CN110494033A - Patch perforation type matrix group, mould group luminescent screen, production method and equipment - Google Patents
Patch perforation type matrix group, mould group luminescent screen, production method and equipment Download PDFInfo
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- CN110494033A CN110494033A CN201910759719.6A CN201910759719A CN110494033A CN 110494033 A CN110494033 A CN 110494033A CN 201910759719 A CN201910759719 A CN 201910759719A CN 110494033 A CN110494033 A CN 110494033A
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 48
- 239000011159 matrix material Substances 0.000 title claims abstract description 46
- 239000000758 substrate Substances 0.000 claims abstract description 42
- 239000011324 bead Substances 0.000 claims abstract description 15
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 41
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims description 24
- 238000009434 installation Methods 0.000 claims description 16
- 239000000463 material Substances 0.000 claims description 13
- 239000011505 plaster Substances 0.000 claims description 12
- 239000000725 suspension Substances 0.000 claims 1
- 238000000034 method Methods 0.000 abstract description 8
- 238000005476 soldering Methods 0.000 description 6
- 239000006071 cream Substances 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 239000003292 glue Substances 0.000 description 3
- 230000005540 biological transmission Effects 0.000 description 2
- 230000033001 locomotion Effects 0.000 description 2
- 238000004080 punching Methods 0.000 description 2
- 230000003319 supportive effect Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000004020 luminiscence type Methods 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar form; Layered products having particular features of form
- B32B3/26—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar form; Layered products having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer
- B32B3/266—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar form; Layered products having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer characterised by an apertured layer, the apertures going through the whole thickness of the layer, e.g. expanded metal, perforated layer, slit layer regular cells B32B3/12
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B33/00—Layered products characterised by particular properties or particular surface features, e.g. particular surface coatings; Layered products designed for particular purposes not covered by another single class
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F13/00—Illuminated signs; Luminous advertising
- G09F13/04—Signs, boards or panels, illuminated from behind the insignia
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F13/00—Illuminated signs; Luminous advertising
- G09F13/04—Signs, boards or panels, illuminated from behind the insignia
- G09F13/0418—Constructional details
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F13/00—Illuminated signs; Luminous advertising
- G09F13/04—Signs, boards or panels, illuminated from behind the insignia
- G09F13/08—Signs, boards or panels, illuminated from behind the insignia using both translucent and non-translucent layers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/046—Surface mounting
- H05K13/0465—Surface mounting by soldering
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/40—Properties of the layers or laminate having particular optical properties
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2551/00—Optical elements
Abstract
The present invention provides a kind of patch perforation type matrix group, mould group luminescent screen, production method and equipment.The mould group includes: rectangular substrate, lamp bead, subsidiary components and two rectangular pads；Substrate includes upper surface and lower end surface；Lamp bead and subsidiary components are each welded to the upper surface of substrate；The lower end surface of substrate is arranged at least one of two rectangular pads.The luminescent screen includes: to perforate type matrix group and the conductive bottom plate, conductive intermediate plate and the advertising panel that set gradually from the bottom to top including patch.This method comprises: bottom plate, intermediate plate and advertising panel are engraved as respective shapes；The first fabrication hole is formed on intermediate plate；Bottom plate and intermediate plate are fixed together；Mould group is attached on bottom plate through the first fabrication hole by the patch path of setting and welds together the one of pad and bottom plate of mould group；Another pad and intermediate plate of mould group are welded together；Advertising panel is fixed on intermediate plate.Working efficiency can be improved in the present invention.
Description
Technical field
The present invention relates to technical field of LED illumination more particularly to a kind of patch perforation type matrix groups, mould group luminescent screen, production
Method and apparatus.
Background technique
There are mainly two types of existing LED advertised products, the first is LED luminescent characters or LED light box, main production method
It manually pastes on a backboard to pass through LED using the mould group or lamp bar that connect in advance, is then buckled again above
Smooth surface cover, to be made into finished product；Second is perforation word, is the perforated lamp carried out and linked together in advance through neatly
Finished product is made on the backboard having openning hole.Both techniques have a common feature, and illuminating source exactly used is all to connect in advance
Good the shortcoming of this technique is in post production process a group by a group, can not be neatly quick group with the means of automation
Dress.
Summary of the invention
The problem of in existing luminescent screen manufacturing process, artificial participation is big, and when module group assembling can not automate, this
Invention provides a kind of patch perforation type matrix group, mould group luminescent screen, production method and equipment, can be automated patch, then again
It is welded, working efficiency can be greatly improved, reduce cost.
In a first aspect, the present invention provides a kind of patch perforation type matrix group, comprising: rectangular substrate, lamp bead, subsidiary components
With two rectangular pads；The rectangular substrate includes upper surface and lower end surface；The lamp bead and the subsidiary components weld
It is connected to the upper surface of the rectangular substrate；The lower end of the rectangular substrate is arranged at least one of two described rectangular pads
Face.
Further, the upper surface of the rectangular substrate is arranged in one in two rectangular pads, another sets
It sets in the lower end surface of the rectangular substrate；Be arranged in the upper surface of the rectangular substrate rectangular pads and the auxiliary electron device
Part is located at the two sides of the lamp bead.
Further, two rectangular pads are separately positioned on the two edges side of the lower end surface of the rectangular substrate.
Second aspect, the present invention provides a kind of mould group luminescent screen, including several as described in claims 1 to 3 is any
Conductive bottom plate, conductive intermediate plate and the advertising panel patch perforation type matrix group and set gradually from the bottom to top；
Two rectangular pads of patch perforation type matrix group be respectively welded on the bottom plate and the intermediate plate on；In described
Between plate and advertising panel be bonded by cohesive material；
Several first fabrication holes, the position of each first fabrication hole and each patch are offered on the intermediate plate
Type matrix group of perforating corresponds.
Further, between the intermediate plate and advertising panel further include: padded made of transparent or semitransparent material
Layer；Adjacent in the intermediate plate, bed course and advertising panel is bonded by cohesive material between the two；
Several second fabrication holes, the position of each second fabrication hole and each first work are offered on the bed course
Skill hole corresponds；Wherein, the size of second fabrication hole is more than or equal to the size of first fabrication hole.
The third aspect, the present invention provide a kind of production method of mould group luminescent screen, comprising:
Step 1: bottom plate, intermediate plate and advertising panel are engraved as respectively by respective shapes according to design requirement；
Step 2: the first fabrication hole is formed on the intermediate plate；
Step 3: bottom plate and intermediate plate are fixed together；
Step 4: will through first fabrication hole by the patch path of setting using the equipment for making LED advertisement light emitting plate
Patch perforation type matrix group is attached on the bottom plate and welds one of rectangular pads of patch perforation type matrix group and the bottom plate
It is connected together；
Step 5: being passed through another rectangular pads of patch perforation type matrix group using the equipment for making LED advertisement light emitting plate
Conducting wire and intermediate plate weld together；
Step 6: advertising panel is fixed on the intermediate plate.
Further, the step 2 further include: the second fabrication hole is formed on bed course；Correspondingly,
The step 6 specifically: bed course is fixed on the intermediate plate；Advertising panel is fixed on the bed course.
Fourth aspect, the present invention provide a kind of equipment for making LED advertisement light emitting plate include: base, working slider,
X-axis cantilever sliding axle, y-axis cantilever sliding axle, work cantilever, automatic chip mounting mounting assembly and fixed feeder；
The working slider is installed in the bottom of the base, it is sliding to be mounted on the x-axis cantilever in the two sides of the base
Moving axis is equipped with the work cantilever in the top shelf of the base, and the work cantilever and two x-axis cantilever sliding axles are sliding
Dynamic connection；The side of the work cantilever is equipped with the y-axis cantilever sliding axle, and peace is slided on the y-axis cantilever sliding axle
Equipped with automatic chip mounting mounting assembly；The fixed feeder is installed on an x-axis cantilever sliding axle wherein.
Further, flying-vision camera, the flying-vision phase are also fixedly installed on the y-axis cantilever sliding axle
Machine is located at the side of the automatic chip mounting mounting assembly；The fixed feeder includes hopper, is located in the hopper described
One end above working slider is equipped with the fixed vision camera.
Further, the automatic chip mounting mounting assembly includes: component installation pedestal, and setting is installed in the component
Fixed plate and flight feeder on pedestal；Plaster mechanism and Dian Xi mechanism are disposed in the fixed plate.
Further, patch feeding sliding rail is fixedly installed in the component installation pedestal, the patch feeding sliding rail is logical
It crosses sliding block to be slidably connected with fixed plate, the left and right sides is rotatably connected to support shaft in component installation pedestal, covers in two support shafts
Equipped with patch feeding belt, the patch feeding belt and fixed plate are sequentially connected.
Further, the flight feeder includes: flight feed pedestal, flies up to fixing seat and flight feed motor；
The flight feed pedestal is arranged in component installation pedestal at the position of plaster mechanism, and the flight is fed motor
On flight feed pedestal, the output shaft of flight feed motor is pierced by the flight feed pedestal and connects the patch feeding for setting
Belt, the fixing seat that flies up to are fixed on the flight feed pedestal, fly up to be fixedly connected in fixing seat described
It flies up to, it is described to fly up to be connected with the internal charging pipe equipped with patch perforation type matrix group.
Further, the plaster mechanism includes: the first z-axis sliding rail, patch z-axis motor, rotary suction nozzle, patch z-axis skin
Band and placement head rotating electric machine；
The patch z-axis motor is fixed in the fixed plate, and the fixed plate is in the position of the correspondence patch z-axis motor
The place of setting is provided with the first z-axis sliding rail, and attachment base is slidably connected on the first z-axis sliding rail, and the patch z-axis motor is logical
Patch z-axis belt and the attachment base is crossed to be sequentially connected, be provided on the attachment base placement head rotating electric machine and with institute
State the rotary suction nozzle of placement head rotating electric machine transmission connection.
Further, the Dian Xi mechanism includes: the second z-axis sliding rail, point tin-tube, point tin z-axis belt, point tin z-axis motor
With a tin-tube mounting base；
Described tin z-axis motor is fixed in the fixed plate, and the fixed plate is in the position of described tin z-axis motor of correspondence
The place of setting is provided with the second z-axis sliding rail, and sliding block is slidably connected on the second z-axis sliding rail, is fixedly installed on the sliding block
There is a tin-tube mounting base, described tin z-axis motor is sequentially connected by described tin z-axis belt and described tin-tube mounting base,
Described tin-tube is embedded in described tin-tube mounting base.
Beneficial effects of the present invention:
Patch provided by the invention is perforated type matrix group, for led lamp beads are attached on circuit board, can by mould group chip mounter patch,
Without the New-type mould group being welded to connect in advance with conducting wire, it is different from and existing connected in advance with conducting wire, passes through people
The mould group that work is pasted；
Mould group luminescent screen provided by the invention be will in advance without conducting wire connection mould group be given by way of braid it is special
Machine carries out automation patch, accomplishes marshalling, beautiful；Then automatic welding is carried out again, is solved existing mould group and is shone
Mould group is by manually pasting in plate, low efficiency, pastes and arranges in disorder, easy leakage lamp, the problem of visual effect difference.
The production method of mould group luminescent screen provided by the invention, operational sequence is simple, solves mould group luminescent screen production work
Sequence is more, the problem of large labor intensity；And bottom plate, intermediate plate and advertising panel can be engraved as the shape needed according to design requirement
Shape solves the problems, such as that existing product does not do 2 centimetres of luminescence scutcheons below；In addition, the thickness of bottom plate, intermediate plate and advertising panel
Degree can be adjusted according to customer demand, so as to make thinner advertisement light emitting product, can more effectively meet market need
It asks.
The production of current advertisement light emitting part, which relies primarily on, manually puts and pastes, and there are low efficiencys, at high cost, neatly
The disadvantages of bad is spent, a kind of equipment for making LED advertisement light emitting plate provided by the invention, when automatic chip mounting mounting assembly is made
When industry, Dian Xi mechanism and plaster mechanism in automatic chip mounting mounting assembly carry out scolding tin and patch under the driving of respective z-axis motor
Piece operation, so as to greatly improve working efficiency, reduce cost so that traditional manual work is changed to automated construction；
And by setting flying-vision camera, automatic chip mounting mounting assembly is monitored, automatic chip mounting installation can be accurately controlled
The moving direction of component, so that scolding tin position and patch location are more accurate, the product of production is more beautiful.
Detailed description of the invention
Fig. 1 is a kind of main view of patch perforation type matrix group provided in an embodiment of the present invention；
Fig. 2 is the top view of one of Fig. 1 patch perforation type matrix group；
Fig. 3 is a kind of main view for patch perforation type matrix group that further embodiment of this invention provides；
Fig. 4 is the top view of one of Fig. 3 patch perforation type matrix group；
Fig. 5 is a kind of intermediate plate top view of mould group luminescent screen provided in an embodiment of the present invention；
Fig. 6 is the sectional structure chart of one of Fig. 5 mould group luminescent screen；
Fig. 7 is a kind of intermediate plate top view for mould group luminescent screen that further embodiment of this invention provides；
Fig. 8 is the sectional structure chart of one of Fig. 7 mould group luminescent screen；
Fig. 9 is provided in an embodiment of the present invention a kind of for making one of the structural schematic diagram of equipment of LED advertisement light emitting plate；
Figure 10 is provided in an embodiment of the present invention a kind of for making the second structural representation of the equipment of LED advertisement light emitting plate.
Appended drawing reference: A1 is patch perforation type matrix group, and A11 is rectangular substrate, and A12 is lamp bead, and A13 is auxiliary electron device
Part, A14 are rectangular pads, and A21 is bottom plate, and A22 is intermediate plate, and A23 is bed course, and A24 is advertising panel, and A25 is the first technique
Hole, A26 are the second fabrication hole, and A27 is conducting wire；1 is fixed plate, and 2 be base, and 3 be working slider, and 4 be x-axis cantilever sliding axle, 5
It is work cantilever for y-axis cantilever sliding axle, 6,7 be plaster mechanism, and 8 be patch z-axis motor, and 9 be Dian Xi mechanism, and 10 be flight view
Feel camera, 11 be fixed feeder, and 12 be rotary suction nozzle, and 13 be fixed vision camera, and 14 be point tin-tube, and 15 be point tin z-axis
Belt, 16 be point tin z-axis motor, and 17 be component installation pedestal, and 18 be point tin-tube mounting base, and 19 is fly up to fixing seat, and 20 be patch
Piece feeding sliding rail, 21 be patch feeding belt, and 22 be flight feed pedestal, and 23 be patch z-axis belt, and 24 be placement head electric rotating
Machine.
Specific embodiment
To make the object, technical solutions and advantages of the present invention clearer, below in conjunction with attached in the embodiment of the present invention
Figure, technical solution in the embodiment of the present invention are explicitly described, it is clear that described embodiment is a part of the invention
Embodiment, instead of all the embodiments.Based on the embodiments of the present invention, those of ordinary skill in the art are not making wound
Every other embodiment obtained under the premise of the property made labour, shall fall within the protection scope of the present invention.
The embodiment of the present invention provides a kind of patch perforation type matrix group A1, comprising: rectangular substrate A11, lamp bead A12, auxiliary electricity
Sub- device A13 and two rectangular pads A14；The rectangular substrate A11 includes upper surface and lower end surface；The lamp bead A12 and institute
State the upper surface that subsidiary components A13 is each welded to the rectangular substrate A11；In two rectangular pads A14 at least
One is arranged in the lower end surface of the rectangular substrate A11.
Specifically, as an embodiment, as depicted in figs. 1 and 2, one in two rectangular pads A14
The upper surface of the rectangular substrate A11 is set, and the lower end surface of the rectangular substrate A11 is arranged in another；It is arranged described
The rectangular pads A14 of the upper surface of rectangular substrate A11 and the subsidiary components A13 are located at the two of the lamp bead A12
Side.
As another embodiment, as shown in Figure 3 and Figure 4, two rectangular pads A14 are separately positioned on described
The two edges side of the lower end surface of rectangular substrate A11.
The embodiment of the present invention provides a kind of mould group luminescent screen, including several above-mentioned patch perforation type matrix group A1 and under
The supreme conductive bottom plate A21 set gradually, conductive intermediate plate A22, the bed course made of transparent or semitransparent material
A23 and advertising panel A24；Two rectangular pads A14 of the patch perforation type matrix group A1 are respectively welded on the bottom plate A21
On the intermediate plate A22；Adjacent in the intermediate plate A22, bed course A23 and advertising panel A24 passes through viscosity between the two
Material is bonded；Several first fabrication hole A25 are offered on the intermediate plate A22, each first fabrication hole A25's
Position and each patch perforation type matrix group A1 are corresponded；Several second fabrication holes are offered on the bed course A23
A26, the position of each second fabrication hole A26 and each first fabrication hole A25 are corresponded；Wherein, described second
The size of fabrication hole A26 is more than or equal to the size of the first fabrication hole A25.
The bottom plate A21 is cleavable, machinable conductive plate, for fixed and soldering surface mounted perforation type matrix group A1, institute
Stating patch perforation type matrix group is to install led lamp beads A12 and subsidiary components A13 on rectangular substrate A11 and be reserved with rectangle weldering
Disk A14, the device of solderable link；The intermediate plate A22 is cleavable, processable, single-sided conductive plank, previously according to wanting
It asks and is processed into respective shapes, and punched above, for being placed with above-mentioned patch perforation type matrix group A1: will be pasted by artificial or equipment
Piece perforation type matrix group A1 is attached in the punching, and patch perforation type matrix group A1 and intermediate plate A22 is welded by conducting wire；
The bed course A23 is the transparent or semitransparent material to play a supportive role, and the advertising panel A24 is corresponding according to requiring to use
Show and colour is prepared advertising the material of effect.
Specifically, as an embodiment, as shown in Figure 5 and Figure 6, when patch perforation type matrix group A1 is Fig. 1 and Fig. 2
When the mould group of shown structure, patch perforates type matrix group A1 between bottom plate A21 and intermediate plate A22.On the one hand, conducting wire can be passed through
A27 connection is located at the rectangular pads A14 and intermediate plate A22 of the upper surface rectangular substrate A11, specifically: it can be by one end of conducting wire 27
Weld together with the rectangular pads A14 being located above rectangular substrate A11, the other end of conducting wire A27 and intermediate plate A22 are welded
Together.On the other hand, the rectangular pads A14 for being located at the lower end surface rectangular substrate A11 can be welded on bottom plate A21's by scolding tin
Surface.
As another embodiment, as shown in Figure 7 and Figure 8, when patch perforation type matrix group A1 is shown in Fig. 3 and Fig. 4
When the mould group of structure, bottom plate A21 and intermediate plate A22 are adjacent, and patch perforation type matrix group A1 is located at the upper surface of intermediate plate A22.One side
Face, can by the one of rectangular pads A14 and bottom plate A21 of conducting wire A27 connection, specifically: can be by one end and position of conducting wire A27
Rectangular pads A14 above rectangular substrate A11 welds together, and the other end of conducting wire A27 and bottom plate A21 are welded on one
It rises.On the other hand, another rectangular pads A14 can be directly welded to the upper surface of intermediate plate A22, intermediate plate by scolding tin
The lower end surface of A22 is soldered to the surface of bottom plate A21.
The embodiment of the present invention provides a kind of production method of mould group luminescent screen, comprising:
S101: bottom plate A21, intermediate plate A22 and advertising panel A24 are engraved as respectively by respective shapes according to design requirement；
S102: forming the first fabrication hole A25 on the intermediate plate A22, and the second fabrication hole A26 is formed on the bed course A23；
S103: bottom plate A21 and intermediate plate A22 are fixed together；For example, setting an insulation between bottom plate A21 and intermediate plate A22
Layer, bottom plate A21 and intermediate plate A22 are carried out with the insulating layer by cohesive material (such as glue) be bonded respectively.
S104: first technique is penetrated by the patch path of setting using the equipment for making LED advertisement light emitting plate
Patch perforation type matrix group A1 is attached on the bottom plate A21 and welds one of rectangle of patch perforation type matrix group A1 by hole A25
Disk A14 and the bottom plate A21 weld together；For example, being welded using conducting resinl or tin cream.
S105: another rectangle of patch perforation type matrix group A1 is welded using the equipment for making LED advertisement light emitting plate
Disk A14 is welded together by conducting wire A27 and intermediate plate A22；
S106: bed course A23 is fixed on the intermediate plate A22；For example, being fixed by glue.
S107: advertising panel A24 is fixed on the bed course A23.For example, being fixed by glue.
Specifically, as an embodiment, when making mould group luminescent screen as shown in Figure 3, the step S104
Specifically:
Firstly, the rectangular pads A14 for being located at the lower end surface rectangular substrate A11 to be welded on to the surface of bottom plate A21 by scolding tin.So
Afterwards, one end of conducting wire A27 is welded together with the rectangular pads A14 being located above rectangular substrate A11, by the another of conducting wire A27
One end welds together with intermediate plate A22.
As another embodiment, when making mould group luminescent screen as shown in Figure 4, the step S104 is specific
Are as follows:
Firstly, one end of conducting wire A27 is welded together with the rectangular pads A14 being located above rectangular substrate A11, by conducting wire
The other end of A27 welds together with bottom plate A21.Then, another rectangular pads A14 is directly welded at by centre by scolding tin
The upper surface of plate A22, the lower end surface of intermediate plate A22 are soldered to the surface of bottom plate A21.
The present invention provides a kind of production method of luminescent screen, the luminescent screen primary structure include: bottom plate, led mould group,
Intermediate plate, bed course, advertising panel.The bottom plate is cleavable, machinable conductive plate, for fixed and soldering surface mounted perforation word
Mould group, the mould group are to install led lamp beads and subsidiary components on substrate and be reserved with pad, the device of solderable link；
The intermediate plate is cleavable, machinable single-sided conductive plate, previously according to requiring to be processed into respective shapes, and is beaten above
Hole, for being placed with above-mentioned mould group: being attached to mould group by artificial or equipment in punching, and mould group and intermediate plate are passed through conducting wire
It welds；The bed course is the transparent or semitransparent material to play a supportive role, and the advertising panel is according to requiring to use phase
The show and colour answered is prepared advertising the material of effect.The embodiment of the present invention can be more energy efficient out with low-cost production, and brightness is higher, figure
The better advertisement light emitting word of case effect, lamp box, display card and other items.
In conjunction with shown in Fig. 9 and Figure 10, the embodiment of the present invention provides a kind of equipment for making LED advertisement light emitting plate, should
Equipment includes: base 2, working slider 3, x-axis cantilever sliding axle 4, y-axis cantilever sliding axle 5, work cantilever 6, automatic chip mounting installation
Component, fixed feeder 11；The working slider 3 is installed in the bottom of the base 2, it is equal in the two sides of the base 2
The x-axis cantilever sliding axle 4 is installed, is equipped with the work cantilever 6 in the top shelf of the base 2, the work cantilever 6 with
Two x-axis cantilever sliding axles 4 are slidably connected；The side of the work cantilever 6 is equipped with the y-axis cantilever sliding axle 5, In
Automatic chip mounting mounting assembly and flying-vision camera 10 are slidably fitted on the y-axis cantilever sliding axle 5；The flying-vision phase
Machine 10 is located at the side of the automatic chip mounting mounting assembly；It is equipped on an x-axis cantilever sliding axle 4 wherein described solid
Determine feeder 11, the fixed feeder 11 includes hopper, is located at one end above the working slider in the hopper
The fixed vision camera 13 is installed.
Specifically, the automatic chip mounting mounting assembly includes: component installation pedestal 17, and setting is installed in the component
Fixed plate 1 and flight feeder on pedestal 17；Plaster mechanism 7 and Dian Xi mechanism are disposed in the fixed plate 1
9.Wherein: patch feeding sliding rail 20 is fixedly installed in the component installation pedestal 17, specifically, the patch feeding sliding rail 20
Sliding block is slidably connected, the sliding block is fixedly connected with fixed plate 1, and the left and right sides is rotatably connected to branch in component installation pedestal 17
Axis is supportted, patch feeding belt 21 is arranged in two support shafts, the patch feeding belt 21 is sequentially connected with fixed plate 1.Institute
Flight feeder is stated to include: flight feed pedestal 22, fly up to fixing seat 19 and flight feed motor；The flight is fed pedestal
22 are arranged in component installation pedestal 17 at the position of plaster mechanism, and the flight feed motor setting is fed bottom in flight
On seat 22, the output shaft of flight feed motor is pierced by the flight feed pedestal 22 and connects the patch feeding belt 21, described
Fixing seat 19 is flown up to be fixed on flight feed pedestal 22, it is described fly up to be fixedly connected in fixing seat 19 it is winged
It reaches, it is described to fly up to be connected with the internal charging pipe equipped with patch perforation type matrix group.
On the basis of the above embodiments, the plaster mechanism 7 includes: the first z-axis sliding rail, patch z-axis motor 8, rotation
Suction nozzle 12, patch z-axis belt 23 and placement head rotating electric machine 24；The patch z-axis motor 8 is fixed at the fixed plate 1
On, the fixed plate 1 is provided with the first z-axis sliding rail, first z-axis at the position of the correspondence patch z-axis motor 8
Attachment base is slidably connected on sliding rail, the patch z-axis motor 8 is sequentially connected by patch z-axis belt 23 and the attachment base,
Be provided on the attachment base placement head rotating electric machine 24 and with the placement head rotating electric machine 24 transmission connection described in
Rotary suction nozzle 12.
Specifically, fixed plate 1 is provided with rotary shaft, the patch z-axis at the position below corresponding patch z-axis motor 8
The output shaft upper and lower end that the upper both ends of belt 23 are set in patch z-axis motor 8 is arranged on the rotary shaft, on patch z-axis belt 23
It is fixedly connected with attachment base.
On the basis of the various embodiments described above, the Dian Xi mechanism 9 includes: the second z-axis sliding rail, point tin-tube 14, point tin z-axis
Belt 15, point tin z-axis motor 16 and point tin-tube mounting base 18；Described tin z-axis motor 16 is fixed at the fixed plate 1
On, the fixed plate 1 is provided with the second z-axis sliding rail, the 2nd z at the position of described tin z-axis motor 16 of correspondence
Sliding block is slidably connected on axis sliding rail, fixed setting has a tin-tube mounting base 18 on the sliding block, and described tin z-axis motor 16 is logical
It crosses described tin z-axis belt 15 to be sequentially connected, is fixedly installed described tin-tube mounting base 18 on described tin z-axis belt 15,
Described tin-tube 14 is embedded in described tin-tube mounting base 18.
Specifically, the upper end of described tin z-axis belt 15 is set on the output shaft of described tin z-axis motor 16, described
The lower end of point tin z-axis belt 15 is rotatablely connected by shaft and component installation pedestal 17.
The move mode of automatic chip mounting mounting assembly in the equipment is as follows: perforating when needing to install patch along the x-axis direction
When type matrix group, work cantilever 6 is moved forward and backward along the x-axis direction on two x-axis cantilever sliding axles 4, automatic on the work cantilever 6
Patch mounting assembly is also moved forward and backward, and then automatic chip mounting mounting assembly carries out patch and soldering operation.When need along the y-axis direction
When installing patch, automatic chip mounting mounting assembly horizontally slips along the y-axis direction on y-axis cantilever sliding axle 5, and then automatic chip mounting is pacified
Arrangement carries out patch and soldering operation.
The process that automatic chip mounting mounting assembly carries out patch operation is as follows: firstly, the substrate for needing to install patch is placed
On working slider；Then, rotary suction nozzle 12 can carry out feeding from fixed feeder 11 or flight feeder, then press
The position for needing to install patch is moved to according to above-mentioned move mode, rotary suction nozzle 12 carries out under the driving of patch z-axis motor 8
Lower movement makes to place a patch on the suitable position in substrate, and the direction of rotation under the driving of placement head rotating electric machine 24
It obtains patch and is in suitable direction.
The process that automatic chip mounting mounting assembly carries out soldering operation is as follows: firstly, the substrate of tin will be needed to be placed on work
Make on slide unit；Then, by tin cream decanting point tin-tube 14, then according to the design needs, Dian Xi mechanism 9 is moved to corresponding position
It sets, then puts tin-tube mounting base 18 and decline under the drive of tin z-axis motor 16, be extruded with the tin cream in time point tin-tube 14
At tin work, it then will be moved in Reflow Soldering by the substrate of tin or heated in thermal station, melt tin cream, complete weldering
Tin work.
Wherein, flying-vision camera 10 is used to monitor the motion state and installation effect of automatic chip mounting mounting assembly.For example,
When being accurately positioned needs position to be mounted, the monitoring image of flying-vision camera 10 is obtained, to control automatic chip mounting installation
Component is moved in front, rear, left and right four direction.Fixed vision camera 13 can then monitor the feeding shape of rotary suction nozzle 12
State, for adjusting the feeding posture of rotary suction nozzle 12 convenient for quick and precisely feeding.
In embodiments of the present invention, flight feeder is moved with plaster mechanism 7, and it is past to greatly save plaster mechanism 7
Return distance and the time of feeding.
In practical applications, the flight in the present invention is fed motor, patch z-axis motor 8, placement head rotating electric machine 24, point
The motor of tin z-axis motor 16 requires to use servo motor or stepper motor, as long as being able to satisfy power demand can, do not have to power etc.
Particular/special requirement.Flying-vision camera 10 and the fixed requirement of vision camera 13 are high-speed cameras, are wanted as long as being able to satisfy image-capture
It then can ask, no particular/special requirement.Fly up to may be selected tubulose fly up to or it is electronic fly up to, as long as being able to satisfy the requirement being fed as required
Can, no particular/special requirement.
Specifically, the flight feed motor in the embodiment of the present invention uses Delta ECMA-C20604RS or ECMA-
C20804RS person's model motor；Patch z-axis motor 8, placement head rotating electric machine 24 and point tin z-axis motor 16 are all made of Delta ASD-
B2- 0421-B model motor；The OSG030-815UM that flying-vision camera 10 and fixed vision camera 13 are all made of YVSION is super
High-speed industrial camera；Fly up to be matched using Samsung SM-321 or CP-421 series chip mounter is flown up to, or uses sky dragon
What K7100 chip mounter matched flies up to.
Finally, it should be noted that the above embodiments are merely illustrative of the technical solutions of the present invention, rather than its limitations；Although
Present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that: it still may be used
To modify the technical solutions described in the foregoing embodiments or equivalent replacement of some of the technical features；
And these are modified or replaceed, technical solution of various embodiments of the present invention that it does not separate the essence of the corresponding technical solution spirit and
Range.
Claims (10)
- The type matrix group 1. a kind of patch is perforated characterized by comprising rectangular substrate, lamp bead, subsidiary components and two rectangles Pad；The rectangular substrate includes upper surface and lower end surface；The lamp bead and the subsidiary components are each welded to the square The upper surface of shape substrate；The lower end surface of the rectangular substrate is arranged at least one of two described rectangular pads.
- The type matrix group 2. patch according to claim 1 is perforated, which is characterized in that one in two rectangular pads sets It sets in the upper surface of the rectangular substrate, the lower end surface of the rectangular substrate is arranged in another；It is arranged in the rectangular substrate Upper surface rectangular pads and the subsidiary components be located at the two sides of the lamp bead.
- The type matrix group 3. patch according to claim 1 is perforated, which is characterized in that two rectangular pads are separately positioned on The two edges side of the lower end surface of the rectangular substrate.
- 4. a kind of mould group luminescent screen, which is characterized in that including several patches perforation words as described in claims 1 to 3 is any Mould group and the conductive bottom plate set gradually from the bottom to top, conductive intermediate plate and advertising panel；Two rectangular pads of patch perforation type matrix group be respectively welded on the bottom plate and the intermediate plate on；In described Between plate and advertising panel be bonded by cohesive material；Several first fabrication holes, the position of each first fabrication hole and each patch are offered on the intermediate plate Type matrix group of perforating corresponds.
- 5. a kind of mould group luminescent screen according to claim 4, which is characterized in that between the intermediate plate and advertising panel Further include: the bed course made of transparent or semitransparent material；In the intermediate plate, bed course and advertising panel it is adjacent between the two It is bonded by cohesive material；Several second fabrication holes, the position of each second fabrication hole and each first work are offered on the bed course Skill hole corresponds；Wherein, the size of second fabrication hole is more than or equal to the size of first fabrication hole.
- 6. a kind of production method of mould group luminescent screen characterized by comprisingStep 1: bottom plate, intermediate plate and advertising panel are engraved as respectively by respective shapes according to design requirement；Step 2: the first fabrication hole is formed on the intermediate plate；Step 3: bottom plate and intermediate plate are fixed together；Step 4: will through first fabrication hole by the patch path of setting using the equipment for making LED advertisement light emitting plate Patch perforation type matrix group is attached on the bottom plate and welds one of rectangular pads of patch perforation type matrix group and the bottom plate It is connected together；Step 5: being passed through another rectangular pads of patch perforation type matrix group using the equipment for making LED advertisement light emitting plate Conducting wire and intermediate plate weld together；Step 6: advertising panel is fixed on the intermediate plate.
- 7. production method according to claim 6, which is characterized in that the step 2 further include: form second on bed course Fabrication hole；Correspondingly,The step 6 specifically: bed course is fixed on the intermediate plate；Advertising panel is fixed on the bed course.
- 8. a kind of equipment for making LED advertisement light emitting plate characterized by comprising base (2), working slider (3), x-axis Cantilever sliding axle (4), y-axis cantilever sliding axle (5), work cantilever (6), automatic chip mounting mounting assembly and fixed feeder (11)；The working slider (3) are installed in the bottom of the base (2), are mounted on the x in the two sides of the base (2) Axle suspension arm sliding axle (4) is equipped with the work cantilever (6), the work cantilever (6) and two in the top shelf of the base (2) A x-axis cantilever sliding axle (4) is slidably connected；The side of the work cantilever (6) is equipped with the y-axis cantilever sliding axle (5), automatic chip mounting mounting assembly is slidably fitted on the y-axis cantilever sliding axle (5)；An x-axis cantilever wherein The fixed feeder (11) is installed on sliding axle (4).
- 9. equipment according to claim 8, which is characterized in that the automatic chip mounting mounting assembly includes: component installation base Seat (17), and the fixed plate (1) and flight feeder that are arranged on the component installation pedestal (17)；In the fixed plate (1) plaster mechanism (7) He Dianxi mechanism (9) is disposed on.
- 10. equipment according to claim 9, which is characterized in that the plaster mechanism (7) includes: the first z-axis sliding rail, patch Piece z-axis motor (8), rotary suction nozzle (12), patch z-axis belt (23) and placement head rotating electric machine (24)；The patch z-axis motor (8) is fixed on the fixed plate (1), and the fixed plate (1) is in the correspondence patch z It is provided with the first z-axis sliding rail at the position of spindle motor (8), slidably connects attachment base on the first z-axis sliding rail, it is described Patch z-axis motor (8) is sequentially connected by patch z-axis belt (23) and the attachment base, is provided on the attachment base described Placement head rotating electric machine (24) and the rotary suction nozzle (12) being sequentially connected with the placement head rotating electric machine (24)；The Dian Xi mechanism (9) includes: the second z-axis sliding rail, point tin-tube (14), point tin z-axis belt (15), point tin z-axis motor (16) and tin-tube mounting base (18) are put；Described tin z-axis motor (16) is fixed on the fixed plate (1), and the fixed plate (1) is in described tin z of correspondence It is provided with the second z-axis sliding rail at the position of spindle motor (16), slidably connects sliding block on the second z-axis sliding rail, it is described Fixed setting has a tin-tube mounting base (18) on sliding block, described tin z-axis motor (16) by described tin z-axis belt (15) and Described tin-tube mounting base (18) is sequentially connected, and described tin-tube (14) is embedded on described tin-tube mounting base (18).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910759719.6A CN110494033A (en) | 2019-08-16 | 2019-08-16 | Patch perforation type matrix group, mould group luminescent screen, production method and equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910759719.6A CN110494033A (en) | 2019-08-16 | 2019-08-16 | Patch perforation type matrix group, mould group luminescent screen, production method and equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110494033A true CN110494033A (en) | 2019-11-22 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910759719.6A Pending CN110494033A (en) | 2019-08-16 | 2019-08-16 | Patch perforation type matrix group, mould group luminescent screen, production method and equipment |
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| CN (1) | CN110494033A (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011048330A (en) * | 2009-07-31 | 2011-03-10 | Kyowa Kasei Kk | Advertisement and bulletin display |
| CN103345893A (en) * | 2013-07-29 | 2013-10-09 | 上海嘉塘电子有限公司 | Large-specification light emitting diode (LED) advertising lamp box |
| US20150311249A1 (en) * | 2014-04-23 | 2015-10-29 | Lite-On Opto Technology (Changzhou) Co., Ltd. | Chip-scale packaged led device |
| US20150380607A1 (en) * | 2014-06-30 | 2015-12-31 | Everlight Electronics Co., Ltd. | Light Emitting Diode Device |
| CN210470186U (en) * | 2019-08-16 | 2020-05-05 | 焦作市特斯拉电子科技有限公司 | Equipment for manufacturing LED advertisement light-emitting plate |
-
2019
- 2019-08-16 CN CN201910759719.6A patent/CN110494033A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011048330A (en) * | 2009-07-31 | 2011-03-10 | Kyowa Kasei Kk | Advertisement and bulletin display |
| CN103345893A (en) * | 2013-07-29 | 2013-10-09 | 上海嘉塘电子有限公司 | Large-specification light emitting diode (LED) advertising lamp box |
| US20150311249A1 (en) * | 2014-04-23 | 2015-10-29 | Lite-On Opto Technology (Changzhou) Co., Ltd. | Chip-scale packaged led device |
| US20150380607A1 (en) * | 2014-06-30 | 2015-12-31 | Everlight Electronics Co., Ltd. | Light Emitting Diode Device |
| CN210470186U (en) * | 2019-08-16 | 2020-05-05 | 焦作市特斯拉电子科技有限公司 | Equipment for manufacturing LED advertisement light-emitting plate |
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