CN110491966A - 碲化铂/甲基氨铅溴钙钛矿单晶异质结光电探测器及其制作方法 - Google Patents
碲化铂/甲基氨铅溴钙钛矿单晶异质结光电探测器及其制作方法 Download PDFInfo
- Publication number
- CN110491966A CN110491966A CN201910804843.XA CN201910804843A CN110491966A CN 110491966 A CN110491966 A CN 110491966A CN 201910804843 A CN201910804843 A CN 201910804843A CN 110491966 A CN110491966 A CN 110491966A
- Authority
- CN
- China
- Prior art keywords
- film
- ptte
- mapbbr
- perovskite monocrystalline
- perovskite
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 title claims abstract description 50
- 229910052697 platinum Inorganic materials 0.000 title claims abstract description 25
- XSOKHXFFCGXDJZ-UHFFFAOYSA-N telluride(2-) Chemical compound [Te-2] XSOKHXFFCGXDJZ-UHFFFAOYSA-N 0.000 title claims abstract description 15
- BAVYZALUXZFZLV-UHFFFAOYSA-N Methylamine Chemical compound NC BAVYZALUXZFZLV-UHFFFAOYSA-N 0.000 title claims abstract description 12
- GDTBXPJZTBHREO-UHFFFAOYSA-N bromine Substances BrBr GDTBXPJZTBHREO-UHFFFAOYSA-N 0.000 title claims abstract description 12
- 229910052794 bromium Inorganic materials 0.000 title claims abstract description 12
- 238000002360 preparation method Methods 0.000 title claims abstract description 9
- 230000015572 biosynthetic process Effects 0.000 claims abstract description 4
- 239000013078 crystal Substances 0.000 claims abstract description 3
- 229910052751 metal Inorganic materials 0.000 claims description 23
- 239000002184 metal Substances 0.000 claims description 23
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 claims description 12
- 238000000034 method Methods 0.000 claims description 12
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims description 7
- 239000001257 hydrogen Substances 0.000 claims description 7
- 229910052739 hydrogen Inorganic materials 0.000 claims description 7
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 claims description 6
- 229910052786 argon Inorganic materials 0.000 claims description 6
- 230000008020 evaporation Effects 0.000 claims description 6
- 238000001704 evaporation Methods 0.000 claims description 6
- 238000006243 chemical reaction Methods 0.000 claims description 5
- 238000005566 electron beam evaporation Methods 0.000 claims description 5
- 239000008246 gaseous mixture Substances 0.000 claims description 5
- 239000002243 precursor Substances 0.000 claims description 5
- PORWMNRCUJJQNO-UHFFFAOYSA-N tellurium atom Chemical compound [Te] PORWMNRCUJJQNO-UHFFFAOYSA-N 0.000 claims description 5
- 239000007789 gas Substances 0.000 claims description 4
- 238000004519 manufacturing process Methods 0.000 claims description 4
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 3
- 239000008367 deionised water Substances 0.000 claims description 3
- 229910021641 deionized water Inorganic materials 0.000 claims description 3
- 238000010438 heat treatment Methods 0.000 claims description 3
- 229910052573 porcelain Inorganic materials 0.000 claims description 3
- 238000004506 ultrasonic cleaning Methods 0.000 claims description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 3
- 229910052714 tellurium Inorganic materials 0.000 claims description 2
- 150000002739 metals Chemical class 0.000 claims 1
- 239000000463 material Substances 0.000 abstract description 11
- 229910052723 transition metal Inorganic materials 0.000 abstract description 3
- 239000010408 film Substances 0.000 description 26
- 230000004044 response Effects 0.000 description 8
- 239000010931 gold Substances 0.000 description 6
- 238000005286 illumination Methods 0.000 description 6
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 5
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 5
- 229910052737 gold Inorganic materials 0.000 description 5
- 229910052710 silicon Inorganic materials 0.000 description 5
- 239000010703 silicon Substances 0.000 description 5
- 239000010409 thin film Substances 0.000 description 3
- 238000010521 absorption reaction Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 230000005693 optoelectronics Effects 0.000 description 2
- 230000001681 protective effect Effects 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 239000010936 titanium Substances 0.000 description 2
- OYPRJOBELJOOCE-UHFFFAOYSA-N Calcium Chemical compound [Ca] OYPRJOBELJOOCE-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 238000002835 absorbance Methods 0.000 description 1
- 239000002390 adhesive tape Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 229910052791 calcium Inorganic materials 0.000 description 1
- 239000011575 calcium Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000006854 communication Effects 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000004070 electrodeposition Methods 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 150000004820 halides Chemical class 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
- 229910001502 inorganic halide Inorganic materials 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 229910052961 molybdenite Inorganic materials 0.000 description 1
- CWQXQMHSOZUFJS-UHFFFAOYSA-N molybdenum disulfide Chemical compound S=[Mo]=S CWQXQMHSOZUFJS-UHFFFAOYSA-N 0.000 description 1
- 229910052982 molybdenum disulfide Inorganic materials 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 230000004297 night vision Effects 0.000 description 1
- 230000005622 photoelectricity Effects 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 238000004528 spin coating Methods 0.000 description 1
- 238000003786 synthesis reaction Methods 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 150000003624 transition metals Chemical class 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/0248—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies
- H01L31/0256—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by the material
- H01L31/0264—Inorganic materials
- H01L31/032—Inorganic materials including, apart from doping materials or other impurities, only compounds not provided for in groups H01L31/0272 - H01L31/0312
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/08—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof in which radiation controls flow of current through the device, e.g. photoresistors
- H01L31/10—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof in which radiation controls flow of current through the device, e.g. photoresistors characterised by at least one potential-jump barrier or surface barrier, e.g. phototransistors
- H01L31/101—Devices sensitive to infrared, visible or ultraviolet radiation
- H01L31/102—Devices sensitive to infrared, visible or ultraviolet radiation characterised by only one potential barrier or surface barrier
- H01L31/109—Devices sensitive to infrared, visible or ultraviolet radiation characterised by only one potential barrier or surface barrier the potential barrier being of the PN heterojunction type
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Inorganic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Light Receiving Elements (AREA)
Abstract
本发明公开了碲化铂/甲基氨铅溴钙钛矿单晶异质结光电探测器及其制作方法,是在绝缘基底上生长有PtTe2薄膜,在PtTe2薄膜上的局部区域生长有MAPbBr3钙钛矿单晶,PtTe2薄膜与MAPbBr3钙钛矿单晶形成异质结。本发明的光电探测器,制备过程简单、性能稳定、性能好,为过渡族金属碲化物及钙钛矿材料在光电探测器中的应用开拓了新的前景。
Description
技术领域
本发明属于半导体光电探测器领域,具体涉及一种PtTe2/MAPbBr3钙钛矿单晶异质结光电探测器及其制作方法。
背景技术
有机/无机卤化物钙钛矿材料在过去十年中因其优异的光电性能而受到广泛的研究兴趣,包括长扩散长度、低捕获密度、大吸收系数和多波段光吸收。因具有这些独特的性质,这一组混合卤化物材料作为组装各种光电器件的构件具有很大的潜力,包括发光二极管(LED)、激光器、太阳能电池和光电探测器等。在这些光电子器件中,光电探测器对于它们在基础科学和工业领域的有前景的应用非常重要,例如成像传感、光通信、夜视和环境监测等。利用钙钛矿薄膜可以制备高性能宽波段的光电探测器,其薄膜的制备可通过简单旋涂获得,但其较差的稳定性制约了其进一步应用,通常研究者们通过表面修饰或表面覆膜的方式来提高其稳定性,但同时亦提高了制备成本并且抑制了钙钛矿材料本身的光电性能,因此开始逐渐转向钙钛矿单晶的合成及其光电性能的研究。钙钛矿单晶不仅拥有优异光电性能,而且由于单晶具备较低的缺陷态以及较高的结晶度,使其具备相对较高的稳定性。
二维(2D)层状过渡金属二硫化物(TMD)材料由于独特的厚度依赖性、高载流子迁移率和良好的空气稳定性,而在电子和光电子应用中显示出巨大的潜力。由于这些出色的性能,2D层状TMD(例如MoS2、WS2和PdSe2)已成功与钙钛矿薄膜结合来制作光电探测器,包括光电导体、光电晶体管和光电二极管。这些检测器虽表现出增强的光电导增益和光响应特性,但其性能仍有待进一步提高。相较于传统的TMD半导体材料,PtTe2具有更加优异的导电性能,或可以大幅提高器件载流子传输能力,从而提高器件性能。但是作为特殊的半金属材料,PtTe2能否与钙钛矿材料结合、与何种钙钛矿材料可以结合以及如何结合可以获得高性能的器件,具有重要的研究价值。
发明内容
本发明的目的在于构建碲化铂/甲基氨铅溴钙钛矿单晶异质结制光电探测器,以期可以利用钙钛矿单晶较高的吸光度、高载流子浓度以及较高的稳定性,和碲化铂较高的导电性能及较高的温度性,来制备具有较高稳定性的高性能光电探测器。
本发明解决技术问题,采用如下技术方案:
碲化铂/甲基氨铅溴钙钛矿单晶异质结光电探测器,其特点在于:是在绝缘基底上生长有PtTe2薄膜,在所述PtTe2薄膜上的局部区域生长有MAPbBr3钙钛矿单晶,所述PtTe2薄膜与所述MAPbBr3钙钛矿单晶形成异质结;在所述绝缘基底还设置有两金属电极,其中一金属电极位于MAPbBr3钙钛矿单晶上,另一金属电极位于未生长MAPbBr3钙钛矿单晶的PtTe2薄膜上。
进一步地,所述PtTe2薄膜的厚度在20-40nm之间。更进一步地,所述PtTe2薄膜是先在绝缘基底上通过电子束蒸发法蒸镀一层5-10nm厚的铂薄膜,再用热辅助转化法,在碲氛围中将铂转化为碲化铂,从而获得PtTe2薄膜。
进一步地,所述MAPbBr3钙钛矿单晶厚度在0.5-3mm之间。更进一步地,所述MAPbBr3钙钛矿单晶是通过溶液法在PtTe2薄膜上生长获得。
进一步地,所述金属电极为Au电极、Ti电极或Ag电极,所述金属电极的厚度为50nm-200nm。
本发明所述碲化铂/甲基氨铅溴钙钛矿单晶异质结光电探测器的制作方法,包括如下步骤:
A、将绝缘基底依次用丙酮、酒精、去离子水超声清洗后,吹干备用;
B、在绝缘基底上通过电子束蒸镀法,在真空度6.7×10-3Pa以下,蒸镀一层5-10nm厚的铂薄膜;
C、将表面覆盖有铂薄膜的绝缘基底放入双温区管式炉的右温区,将盛有0.1g纯度为99.99%的碲粉的瓷舟放入双温区管式炉的左温区;通入流量为50sccm的氩氢混合气为保护气体,将左温区升温至250℃,将右温区升温至500-560℃,保持管式炉内压强为20Pa;维持反应条件1h之后,关闭双温区管式炉的加热系统,继续通入流量为50sccm的氩氢混合气,等待双温区管式炉冷却至室温时取出绝缘基底,即在绝缘基底表面生长有厚度在20-40nm之间的PtTe2薄膜;
D、将PtTe2薄膜上不需生长MAPbBr3钙钛矿单晶的区域覆盖;
将MABr和PbBr2按摩尔比1:1溶于DMF溶液中,获得二者摩尔浓度皆为0.5mol/L的前驱体溶液;然后将覆盖后的绝缘基底水平浸放在所述前驱体溶液中,80℃下保温6-12h,即在未覆盖区域生长出0.5-3mm厚的MAPbBr3钙钛矿单晶;
E、将不需蒸镀金属电极的区域覆盖,然后通过电子束蒸发法在绝缘基底上蒸镀两金属电极,其中一金属电极位于MAPbBr3钙钛矿单晶上,另一金属电极位于未生长MAPbBr3钙钛矿单晶的PtTe2薄膜上,即完成光电探测器的制备。
与已有技术相比,本发明的有益效果体现在:
1、本发明基于PtTe2薄膜和MAPbBr3钙钛矿单晶的异质结光电探测器,器件制备过程简单、性能稳定、性能良好,为过渡族金属碲化物和钙钛矿单晶材料在光电探测器中的应用开拓了新的前景。
2、本发明选用PtTe2,其具有较高的稳定性和优异的导电性能,从而提高了器件的光电性能。
3、本发明的光电探测器,MAPbBr3钙钛矿单晶在紫外可见光范围内具有较高吸收系数、较高的载流子浓度以及较高的稳定性,与PtTe2协同,因此制备的器件性能好,稳定性高。
4、本发明中的PtTe2薄膜和MAPbBr3钙钛矿单晶异质结光电探测器可以工作于零电压下,无需消耗外部能量,因而可有效降低功耗。
附图说明
图1为PtTe2/MAPbBr3钙钛矿单晶异质结制光电探测器的结构示意图,其中:1为PtTe2薄膜,2为MAPbBr3钙钛矿单晶,3为金属电极,4为绝缘基底。
图2为本发明实施例1中所得光电探测器在黑暗条件下的电流-电压特性曲线。
图3为本发明实施例1中所得光电探测器在黑暗条件下和520nm波长(11.5mW/cm2)光照下的电流-电压特性曲线。
图4为本发明实施例1中所得光电探测器在零工作电压下,在520nm波长(11.5mW/cm2)光照下的时间电流响应。
图5为本发明实施例1中所得光电探测器在5伏工作电压下,在520nm波长(11.5mW/cm2)光照下的时间电流响应。
具体实施方式
下面结合附图对本发明的实施例作详细说明,本实施例在以本发明技术方案为前提下进行实施,给出了详细的实施方式和具体的操作过程,但本发明的保护范围不限于下述的实施例。
实施例1
如图1所示,PtTe2/MAPbBr3钙钛矿单晶异质结光电探测器,是在绝缘基底4上生长有PtTe2薄膜1,在PtTe2薄膜1上的局部区域生长有MAPbBr3钙钛矿单晶2,PtTe2薄膜1与MAPbBr3钙钛矿单晶2形成异质结;在绝缘基底4还设置有两金属电极3,其中一金属电极位于MAPbBr3钙钛矿单晶上,另一金属电极位于未生长MAPbBr3钙钛矿单晶的PtTe2薄膜上。
进一步地,本实施例中所用绝缘基底为氧化硅片,所用金属电极为50nm金电极。
本实施例光电探测器的制作方法,包括如下步骤:
A、将氧化硅片依次用丙酮、酒精、去离子水超声清洗后,吹干备用。
B、在氧化硅片上通过电子束蒸镀法,在真空度6.7×10-3Pa以下,蒸镀一层8nm厚的铂薄膜;
C、将表面覆盖有铂薄膜的氧化硅片放入双温区管式炉的右温区,将盛有0.1g纯度为99.99%的碲粉的瓷舟放入双温区管式炉的左温区;通入流量为50sccm的氩氢混合气(氢气体积百分比占5%)为保护气体,将左温区升温至250℃,将右温区升温至550℃,保持管式炉内压强为20Pa;维持反应条件1h之后,关闭双温区管式炉的加热系统,继续通入流量为50sccm的氩氢混合气,等待双温区管式炉冷却至室温时取出绝缘基底,即在绝缘基底表面生长有厚度在32-35nm之间的PtTe2薄膜;
D、将PtTe2薄膜上不需生长MAPbBr3钙钛矿单晶的区域粘上胶带覆盖;
将MABr和PbBr2按摩尔比1:1溶于DMF溶液中,获得二者摩尔浓度皆为0.5mol/L的前驱体溶液;然后将覆盖后的氧化硅片水平浸放在所述前驱体溶液中,80℃下保温6h,即在未覆盖区域生长出2-3mm厚的MAPbBr3钙钛矿单晶;
E、将不需蒸镀金属电极的区域用铜箔覆盖,然后通过电子束蒸发法在绝缘基底上蒸镀两50nm的金电极,其中一金电极位于MAPbBr3钙钛矿单晶上,另一金电极位于未生长MAPbBr3钙钛矿单晶的PtTe2薄膜上,即完成PtTe2/MAPbBr3钙钛矿单晶异质结光电探测器的制备。
本实施例所制备的PtTe2/MAPbBr3钙钛矿单晶异质结光电探测器在黑暗下的电流-电压特性曲线如图2所示,从图中可以看出探测器具有明显的整流特性,整流比约等于10。
本实施例所制备的PtTe2/MAPbBr3钙钛矿单晶异质结光电探测器在黑暗下和波长为520nm、强度为11.5mW/cm2的光照下的电流-电压特性曲线如图3所示,从图中可以看出探测器在正向偏压下具有明显的光电响应特性。
本实施例所制备的PtTe2/MAPbBr3钙钛矿单晶异质结光电探测器在零工作电压下,在波长为520nm、强度为11.5mW/cm2的光照下的时间响应曲线如图4所示,从图中可以看出探测器对被探测光非常敏感,且具有超快的响应速度。此外制备的PtTe2/MAPbBr3钙钛矿单晶异质结光电探测器在零工作电压下可以正常工作,可有效降低器件功耗。
本实施例所制备的PtTe2/MAPbBr3单晶异质结光电探测器在5V工作电压下,在波长为520nm、强度为11.5mW/cm2的光照下的时间响应曲线如图5所示,从图中可以看出探测器具有较快的响应速度,电流开关比约为15,且在正向偏压下有明显的光响应。
以上所述仅为本发明的较佳实施例而已,并不用以限制本发明,凡在本发明的精神和原则之内所作的任何修改、等同替换和改进等,均应包含在本发明的保护范围之内。
Claims (7)
1.碲化铂/甲基氨铅溴钙钛矿单晶异质结光电探测器,其特征在于:是在绝缘基底上生长有PtTe2薄膜,在所述PtTe2薄膜上的局部区域生长有MAPbBr3钙钛矿单晶,所述PtTe2薄膜与所述MAPbBr3钙钛矿单晶形成异质结;在所述绝缘基底还设置有两金属电极,其中一金属电极位于MAPbBr3钙钛矿单晶上,另一金属电极位于未生长MAPbBr3钙钛矿单晶的PtTe2薄膜上。
2.根据权利要求1所述的碲化铂/甲基氨铅溴钙钛矿单晶异质结光电探测器,其特征在于:所述PtTe2薄膜的厚度在20-40nm之间。
3.根据权利要求1或2所述的碲化铂/甲基氨铅溴钙钛矿单晶异质结光电探测器,其特征在于:所述PtTe2薄膜是先在绝缘基底上通过电子束蒸发法蒸镀一层5-10nm厚的铂薄膜,再用热辅助转化法,在碲氛围中将铂转化为碲化铂,从而获得PtTe2薄膜。
4.根据权利要求1所述的碲化铂/甲基氨铅溴钙钛矿单晶异质结光电探测器,其特征在于:所述MAPbBr3钙钛矿单晶厚度在0.5-3mm之间。
5.根据权利要求1所述的碲化铂/甲基氨铅溴钙钛矿单晶异质结光电探测器,其特征在于:所述MAPbBr3钙钛矿单晶是通过溶液法在PtTe2薄膜上生长获得。
6.根据权利要求1所述的碲化铂/甲基氨铅溴钙钛矿单晶异质结光电探测器,其特征在于:所述金属电极为Au电极、Ti电极或Ag电极,所述金属电极的厚度为50nm-200nm。
7.一种权利要求1~5中任意一项所述光电探测器的制作方法,其特征在于,包括如下步骤:
A、将绝缘基底依次用丙酮、酒精、去离子水超声清洗后,吹干备用;
B、在绝缘基底上通过电子束蒸镀法,在真空度6.7×10-3Pa以下,蒸镀一层5-10nm厚的铂薄膜;
C、将表面覆盖有铂薄膜的绝缘基底放入双温区管式炉的右温区,将盛有0.1g纯度为99.99%的碲粉的瓷舟放入双温区管式炉的左温区;通入流量为50sccm的氩氢混合气为保护气体,将左温区升温至250℃,将右温区升温至500-560℃,保持管式炉内压强为20Pa;维持反应条件1h之后,关闭双温区管式炉的加热系统,继续通入流量为50sccm的氩氢混合气,等待双温区管式炉冷却至室温时取出绝缘基底,即在绝缘基底表面生长有厚度在20-40nm之间的PtTe2薄膜;
D、将PtTe2薄膜上不需生长MAPbBr3钙钛矿单晶的区域覆盖;
将MABr和PbBr2按摩尔比1:1溶于DMF溶液中,获得二者摩尔浓度皆为0.5mol/L的前驱体溶液;然后将覆盖后的绝缘基底水平浸放在所述前驱体溶液中,80℃下保温6-12h,即在未覆盖区域生长出0.5-3mm厚的MAPbBr3钙钛矿单晶;
E、将不需蒸镀金属电极的区域覆盖,然后通过电子束蒸发法在绝缘基底上蒸镀两金属电极,其中一金属电极位于MAPbBr3钙钛矿单晶上,另一金属电极位于未生长MAPbBr3钙钛矿单晶的PtTe2薄膜上,即完成光电探测器的制备。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201910804843.XA CN110491966B (zh) | 2019-08-28 | 2019-08-28 | 碲化铂/甲基氨铅溴钙钛矿单晶异质结光电探测器及其制作方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201910804843.XA CN110491966B (zh) | 2019-08-28 | 2019-08-28 | 碲化铂/甲基氨铅溴钙钛矿单晶异质结光电探测器及其制作方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN110491966A true CN110491966A (zh) | 2019-11-22 |
CN110491966B CN110491966B (zh) | 2021-05-04 |
Family
ID=68554998
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201910804843.XA Active CN110491966B (zh) | 2019-08-28 | 2019-08-28 | 碲化铂/甲基氨铅溴钙钛矿单晶异质结光电探测器及其制作方法 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN110491966B (zh) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112310238A (zh) * | 2020-10-27 | 2021-02-02 | 合肥工业大学 | 基于二维碲化铂纳米薄膜与硅的自驱动肖特基结型超宽波段光电探测器及其制备方法 |
CN114672767A (zh) * | 2022-04-14 | 2022-06-28 | 南京大学 | 一种大尺寸二碲化铂的化学气相沉积制备方法 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108217608A (zh) * | 2017-12-27 | 2018-06-29 | 中国科学院化学研究所 | 二维材料纳米卷及其制备方法和应用 |
WO2018134581A1 (en) * | 2017-01-18 | 2018-07-26 | The University Of Manchester | Inkjet printed electronic devices |
-
2019
- 2019-08-28 CN CN201910804843.XA patent/CN110491966B/zh active Active
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2018134581A1 (en) * | 2017-01-18 | 2018-07-26 | The University Of Manchester | Inkjet printed electronic devices |
CN108217608A (zh) * | 2017-12-27 | 2018-06-29 | 中国科学院化学研究所 | 二维材料纳米卷及其制备方法和应用 |
Non-Patent Citations (2)
Title |
---|
MASHIYAT SUMAIYA SHAWKAT ET.AL.: ""Two一Dimensional/Three-Dimensional Schottky Junction Photovoltaic Devices Realized by the Direct CVD Growth of vdW 2D PtSe2 Layers on silicon"", 《APPLIED MATERIALS》 * |
韩娜等: ""二维层状钙钛矿材料及其应用研究进展"", 《激光与光电子学进展》 * |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112310238A (zh) * | 2020-10-27 | 2021-02-02 | 合肥工业大学 | 基于二维碲化铂纳米薄膜与硅的自驱动肖特基结型超宽波段光电探测器及其制备方法 |
CN114672767A (zh) * | 2022-04-14 | 2022-06-28 | 南京大学 | 一种大尺寸二碲化铂的化学气相沉积制备方法 |
Also Published As
Publication number | Publication date |
---|---|
CN110491966B (zh) | 2021-05-04 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
Nguyen et al. | Transparent photovoltaic cells and self-powered photodetectors by TiO2/NiO heterojunction | |
Xu et al. | ZnO-based photodetector: from photon detector to pyro-phototronic effect enhanced detector | |
CN110165000B (zh) | 一种基于宽禁带无铅钙钛矿铯铜碘微晶薄膜的深紫外光电探测器及其制备方法 | |
Cao et al. | Novel perovskite/TiO 2/Si trilayer heterojunctions for high-performance self-powered ultraviolet-visible-near infrared (UV-Vis-NIR) photodetectors | |
Ismail et al. | A new route for fabricating CdO/c-Si heterojunction solar cells | |
Mahdi et al. | Growth and characterization of CdS single-crystalline micro-rod photodetector | |
CN109461790A (zh) | 氧化镓/石墨烯异质结零功耗光电探测器及其制造方法 | |
Periasamy et al. | Large-area and nanoscale n-ZnO/p-Si heterojunction photodetectors | |
US3978510A (en) | Heterojunction photovoltaic devices employing i-iii-vi compounds | |
CN101853894B (zh) | 一种纳米线异质结阵列基紫外光探测器及其制备方法 | |
Zhou et al. | The investigation of Al-doped ZnO as an electron transporting layer for visible-blind ultraviolet photodetector based on n-ZnO nanorods/p-Si heterojunction | |
Xie et al. | High-performance quasi-solid-state photoelectrochemical-type ultraviolet photodetector based on ZnO nanowire arrays | |
Diachenko et al. | The influence of optical and recombination losses on the efficiency of thin-film solar cells with a copper oxide absorber layer | |
Kim et al. | Cu4O3-based all metal oxides for transparent photodetectors | |
Mohammadi et al. | High performance n-ZnO/p-metal-oxides UV detector grown in low-temperature aqueous solution bath | |
Rana et al. | Influence of N2 flow rate on UV photodetection properties of sputtered p-ZnO/n–Si heterojuctions | |
CN110491966A (zh) | 碲化铂/甲基氨铅溴钙钛矿单晶异质结光电探测器及其制作方法 | |
Dong et al. | Semi-transparent, high-performance lead-free Cs3Bi2I9 single crystal self-driven photodetector | |
Fang et al. | Band offset and an ultra-fast response UV-VIS photodetector in γ-In 2 Se 3/p-Si heterojunction heterostructures | |
Zhou et al. | Self-powered heterojunction photodetector based on thermal evaporated p-CuI and hydrothermal synthesised n-TiO 2 nanorods | |
Zhang et al. | Ultra-broadband, self-powered and high performance vertical WSe2/AlOx/Ge heterojunction photodetector with MXene electrode | |
Liu et al. | High-performance self-driven ultraviolet photodetector based on SnO2 pn homojunction | |
Wang et al. | High-sensitivity silicon: PbS quantum dot heterojunction near-infrared photodetector | |
Ghosh et al. | High performance broad-band ultraviolet-B to visible photodetection based on planar Al-Zn2SnO4-Al structure | |
Qi et al. | Enhanced Ultraviolet Detection by Constructing Ga 2 O 3/TiO 2 Heterojunction Photodiode Featuring Weak Light Signal Sensing |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
GR01 | Patent grant | ||
GR01 | Patent grant |