oxide ceramic substrate, it is described
Ceramic substrate with a thickness of 200~3000 μm.
In a preferred embodiment, the continuous gap 16 be regularly or irregularly snakelike, spiral shape or rectangle,
The width in the gap 16 is 30~500 μm, it is preferable that the continuous gap 16 includes the length along the ceramic substrate 10
The multiple tracks square waveform gap of setting.
In a preferred embodiment, the zirconia ceramics substrate that the zirconia ceramics substrate is stably-doped dose, it is described
Stabilizer is one or more of Y2O3, MgO, Al2O3, CaO, CeO2.The embodiment of the present invention is preferably using described in doping
The zirconia ceramics substrate of stabilizer, can effectively improve chip integral strength and thermal shock resistance.
Refering to fig. 1 and Fig. 2, in another embodiment, a kind of production of the chip particulate matter sensors ceramic chip
Method, comprising the following steps:
Prepare the ceramic substrate 10；
First insulating glass layer 18 is formed on the upper surface of the ceramic substrate 10；
The first electrode 11,12 and the second electrode are formed on the upper surface of first insulating glass layer 18
13,14, it is separated between the first electrode 11,12 and the second electrode 13,14 by continuous gap 16；
Close to the first electrode 11,12 of measuring signal output end and the hindfoot portion of the second electrode 13,14
Upper covering second insulating glass layer 15, and the front section of the first electrode 11,12 and the second electrode 13,14 to
Outer exposure enables particulate matter when measurement to fall in the front section of the first electrode 11,12 and the second electrode 13,14
Change the resistance value between the first electrode 11,12 and the second electrode 13,14 on the gap 16 at place, described the
One electrode 11,12 and/or second electrode 13,14 are also as heating electrode, for by heating to remove particulate matter.
In a preferred embodiment, first insulating glass layer 18 and second insulating glass layer 15 are with glass material
Material is coated with silk-screen printing or spraying method, and 400 DEG C~1200 DEG C, soaking time 0.1~3.0 hour of sintering temperature.
In a preferred embodiment, the first electrode 11,12 and the second electrode 13,14 be by Pt slurry, Au slurry,
One of Pd-Au slurry, Pd-Ag slurry are sintered, and 800 DEG C~1200 DEG C of sintering temperature；The continuous gap 16 is to pass through
What etching or screen printing mode were formed.
Specific embodiments of the present invention described further below.
The one side of a kind of chip particulate matter sensors ceramic chip, rectangular ceramic substrate 10 is equipped with the first insulating glass layer
18, the surface of the first insulating glass layer 18 is equipped with first electrode 11,12 and second electrode 13,14, first electrode 11,12 and second
Electrode 13,14 is separated by a continuous gap 16, covers second above the back segment of first electrode 11,12 and second electrode 13,14
Insulating glass layer 15；First electrode 11,12 and second electrode 13,14 by be piled up in first electrode 11,12 and second electrode 13,
Conduction or semiconductive particle between 14 are connected with each other, so that between first electrode 11,12 and second electrode 13,14
Resistance value changes.First electrode 11,12 and/or second electrode 13,14 are also as heating electrode, first electrode 11,12
And/or second electrode 13,14 is also used as thermometric electrode.This chip particulate matter sensors ceramic chip, structure is simple, single layer
Electrode structure can realize particle analyte detection, heating removal and temp sensing function simultaneously.Above-mentioned rectangular substrate is mono-layer oxidized zirconium pottery
Porcelain substrate, the zirconia ceramics substrate are stably-doped dose of zirconia ceramics substrate, stabilizer can be Y2O3, MgO,
One or more of Al2O3, CaO, CeO2, the zirconia ceramics substrate thickness are 200~3000 μm.Above-mentioned thermometric electricity
Electrode entoplasm used in pole and heating electrode can be one of Pt slurry, Au slurry, Pd-Au slurry, Pd-Ag slurry；Using screen printing
Electrode slurry is printed in the first insulating glass layer 18 on one side by brush mode, and 800 DEG C~1200 DEG C of sintering temperature.Above-mentioned heating electrode
It with thermometric distribution of electrodes on the surface of the first insulating glass layer 18, is separated by a continuous gap 16, the gap 16 is rule
Or irregular snakelike, spiral shape or rectangle, the width in the gap 16 are 30~500 μm, pass through silk-screen printing or etching
Technique is formed.The second insulating glass layer 15 is covered above the rear end of above-mentioned first electrode 11,12 and second electrode 13,14, it is described
The front end of second insulating glass layer 15 is arc-shaped or rectangle, and with a thickness of 20~40 μm, 400 DEG C~1200 DEG C of sintering temperature is protected
0.1~3.0 hour warm time.Conductive or semiconductive particulate matter is deposited in above-mentioned electrode gap 16, so that above-mentioned first electricity
Pole 11,12 and second electrode 13,14 are connected with each other, and make the resistance value between above-mentioned first electrode 11,12 and second electrode 13,14
Value is in decreasing trend with the quantity of particulate matter.
A kind of chip particulate matter sensors ceramic chip manufacturing method comprises the steps of:
One, using stably-doped dose of zirconia ceramics substrate, stabilizer can be Y2O3, MgO, Al2O3, CaO, CeO2
One or more of, the zirconia ceramics substrate thickness is 200~3000 μm.
Two, it in the first insulating glass layer 18 of the one side silk-screen printing of ceramic substrate 10 or spraying, 20~40 μm of thickness, is sintered
400 DEG C~1200 DEG C, soaking time 0.1~3.0 hour of temperature.
Three, slurry in electrode is printed in the one side of the first insulating glass layer 18, thickness 3~40 using screen printing mode
μm, 800 DEG C~1200 DEG C of sintering temperature, soaking time 0.1~3.0 hour.In electrode used in thermometric electrode and heating electrode
Slurry can be one of Pt slurry, Au slurry, Pd-Au slurry, Pd-Ag slurry.
Four, using lithographic method, in whole face electrode etch first electrode 11,12 and second electrode 13,14, electrode pattern packet
Regularly or irregularly snakelike, spiral shape or rectangle are included, the width of electrode gap 16 is 30~500 μm.
Five, silk-screen printing covers the second insulating glass layer on the rear end of first electrode 11,12 and second electrode 13,14
15, front end is arc-shaped or rectangle, and with a thickness of 20~40 μm, 400 DEG C~1200 DEG C of sintering temperature, soaking time 0.1~3.0 are small
When.
First electrode 11,12, second electrode 13,14 have certain resistance value, and resistance value can set, can be used to
Heating or measurement temperature.When work, between first electrode 11,12 and second electrode 13,14, conductive or semiconductive particulate matter heap
Wherein, resistance value is in decreasing trend with the quantity of particulate matter to product.
Example one
A kind of chip particulate matter sensors ceramic chip, using the zirconia ceramics substrate of stably-doped dose of Y2O3, ceramics
Substrate thickness is 200 μm.In the first insulating glass layer of one side silk-screen printing of ceramic substrate, 20 μm of thickness, sintering temperature 1200
DEG C, soaking time 1.0 hours.Electrode entoplasm used in thermometric electrode and heating electrode is Pt slurry.It will using screen printing mode
Slurry is printed in a whole face of the first insulating glass layer in electrode, with a thickness of 10 μm, 1100 DEG C of sintering temperature, soaking time
1.0 hour.Lithographic method is used again, and in whole face electrode etch first electrode and second electrode, electrode pattern is regular rectangular shape, electricity
The width of clearance between poles is 30 μm.Silk-screen printing covers the second insulating glass layer on the rear end of first electrode and second electrode,
Its front end is arc-shaped, with a thickness of 20 μm, 910 DEG C of sintering temperature, soaking time 0.5 hour.First electrode resistance value is 3.57 Ω,
Second electrode resistance value is 3.61 Ω, can be used to heat or measure temperature.Resistance value is between first electrode and second electrode
5M Ω, wherein, resistance value is in decreasing trend with the quantity of particulate matter to the accumulation of conductive or semiconductive particulate matter.
Example two
A kind of chip particulate matter sensors ceramic chip, using the zirconia ceramics substrate of stably-doped dose of Y2O3, ceramics
Substrate thickness is 500 μm.In the first insulating glass layer of one side silk-screen printing of ceramic substrate, 30 μm of thickness, sintering temperature 1200
DEG C, soaking time 1.0 hours.Electrode entoplasm used in thermometric electrode and heating electrode is Pt slurry.It will using screen printing mode
Slurry is printed in a whole face of the first insulating glass layer in electrode, with a thickness of 10 μm, 1100 DEG C of sintering temperature, soaking time
1.0 hour.Lithographic method is used again, and in whole face electrode etch first electrode and second electrode, electrode pattern is regular rectangular shape, electricity
The width of clearance between poles is 50 μm.Silk-screen printing covers the second insulating glass layer on the rear end of first electrode and second electrode,
Its front end is arc-shaped, with a thickness of 30 μm, 850 DEG C of sintering temperature, soaking time 0.5 hour.First electrode resistance value is 3.57 Ω,
Second electrode resistance value is 3.61 Ω, can be used to heat or measure temperature.Resistance value is between first electrode and second electrode
10M Ω, wherein, resistance value is in decreasing trend with the quantity of particulate matter to the accumulation of conductive or semiconductive particulate matter.
Example three
A kind of chip particulate matter sensors ceramic chip, using the zirconia ceramics substrate of stably-doped dose of Y2O3, ceramics
Substrate thickness is 900 μm.In the first insulating glass layer of one side silk-screen printing of ceramic substrate, 40 μm of thickness, sintering temperature 1200
DEG C, soaking time 1.0 hours.Electrode entoplasm used in thermometric electrode and heating electrode is Pd-Ag slurry.Using screen printing mode
Slurry in electrode is printed in the one side of the first insulating glass layer, 10 μm of thickness, first electrode and second electrode pattern are rectangle,
The width of electrode gap is 100 μm, 1000 DEG C of sintering temperature, soaking time 0.5 hour.After first electrode and second electrode
Silk-screen printing above is held to cover the second insulating glass layer, front end is arc-shaped, with a thickness of 40 μm, when 850 DEG C of sintering temperature, heat preservation
Between 0.5 hour.First electrode resistance value is 3.57 Ω, and second electrode resistance value is 3.61 Ω, can be used to heat or measure temperature
Degree.Resistance value is 20M Ω between first electrode and second electrode, and conductive or semiconductive particulate matter is accumulated wherein, resistance value
Quantity with particulate matter is in decreasing trend.
The above content is combine it is specific/further detailed description of the invention for preferred embodiment, cannot recognize
Fixed specific implementation of the invention is only limited to these instructions.For those of ordinary skill in the art to which the present invention belongs,
Without departing from the inventive concept of the premise, some replacements or modifications can also be made to the embodiment that these have been described,
And these substitutions or variant all shall be regarded as belonging to protection scope of the present invention.
Claims (10)
1. a kind of chip particulate matter sensors ceramic chip, which is characterized in that including ceramic substrate, first electrode, second electrode,
First insulating glass layer and the second insulating glass layer, first insulating glass layer are formed in the upper surface of the ceramic substrate
On, the first electrode and the second electrode are formed on the upper surface of first insulating glass layer, and first electricity
Separated between pole and the second electrode by continuous gap, the front section of the first electrode and the second electrode to
Outer exposure enables particulate matter when measurement to fall between described at the front section of the first electrode and the second electrode
Change the resistance value between the first electrode and the second electrode in gap, close to described the first of measuring signal output end
Electrode and the hindfoot portion of the second electrode are covered by second insulating glass layer, the first electrode and/or the second electricity
Pole is also as heating electrode, for by heating to remove particulate matter.
2. chip particulate matter sensors ceramic chip as described in claim 1, which is characterized in that first insulating glass layer
And/or second insulating glass layer with a thickness of 20~40 μm.
3. chip particulate matter sensors ceramic chip as claimed in claim 1 or 2, which is characterized in that the second insulation glass
The front end of the front section close to the first electrode and the second electrode of glass layer is arc.
4. chip particulate matter sensors ceramic chip as claimed in claim 1 or 2, which is characterized in that the first electrode and/
Or second electrode is also used as thermometric electrode, for measuring the temperature of heating.
5. chip particulate matter sensors ceramic chip as claimed in claim 1 or 2, which is characterized in that the ceramic substrate is
Zirconia ceramics substrate or aluminium oxide ceramic substrate, with a thickness of 200~3000 μm.
6. chip particulate matter sensors ceramic chip as claimed in claim 1 or 2, which is characterized in that the continuous gap
For regularly or irregularly snakelike, spiral shape or rectangle, the width in the gap is 30~500 μm, it is preferable that described continuous
Gap include along the ceramic substrate length be arranged multiple tracks square waveform gap.
7. chip particulate matter sensors ceramic chip as claimed in claim 1 or 2, which is characterized in that the zirconia ceramics
The zirconia ceramics substrate that substrate is stably-doped dose, the stabilizer is one of Y2O3, MgO, Al2O3, CaO, CeO2
Or it is a variety of.
8. a kind of production method of chip particulate matter sensors ceramic chip as described in any one of claim 1 to 7, feature
It is, comprising the following steps:
Prepare the ceramic substrate；
First insulating glass layer is formed on the upper surface of the ceramic substrate；
The first electrode and the second electrode, the first electrode are formed on the upper surface of first insulating glass layer
It is separated between the second electrode by continuous gap；
Described second is being covered in the first electrode of measuring signal output end and the hindfoot portion of the second electrode
Insulating glass layer, and the front section of the first electrode and the second electrode exposes outward, enable measurement when particulate matter
Enough fall on the gap at the front section of the first electrode and the second electrode and change the first electrode and
Resistance value between the second electrode；The first electrode and/or second electrode are also as heating electrode, for passing through heating
To remove particulate matter.
9. the insulating glass layer of chip particulate matter sensors ceramic chip according to claim 8, which is characterized in that described
First insulating glass layer and second insulating glass layer are to be coated with glass material with silk-screen printing or spraying method, sintering temperature
400 DEG C~1200 DEG C, soaking time 0.1~3.0 hour of degree.
10. chip particulate matter sensors ceramic chip according to claim 1 or 2, which is characterized in that the first electrode
It with the second electrode is sintered by one of Pt slurry, Au slurry, Pd-Au slurry, Pd-Ag slurry, 800 DEG C of sintering temperature~
1200℃；The continuous gap is formed by etching or screen printing mode.
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Citations (10)
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