CN110504198A - A kind of detection system, semiconductor board and the detection method of substrate breakage - Google Patents
A kind of detection system, semiconductor board and the detection method of substrate breakage Download PDFInfo
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- CN110504198A CN110504198A CN201910809930.4A CN201910809930A CN110504198A CN 110504198 A CN110504198 A CN 110504198A CN 201910809930 A CN201910809930 A CN 201910809930A CN 110504198 A CN110504198 A CN 110504198A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67288—Monitoring of warpage, curvature, damage, defects or the like
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- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
A kind of detection system of substrate breakage provided by the present application, semiconductor board and detection method, by the way that pressure sensor is arranged on thimble, after the substrate is jacked up to before being sent to common path, it can be by judging whether the pressure that the pressure sensor senses meets preset condition, to judge whether the substrate has breakage, substrate can be judged in advance with the presence or absence of breakage before the substrate enters common path in this way, it avoids and semiconductor board is caused to damage in the presence of damaged substrate, it also avoids polluting common path in the presence of damaged substrate simultaneously, to avoid clearing up common path due to damaged substrate, the working efficiency of semiconductor board can be improved, further, the substrate needs to be lifted off electrostatic chuck by thimble before entering common path, so being jacked up in the thimble It detects whether the substrate has breakage during the substrate, can further improve the efficiency of semiconductor board.
Description
Technical field
This application involves technical field of manufacturing semiconductors, and in particular to a kind of detection system of substrate breakage, semiconductor machine
Platform and detection method.
Background technique
Semiconductor etching includes two methods of dry etching and wet etching.Wherein, dry etching is substrate such as base
Gas excitation around bottom becomes plasma, and plasma bombards substrate surface under bias guidance, and physics occurs with substrate
Chemical reaction, to etch required pattern in substrate surface.When substrate completed in processing chamber etching, put by plasma
After electricity, the indoor thimble of process cavity can jack up substrate.When the inductor of thimble senses that thimble rises, it is located in transmission cavity body
Vacuum transmission arm will grab substrate carry out next step technique.
But currently, since the indoor thimble of process cavity does not have the substrate of detection thimble jack-up either with or without damaged function
Can, thus, when the indoor substrate of process cavity has damaged, the indoor thimble of process cavity still can normally be risen, and work as thimble
It when substrate is jacked up, also will continue to take piece positioned at the intracorporal vacuum transmission arm of transmission cavity, take piece mistake in vacuum transmission arm
So that vacuum transmission arm is collided in journey with there is damaged substrate, it is possible to following problem can be caused: vacuum being caused to transmit hand
The damage of arm, vacuum transmission arm will lead to the pollution that broken substrate causes entire reaction chamber when grabbing to broken substrate
And will there is damaged substrate to be transmitted in the common path of semiconductor board, lead to the pollution of entire semiconductor board, needs
It begins to speak to clear up, thus delay semiconductor board runing time, so that working efficiency reduction is also resulted in, it is serious to also result in half
The phenomenon that conductor board delay machine, causes that the production cost increases and the reduction of working efficiency in this way.
Summary of the invention
Detection system, semiconductor board and the detection method for being designed to provide a kind of substrate breakage of the application, with reality
Present thimble is able to detect while jacking up substrate by whether jack-up substrate has breakage.
This application provides a kind of detection systems of substrate breakage, the substrate in process cavity for detecting semiconductor board
With the presence or absence of breakage, thimble, driver and electrostatic chuck, one end of the thimble and the driver are equipped in the process cavity
Connection, the driver drives the thimble to move reciprocatingly on the direction vertical with the electrostatic chuck, and makes the top
The substrate can be lifted off the electrostatic chuck by the other end of needle characterized by comprising
Pressure sensor is connect with the thimble；And
Controller, the controller are connect with the pressure sensor, when the thimble jacks up substrate, the control
Device judges that the pressure sensor senses whether pressure value meets preset condition, to judge whether the substrate has breakage.
Optionally, in the detection system of the substrate breakage, at least there are three the thimble and at least, there are three described
Pressure sensor, a pressure sensor are connect with a thimble, and the pressure sensor is arranged in the thimble
One end.
Optionally, in the detection system of the substrate breakage, the detection system of the substrate breakage further includes alarm device,
The alarm device is connect with the controller.
On the other hand, present invention also provides a kind of semiconductor board, the monitoring system including above-mentioned substrate breakage.
Optionally, in the semiconductor board, the semiconductor board is dry etching board or physical film deposition board.
Optionally, in the semiconductor board, the semiconductor board include three thimbles and a thimble connector, three
A thimble is arranged on the thimble connector, and the thimble connector is connect with the driver, the driver
The thimble connector is driven to move reciprocatingly on the direction vertical with the electrostatic chuck, the thimble connector drives three
A thimble moves in the same direction simultaneously.
Another aspect, present invention also provides a kind of detection methods of substrate breakage, for detecting in semiconductor board
Substrate in process cavity is with the presence or absence of breakage, which comprises the following steps:
Thimble jacks up substrate；
Pressure sensor incudes the pressure that the thimble is born, and exports first pressure value；
Judge whether the first pressure value meets preset condition, if so, substrate is without breakage, if it is not, then substrate have it is broken
Damage.
Optionally, in the detection method of the substrate breakage, when pressure sensor setting is jacked up in the thimble
When one end of the substrate, the preset condition is the pressure value that the first pressure value and the substrate generate the thimble
It is equal.
Optionally, in the detection method of the substrate breakage, when pressure sensor setting is separate in the thimble
When jacking up one end of the substrate, the preset condition is that the first pressure value is greater than the thimble to the pressure sensor
Generated pressure value or the first pressure value are equal to the thimble to pressure caused by the pressure sensor and institute
State the value of the sum of pressure that substrate generates the thimble.
Optionally, in the detection method of the substrate breakage, the quantity of the thimble and the pressure sensor is
Three, a pressure sensor incudes the pressure that a thimble is born, and one first pressure value of corresponding output,
The preset condition is that three first pressure values are identical, and each first pressure value is greater than a thimble to corresponding
Pressure value caused by pressure sensor.
Compared with the prior art, the detection of substrate breakage provided by the present application, by the way that pressure sensor is arranged on thimble,
After the substrate is jacked up to before being sent to common path, the pressure that can be sensed by judging the pressure sensor
Whether power meets preset condition, in this way can be before the substrate enters common path to judge whether the substrate has breakage
Substrate is judged in advance with the presence or absence of breakage, avoids and semiconductor board is caused to damage in the presence of damaged substrate, simultaneously
It also avoids polluting common path in the presence of damaged substrate, to avoid carrying out common path due to damaged substrate
Cleaning, can be improved the working efficiency of semiconductor board, and further, the substrate needs to be pushed up before entering common path
Needle is lifted off electrostatic chuck, so detect whether the substrate has breakage during the thimble jacks up the substrate, it can be with
The further efficiency for improving semiconductor board.
Detailed description of the invention
Fig. 1 is the structure chart of the detection system of substrate breakage provided by the embodiments of the present application；
Fig. 2 is the structure chart of the detection system of substrate breakage when substrate provided by the embodiments of the present application is jacked up；
Fig. 3 is the flow chart of the detection method of substrate breakage provided by the embodiments of the present application.
The reference numerals are as follows by attached drawing 1-2:
1- process cavity；2- substrate；3- electrostatic chuck；4- thimble；5- thimble connector；6- pressure sensor.
Specific embodiment
As mentioned by background technique, since the substrate that the inductor of the indoor thimble of process cavity can not detect thimble jack-up has
Without breakage, this will lead to the pollution of semiconductor board, to delay semiconductor board runing time, also results in when serious and partly leads
Body board delay machine.Based on this, the application provides whether one kind can be had by jack-up substrate in detection while thimble jacks up substrate
Damaged detection system when solving to have breakage due to the indoor substrate of process cavity at present, by vacuum transmission arm and has breakage
Substrate vacuum transmission arm caused when colliding damage, crash substrate cause entire reaction chamber pollution and
There to be damaged substrate to be transmitted in the common path of semiconductor board, and cause the pollution of entire semiconductor board, it is serious to go back
The problem of the phenomenon that will lead to semiconductor board delay machine, is necessary.
To keep purpose, the advantages and features of the application clearer, the substrate that the application is proposed below in conjunction with attached drawing 1-3
Damaged detection system, semiconductor board and detection method is described in further detail.It should be noted that attached drawing is all made of very
Simplified form and use non-accurate ratio, only to it is convenient, lucidly aid in illustrating the purpose of the embodiment of the present application.
Fig. 1 is the structure chart of the detection system of substrate breakage provided by the embodiments of the present application.
Refering to fig. 1, the detection system for present embodiments providing a kind of substrate breakage, for detecting the work in semiconductor board
Substrate 2 in skill chamber 1 whether there is breakage, is equipped with thimble 4, driver (not shown) and electrostatic in the process cavity 1 and inhales
One end of disk 4, the thimble 4 is connect with the driver, the driver drive the thimble 4 with the electrostatic chuck 3
It moves reciprocatingly on vertical direction, and enables the other end of the thimble 4 that the substrate 2 is lifted off the electrostatic chuck 3,
The detection system of the substrate breakage includes: pressure sensor 6 and controller (not shown), the pressure sensor 6 with
The thimble 4 connects, to induction pressure；The controller is connect with the pressure sensor 6, when the thimble 4 will be described
When substrate 2 jacks up, the controller judges that the pressure sensor 6 senses whether pressure value meets preset condition, with judgement
Whether the substrate 2 has breakage.
By on thimble 4 be arranged pressure sensor 6, after the substrate 2 is jacked up to be sent to common path it
Before, it can be by judging whether the pressure that the pressure sensor senses meets preset condition, whether to judge the substrate 2
There is breakage, substrate 2 can be judged before the substrate 2 enters common path so in advance with the presence or absence of breakage, be avoided
There is damaged substrate 2 semiconductor board is caused to damage, while also avoiding making common path in the presence of damaged substrate 2
At pollution, to avoid common path being cleared up due to damaged substrate 2, can be improved the work effect of semiconductor board
Rate, further, the substrate 2 need to be lifted off electrostatic chuck 3 by thimble 4 before entering common path, so on the top
Needle 4 detects whether the substrate 2 has breakage during jacking up the substrate 2, can further improve semiconductor board
Efficiency.
The detection system of the substrate breakage further includes alarm device (not shown), the alarm device and the controller
Connection, when stating pressure sensor 6 and sensing that pressure value does not meet preset condition, the controller controls the alarm device and issues
Alarm can intuitively remind the substrate 2 jacked up by the thimble 4 with the presence or absence of breakage in this way.
Specifically, the controller includes signal receiving unit, control unit, data capture unit, Data Analysis Services
Unit, output unit.The signal receiving unit is connect with the thimble 4, and the signal receiving unit receives the thimble 4
When jacking up the signal of substrate 2, the signal receiving unit sends the signal to described control unit.The data cell and institute
It states control unit to connect with the pressure sensor, described control unit controls the pressure sensor according to the signal
Work, after the thimble 4 jacks up substrate 2, the data capture unit obtains the pressure value that the pressure sensor 6 senses.
The data analysis and processing unit analysis handles whether the pressure value that the pressure sensor 6 senses meets preset condition, and
It forms corresponding control signal and is sent to described control unit, described control unit controls the alarm device work
Fig. 2 is the structure chart of the detection system of substrate breakage when substrate provided by the embodiments of the present application is jacked up.Refering to
Fig. 2, at least there are three the thimble 4 and at least there are three the pressure sensor 6, a pressure sensor 6 and one
Thimble 4 connects, specifically, the pressure sensor 6 is fixed on the thimble 4, can be fixed on the thimble 4 far from jack-up
One end of the substrate 2, or it is fixed on one end that the thimble 4 jacks up the substrate 2, do not limit the pressure sensing herein
The positional relationship of device 6 and the thimble 4, as long as the pressure sensor 6 can incude the pressure that the thimble 4 is born, institute
Other positional relationships can also be had by stating pressure sensor 6 and the thimble 4, for example, the pressure sensor 6 can also be fixed
In the inside of the thimble 4.Such as it is equipped with accommodating chamber in one end of the thimble 4, the pressure sensor 6 is arranged in the appearance
It receives intracavitary, protection can be played the role of to the pressure sensor 6.
Preferably, three thimbles 4 are located at the position of 2 trisection of substrate, when the substrate 2 is complete
It waits, what the thimble 4 described in this way can be consolidated more jacks up the substrate 2, when the substrate 2 is damaged, i.e., described
Substrate 2 is at least two parts, since three thimbles 4 are located at the position of 2 trisection of substrate, such three thimbles
4 must jack up at least two-part substrate 2, then at least one thimble 2 is to need individually to jack up a part of substrate 2, one
Thimble 4 is can not to jack up the substrate 2 of damaged portion, and the substrate 2 at least jacked up in this way by a thimble 4 can not be by the top
Needle 4 jacks up, i.e., the gravity of the described substrate 2 will not be pressed on the thimble 4, and the pressure sensor 6 connecting in this way with the thimble 4 can not
The pressure that the substrate 2 applies the thimble 4 is sensed, at this point, the pressure that the pressure sensor 6 incudes does not meet default item
Part, the controller can judge that the substrate 2 has breakage.
It is on the other hand, described present invention also provides a kind of semiconductor board (not shown) with continued reference to Fig. 1-2
Semiconductor board includes process cavity 1 and above-mentioned substrate breakage detection system, and thimble 4, driver and quiet are equipped in the process cavity 1
One end of electric sucker 3, the thimble 4 is connect with the driver, and the driver drives the thimble 4 to inhale with the electrostatic
Disk 3 moves reciprocatingly on vertical direction, and enables the other end of the thimble 4 that the substrate 2 is lifted off the electrostatic and inhale
Disk 3, the detection system of the substrate breakage include: pressure sensor 6 and controller, the pressure sensor 6 and the thimble 4
Connection, to induction pressure；The controller is connect with the pressure sensor 6, when the thimble 4 jacks up the substrate 2
When, the controller judges that the pressure sensor 6 senses whether pressure value meets preset condition, to judge the substrate 2
Whether breakage is had.
Preferably, the semiconductor board is dry etching board or physical film deposition board, it should be noted that herein simultaneously
It is not limited to the concrete type of semiconductor board, as long as including above-mentioned process cavity 1, is equipped with thimble in the process cavity 1
4, one end of driver (not shown) and electrostatic chuck 4, the thimble 4 is connect with the driver, and the driver drives
It moves the thimble 4 to move reciprocatingly on the direction vertical with the electrostatic chuck 3, and enables the other end of the thimble 4
By the semiconductor board that the semiconductor board that the substrate 2 is lifted off the structure of the electrostatic chuck 3 can be in the application.
The semiconductor board includes three thimbles 4 and a thimble connector 5, and three thimbles are arranged at the top
On needle connector 5, the thimble connector 5 is connect with the driver, the driver drive the thimble connector 5 with
The electrostatic chuck 4 moves reciprocatingly on vertical direction, and three thimbles 4 are as the thimble connector 5 is simultaneously to phase
Same direction movement, specifically, the thimble connector 5 is annulus column, three top 4 needles concentric with the substrate 2
It is fixed on the trisection point of the thimble connector 5, when can guarantee that three thimbles 4 jack up the substrate 2 in this way
On the trisection line of the substrate 2, the stability of the substrate 2 when the substrate 2 is jacked up thereby may be ensured that.
Refering to Fig. 3, in conjunction with Fig. 1-2, another aspect, present invention also provides a kind of detection methods of substrate breakage, are used for
The substrate in the process cavity in semiconductor board is detected with the presence or absence of breakage, which comprises the following steps:
Step s110: thimble 4 jacks up base, 2；
Step s120:: pressure sensor 6 incudes the pressure that the thimble 4 is born, and exports first pressure value；
Step s130: judging whether the first pressure value meets preset condition, if so, substrate 2 is without breakage, if it is not,
Then substrate 2 has breakage.
Specifically, the signal receives when the signal receiving unit receives the signal of the jack-up of thimble 4 substrate 2
Unit sends the signal to described control unit.The data cell and described control unit with the pressure sensor 6
Connection, described control unit controls the pressure sensor 6 according to the signal and works, described after the thimble 4 jacks up substrate 2
Data capture unit obtains the first pressure value that the pressure sensor senses.The data analysis and processing unit analysis processing
Whether the first pressure value meets preset condition, and forms corresponding control signal and be sent to described control unit, the control
Unit processed controls alarm device according to the signal or grabs the vacuum transmission arm (not shown) work of substrate 2, that is, when described
When first pressure value does not meet preset condition, the data analysis and processing unit sends the first signal, institute to described control unit
Control unit is stated to be sounded an alarm according to the first signal control alarm device, when the first pressure value meets preset condition,
The data analysis and processing unit sends second signal to described control unit, and described control unit controls institute according to second signal
Vacuum transmission arm work is stated, unabroken substrate 2 is transmitted to common path by the vacuum transmission arm.
Wherein, when the thimble 4, which is arranged in, in the pressure sensor 6 jacks up one end of the substrate 2, when the thimble
4 by the substrate 2 jack up when, the pressure that the pressure sensor 5 senses is the pressure that the substrate 2 is applied to the thimble 4
Power, at this moment the preset condition is the pressure value that the first pressure value is equal to that the substrate 2 generates the thimble 4, works as institute
When stating the pressure value that first pressure value generates the thimble 4 equal to the substrate 2, the substrate 2 is without breakage, if it is not, then base
There is breakage at bottom 2.
In another embodiment, when the thimble 4 is arranged in far from the jack-up substrate 2 in the pressure sensor 4
When one end, when the thimble 4 jacks up the substrate 2, the pressure that the pressure sensor 6 senses is that the substrate 2 is applied
The pressure and the thimble 4 that add to the thimble 4 are applied to the gross pressure of the pressure of the pressure sensor 6, so described default
Condition is that the first pressure value is equal to the thimble 4 to pressure caused by the pressure sensor 6 and the substrate to institute
The gross pressure of the pressure of the generation of pressure sensor 6 is stated, alternatively, the first pressure value is greater than the thimble 4 to pressure sensor 6
Generated pressure value, when the first pressure value is equal to the thimble 4 to pressure caused by the pressure sensor 6 and institute
The value of the sum of pressure that substrate 2 generates the thimble 4 is stated, pressure is passed alternatively, the first pressure value is greater than the thimble 4
When pressure value caused by sensor 4, the substrate 2 is without breakage, if it is not, then substrate 2 has breakage.
In another embodiment, the quantity of the thimble 4 and the pressure sensor 6 is three, and a pressure passes
Sensor 6 incudes the pressure that a thimble 4 is born, and one first pressure value of corresponding output, when the thimble 4 will
When the substrate 2 jacks up, when the substrate 2 is without damaged substrate, receiving pressure described in three thimbles 4 is identical,
Three first pressure values that i.e. three pressure sensors 6 are exported are identical, at this point, the preset condition is three institutes
It is identical to state first pressure value, and each first pressure value is greater than a thimble 4 to caused by corresponding pressure sensor 6
Pressure value, when three first pressures values are identical, and each first pressure value is greater than a thimble 4 to corresponding pressure
When pressure value caused by sensor 6, the substrate 2 is without breakage, if it is not, then substrate 2 has breakage.
Foregoing description is only the description to the application preferred embodiment, not to any restriction of the application range, this Shen
Please field those of ordinary skill any change, the modification done according to the disclosure above content, belong to the protection of claims
Range.
Claims (10)
1. a kind of detection system of substrate breakage, the substrate in process cavity for detecting semiconductor board whether there is breakage,
Thimble, driver and electrostatic chuck are equipped in the process cavity, one end of the thimble is connect with the driver, the driving
Device drives the thimble to move reciprocatingly on the direction vertical with the electrostatic chuck, and enables the other end of the thimble
The substrate is lifted off the electrostatic chuck characterized by comprising
Pressure sensor is connect with the thimble；And
Controller, the controller are connect with the pressure sensor, and when the thimble jacks up substrate, the controller is sentenced
The pressure sensor that breaks senses whether pressure value meets preset condition, to judge whether the substrate has breakage.
2. the detection detection system of substrate breakage according to claim 1, which is characterized in that at least there are three the thimbles
At least there are three the pressure sensor, a pressure sensor is connect with a thimble, the pressure sensing
One end of the thimble is arranged in device.
3. the detection system of substrate breakage according to claim 1, which is characterized in that the detection system of the substrate breakage
It further include alarm device, the alarm device is connect with the controller.
4. a kind of semiconductor board, which is characterized in that the monitoring system including the substrate breakage as described in claim 1-4.
5. semiconductor board according to claim 4, which is characterized in that the semiconductor board be dry etching board or
Physical film deposition board.
6. semiconductor board according to claim 4 or 5, which is characterized in that the semiconductor board includes three thimbles
With a thimble connector, three thimbles are arranged on the thimble connector, the thimble connector and the driving
Device connection, the driver drive the thimble connector to move reciprocatingly on the direction vertical with the electrostatic chuck, and three
A thimble moves in the same direction simultaneously with the thimble connector.
7. a kind of detection method of substrate breakage, for detecting the substrate in the process cavity in semiconductor board with the presence or absence of broken
Damage, which comprises the following steps:
Thimble jacks up substrate；
Pressure sensor incudes the pressure that the thimble is born, and exports first pressure value；
Judge whether the first pressure value meets preset condition, if so, substrate is without breakage, if it is not, then substrate has breakage.
8. the detection method of substrate breakage according to claim 7, which is characterized in that when pressure sensor setting exists
When the thimble jacks up one end of the substrate, the preset condition is the first pressure value and the substrate to the thimble
The pressure value of generation is equal.
9. the detection method of substrate breakage according to claim 7, which is characterized in that when pressure sensor setting exists
When the thimble is far from the one end for jacking up the substrate, the preset condition is that the first pressure value is greater than the thimble to institute
It states pressure value caused by pressure sensor or the first pressure value is equal to the thimble and is produced to the pressure sensor
The value of the sum of the pressure that raw pressure and the substrate generate the thimble.
10. the detection method of substrate breakage according to claim 7, which is characterized in that the thimble and the pressure pass
The quantity of sensor is three, and a pressure sensor incudes the pressure that a thimble is born, and corresponding output one
The first pressure value, the preset condition are that three first pressure values are identical, and each first pressure value is greater than one
The thimble is to pressure value caused by corresponding pressure sensor.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910809930.4A CN110504198A (en) | 2019-08-29 | 2019-08-29 | A kind of detection system, semiconductor board and the detection method of substrate breakage |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910809930.4A CN110504198A (en) | 2019-08-29 | 2019-08-29 | A kind of detection system, semiconductor board and the detection method of substrate breakage |
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| CN110504198A true CN110504198A (en) | 2019-11-26 |
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| CN201910809930.4A Pending CN110504198A (en) | 2019-08-29 | 2019-08-29 | A kind of detection system, semiconductor board and the detection method of substrate breakage |
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| WO2023279444A1 (en) * | 2021-07-07 | 2023-01-12 | 长鑫存储技术有限公司 | System and method for preventing wafer breakage |
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| CN203721695U (en) * | 2014-01-22 | 2014-07-16 | 北京京东方光电科技有限公司 | Elevator and dry etching system |
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| CN111128847A (en) * | 2019-12-24 | 2020-05-08 | 北京北方华创微电子装备有限公司 | Bearing device and semiconductor processing equipment |
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| WO2023279444A1 (en) * | 2021-07-07 | 2023-01-12 | 长鑫存储技术有限公司 | System and method for preventing wafer breakage |
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Application publication date: 20191126 |