CN110475427A - A kind of pad, terminal device and welding method - Google Patents
A kind of pad, terminal device and welding method Download PDFInfo
- Publication number
- CN110475427A CN110475427A CN201910893915.2A CN201910893915A CN110475427A CN 110475427 A CN110475427 A CN 110475427A CN 201910893915 A CN201910893915 A CN 201910893915A CN 110475427 A CN110475427 A CN 110475427A
- Authority
- CN
- China
- Prior art keywords
- pad
- electronic component
- aperture
- scolding tin
- terminal device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/111—Pads for surface mounting, e.g. lay-out
- H05K1/112—Pads for surface mounting, e.g. lay-out directly combined with via connections
- H05K1/113—Via provided in pad; Pad over filled via
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09372—Pads and lands
- H05K2201/0939—Curved pads, e.g. semi-circular or elliptical pads or lands
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
It the present invention provides a kind of pad, terminal device and welding method, solves since there are stress between pad and scolding tin, scolding tin is caused easily to fall off, thus the problem of making firm welding be deteriorated.It include: pad ontology；And aperture, it is arranged on the pad ontology.
Description
Technical field
The present invention relates to welding technology fields, and in particular to a kind of pad, terminal device and welding method.
Background technique
With the development of science and technology, intelligent terminal plays increasingly important role in people's life and work.
The antenna of existing intelligent terminal generallys use the mode directly welded, after same day line is welded on flexible circuit board, antenna
There are a stress between flexible circuit board, this stress is concentrated on the pad of welding, and is flowed since high temperature scolding tin exists
Dynamic property, it is insufficient to be easy to cause local scolding tin, therefore part scolding tin easily falls off under stress, and firm welding is caused to become
Difference, to cause to open a way；And stress will affect the fatigue life of pad, shorten the service life of pad.
Summary of the invention
In view of this, solving the present invention provides a kind of pad, terminal device and welding method due to existing on pad
Stress causes scolding tin easily to fall off, thus the problem of making firm welding be deteriorated.
A kind of pad, terminal device and the welding method that one embodiment of the invention provides include: pad ontology；And it opens
Hole, be arranged on the pad ontology on.
In one embodiment, the aperture is ellipse.
In one embodiment, the side for the external force that the long axis direction of the ellipse is born with the pad in parallel
To.
In one embodiment, further comprise reinforcing ring, the surrounding of the aperture is set, is configured to described in enhancing
The stress value that aperture can bear.
A kind of terminal device, comprising: the first electronic component, including any of the above-described pad；And second electronics member
Part, including any of the above-described pad；Wherein, the pad of the pad of first electronic component and second electronic component
It fits closely, the pad of the pad of first electronic component and second electronic component all includes aperture, and scolding tin passes through institute
Aperture is stated by the pad of first electronic component together with the pad solder of second electronic component.
In one embodiment, the size of the pad of first electronic component is greater than the weldering of second electronic component
The size of disk.
In one embodiment, first electronic component includes at least two pads, and at least two pad is flat
Row arrangement；Wherein at least two pad respectively includes aperture, and the aperture of the adjacent pad mutually staggers arrangement.
In one embodiment, further comprise insulation component, be arranged in first electronic component and described second
On the scolding tin on the surface of electronic component.
A kind of welding method, comprising: the pad of the pad of the second electronic component and the first electronic component is fitted closely,
Described in the pad of the second electronic component and the pad of first electronic component all include aperture, second electronic component
The position of opening of the pad of the aperture of pad and first electronic component is corresponding；And heating scolding tin, make to weld
The aperture of the pad of first electronic component is flowed through in the aperture of pad of the tin through second electronic component.
In one embodiment, further comprise: in the table of first electronic component and second electronic component
Insulation component is set on the scolding tin in face.
A kind of pad, terminal device and welding method provided in an embodiment of the present invention, the pad include pad ontology and open
Hole.Aperture is arranged on pad ontology, and the effect of aperture is scolding tin can be made to flow through aperture in welding to be fixed on pad ontology
On, to disperse stress, the fastness of welding is increased, prevents from causing to take off under stress since local scolding tin is insufficient
It falls, thus the phenomenon that causing open circuit generation.
Detailed description of the invention
Fig. 1 show a kind of structural schematic diagram of pad of one embodiment of the invention offer.
Fig. 2 show a kind of structural schematic diagram of terminal device of one embodiment of the invention offer.
Fig. 3 show the structural schematic diagram of the first electronic pads of one kind of one embodiment of the invention offer.
Fig. 4 show a kind of flow diagram of welding method of one embodiment of the invention offer.
Fig. 5 show a kind of flow diagram of welding method of one embodiment of the invention offer.
Specific embodiment
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation description, it is clear that the described embodiment is only a part of the embodiment of the present invention, instead of all the embodiments.Based on this
Embodiment in invention, every other reality obtained by those of ordinary skill in the art without making creative efforts
Example is applied, shall fall within the protection scope of the present invention.
Fig. 1 show a kind of structural schematic diagram of pad of one embodiment of the invention offer.
As shown in Figure 1, the pad includes pad ontology 1 and aperture 2.The surface mount of pad ontology 1 has assembly substrate structure
At unit, for constituting the welding disk pattern of circuit board, the pad combination of as various particular components types designs.Aperture 2 is set
It sets on pad ontology 1, the effect of aperture 2 is scolding tin 9 can be made to flow through aperture 2 in welding, it is fixed on pad ontology, from
And dispersed stress, the fastness of welding is increased, is prevented since local scolding tin 9 is insufficient, so that scolding tin 9 is led under stress
Cause falls off, thus the phenomenon that causing open circuit generation.
It is appreciated that the quantity of aperture 2 can be one or more on a pad ontology 1, opened on a pad ontology 1
The quantity in hole 2 can be set according to actual demand, and the present invention is not construed as limiting the quantity of aperture 2 on a pad ontology 1.
It is further appreciated that the size of aperture 2 can be set according to the size of actual pad ontology 1, the present invention is split
The size in hole 2 is not construed as limiting.
In one embodiment of the invention, the shape of aperture should avoid wedge angle as far as possible, use the circular arc of transition, and Ying Shi as far as possible
When the radius for increasing transition arc, the stress concentrated can be dispersed using the aperture with circular arc.Such as the shape of aperture 2 can be with
It is ellipse, oval aperture 2 avoids the presence of wedge angle, can disperse the stress concentrated, therefore can reduce aperture 2
Stress caused by shape is concentrated, and the fatigue life for welding device is influenced, and causes welding device to avoid concentrating due to stress
Be detached from and caused by damage problem.
It is appreciated that the shape of aperture 2 can be ellipse or circle etc., the shape of aperture 2 can be according to pad ontology 1
The parameters such as shape or size are set, and the present invention is not construed as limiting the concrete shape of aperture 2.
In one embodiment of the invention, as described in above-described embodiment, the shape of aperture 2 can be ellipse.Ellipse
Long axis is the longest diameter of the ellipse, and the direction of external force that wherein direction of long axis should be born with pad is parallel.It will be oval
The direction that the long axis direction of shape aperture 2 is arranged to the external force born with pad is parallel, and aperture 2 can be made to avoid high stress as far as possible
Area, and peak stress can be reduced, make to act on the stress on pad and reduce, increases fastness of the scolding tin 9 on pad.
It is appreciated that oval long axis direction can be parallel to what pad was born when the shape of aperture 2 is ellipse
The direction of external force.The setting direction of different 2 shapes of aperture can be set according to practical situation, and the present invention is to aperture 2
Setting direction is not construed as limiting.
In one embodiment of the invention, pad may include reinforcing ring 11, and reinforcing ring 11 is the ring structure of a circle protrusion, setting
In the surrounding of aperture 2.The effect of reinforcing ring 11 is reinforced for the surrounding in aperture 2, and aperture 2 is made to be able to bear bigger answer
Power prevents aperture 2 from occurring crack under the action of stress, and leads to the insecure of welding, influences the service life for welding device.
It is appreciated that the shapes and sizes of reinforcing ring 11 should match the shapes and sizes of aperture 2, meeting reinforcing ring 11
It can play the role of to aperture 2 under the premise of reinforcement meets with stresses, the present invention is not construed as limiting the shapes and sizes of reinforcing ring 11.
It is further appreciated that reinforcing ring 11 can be metal material, silica gel material can also be made, it can meeting reinforcing ring 11
Play the role of under the premise of reinforcement meets with stresses to aperture 2, the present invention is not construed as limiting the shapes and sizes of reinforcing ring 11.
Fig. 2 show a kind of structural schematic diagram of terminal device of one embodiment of the invention offer.
As shown in Fig. 2, the terminal device includes the first electronic component 7 and the second electronic component 8, wherein the first electronic component
7 and second include pad described in above-described embodiment on electronic component 8.The pad 3 and the second electronics of first electronic component 7
The aperture 6 of the pad 4 of element 8 fits closely together, and the pad of the pad of the first electronic original part and the second electronic original part wraps
Aperture is included, opening for the aperture 6 of the pad 4 of the second electronic component 8 is flowed through in the aperture 52 of pad 3 of the scolding tin 9 through the first electronic component 7
Hole is fixed on the surface of the aperture 6 of the pad 3 of the first electronic component 7 and the pad 4 of the second electronic component 8 after scolding tin 9 is cooling,
To increase the fastness of welding, prevent from causing to fall off under stress, to cause out since local scolding tin 9 is insufficient
The phenomenon that road, generates.
It is further appreciated that the first electronic component 7 can be antenna, for example, it may be near field is the same as letter (Near Field
Communication, abbreviation NFC) antenna, the first electronic component 7 can also be other types of electronic component, and the present invention is to the
The concrete type of one electronic component 7 is not construed as limiting.
It is further appreciated that the second electronic component 8 can also for flexible circuit board (Flexible Printed Circuit,
FPC), the second electronic component 8 can also be other types of electronic component, the present invention to the concrete type of the second electronic component 8 not
It limits.
In one embodiment of the invention, the size of the pad 3 of the first electronic component 7 is greater than the pad 4 of the second electronic component 8
The size of aperture 6.According to the size of 7 pad of the first electronic component, 7 pad center spacing of the first electronic component, to design second
The size of the aperture 6 of the pad 4 of electronic component 8, the size of the aperture 6 of the pad 4 of the second electronic component 8 is than the first electronics member
The size of the pad 3 of part 7 is larger, and specific calculation method can be with are as follows: setting 7 pad center spacing of the first electronic component (in
In the heart away from one center referred in two adjacent pads to another the distance between center) it is P, the first electronics member
The maximum width of 7 pad of part is W, and 6 width of aperture of the pad 4 of the second electronic component 8 is A, as P≤0.65mm, A=(P/
2)+0.03mm；P > 0.65mm, A=W+0.2mm.By being dimensioned to greater than the second electronics for the pad 3 of the first electronic component 7
The size of the aperture 6 of the pad 4 of element 8 can be convenient welding, prevents and generates the insufficient solder joint of scolding tin 9.
It is appreciated that the specific size of the aperture 6 of the pad 4 of 7 pad of the first electronic component and the second electronic component 8 can root
It is factually adjusted the case where border, the present invention is to the aperture 6 of the pad 4 of 7 pad of the first electronic component and the second electronic component 8
Specific size is without limitation.
Fig. 3 show the structural schematic diagram of 7 pad of the first electronic component of one kind of one embodiment of the invention offer.
As shown in figure 3, first electronic component 7 includes at least two pads, wherein each pad includes pad sheet
Body 1, at least two pad ontologies 1 can arranged in parallel, may include at least one aperture 2 on each pad ontology 1, wherein adjacent
The aperture of pad mutually staggers distribution.The aperture 2 of multiple pads, which is interspersed, can avoid causing to answer because influencing each other between hole
The problem of power coefficient of concentration increases prevents from leading to falling off for solder joint since the factor of stress concentration is excessive, to cause showing for open circuit
As generating.When the alternate stress that material is born is much smaller than strength degree under its static load, destruction is possible to occur, and material can be by
In sectional dimension change and cause stress part increase, this phenomenon be known as stress concentration, material bear alternate stress with
The ratio between strength degree under static load is the factor of stress concentration, and the calculation formula of the factor of stress concentration can be α=σmax/σn=1+
(2a/b), it is a coefficient greater than 1 that wherein σ, which is theoretical stress concentration factor, he has reacted the degree of stress concentration；σmaxIt is
The maximum stress that verge of opening is born, σnFor the mean stress on the same section of pad, a is the half of oval aperture short axle
Diameter, b are the radius of oval aperture long axis.
In one embodiment of the invention, which further includes insulation component, and setting is in the first electronic component 7 and the second electricity
On the scolding tin 9 on the surface of subcomponent 8.After heating scolding tin 9, the aperture 5 of the pad 3 by scolding tin 9 through the first electronic component 7 flows through the
The aperture of the aperture 6 of the pad 4 of two electronic components 8 stops heating, and after scolding tin 9 is automatically cooling, scolding tin 9 is fixed on first
On 6 ontology of aperture of the pad 4 of 3 ontology of pad and the second electronic component 8 of electronic component 7.Due to some electronic components
Space radiation can be absorbed by the metallic member couples of mainboard generates a certain amount of secondary radiation phenomenon, on being exposed to pad ontology
The surface setting insulation component of scolding tin 9 prevent since scolding tin 9 is exposed is done in air by secondary radiation phenomenon after welding
It disturbs, therefore the risk of interference can be will receive to avoid complete machine signal.
It is appreciated that insulation component can be insulating tape, wherein insulating tape is covered in exposed aerial scolding tin 9
On, insulation component can also be the other types of element with insulating effect, make exposed aerial weldering that can play
Under the premise of tin 9 receives the interference of secondary radiation phenomenon, the present invention is not construed as limiting the concrete type of insulation component.
Fig. 4 show a kind of flow diagram of welding method of one embodiment of the invention offer.
As shown in figure 4, the welding method includes:
Step 01: the pad 3 of the aperture 6 of the pad 4 of the second electronic component 8 and the first electronic component 7 is fitted closely,
In the second electronic component 8 pad 4 aperture 6 and the first electronic component 7 pad 3 all include aperture, the second electronic component 8
5 position of aperture of the pad 3 of the aperture of the aperture 6 of pad 4 and the first electronic component 7 is corresponding.To make on the second electronic component 8
Pad and 7 pad of the first electronic component fit closely, pad on the second electronic component 8 and 7 pad of the first electronic component need
Want matching design, when design should strictly keep pad and 7 pad of the first electronic component on the second electronic component 8 to keep comprehensive
Symmetry, i.e. the shape and size of the pad 3 of the aperture 6 of the pad 4 of the second electronic component 8 and the first electronic component 7 are opposite
Answer, the size of the aperture in the aperture 6 of the pad 4 of the second electronic component 8 and the aperture on the pad 3 of the first electronic component 7 and
Position is corresponding.The pad 3 of the aperture 6 of the pad 4 of second electronic component 8 and the first electronic component 7 is fitted closely and can be protected
Demonstrate,prove the surface tension (also becoming wetting power) of all scolding tin 9 acted on the second electronic component 8 be able to maintain balance (i.e. its
Resultant force is zero), in favor of forming ideal solder joint.
Step 02: heating scolding tin 9 flows through scolding tin 9 and first through the aperture of the aperture 6 of the pad 4 of the second electronic component 8
The aperture 52 of the pad 3 of electronic component 7.
Together with the pad 3 of first electronic component 7 is fitted closely with the aperture 6 of the pad 4 of the second electronic component 8, make
5 position of aperture of the pad 3 of the aperture of the aperture 6 of the pad 4 of second electronic component 8 and the first electronic component 7 is corresponding, can
After guaranteeing heating scolding tin 9, scolding tin 9 is flowed through to the aperture 6 of the pad 4 of the second electronic component 8 through the pad 3 of the first electronic component 7,
Stop heating, after scolding tin 9 is automatically cooling, scolding tin 9 is fixed on to 3 ontology of pad and the second electronics member of the first electronic component 7
On 6 ontology of aperture of the pad 4 of part 8, to increase the fastness of welding, prevent since local scolding tin 9 is insufficient, in Ying Lizuo
Cause to fall off under, thus the phenomenon that causing open circuit generation.
It is appreciated that the welding method is not only applicable to for the first electronic component 7 being welded on the second electronic component 8,
Apply also for include pad described in above-described embodiment all devices, which kind of the present invention is particularly applicable in the welding method
It is not construed as limiting in the welding of device.
Fig. 5 show a kind of flow diagram of welding method of one embodiment of the invention offer.
As shown in figure 5, flowing through scolding tin 9 through the aperture of the aperture 6 of the pad 4 of the second electronic component 8 in heating scolding tin 9
It further comprise step 03 after the aperture 52 of the pad 3 of first electronic component 7: in the first electronic component 7 and the second electronics member
Insulation component is set on the scolding tin 9 on the surface of part 8.Since the space radiation of some electronic components can be by the hardware coupling of mainboard
It closes to absorb and generates a certain amount of secondary radiation phenomenon, setting insulation component is anti-on the surface for the scolding tin 9 being exposed on pad ontology
It, can be by avoid complete machine signal only due to the exposed interference by secondary radiation phenomenon in air of scolding tin 9 after welding
To the risk of interference.
The foregoing is merely illustrative of the preferred embodiments of the present invention, is not intended to limit the invention, all in essence of the invention
Within mind and principle, made any modification, equivalent replacement etc. be should all be included in the protection scope of the present invention.
Claims (10)
1. a kind of pad characterized by comprising
Pad ontology；And
Aperture is arranged on the pad ontology.
2. pad according to claim 1, which is characterized in that the aperture is ellipse.
3. pad according to claim 2, which is characterized in that the long axis direction of the ellipse in parallel with the pad institute
The direction of the external force of receiving.
4. pad according to claim 1, which is characterized in that further comprise reinforcing ring, the four of the aperture are arranged in
It week is configured to enhance the stress value that the aperture can bear.
5. a kind of terminal device characterized by comprising
First electronic component, including any pad of the claims 1-4；And
Second electronic component, including any pad of the claims 1-4；
Wherein, the pad of the pad of first electronic component and second electronic component fits closely, first electronics
The pad of the pad of element and second electronic component all includes aperture, and scolding tin passes through the aperture for the first electronics member
The pad of part is together with the pad solder of second electronic component.
6. terminal device according to claim 5, which is characterized in that the size of the pad of first electronic component is greater than
The size of the pad of second electronic component.
7. terminal device according to claim 5, which is characterized in that first electronic component includes at least two welderings
Disk, at least two pads parallels arrangement；
Wherein at least two pad respectively includes aperture, and the aperture of the adjacent pad mutually staggers arrangement.
8. terminal device according to claim 5, which is characterized in that further comprise insulation component, setting is described the
On the scolding tin on the surface of one electronic component and second electronic component.
9. a kind of welding method of the terminal device as described in the claims 5 characterized by comprising
The pad of the pad of second electronic component and the first electronic component is fitted closely, wherein the weldering of second electronic component
The pad of disk and first electronic component all includes aperture, the aperture of the pad of second electronic component and described
The position of opening of the pad of one electronic component is corresponding；And
Scolding tin is heated, scolding tin is made to flow through the weldering of first electronic component through the aperture of the pad of second electronic component
The aperture of disk.
10. welding method according to claim 9, which is characterized in that further comprise: in first electronic component and
Insulation component is set on the scolding tin on the surface of second electronic component.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910893915.2A CN110475427A (en) | 2019-09-20 | 2019-09-20 | A kind of pad, terminal device and welding method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910893915.2A CN110475427A (en) | 2019-09-20 | 2019-09-20 | A kind of pad, terminal device and welding method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110475427A true CN110475427A (en) | 2019-11-19 |
Family
ID=68516387
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910893915.2A Pending CN110475427A (en) | 2019-09-20 | 2019-09-20 | A kind of pad, terminal device and welding method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110475427A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112384004A (en) * | 2020-11-16 | 2021-02-19 | 京东方科技集团股份有限公司 | Circuit board assembly, display assembly, assembly method of display assembly and display device |
| CN112468912A (en) * | 2020-12-18 | 2021-03-09 | 瑞声新能源发展(常州)有限公司科教城分公司 | Loudspeaker box |
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| CN206323640U (en) * | 2016-11-17 | 2017-07-11 | 深圳市赛维斯光电有限公司 | A kind of anti-fracture structure of backlight FPC pads |
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| CN200944702Y (en) * | 2006-09-14 | 2007-09-05 | 华为技术有限公司 | Flexible printed circuit structure |
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Application publication date: 20191119 |