CN110494529A - Silicon composition is used in peeling paper or stripping film manufacture - Google Patents
Silicon composition is used in peeling paper or stripping film manufacture Download PDFInfo
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- CN110494529A CN110494529A CN201880024162.5A CN201880024162A CN110494529A CN 110494529 A CN110494529 A CN 110494529A CN 201880024162 A CN201880024162 A CN 201880024162A CN 110494529 A CN110494529 A CN 110494529A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/18—Manufacture of films or sheets
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
- C08J7/04—Coating
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/04—Polysiloxanes
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/04—Polysiloxanes
- C08L83/06—Polysiloxanes containing silicon bound to oxygen-containing groups
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/40—Adhesives in the form of films or foils characterised by release liners
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
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- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2483/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen, or carbon only; Derivatives of such polymers
- C08J2483/04—Polysiloxanes
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2483/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen, or carbon only; Derivatives of such polymers
- C08J2483/04—Polysiloxanes
- C08J2483/06—Polysiloxanes containing silicon bound to oxygen-containing groups
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- Engineering & Computer Science (AREA)
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Abstract
The present invention provides the peeling paper or stripping film manufacture silicon composition of addition reaction curing type, it includes: (A) alkenyl with 2 or more, the polysiloxane that amount vinyl content is 0.001~0.04mol/100g, 30 mass % dilution with toluene viscosity at 25 DEG C are 0.01~70Pas；(B) there are the organic hydrogen polysiloxanes of 3 or more the hydrogen atoms in conjunction with silicon atom；(C) polysiloxane (R of formula (2)2For the alkyl etc. of carbon atom number 1~20, the integer that c is 2 or more, the integer that d is 1 or more, the integer that e is 0 or more, the integer that f is 0 or more, 25 DEG C of viscosity is 0.001~4Pas.)；(D) platinum group metal catalyst.
Description
Technical field
It is obtained the present invention relates to peeling paper or stripping film manufacture silicon composition and using the silicon composition
Peeling paper or stripping film.
Background technique
As peeling paper, stripping film, it is known that be coated with organic silicon-type remover on the surface of the substrates such as paper, plastic foil, pass through
Cross-linking reaction forms curing overlay film, uses the remover overlay film for cementability or adhesive.
Peeling paper and stripping film use on the way, have two sides adhesive tape, make front and back sides become bonding plane comprising pressure-sensitive
Centreless adhesive sheet of adhesive phase etc. needs the product of protection spacer in the two sides of pressure sensitive adhesive layer, it is contemplated that these products
Demand will expand to industrial use.For such product, in order to improve the convenience in processing, need pressing
The two sides of sensitive adhesive layer have the difference of peeling force.In addition, being usually according to peeling rate, peeling force variation, sometimes according to stripping
From speed, the difference of peeling force disappears, and it is bad to become removing, therefore it is required that controlling peeling rate dependence.
The difference and the responsibility of peeling rate dependence for controlling peeling force are generally undertaken by spacer, as nearest tendency,
Gradually require difference and peeling rate dependence that peeling force is more correctly controlled for extensive contact adhesive type.In the past,
In order to make the peeling force of low speed peeling rate range become smaller, it is known to use the low polysiloxane of contents of ethylene is as base
Plinth, but in this case, the peeling force in high speed peeling rate range becomes larger to heavens.Gather using contents of ethylene is high
In the case where based on organosiloxane, although the peeling force in high speed peeling rate range can be made to become smaller, low speed stripping
Peeling force from velocity interval becomes larger.Thus, while hinder the removing of low speed peeling rate range and high speed peeling rate range
Power becomes smaller difficulty.
As the method for making the peeling force of low speed peeling rate range and high speed peeling rate range all become smaller, it is known that by second
Amount vinyl content height and the polysiloxane containing phenyl and the low polysiloxane of contents of ethylene are simultaneously used as containing alkene
The method (Japanese Unexamined Patent Publication 2-187466 bulletin) of the polysiloxane of base uses the high poly organo of contents of ethylene
Alkane and poly- two organohydrogensiloxanes of specific molar ratio and then the method (Japan for cooperating the polysiloxane with hydroxyl
Japanese Laid-Open Patent Publication 6-93183 bulletin).
But for these methods, although above-mentioned such high speed peeling rate model can be made to a certain extent
The peeling force enclosed becomes smaller, but and it is insufficient, it cannot be said that the peeling force of low speed peeling rate range can be made also fully to become smaller.It is special
Not, for the method for the latter, due to the polysiloxane with hydroxyl, the amount of migration of organosilicon increases, sometimes residual
Bonding rate is stayed terrifically to reduce.Therefore, these methods are all impracticable.
In addition, as will the polysiloxane containing aryl and be used to make low speed peeling rate range and high speed remove speed
Spend the method that the peeling force of range becomes smaller simultaneously, it is known that cooperate non-reacted contain in the removing composition of addition reaction-type
Have the polysiloxane of aryl method (Japanese Unexamined Patent Application 60-133051 bulletin), cooperation end have hydroxyl and
The method (Japanese Unexamined Patent Publication 3-93858 bulletin) of polysiloxane containing aryl, by the high molecular weight with hydroxyl
Method (the Japanese Unexamined Patent Publication 8- of dimethyl silicone polymer and the polysiloxane with hydroxyl and with aryl
No. 217980 bulletins).
But for these methods using the polysiloxane containing aryl, although being able to confirm that makes high speed
The effect that the peeling force of peeling rate range becomes smaller, but the amount of migration of organosilicon increases, and inhibits the reduction of residual bonding rate difficult.
In addition, even the method recorded in Japanese Unexamined Patent Publication 8-217980 bulletin, also confirmed the increase of the amount of migration of organosilicon
With the reduction of residual bonding rate.Therefore, these methods are also impracticable.
Thus, so far, using the polysiloxane containing aryl used with or without hydroxyl or incite somebody to action
The inhibition that the technique study of the dimethyl silicone polymer of high molecular weight with hydroxyl residual bonding rate reduces.But
Status is cannot to inhibit the migration of organosilicon using these methods, and residual bonding rate reduces.
In addition, in the feelings of the high polysiloxane of cooperation containing ratio of hydrocarbon as the polysiloxane containing aryl
Compatibility poor under condition, with remover combination, it is intended to lack for the closely sealed of the plastic foils such as polyester film, polypropylene screen
Property.Therefore, while the inhibition that adaptation deteriorates is also required to.
Existing technical literature
Patent document
Patent document 1: Japanese Unexamined Patent Publication 2-187466 bulletin
Patent document 2: Japanese Unexamined Patent Publication 6-93183 bulletin
Patent document 3: Japanese Unexamined Patent Application 60-133051 bulletin
Patent document 4: Japanese Unexamined Patent Publication 3-93858 bulletin
Patent document 5: Japanese Unexamined Patent Publication 8-217980 bulletin
Patent document 6: Japanese Unexamined Patent Publication 2003-192897 bulletin
Summary of the invention
Subject to be solved by the invention
The present invention is completed in view of above-mentioned actual conditions, and it is an object of the present invention to provide in the reduction, organic for inhibiting residual bonding rate
Low speed and high speed can be made to shell in the case where not to the generation adverse effect of the adaptation of substrate while the amount of migration of silicon increases
From when the peeling paper that becomes smaller of peeling force or stripping film manufacture silicon composition and peeling paper or stripping film.
Means for solving the problems
The present inventor has made intensive studies to achieve the goals above, as a result, it has been found that: by existing stripping film system
The viscosity for cooperating 25 DEG C in the silicon composition made is 0.001~4Pas without unsaturated group of aliphatic series such as alkenyls
Polysiloxane as neccessary composition, inhibit the amount of migration of the residual reduction of bonding rate, organosilicon to increase to may be provided in
Not to the peeling force generated with the adaptation of substrate when in the case where adverse effect low speed and high speed can remove while adding
The peeling paper or stripping film manufacture silicon composition to become smaller.
Therefore, the present invention provide it is following shown in peeling paper or stripping film manufacture silicon composition and had using this
The peeling paper or stripping film that machine silicon composition obtains.
[1] peeling paper of addition reaction curing type or stripping film manufacture silicon composition, it includes:
(A) have at least two alkenyl, amount vinyl content for 30 at 0.001~0.04mol/100g, 25 DEG C in 1 molecule
Quality % dilution with toluene viscosity is the polysiloxane of 0.01~70Pas: 100 mass parts
(B) with hydrogen atom of at least three with silicon atom in conjunction with, by the expression of following average composition formulas (1) in 1 molecule
Organic hydrogen polysiloxanes: 0.1~30 mass parts
R1 aHbSiO(4-a-b)/2 (1)
(in formula, R1For the monovalent organic group without aliphatic unsaturated bond, a is that 0.1~2, b is 0.1~2.9, a+b
For 1~3.0 positive number, there is 3 or more SiH bases in 1 molecule, the model of 0.005~10Pas is fallen into 25 DEG C of viscosity
The mode enclosed selects.)
(C) polysiloxane indicated by the following general formula (2): 1~30 mass parts
[changing 1]
(in formula, R2Can be identical or different, it is unsubstituted or substituted alkyl radical, the carbon atom number 6 of carbon atom number 1~20
~20 unsubstituted or substituted aryl, the unsubstituted or substituted aralkyl of carbon atom number 7~20 or hydroxyl or carbon atom
The alkoxy of number 1~3, the integer that c is 2 or more, the integer that d is 1 or more, the integer that e is 0 or more, the integer that f is 0 or more, with
The mode that 25 DEG C of viscosity falls into the range of 0.001~4Pas selects c+d+e+f.)
(D) platinum group metal catalyst: catalytic amount.
[2] peeling paper described in [1] or stripping film manufacture silicon composition, wherein in general formula (2), with 25 DEG C
The mode of the viscosity range that falls into 0.008~1Pas select c+d+e+f.
[3] peeling paper described in [2] or stripping film manufacture silicon composition, wherein in general formula (2), with 25 DEG C
The mode of the viscosity range that falls into 0.015~0.5Pas select c+d+e+f.
[4] peeling paper described in any one of [1]~[3] or stripping film manufacture silicon composition, wherein in general formula
(2) in, R2For the unsubstituted or substituted alkyl radical of carbon atom number 1~20 that can be identical or different.
[5] peeling paper described in any one of [1]~[4] or stripping film manufacture silicon composition, also include (E)
Organic solvent.
[6] peeling paper or stripping film, by being formed described in any one of [1]~[5] on paper base material or film base material
The solidfied material of silicon composition forms.
The effect of invention
The peeling paper or stripping film obtained using silicon composition of the invention is being inhibited the reduction of residual bonding rate, had
While the amount of migration of machine silicon increases when not generating to adaptation, in the case where adverse effect low speed and high speed can remove
Peeling force becomes smaller.
Specific embodiment
It is explained in detail below for the present invention.
Peeling paper of the invention or stripping film manufacture (are also sometimes referred to simply as organosilicon to combine below with silicon composition
Object) it include addition reaction curing type polysiloxane, specifically making comprising following (A)~(D) ingredient and as needed
The composition of following (E) ingredients, is solidified by addition reaction.
[(A) ingredient]
(A) ingredient is that have at least two alkenyl, amount vinyl content for 0.001~0.04mol/100g, 25 DEG C in 1 molecule
Under 30 mass % dilution with toluene viscosity be 0.01~70Pas polysiloxane, preferably by the following general formula (3) indicate.
[changing 2]
In above-mentioned formula (3), R3Can be identical or different, for selected from the carbon atom number 1 without aliphatic unsaturated bond~
20 unsubstituted or substituted 1 valency alkyl or the base of carbon atom number 2~12 made in the intervenient alkenyl of oxygen atom
Group, R3At least two be alkenyl.
1 valency alkyl as the above-mentioned carbon atom number 1~20 without aliphatic unsaturated bond specifically can enumerate choosing
From the cycloalkanes of the preferably carbon atom number 5~8 such as methyl, ethyl, propyl, butyl etc. preferably alkyl, the cyclohexyl of carbon atom number 1~6
The preferably aralkyl of carbon atom number 7~10 such as aryl, benzyl of the preferably carbon atom number 6~10 such as base, phenyl, tolyl or
Part or all of the hydrogen atom in conjunction with carbon atom of these groups hydroxyl, alkoxy, polyether-based, alkoxyalkyl,
Carbon atom number 1 in hydroxypropyl, 1- chloropropyl, 3,3,3- trifluoro propyl etc. made of epoxy group, halogen atom etc. replace~
10 1 valency alkyl, especially from the viewpoint of fissility, preferably alkyl, aryl, more preferable methyl, ethyl, propyl, benzene
Base.
Make the intervenient alkenyl of oxygen atom as carbon atom number 2~12, preferably by-(CH2)n- CH=CH2(n
Integer for 0 or 1~10) indicate group specifically can enumerate vinyl, acrylic, cyclobutenyl, hexenyl, octene
Base, decene base.In these, preferred vinyl.
(A) alkenyl in 1 molecule of the polysiloxane of ingredient is 2 or more, if less than 2, after solidification
A possibility that remaining uncrosslinked molecule is high, and curability reduces.As the amount vinyl content of the every 100g of (A) polysiloxane, preferably
0.001~0.04 mole, more preferable 0.002~0.02 mole.If the content, less than 0.001 mole, curability reduces sometimes,
If it exceeds 0.04 mole, the peeling force in low speed peeling rate range becomes larger sometimes.
In addition, being 0.01~70Pa in 30 mass % toluene solutions for the viscosity at 25 DEG C of (A) ingredient
S, in 30 mass % toluene solutions, preferably 0.01~50Pas.If painting when composition is made less than 0.01Pas
Cloth is insufficient, if it exceeds 70Pas, workability is reduced.It should be noted that viscosity can using rotary viscosity design determining (under
Together).
G, h, i, j in above-mentioned formula (3) are selected from the integer of range for becoming above-mentioned viscosity, particularly, g 2
Above, preferably 2~300 integer, h are 100 or more, preferably 200~20, and 000 integer, i is 0 or more, preferably 0~100
Integer, j be 0 or more, preferably 0~100 integer, be 150≤g+h+i+j≤20,000, preferably 200≤g+h+i+j≤15,
000。
As the specific example of (A) ingredient, example below can be enumerated, but is not limited to these.It should be noted that
Me, Vi, Ph in following formula respectively indicate methyl, vinyl, phenyl.
[changing 3]
(150≤k1≤2,500)
[changing 4]
(150≤k2≤10,000)
[changing 5]
(150≤k3≤19,000、2≤k4≤500)
[changing 6]
(150≤k5≤19,000、1≤k6≤500)
[changing 7]
(150≤k7≤19,000、1≤k8≤500、1≤k9≤500)
[changing 8]
(150≤k10≤5,000、0≤k11≤5,000、0≤k12≤500、0≤k13≤100)
[changing 9]
(150≤k14≤5,000、0≤k15≤5,000、0≤k16≤500、0≤k17≤500、0≤k18≤500、0
≤k19≤100、0≤k20≤100)
[(B) ingredient]
(B) hydrogen atom of the organic hydrogen polysiloxanes of ingredient in 1 molecule at least three in conjunction with silicon atom is (following
Also referred to as " SiH yl "), alkenyl addition reaction in the SiH base and (A) ingredient and form curing overlay film.As (B) ingredient,
Such as the organic hydrogen polysiloxanes indicated by following average composition formulas (1) can be enumerated.
R1 aHbSiO(4-a-b)/2 (1)
In above-mentioned formula (1), R1It specifically can for unsubstituted or substituted 1 valency alkyl without aliphatic unsaturated bond
Illustrate the ring of the preferably carbon atom number 5~8 such as methyl, ethyl, propyl, butyl etc. preferably alkyl, the cyclohexyl of carbon atom number 1~6
The preferably aralkyl of carbon atom number 7~10 such as aryl, benzyl of the preferably carbon atom number 6~10 such as alkyl, phenyl, tolyl or
Part or all of the hydrogen atom in conjunction with carbon atom of these groups of person hydroxyl, alkoxy, polyether-based, alkoxy alkane
Hydroxypropyl, 1- chloropropyl, 3,3,3- trifluoro propyl made of base, epoxy group, halogen atom etc. replace etc..Wherein preferred alkane
Base, aryl, from the viewpoint of the raising of addition reaction speed, more preferably methyl.
The positive number that a is 0.1~2, preferably 0.2~1.5, the positive number that b is 0.1~2.9, preferably 0.2~2, a+b are 1~3.0
Positive number, especially meet 0.4~2.7.
As the example of the organic hydrogen polysiloxanes indicated by above-mentioned formula (1), can illustrate with R1HSiO2/2Unit (R1With
Above-mentioned identical, similarly hereinafter), HSiO3/2Unit and R1 2HSiO1/2At least one of unit also contains R sometimes1 2SiO2/2Unit,
R1SiO3/2Unit and R1 3SiO1/2The polymer or copolymer of at least one of unit, adding up to preferably in 1 molecule has extremely
It is 2, particularly 10~100 R few1HSiO2/2Unit or R1 2HSiO1/2Unit.In addition, in the range for obtaining effect of the invention
It is interior to contain SiO4/2Unit.
Further more, the content of SiH base is 0.1~3 mole/100g preferably in polysiloxane, particularly preferably 0.2~
2 moles/100g.In addition, the viscosity being somebody's turn to do at 25 DEG C of the organic hydrogen polysiloxanes of (B) ingredient is preferably 0.001~3mPas,
Particularly preferably 0.005~1.5mPas.
It is straight-chain, branch-like, cyclic annular for the organic hydrogen polysiloxanes, alternatively, it is also possible to be their mixing
Object.
As the specific example of (B) ingredient, example below can be enumerated, but is not limited to these.It should be noted that
Me, Ph in following formula respectively indicate methyl, phenyl.
[changing 10]
(2≤p1≤100)
[changing 11]
(2≤p2≤100、0≤p3≤500)
[changing 12]
(0≤p4≤100、0≤p5≤500)
[changing 13]
(2≤p6≤100、0≤p7≤500)
[changing 14]
(0≤p8≤200、0≤p9≤200、0≤p10≤100、0≤p11≤100)
For the use level of (B) ingredient, from obtaining appropriate crosslink density aspect, relative to (A) ingredient 100
Mass parts are 0.1~30 mass parts, preferably 0.5~15 mass parts, more preferably 0.5~10 mass parts.
In turn, at this point, the use level of (B) ingredient is preferably following amount: relative to (A) ingredient 1 mole of alkenyl or
1 mole of total alkenyl of (A) ingredient and peeling force controlling agent, (B) ingredient in the case where the peeling force controlling agent stated after engagement
In the hydrogen atom in conjunction with silicon atom molal quantity become 0.5~10 range, in more preferable (B) ingredient with silicon atom knot
The molal quantity of the hydrogen atom of conjunction becomes the amount of 1.0~5.0 range.If molar ratio is smaller than 0.5, curability is reduced, and
Sometimes with the closely sealed variation of substrate, if bigger than 10, re-separation sometimes.
[(C) ingredient]
(C) ingredient is the polysiloxane that the viscosity at 25 DEG C is 0.001~4Pas, preferably by the following general formula (2)
It indicates.
[changing 15]
In above-mentioned formula (2), R2Can be identical or different, it is that unsubstituted or substituted alkyl radical, the carbon of carbon atom number 1~20 are former
The unsubstituted or substituted aryl of subnumber 6~20, the unsubstituted or substituted aralkyl of carbon atom number 7~20 or hydroxyl or
The alkoxy of carbon atom number 1~3.
As the alkyl of above-mentioned carbon atom number 1~20, specifically, can enumerate selected from methyl, ethyl, propyl, butyl etc.
It is preferred that the preferably naphthenic base of carbon atom number 5~8 or these groups such as the alkyl of carbon atom number 1~6, cyclohexyl is former with carbon
Part or all for the hydrogen atom that son combines hydroxyl, alkoxy, polyether-based, alkoxyalkyl, epoxy group, halogen atom etc.
Hydroxypropyl made of substitution, 1- chloropropyl, 3, the alkyl of the carbon atom number 1~10 in 3,3- trifluoro propyls etc., especially from
From the perspective of fissility, optimizing alkyl, particularly, more preferable methyl, ethyl, propyl.
In turn, as R2, it is excellent that above-mentioned phenyl, tolyl etc. preferably aryl, the benzyl of carbon atom number 6~10 etc. can be enumerated
Part or all of the aralkyl of carbon atom number 7~10 or the hydrogen atom in conjunction with carbon atom of these groups is selected to use hydroxyl
Group made of base, alkoxy, polyether-based, alkoxyalkyl, epoxy group, halogen atom etc. replace, especially from fissility
Viewpoint is set out, more preferable phenyl.
In addition, viscosity at 25 DEG C of (C) ingredient is 0.001~4Pas, preferably 0.008~1Pas, it is especially excellent
It is selected as 0.015~0.5Pas.If viscosity, less than 0.001Pas, (C) ingredient volatilizees in a heated condition, sometimes peeling force
It is unstable.If viscosity is more than 4Pas, the amount of migration of organosilicon is caused to increase, remaining bonding rate sometimes reduces.
It is preferred that the boiling point under the normal pressure of (C) ingredient is 220 DEG C or more.If the boiling point under normal pressure is less than 220 DEG C, peeling force
It is unstable, timely change sometimes.
C, d, e, f in above-mentioned formula (2) are selected from the integer of range for becoming above-mentioned viscosity, particularly, c 2
Above, preferably 2~30 integer, the integer that d is 1 or more, preferably 1~500, the integer that e is 0 or more, preferably 0~10, f 0
Above, preferably 0~10 integer is 3≤c+d+e+f≤500, preferably 4≤c+d+e+f≤200.
As the specific example of (C) ingredient, example below can be enumerated, but is not limited to these.It should be noted that
Me, Et, Ph in following formula respectively indicate methyl, ethyl, phenyl.
[changing 16]
(2≤m1≤350)
[changing 17]
(1≤m2≤350)
[changing 18]
(2≤m3≤350)
[changing 19]
(2≤m4≤350)
[changing 20]
(2≤m5≤350、1≤m6≤80)
[changing 21]
(1≤m7≤350、1≤m8≤80)
[changing 22]
(2≤m9≤350、1≤m10≤80)
[changing 23]
(2≤m11≤350、1≤m12≤80)
[changing 24]
(1≤m13≤200、1≤m14≤200、1≤m15≤100、1≤m16≤30)
[changing 25]
(1≤m17≤100、1≤m18≤100、1≤m19≤15、1≤m20≤15、1≤m21≤15、0≤m22≤10、
0≤m23≤10)
Without being bound by theory, discovery in remover combination by cooperating 25 DEG C of viscosity to be 0.001~4Pas
The non-reacted polysiloxane without unsaturated group of aliphatic series, thus can inhibit organosilicon the amount of migration increase and it is residual
The reduction of bonding rate is stayed, while adverse effect will not be generated to adaptation, makes low speed peeling rate range and high speed peeling rate
The peeling force of range becomes smaller.
Generally, it is known that by cooperating non-reacted polysiloxane, low speed peeling rate range and high speed are removed
The peeling force of velocity interval becomes smaller.It is thought that by being non-reacted polysiloxane to surface migration, to remove
Power becomes smaller, by organic silicon migration to contact adhesive, to remain the reduction of bonding rate.For example, the poly-organosilicon containing aryl
Oxygen alkane is since the ratio of hydrocarbon increases, the compatibility poor with remover combination, the reduction of peeling force and residual bonding rate
Become more significant.In addition, in this case, also to overlay film and base while above-mentioned polysiloxane is to surface migration
The interfacial migration of material leads to the deterioration with the adaptation of substrate.In order to inhibit to migrate, reactivity is introduced in polysiloxane
Group is effective.But due to being incorporated into overlay film completely in the case where introducing hydrosilylation reactions group,
Although the migration of organosilicon is suppressed, the effect for making peeling force become smaller also becomes smaller.Hydroxyl is being introduced as other functions
In the case where group, hydroxyl lacks reactivity, so if being low as remover compared with hydrosilylation reactions group
The condition of cure of warm short time cannot prevent the migration of organosilicon.
The molecular weight of the polysiloxane means useful also for the migration of inhibition organosilicon, but high molecular weight
Also in itself with the poor compatibility of curing overlay film, therefore organic silicon migration causes to remain bonding rate the polysiloxane of change
Reduction.
In the case where having cooperated the viscosity of of the invention, 25 DEG C to be the polysiloxane of 0.001~4Pas, due to
It for low molecular weight, therefore can speculate good with the compatibility of curing overlay film, therefore can stay in curing overlay film.As a result,
Although thinking that peeling force becomes smaller, the migration of organosilicon is suppressed, and leads to the raising for remaining bonding rate.Additionally, it is believed that due to
It is good with the compatibility of curing overlay film, therefore be suppressed to the migration between curing overlay film and substrate, adaptation is not deteriorated.
[(D) ingredient]
(D) platinum group metal catalyst (addition reaction catalyst) is for promoting (A) ingredient and the crosslinking of (B) ingredient anti-
It answers, forms curing overlay film.As the addition reaction catalyst, for example, can enumerate platinum, platinum black, chloroplatinic acid, chloroplatinic acid with
The complex compound of various alkene or vinylsiloxane, chloroplatinic acid -ol complex, rhodium, rhodium-alkene complex etc..These energy
Enough a kind is used alone or two or more is appropriately combined use.
For above-mentioned addition reaction catalyst, relative to total quality of (A) ingredient and (B) ingredient, with platinum family gold
The meter of category, on forming sufficient curing overlay film, preferably cooperation 10~1,000ppm (mass ratio) can be according to mentioned component
Reactive or desired curing rate suitably increase and decrease.
[(E) ingredient]
(E) organic solvent can be cooperated in silicon composition of the invention.
Silicon composition of the invention can also be made by cooperating above-mentioned (A)~(D) ingredient of specified amount to obtain
No-solvent type composition, but also can be used as and to be used as needed with the solvent-based compositions of organic solvent diluting.Pass through
Composition is diluted with organic solvent, thus the ornamenting state for obtaining the improvement of coating operations, being coated with the thickness of overlay film, surface
The advantages in practical use such as the improvement Deng coating overlay film state.
As workable (E) organic solvent, the aromatic hydrocarbons such as toluene, dimethylbenzene based compound, hexane, heptan can be enumerated
The ketone compounds such as the aliphatic hydrocarbon based compounds such as alkane, isoparaffin, acetone, methyl ethyl ketone, methyl iso-butyl ketone (MIBK), ethyl acetate, vinegar
The ether compounds such as the ester compounds such as acid butyl ester, Di Iso Propyl Ether, Isosorbide-5-Nitrae-dioxanes, as long as the chemical combination that organosilicon can be made to dissolve
Object, then.They can a kind be used alone or two or more be appropriately combined use.
(E) ingredient is optional member, and use level can be set as any amount.I.e., it is possible to be 0 mass parts.In organic solvent
In caused risk, the worthless situation of reduction of safety, (E) ingredient can also be mismatched and the stripping of no-solvent type is made
From paper or stripping film manufacture silicon composition.For use level when cooperation (E) ingredient, relative to above-mentioned (A) ingredient
100 mass parts, preferably 100~20,000 mass parts, more preferable 200~10,000 mass parts.If the use level of (E) ingredient is not
To 100 mass parts, the advantages of generation cannot be diluted sometimes, even more than 20,000 mass parts, effect also can be less look to
Raising.
Silicon composition of the invention is by cooperating above-mentioned (A)~(E) ingredient of specified amount to obtain, as needed,
Other any ingredients can be added without impairing the purpose and effect of the present invention.It is combined in organic silicon-type remover
In object, it can be added using common use level as ingredient well known to commonly used ingredient.
As other any ingredients, peeling force controlling agent can be enumerated.This ingredient is remaining in processing bath for making
SiH base reduces, peeling force is made to lighten or improve crosslink density, use the purpose of adaptation raising.For the purpose, make
Have in 1 molecule at least two alkenyl, amount vinyl content be 5~1,000 times of amount for being equivalent to the amount vinyl content of (A) ingredient,
Viscosity at 25 DEG C is less than 1Pas or 30 compounds of the mass % dilution with toluene viscosity less than 0.1Pas.
In the case where cooperating peeling force controlling agent, relative to 100 mass parts of (A) ingredient, use level is 0.1~20 matter
Measure part, more preferably 0.1~15 mass parts.The peeling force of target can be adjusted within the above range.
As the concrete example of peeling force controlling agent, example below can be enumerated, but is not limited to these.It should say
Bright, Me, Vi in following formula respectively indicate methyl, vinyl.
[changing 26]
[changing 27]
[changing 28]
[changing 29]
[changing 30]
[changing 31]
[changing 32]
[changing 33]
(0≤n1≤100)
[changing 34]
(0≤n2≤100、0≤n3≤100、0≤n2+n3≤100)
[changing 35]
(0≤n4≤100)
[changing 36]
(0≤n5≤100、0≤n6≤100、0≤n7≤100、0≤n8≤30)
[changing 37]
(0≤n9≤100、0≤n10≤100、0≤n11≤100、0≤n12≤100、0≤n13≤100、0≤n14≤
30、0≤n15≤30)
As other any ingredients, for example, being able to use various organonitrogen compounds as working life extension agent, having
Machine phosphorus compound, alkyne series compound, oxime compound, organochlorine compound etc. are used as well known working life extension agent.Such as it can arrange
Enumerate 3- methyl-1-butine-3- alcohol, 3,5- dimethyl-1- hexin-3- alcohol, 3- Methyl-1-pentene-3- alcohol, phenylbutynol etc.
The alkyne series compounds, these alkyne series compounds such as alkyne series alcohol, 3- methyl -3-1- amylene -1- alkynes, 3,5- dimethyl -1- hexin -3- alkynes
With the vinyl silicon oxygen such as the reactant of alkoxy silane or siloxanes or hydrogen silane, tetramethyl-ethylene radical siloxane ring bodies
The organonitrogen compounds such as alkane, benzotriazole and other organic phosphorus compounds, oxime compound, organo-chromium compound etc..
As long as the use level of working life extension agent obtains the amount of good working life, generally, relative to (A) at
Divide 100 mass parts, preferably 0.01~10 mass parts.
It in turn, as needed, can as other arbitrary ingredients in the range of not interfering effect of the invention
Cooperate the inorganic fillers such as well known antioxidant, pigment, stabilizer, defoaming agent, closely sealed enhancer, thickener, silica.
[preparation method]
For the preparation of peeling paper or stripping film manufacture silicon composition, in terms of working life, preferably pre-
(A), (B), (C), (E) ingredient and any ingredient are first being used into the preceding method for adding (D) ingredient at once after mixing.
[peeling paper and stripping film]
Peeling paper and stripping film have paper base material or film base material and be formed in the substrate by above-mentioned silicon composition
The peeling layer that solidfied material is formed.Peeling layer can be formed in at least one side of above-mentioned substrate, can be single side and be also possible to two sides.
As the example of substrate, polyethylene layer stacker, glassine paper, vellum, brown paper, clay coated paper etc. can be enumerated
The polypropylene screens such as synthetic papers, polyethylene film, CPP, OPP, polyethylene terephthalate such as various coating papers, ユ Port (YUPO)
The polyester films such as film, PA membrane, polyimide film, polylactic acid membrane, poly- phenolic aldehyde film, polycarbonate membrane etc..In order to improve these bases
The product that sided corona treatment, etching process or corona treatment have been carried out to substrate surface can be used in the adaptation of material and peeling layer.
For the manufacturing method of peeling paper and stripping film, can enumerate included in substrate at least one side such as single side or
The process of the two sides coating silicon composition and silicon composition is dry, the process that solidifies it, form peeling layer
Method.As coating method, for example, can enumerate using chipping wheel coater, lip type coating machine, roll coater, molding coating machine,
Knife type coater, scraper plate coating machine, bar coater, the coating for licking painting machine, heliogravure coating machine, bar coater etc., silk screen apply
The coating methods such as cloth, dip coated, cast coat.At this point, directly can use or use as above-mentioned silicon composition
Further with the solvent of above-mentioned dilution, water above-mentioned range dilution product.To coating weight, there is no particular restriction, leads to
Often, in terms of solid component, preferably 0.01~100g/m2, more preferable 0.03~10g/m2.As dry method, can enumerate logical
Cross the method for carrying out heating to will volatilize ingredient, solvent composition removes.Specifically, it is dry that air drier, IR can be enumerated
Machine etc..Or it can directly place at normal temperature.For curing method, using conventional method, solidification temperature preferably 50~200
DEG C, more preferable 70~180 DEG C.Curing time preferably 1~120 second, more preferable 5~90 seconds.Peeling layer is made on the two sides of substrate
In the case where, the formation operation of curing overlay film is preferably carried out to each single side of substrate.
Embodiment
Embodiment described below and comparative example, but the present invention is not limited to following embodiments.
< uses raw material >
[(A) ingredient]
(A-1)
By (CH3)2(CH2=CH) SiO1/2Shown in dimethylvinyl siloxane unit 0.02 mole of %, (CH3)(CH2
=CH) SiO2/2Shown in methyl vinyl siloxane unit 0.58 mole of %, (CH3)2SiO2/2Shown in dimethyl siloxane list
The polysiloxane that 99.4 moles of % of member are constituted
Viscosity at 25 DEG C of 30 mass % toluene solutions is 15Pas
Amount vinyl content=0.008 mole/100g
(A-2)
By (CH3)2(CH2=CH) SiO1/2Shown in dimethylvinyl siloxane unit 0.02 mole of %, (CH3)(CH2
=CH) SiO2/2Shown in methyl vinyl siloxane unit 0.63 mole of %, (CH3)2SiO2/2Shown in dimethyl siloxane list
Member 96.35 moles of %, Ph2SiO2/2Shown in 3.0 moles of % of diphenylsiloxane unit constitute polysiloxane
Viscosity at 25 DEG C of 30 mass % toluene solutions is 10Pas
Amount vinyl content=0.008 mole/100g
[(B) ingredient]
(B-1)
By (CH3)3SiO1/2Shown in trimethyl siloxane units 5 moles of %, (CH3)HSiO2/2Shown in methyl hydrogen silicon oxygen
The organic hydrogen polysiloxanes that 95 moles of % of alkane unit are constituted
Viscosity at 25 DEG C is 0.02Pas
SiH base content=1.6 mole/100g
(B-2)
By (CH3)3SiO1/2Shown in trimethyl siloxane units 2 moles of %, (CH3)HSiO2/2Shown in methyl hydrogen silicon oxygen
Alkane unit 58 moles of %, (CH3)2SiO2/2Shown in dimethyl siloxane units 20 moles of %, Ph2SiO2/2Shown in diphenyl
The organic hydrogen polysiloxanes that 20 moles of % of siloxane unit are constituted
Viscosity at 25 DEG C is 0.7Pas
SiH base content=0.64 mole/100g
[(C) ingredient]
(C-1)~(C-8)
The polysiloxane indicated by general formula (4).O is the number for meeting the viscosity of C-1~C-8.
[changing 38]
(C-1) viscosity at 25 DEG C is 0.01Pas
(C-2) viscosity at 25 DEG C is 0.02Pas
(C-3) viscosity at 25 DEG C is 0.05Pas
(C-4) viscosity at 25 DEG C is 0.1Pas
(C-5) viscosity at 25 DEG C is 0.5Pas
(C-6) viscosity at 25 DEG C is 1Pas
(C-7) viscosity at 25 DEG C is 3Pas
(C-8) viscosity at 25 DEG C is 10Pas
(C-9) and (C-11)
The polysiloxane indicated by general formula (5).O1 and o2 is that the viscosity for meeting (C-9) and (C-11) and Ph base contain
There is the number of rate.
[changing 39]
(C-9) Ph base containing ratio is 5 moles of %, the viscosity at 25 DEG C is 0.02Pas
(C-11) Ph base containing ratio is 5 moles of %, the viscosity at 25 DEG C is 5Pas
(C-10) and (C-13)
The polysiloxane indicated by general formula (6).O is the number for meeting the viscosity of (C-10) and (C-13).
[changing 40]
(C-10) viscosity at 25 DEG C is 0.05Pas
(C-13) viscosity at 25 DEG C is 15Pas
(C-12)
The polysiloxane indicated by general formula (7).O1 and o2 is the viscosity for meeting (C-12) and the number of Ph base containing ratio.
[changing 41]
(C-12) Ph base containing ratio is 5 moles of %, and the viscosity at 25 DEG C is 50Pas
(C-14)
1 grade of atoleine deer (Kanto Kagaku K. K.'s manufacture)
[(D) ingredient]
Platinum-vinyl siloxane complex compound as catalyst
[(E) ingredient]
The weight ratio 1:1 mixed solvent of toluene and hexane
[any ingredient]
3- methyl-1-butine-3- alcohol as working life extension agent
< Examples 1 to 10,1~11 > of comparative example
(A) shown in will be above-mentioned~(E) ingredient and any ingredient are used as raw material, prepare coating using following step
Silicon composition.
(A), (B), (C) ingredient are taken into flask according to the match ratio of table, add (E) 3,200 mass parts, any ingredient
3 mass parts are stirred and are dissolved.
By adding (D) ingredient in obtained solution, so as to, with platinum mass conversion meter, become relative to (A) ingredient
100ppm is stirred, to obtain the silicon composition of coating.Using the composition, using aftermentioned method system
Make coated articles, is evaluated.
< evaluates >
For the remover of each example, power needed for being evaluated using the following method or measured curability, removing is (hereinafter referred to as
" peel strength "), residual bonding rate.It shows the result in table 1~3.
[curability (adaptation after effect at once)]
Obtained composition is coated on thick 38 μm of PET film using rod coaters, is added in 120 DEG C of heated air drier
Heat 1 minute, forms peeling layer.At this point, making coating weight in terms of solid component, become 0.2g/m2.Next, should with finger
It after peeling layer rubs 10 times, observes by visual observation and the presence or absence of obscures and fall off, evaluated using standard below.
A: it does not find fuzzy and falls off.
B: it rarely has found fuzzy and falls off.
C: discovery is fuzzy or falls off.
[peel strength]
Low speed disbonded test
It is identically formed peeling layer with the evaluation of above-mentioned curability, is evaluated according to FINAT method using following steps.
In the wide 25mm adhesive tape of the surface mount of peeling layer (Tesa7475 Tape, Tesa Tape.Inc trade name),
Apply 70g/cm in 25 DEG C of drying machine2Load, heat 20 hours.After air-cooled 30 minutes or so, tried using stretching
Machine (Shimadzu Scisakusho Ltd manufacture AGS-50G type) is tested, is stretched using the angle of 180 ゜, peeling rate 0.3m/ minutes
Tesa7475 Tape, power (N/25mm) needed for measurement makes its removing.
High speed disbonded test
In the same manner as above-mentioned low speed disbonded test, evaluated according to FINAT method using following steps.
In the wide 25mm adhesive tape of the surface mount of peeling layer (Tesa7475 Tape, Tesa Tape.Inc trade name),
Apply 70g/cm in 25 DEG C of drying machine2Load, heat 20 hours.After air-cooled 30 minutes or so, tried using stretching
Test machine (テ ス タ ー Industry Co., Ltd high speed electronic stripping tester), using the angle of 180 ゜, peeling rate 60m/ minutes come
Stretch Tesa7475 Tape, power (N/25mm) needed for measurement makes its removing.
[residual bonding rate]
·Tesa7475 Tape
It is identically formed peeling layer with the evaluation of above-mentioned curability, in the wide 25mm adhesive tape of the surface mount of peeling layer
(Tesa7475 Tape, Tesa Tape.Inc trade name), applies 70g/cm in 25 DEG C of drying machine2Load, heating
Processing 20 hours.Then, it is removed from peeling layer by wide 25mm adhesive tape, width 25mm adhesive tape is pasted on stainless steel plate.It connects
Get off, using cupping machine (Shimadzu Scisakusho Ltd manufacture AGS-50G type), from stainless steel plate by wide 25mm adhesive tape
Removing measures peel strength X.
In addition, the wide 25mm adhesive tape for not fitting in peeling layer is pasted on stainless steel plate, it will using cupping machine
Wide 25mm adhesive tape determines peel strength Y from stainless steel sheet peeling off.
Moreover, having found out residual bonding rate by the formula of (peel strength X/ peel strength Y) × 100 (%).
Residual bonding rate is higher, and the fissility of peeling layer is more excellent, and expression fits in width 25mm gluing caused by peeling layer
The reduction of the bonding force of band is inhibited, that is, is inhibited from the exudation of overlay film.
·Nitto 31B
It is identically formed peeling layer with the evaluation of above-mentioned curability, loads polyester adhesive tape (Nitto on the surface of peeling layer
31B, Nitto Denko Corp's trade name), next, the load of 1,976Pa is loaded on the adhesive tape, by polyester gluing
Band fits in peeling layer.Then, after heating 20 hours at 70 DEG C, polyester adhesive tape is removed from peeling layer, this is gathered
Ester gum adhesive tape is pasted on stainless steel plate.Next, using cupping machine, (Shimadzu Scisakusho Ltd manufactures AGS-50G
Type), polyester adhesive tape is never become rusty steel sheet peeling off, peel strength X is determined.
In addition, the polyester adhesive tape for not fitting in peeling layer is pasted on stainless steel plate, will be gathered using cupping machine
Ester gum adhesive tape determines peel strength Y from stainless steel sheet peeling off.
Then, by the formula of (peel strength X/ peel strength Y) × 100 (%), residual bonding rate has been found out.
Residual bonding rate is higher, and the fissility of peeling layer is more excellent, and expression fits in polyester adhesive tape caused by peeling layer
The reduction of bonding force be inhibited, that is, be inhibited from organic silicon migration of overlay film.
[table 1]
[table 2]
[table 3]
The result of evaluation: the polysiloxane that the viscosity by 25 DEG C of cooperation is 0.001~4Pas, to can inhibit
The amount of migration of organosilicon increases and the reduction of residual bonding rate, and makes low speed peeling rate range and high speed peeling rate simultaneously
The peeling force of range becomes smaller.
Claims (6)
1. peeling paper or stripping film the manufacture silicon composition of addition reaction curing type, it includes:
It (A) is 0.001~0.04mol/100g at least two alkenyl, amount vinyl content in 1 molecule, 30 matter at 25 DEG C
Measure the polysiloxane that % dilution with toluene viscosity is 0.01~70Pas: 100 mass parts
(B) with hydrogen atom of at least three with silicon atom in conjunction with, by the organic of following average composition formulas (1) expression in 1 molecule
Hydrogen polysiloxanes: 0.1~30 mass parts
R1 aHbSiO(4-a-b)/2 (1)
In formula, R1For the monovalent organic group without aliphatic unsaturated bond, a be 0.1~2, b be 0.1~2.9, a+b be 1~
3.0 positive number, with the SiH base in 1 molecule with 3 or more, 25 DEG C of viscosity falls into the range of 0.005~10Pas
Mode selects,
(C) polysiloxane indicated by the following general formula (2): 1~30 mass parts
[changing 1]
In formula, R2Can be identical or different, it is unsubstituted or substituted alkyl radical, the carbon atom number 6~20 of carbon atom number 1~20
Unsubstituted or substituted aryl, the unsubstituted or substituted aralkyl of carbon atom number 7~20 or hydroxyl or carbon atom number 1~3
Alkoxy, c be 2 or more integer, d be 1 or more integer, e be 0 or more integer, f be 0 or more integer, with 25 DEG C
The mode that viscosity falls into the range of 0.001~4Pas selects c+d+e+f,
(D) platinum group metal catalyst: catalytic amount.
2. peeling paper according to claim 1 or stripping film manufacture silicon composition, wherein in general formula (2), with
The mode that 25 DEG C of viscosity falls into the range of 0.008~1Pas selects c+d+e+f.
3. peeling paper according to claim 2 or stripping film manufacture silicon composition, wherein in general formula (2), with
The mode that 25 DEG C of viscosity falls into the range of 0.015~0.5Pas selects c+d+e+f.
4. peeling paper described in any one of claim 1 to 3 or stripping film manufacture silicon composition, wherein In
In general formula (2), R2For the unsubstituted or substituted alkyl radical of carbon atom number 1~20 that can be identical or different.
5. peeling paper according to any one of claims 1 to 4 or stripping film manufacture silicon composition, also include
(E) organic solvent.
6. peeling paper or stripping film, according to any one of claims 1 to 5 have by being formed on paper base material or film base material
The solidfied material of machine silicon composition forms.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2017-078224 | 2017-04-11 | ||
| JP2017078224 | 2017-04-11 | ||
| PCT/JP2018/007275 WO2018190012A1 (en) | 2017-04-11 | 2018-02-27 | Silicone composition for manufacturing release paper or release film |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN110494529A true CN110494529A (en) | 2019-11-22 |
| CN110494529B CN110494529B (en) | 2022-10-04 |
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|---|---|---|---|
| CN201880024162.5A Active CN110494529B (en) | 2017-04-11 | 2018-02-27 | Silicone composition for producing release paper or release film |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JP6874831B2 (en) |
| KR (1) | KR102516463B1 (en) |
| CN (1) | CN110494529B (en) |
| TW (1) | TWI781151B (en) |
| WO (1) | WO2018190012A1 (en) |
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|---|---|---|---|---|
| CN115103888A (en) * | 2020-02-18 | 2022-09-23 | 信越化学工业株式会社 | Silicone composition for producing release paper or release film, and release paper or release film |
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| KR20210118855A (en) * | 2019-01-22 | 2021-10-01 | 신에쓰 가가꾸 고교 가부시끼가이샤 | Resin composition for release paper or release film, and release paper or release film |
| WO2021012135A1 (en) * | 2019-07-22 | 2021-01-28 | Wacker Chemie Ag | Silicone composition |
| US20230144102A1 (en) * | 2020-03-16 | 2023-05-11 | Shin-Etsu Chemical Co., Ltd. | Organopolysiloxane composition for use in release paper or release film |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0753875A (en) * | 1993-08-09 | 1995-02-28 | Toray Dow Corning Silicone Co Ltd | Curbale release agent composition |
| JP2003261855A (en) * | 2002-03-07 | 2003-09-19 | Wacker Asahikasei Silicone Co Ltd | Silicone composition for forming peelable cured film |
| JP2017025135A (en) * | 2015-07-16 | 2017-02-02 | 信越化学工業株式会社 | Silicone composition for release paper or release film, release paper or release film |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60133051A (en) | 1983-12-21 | 1985-07-16 | Dow Corning Kk | Releasable film-forming composition |
| JPH0619028B2 (en) | 1989-01-17 | 1994-03-16 | 信越化学工業株式会社 | Organopolysiloxane composition for release coating |
| JPH0660287B2 (en) | 1989-09-05 | 1994-08-10 | 信越化学工業株式会社 | Silicone composition for release paper and release paper |
| JP2946963B2 (en) | 1992-09-09 | 1999-09-13 | 信越化学工業株式会社 | Silicone composition for forming release film and release film |
| JP2971357B2 (en) | 1995-02-13 | 1999-11-02 | ジーイー東芝シリコーン株式会社 | Peeling composition |
| JP4083426B2 (en) | 2001-12-27 | 2008-04-30 | 東レ・ダウコーニング株式会社 | Organopolysiloxane composition for forming a peelable cured film |
| JP6418326B2 (en) * | 2015-06-08 | 2018-11-07 | 信越化学工業株式会社 | Release paper or silicone composition for release film, release paper and release film |
-
2018
- 2018-02-27 JP JP2019512370A patent/JP6874831B2/en active Active
- 2018-02-27 WO PCT/JP2018/007275 patent/WO2018190012A1/en active Application Filing
- 2018-02-27 KR KR1020197011033A patent/KR102516463B1/en active IP Right Grant
- 2018-02-27 CN CN201880024162.5A patent/CN110494529B/en active Active
- 2018-03-13 TW TW107108368A patent/TWI781151B/en active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0753875A (en) * | 1993-08-09 | 1995-02-28 | Toray Dow Corning Silicone Co Ltd | Curbale release agent composition |
| JP2003261855A (en) * | 2002-03-07 | 2003-09-19 | Wacker Asahikasei Silicone Co Ltd | Silicone composition for forming peelable cured film |
| JP2017025135A (en) * | 2015-07-16 | 2017-02-02 | 信越化学工業株式会社 | Silicone composition for release paper or release film, release paper or release film |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115103888A (en) * | 2020-02-18 | 2022-09-23 | 信越化学工业株式会社 | Silicone composition for producing release paper or release film, and release paper or release film |
| CN115103888B (en) * | 2020-02-18 | 2024-05-10 | 信越化学工业株式会社 | Silicone composition for producing release paper or release film, and release paper or release film |
Also Published As
| Publication number | Publication date |
|---|---|
| TW201843237A (en) | 2018-12-16 |
| WO2018190012A1 (en) | 2018-10-18 |
| KR20190131474A (en) | 2019-11-26 |
| JP6874831B2 (en) | 2021-05-19 |
| TWI781151B (en) | 2022-10-21 |
| KR102516463B1 (en) | 2023-03-31 |
| CN110494529B (en) | 2022-10-04 |
| JPWO2018190012A1 (en) | 2020-04-23 |
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