CN110472547B - Display module assembly and display device - Google Patents
Display module assembly and display device Download PDFInfo
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- CN110472547B CN110472547B CN201910726626.3A CN201910726626A CN110472547B CN 110472547 B CN110472547 B CN 110472547B CN 201910726626 A CN201910726626 A CN 201910726626A CN 110472547 B CN110472547 B CN 110472547B
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- integrated chip
- fingerprint identification
- cover plate
- array substrate
- display module
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/13306—Circuit arrangements or driving methods for the control of single liquid crystal cells
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
- G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
- G06V40/12—Fingerprints or palmprints
- G06V40/13—Sensors therefor
- G06V40/1306—Sensors therefor non-optical, e.g. ultrasonic or capacitive sensing
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/60—OLEDs integrated with inorganic light-sensitive elements, e.g. with inorganic solar cells or inorganic photodiodes
- H10K59/65—OLEDs integrated with inorganic image sensors
Abstract
The embodiment of the invention discloses a display module and a display device. The display module comprises an array substrate, a cover plate and an integrated chip; the display module further comprises a display area and a non-display area arranged around the display area, and the non-display area is provided with a fingerprint identification area; the array substrate and the cover plate are oppositely arranged, the integrated chip is positioned between the array substrate and the cover plate, the integrated chip is bound on the array substrate in the non-display area, the vertical projection of the integrated chip on the array substrate covers the fingerprint identification area, a dielectric material is also arranged between the integrated chip and the cover plate, and the dielectric constant of the dielectric material is greater than that of air; the integrated chip comprises a control drive circuit and a fingerprint identification module, and the fingerprint identification module comprises a fingerprint identification drive circuit and a plurality of fingerprint identification electrodes. The embodiment of the invention can simplify the assembly process on the basis of ensuring the fingerprint identification capability, improve the space utilization rate of the non-display area of the display module and be beneficial to reducing the frame width of the display device.
Description
Technical Field
The embodiment of the invention relates to the technical field of panel display, in particular to a display module and a display device.
Background
With the rapid development of display technology, display panels with fingerprint identification function have gradually spread throughout the life of people, and fingerprint identification is widely applied to display screens of electronic devices such as mobile phones, personal digital assistants, computers and the like. In the current display panel, the fingerprint identification technology is usually combined with the display technology, so that the display panel not only has the display function, but also can perform fingerprint identification, and the safety performance of information in the display device is improved.
The fingerprint identification process of the display panel is generally that when a finger contacts the surface of the glass, fingerprint ridges contact the glass, and fingerprint valleys are suspended. When light beams are emitted from the surface of the glass and are reflected by fingers, the difference exists between the reflectivity of the fingerprint ridges and the reflectivity of the fingerprint valleys and the interface of the glass, and the light intensity difference reflected by the fingerprint ridges and the fingerprint valleys can be detected by adopting the light sensing element, so that the fingerprints are identified.
The capacitive fingerprint identification module is generally adopted for fingerprint identification in the existing display panel, and is generally applied to mobile phone products and arranged outside a screen display area, for example, the capacitive fingerprint identification module is arranged at the Home key position below a front cover plate of a mobile phone or on a back cover plate of the back of the whole mobile phone, and an opening needs to be made on the cover plate or a back shell, and alignment assembly is carried out through a fingerprint identification chip. Fig. 1 is a schematic view of a partial structure of a conventional display panel, and referring to fig. 1, in the conventional display panel, a fingerprint identification sensing element 1 disposed at a Home key position is connected to a fingerprint identification Integrated Chip (IC) 3 through a Flexible Printed Circuit (FPC) 2, and then connected to a main IC4 of the display panel or a main board of the whole display panel. Due to the existence of the fingerprint identification IC3 and the main IC4, the occupied space is large, the area of a non-display area of the Home key position is large, and the screen occupation ratio of a display screen is limited.
Disclosure of Invention
The invention provides a display module and a display device, which are used for improving the integration level of a display panel to a fingerprint identification module and reducing the occupied space of the fingerprint identification module.
In a first aspect, an embodiment of the present invention provides a display module, including an array substrate, a cover plate, and an integrated chip; the display module further comprises a display area and a non-display area arranged around the display area, and the non-display area is provided with a fingerprint identification area;
the array substrate and the cover plate are oppositely arranged, the integrated chip is positioned between the array substrate and the cover plate, the integrated chip is bound on the array substrate in the non-display area, the vertical projection of the integrated chip on the array substrate covers the fingerprint identification area, a dielectric layer is also arranged between the integrated chip and the cover plate, and the dielectric constant of the dielectric layer is greater than that of air;
the integrated chip comprises a control driving circuit and a fingerprint identification module, the fingerprint identification module comprises a fingerprint identification driving circuit and a plurality of fingerprint identification electrodes, and the fingerprint identification driving circuit is electrically connected with the plurality of fingerprint identification electrodes; the control drive circuit is used for controlling display drive; the fingerprint identification driving circuit is used for driving the plurality of fingerprint identification electrodes to carry out fingerprint identification.
In a second aspect, an embodiment of the present invention further provides a display device, including the display module according to any one of the first aspects.
According to the display module and the display device provided by the embodiment of the invention, the array substrate, the cover plate and the integrated chip are arranged in the display module, the integrated chip is arranged between the array substrate and the cover plate and is bound on the array substrate in the non-display area, and the integrated chip is simultaneously integrated with the control drive circuit for drive control and the fingerprint identification module for fingerprint identification, so that the integration level of the chip in the non-display area of the display module is increased, and the occupied space of the control drive chip and the fingerprint identification module is reduced. In addition, through set up the dielectric layer between integrated chip and apron, utilize the dielectric constant of dielectric layer to be greater than the dielectric constant of air, guaranteed the fingerprint identification ability of fingerprint identification module on the integrated chip. The display module provided by the embodiment of the invention can simplify the assembly process on the basis of ensuring the fingerprint identification capability, improve the space utilization rate of the non-display area of the display module and be beneficial to reducing the width of the frame of the display device.
Drawings
FIG. 1 is a schematic diagram of a partial structure of a conventional display panel;
fig. 2 is a schematic structural diagram of a display module according to an embodiment of the present invention;
FIGS. 3 and 4 are schematic structural diagrams of two fingerprint identification electrodes provided by the embodiment of the invention;
FIG. 5 is a schematic structural diagram of another display module according to an embodiment of the present invention;
FIG. 6 is a schematic structural diagram of another display module according to an embodiment of the present invention;
FIG. 7 is a schematic partial structure diagram of another display module according to an embodiment of the present invention;
FIG. 8 is a schematic partial structure diagram of another display module according to an embodiment of the present invention;
FIG. 9 is a schematic partial structure diagram of another display module according to an embodiment of the present invention;
FIG. 10 is a schematic structural diagram of another display module according to an embodiment of the present invention;
FIG. 11 is a schematic view of a partial structure of another display module according to an embodiment of the present invention;
FIG. 12 is a schematic structural diagram of another display module according to an embodiment of the present invention;
fig. 13 is a schematic structural diagram of a display device according to an embodiment of the present invention.
Detailed Description
The present invention will be described in further detail with reference to the accompanying drawings and examples. It is to be understood that the specific embodiments described herein are merely illustrative of the invention and are not limiting of the invention. It should be further noted that, for the convenience of description, only some of the structures related to the present invention are shown in the drawings, not all of the structures.
As described in the background section, the conventional display panel is provided with a main IC for performing display driving control of the panel, a fingerprint recognition IC for performing a fingerprint recognition function, and both the fingerprint recognition IC and the main IC can be provided only in a non-display area of the display panel, thereby occupying a large space in the non-display area. In other words, because the fingerprint identification IC and the main IC are separately arranged, the area of a non-display area of the display panel is large, the frame of the display screen is wide, and the screen occupation ratio of the screen is influenced. In addition, because the fingerprint identification IC and the main IC are required to be provided with flexible circuit boards for connection, the installation process is more complex to a certain extent, and the assembly cost and time are increased.
In view of the above problems, an embodiment of the present invention provides a display module, which includes an array substrate, a cover plate, and an integrated chip; the display module further comprises a display area and a non-display area arranged around the display area, and the non-display area is provided with a fingerprint identification area; the array substrate and the cover plate are oppositely arranged, the integrated chip is positioned between the array substrate and the cover plate, the integrated chip is bound on the array substrate in the non-display area, the vertical projection of the integrated chip on the array substrate covers the fingerprint identification area, a dielectric layer is also arranged between the integrated chip and the cover plate, and the dielectric constant of the dielectric layer is greater than that of air; the integrated chip comprises a control driving circuit and a fingerprint identification module, the fingerprint identification module comprises a fingerprint identification driving circuit and a plurality of fingerprint identification electrodes, and the fingerprint identification driving circuit is electrically connected with the plurality of fingerprint identification electrodes; the control drive circuit is used for controlling display drive; the fingerprint identification driving circuit is used for driving the plurality of fingerprint identification electrodes to carry out fingerprint identification.
In a display module, a pixel driving circuit is usually disposed in an array substrate to perform display driving on a display unit in a display area, and the control of the pixel driving circuit is controlled by a driving control circuit. And the non-display area is provided with a fingerprint identification area, and fingerprint identification is carried out through the fingerprint identification module. The integrated chip provided by the embodiment of the invention integrates a drive control circuit for controlling a pixel drive circuit on an array substrate and a fingerprint identification module for fingerprint identification. The integrated chip is bound on the array substrate, and the pixel driving circuit of the display area is controlled through the signal wiring on the array substrate. Simultaneously, this vertical projection of integrated chip on array substrate covers the fingerprint identification district, is about to set up the integrated chip in the fingerprint identification district, thereby counterpoints to the fingerprint identification district through the fingerprint identification module on it and realizes the fingerprint identification function.
Specifically, this integrated chip's fingerprint identification module can adopt capacitanc fingerprint identification module, wherein including the fingerprint identification electrode that is used for sensing fingerprint signal, still includes the fingerprint identification drive circuit who drives the fingerprint identification electrode simultaneously. When fingerprint identification is carried out, the fingerprint identification drive circuit provides a drive signal for the fingerprint identification electrode, and when the fingerprint is touched, the fingerprint identification electrode and the fingerprint form a capacitor and generate a sensing signal and feed back the sensing signal to the fingerprint identification drive circuit, and the fingerprint can be judged and identified by analyzing the sensing signal. Wherein, set up the dielectric layer between integrated chip and apron, can utilize the great characteristics of the relative dielectric constant of air of dielectric layer to increase the capacitance value that fingerprint identification electrode and finger fingerprint formed, improve the sensing signal intensity of fingerprint identification electrode, and then make fingerprint identification ability reinforcing.
According to the display module provided by the embodiment of the invention, the array substrate, the cover plate and the integrated chip are arranged, the integrated chip is arranged between the array substrate and the cover plate and is bound on the array substrate of the non-display area, and the integrated chip is simultaneously integrated with the control drive circuit for drive control and the fingerprint identification module for fingerprint identification, so that the integration level of the chip of the non-display area of the display module is increased, and the occupied space of the control drive chip and the fingerprint identification module is reduced. In addition, through set up the dielectric layer between integrated chip and apron, utilize the dielectric constant of dielectric layer to be greater than the dielectric constant of air, guaranteed the fingerprint identification ability of fingerprint identification module on the integrated chip. The display module provided by the embodiment of the invention can simplify the assembly process on the basis of ensuring the fingerprint identification capability, improve the space utilization rate of the non-display area of the display module and be beneficial to reducing the width of the frame of the display device.
The above is the core idea of the present invention, and the technical solution in the embodiment of the present invention will be clearly and completely described below with reference to the drawings in the embodiment of the present invention. All other embodiments obtained by a person of ordinary skill in the art based on the embodiments of the present invention without any creative work belong to the protection scope of the present invention.
Fig. 2 is a schematic structural diagram of a display module according to an embodiment of the present invention, and referring to fig. 2, the display module includes an array substrate 10, a cover plate 20 and an integrated chip 30; the display module further comprises a display area 110 and a non-display area 120 arranged around the display area 110, and the non-display area 120 is provided with a fingerprint identification area 121; the array substrate 10 and the cover plate 20 are oppositely arranged, the integrated chip 30 is positioned between the array substrate 10 and the cover plate 20, the integrated chip 30 is bound on the array substrate 10 in the non-display area 120, the vertical projection of the integrated chip 30 on the array substrate 10 covers the fingerprint identification area 121, a dielectric layer 40 is also arranged between the integrated chip 30 and the cover plate 20, and the dielectric constant of the dielectric layer 40 is greater than that of air; the integrated chip 30 comprises a control drive circuit 31 and a fingerprint identification module 32, the fingerprint identification module 32 comprises a fingerprint identification drive circuit 321 and a plurality of fingerprint identification electrodes 322, and the fingerprint identification drive circuit 321 is electrically connected with the plurality of fingerprint identification electrodes 322; the control drive circuit 31 is used to control display drive; the fingerprint identification driving circuit 321 is used for driving the plurality of fingerprint identification electrodes 322 to perform fingerprint identification.
It should be noted that fig. 2 exemplarily fills the dielectric layer 40 in the space between the integrated chip 30 and the cover plate 20, and it can be understood that a certain degree of fingerprint identification capability enhancement can be achieved only by disposing the dielectric layer 40 between the integrated chip 30 and the cover plate 20. Of course, the dielectric layer 40 is filled in the space between the integrated chip 30 and the cover plate 20 or the material with larger dielectric constant is selected, so that the fingerprint identification capability of the fingerprint identification module can be improved to a greater extent, and the fingerprint identification effect is ensured.
Further, with continued reference to fig. 2, when designing the integrated chip, the influence of the size of the integrated chip on the volume of the display module needs to be considered. Therefore, in the display module, the distance between the array substrate 10 and the cover plate 20 is a, and the thickness c of the integrated chip 30 has a value range of c < a.
Wherein, apron 20 is used for keeping apart and the protection whole display module assembly, prevents that the external world from causing the damage to display element and integrated chip etc.. The thickness of the integrated chip 30 is smaller than the distance between the array substrate 10 and the cover plate 20, so that a gap is still formed between the integrated chip 30 and the cover plate 20 after the integrated chip is bonded on the array substrate 10. The gap may be filled with a dielectric layer to enhance fingerprint recognition. Of course, on the basis of ensuring the fingerprint identification capability, a person skilled in the art can also design the thickness of the integrated chip to be equal to the distance between the array substrate and the cover plate, at the moment, the integrated chip is directly contacted with the cover plate, and the distance between the fingerprint identification module on the integrated chip and the fingerprint is closer.
Further, the area size of the fingerprint identification area needs to be considered when designing the integrated chip. Optionally, the vertical projection of the integrated chip on the array substrate may be rectangular, and the side length of each rectangle is greater than or equal to 3 mm. Wherein, the area of integrated chip has decided the area in effective fingerprint identification district, sets up integrated chip's length of side and is greater than or equal to 3mm, can carry out fingerprint collection to the finger of certain area to ensure fingerprint identification's accuracy.
Further, with continued reference to fig. 2, the design of the integrated chip also requires ensuring drive control and fingerprint identification of the adaptive display module. Therefore, in the display module, the integrated chip 30 further includes a plurality of bonding pins 33, and the integrated chip 30 is bonded on the array substrate 10 in the non-display area 120 through the bonding pins 33; the fingerprint identification module 32 is located on the surface of the integrated chip 30 on the side away from the bonding pins 33.
For the specific structure of the fingerprint identification module in the integrated chip, the embodiment of the invention exemplarily provides two fingerprint identification electrodes. Fig. 3 and 4 are schematic structural diagrams of two types of fingerprint identification electrodes provided by an embodiment of the present invention, and referring to fig. 3, the fingerprint identification electrodes are composed of a plurality of driving electrodes 3221 arranged along a first direction 100 and a plurality of sensing electrodes 3222 arranged along a second direction 200, and the first direction 100 and the second direction 200 are mutually crossed. The working principle of the fingerprint identification electrode is as follows: the driving electrodes 3221 and the sensing electrodes 3222 cross each other to form a capacitor, and when the fingerprint identification driving circuit transmits a driving signal to the driving electrodes 3221, the sensing electrodes 3222 generate a stable response signal. Since the finger can be regarded as a conductor, when the finger touches the fingerprint identification area of the display module, the capacitance formed by the driving electrode 3221 and the sensing electrode 322 changes, and the response signal generated by the sensing electrode 3222 changes. At this time, fingerprint recognition can be performed by determining the position of the sensing electrode 3222 in which the response signal changes.
Referring to fig. 4, the fingerprint identification module may also include a plurality of sensing electrode blocks 3223 arranged in an array. The sensing electrode block 3223 is used as a self-inductance capacitor, a driving signal is provided to the sensing electrode block 3223 by the fingerprint identification driving circuit, when a finger touches the fingerprint identification area of the display module, the sensing electrode block 3223 generates a feedback signal, and the fingerprint identification can be performed through the feedback signal.
Except the shape matching display module with the integrated chip shown in fig. 2, the structure of the display module can be reasonably adjusted according to the size of the integrated chip. Fig. 5 is a schematic structural view of another display module according to an embodiment of the present invention, referring to fig. 5, in the display module, a receiving groove 21 is disposed on a surface of a side of a cover plate 20 facing an array substrate 10; the distance between the array substrate 10 and the cover plate 20 is a, the depth of the receiving groove 21 is b, and the value range of the thickness c of the integrated chip 30 is c < a + b.
At this time, a part of the integrated chip 30 is accommodated in the accommodating groove 21, so that the integrated chip 30 with a larger volume can be accommodated between the array substrate 10 and the cover plate 20. Certainly, under the condition that the integrated chip 30 is designed reasonably and the thickness of the integrated chip 30 is ensured to be smaller, the distance between the array substrate 10 and the cover plate 20 can be reduced, in other words, the display module can be made thinner.
With reference to fig. 5, in consideration of the actual assembly tolerance, when the receiving groove 21 is formed on the cover plate, the size of the receiving groove 21 needs to be slightly larger than the size of the ic chip 30, that is, a gap exists between the side wall of the ic chip 30 and the receiving groove 21. On the one hand, it is ensured that the integrated chip 30 can easily enter the receiving groove 21 when the cover plate 20 is assembled. On the other hand, when the cover plate 20 is pressed by a finger, the cover plate 20 is easily deformed, and at this time, because a gap exists between the accommodating groove 21 and the integrated chip 30, the deformation of the cover plate 20 can be ensured to have no acting force on the integrated chip 30, and the binding of the integrated chip 30 on the array substrate 10 is prevented from being influenced.
The display module provided by the embodiment of the invention is suitable for an organic light-emitting display module and a liquid crystal display module, for example, the display module illustrated in fig. 2 is a liquid crystal display module, a liquid crystal layer 51, a color film substrate 61, a polarizer 70 and an optical adhesive layer 80 are sequentially arranged between an array substrate 10 and a cover plate 20 along a light emitting direction of the display module, and a vertical projection of the liquid crystal layer 51 on the array substrate 10 covers a display area 110.
In the liquid crystal display module, the pixel driving circuit in the array substrate 10 controls the deflection of the liquid crystal molecules of the liquid crystal layer 51, and is used for selectively outputting backlight, thereby realizing the light emission of each pixel unit. The color filter substrate 61 is provided with a color resistance region for filtering the light emitted from the pixel units, so as to realize the light emission of different colors and cooperate with each other to form a display image. The polarizer 70 in the lcd module is used to deflect the liquid crystal molecules, so as to realize selective output of backlight. When the polarization state of the liquid crystal molecule controlled backlight is consistent with the transmission axis of the polarizer 70, the backlight is output; when the polarization state of the liquid crystal molecules controlled backlight is perpendicular to the transmission axis of the polarizer 70, the backlight is blocked.
Fig. 6 is a schematic structural diagram of another display module according to an embodiment of the present invention, referring to fig. 6, the display module sequentially includes, along a light emitting direction, an organic light emitting structure array 52, a package substrate 62, a polarizer 70, and an optical adhesive layer 80 between an array substrate 10 and a cover plate 20, where the organic light emitting structure array 52 is located in a display area 110.
In the organic light emitting display module, the organic light emitting structure array 51 performs light emitting display under the driving of the array substrate 10. In addition, since the organic light emitting material in the organic light emitting structure is sensitive to water and oxygen, in order to isolate water and oxygen and ensure the light emitting efficiency of the organic light emitting structure, the package substrate 62 may be covered on the organic light emitting structure array 52. The polarizer 70 disposed on the package substrate 62 can prevent the incident light from being reflected and emitted again, thereby ensuring the contrast of the display module. The optical adhesive layer 80 is used for bonding and fixing with the cover plate 20.
It should be noted that fig. 6 only illustrates the structure of the organic light emitting display module in which the receiving groove is disposed in the cover plate, and corresponding to fig. 2, the cover plate in the organic light emitting display module may not be disposed with the receiving groove, that is, the integrated chip and the dielectric layer are disposed between the cover plate and the array substrate.
The embodiment of the invention also provides a plurality of display modules aiming at the dielectric layer between the integrated chip and the cover plate. Fig. 7 is a partial schematic structural diagram of another display module according to an embodiment of the invention, referring to fig. 7, in which a dielectric layer includes an insulating buffer foam 41, and the insulating buffer foam 41 is filled between the integrated chip 30 and the cover plate 20.
By arranging the insulating buffer foam 41 between the integrated chip 30 and the cover plate 20, on one hand, the dielectric constant of the insulating buffer foam 41 is greater than that of air, so that the fingerprint identification capability of the fingerprint identification module is improved to a certain extent; on the other hand, when the cover plate 20 is deformed to a certain extent by being pressed by a finger, the integrated chip 30 is easily squeezed, so that the integrated chip 30 and the array substrate 10 are not electrically connected well, and at this time, the integrated chip 30 is provided with a control driving circuit, and further, poor display is caused. The insulating buffer foam 41 can play a role in buffering pressure, and the occurrence of poor display is avoided.
Fig. 8 is a partial schematic structural diagram of another display module according to an embodiment of the invention, referring to fig. 8, in the display module, the dielectric layer includes a heat dissipation silicone 42, the heat dissipation silicone 42 covers a side surface of the integrated chip 30 facing the cover plate 20, and a side surface of the heat dissipation silicone 42 facing away from the integrated chip 30 is bonded to the cover plate 20.
Wherein, heat dissipation silica gel 42 covers on integrated chip 30, can assist the heat dissipation to the heat that integrated chip 30 produced when control shows the drive, avoids a large amount of heats that integrated chip 30 produced to influence the fingerprint identification function of fingerprint identification module wherein. Certainly, since the heat dissipation silica gel 42 is also a dielectric layer, it can increase the fingerprint identification capability of the fingerprint identification module, and the description is omitted here.
Fig. 9 is a partial schematic structural diagram of another display module according to an embodiment of the present invention, and referring to fig. 9, further, a dielectric layer including a heat dissipation silicone gel 42 and an insulating buffer foam 41 may be further disposed in the display module, the heat dissipation silicone gel 42 covers a side surface of the integrated chip 30 facing the cover plate 20, and the insulating buffer foam 41 is filled between the heat dissipation silicone gel 42 and the cover plate 20.
Fig. 10 is a schematic structural diagram of another display module according to an embodiment of the present invention, and referring to fig. 10, preferably, an orthographic projection of the heat dissipation silicone gel 42 on the array substrate 10 may be set to be larger than an orthographic projection of the integrated chip 30 on the array substrate 10.
Compared with the display module shown in fig. 8 and 9, since the integrated chip 30 is accommodated in the accommodating groove 21 of the cover plate 20, the heat dissipation paths of the integrated chip 30 and the heat dissipation silica gel 42 in the accommodating groove 21 are limited, heat is easily concentrated, and the heat dissipation effect is poor. Part of the structure of the heat-dissipating silicone gel 42 in the display module shown in fig. 10 covers the surface of the integrated chip 30, so as to absorb heat through direct contact. The partial structure absorbs heat and dissipates heat at the same time, so that untimely heat dissipation is easily caused. The rest part extends out of the containing groove 21, the part extending outwards can be used as a heat conduction and dissipation structure, a heat dissipation path is increased, heat absorbed by the part directly contacting the integrated chip can be conducted and dissipated in time, and the heat dissipation efficiency is improved. In addition, chip heat conduction structure 90 can give the apron with heat transfer, changes the heat dissipation route and increases heat radiating area with the apron as heat radiation structure to supplementary dispelling the heat, avoiding the heat to concentrate on the microchip, guarantee the fingerprint identification function of fingerprint identification module.
Fig. 11 is a schematic partial structure diagram of another display module according to an embodiment of the present invention, and referring to fig. 11, further, in order to avoid that the heat dissipation silica gel 42 dissipates heat in the accommodating groove in time, a chip heat conduction structure 90 may be further disposed in the display module, the chip heat conduction structure 90 is disposed on a side surface of the cover plate 20 facing the array substrate 10, one end of the chip heat conduction structure 90 is in thermal contact with the heat dissipation silica gel 42, and the other end extends in a direction away from the integrated chip 30.
Similarly, the chip heat conducting structure 90 is in thermal contact with the heat dissipation silica gel 42 directly contacting the integrated chip 30, so as to conduct the heat absorbed by the heat dissipation silica gel 42, achieve timely and effective heat dissipation, and avoid the concentration of the heat of the integrated chip. Similarly, the chip heat conducting structure 90 can also transfer heat to the cover plate 20, and the cover plate 20 can be used as a heat dissipation structure to change a heat dissipation path and increase a heat dissipation area, thereby assisting heat dissipation. The chip heat conducting structure 90 can be made of a material with good heat conducting property, such as a graphite sheet, a metal material, etc.
In order to ensure the heat conduction and dissipation effects of the chip heat conduction structure and prevent the chip heat conduction structure from conducting heat to the integrated chip again, the embodiment of the invention also provides a display module. Fig. 12 is a schematic structural view of another display module according to an embodiment of the invention, and referring to fig. 12, optionally, a notch structure 91 may be disposed at a corner of the chip heat conducting structure 90 located at the receiving groove 21. The notch structure 91 prevents the chip heat conducting structure 90 from directly contacting the integrated chip 30, so that the heat conducting structure 90 can prevent the heat from being conducted to the integrated chip 30 again, which reduces the heat dissipation efficiency of the integrated chip 30; on the other hand, there is a decreasing temperature difference between the chip heat conducting structure 90, the heat dissipation silicone rubber 42 and the integrated chip 30, so as to form a good heat dissipation path and increase the heat dissipation efficiency.
It should be noted that the structures between the integrated chip and the cover plate in the display module shown in fig. 8 to 12 are also applicable to the scheme without the accommodating groove on the cover plate, and those skilled in the art can select the structure according to actual requirements, which is not described herein.
Fig. 13 is a schematic structural diagram of a display device according to an embodiment of the present invention, and referring to fig. 13, the display device includes any one of the display modules 300 according to the embodiment. In addition, since the display device employs the display module 300 of the above embodiment, the display device also has the advantages of the display module 300. The display device can be a mobile phone, an intelligent tablet, a computer and the like. In addition, because the integrated chip of the display module provided by the embodiment is arranged in the non-display area of the display module, the display device still has a frame with a certain width.
It is to be noted that the foregoing is only illustrative of the preferred embodiments of the present invention and the technical principles employed. It will be understood by those skilled in the art that the present invention is not limited to the particular embodiments described herein, but is capable of various obvious modifications, rearrangements, combinations and substitutions as will now become apparent to those skilled in the art without departing from the scope of the invention. Therefore, although the present invention has been described in greater detail by the above embodiments, the present invention is not limited to the above embodiments, and may include other equivalent embodiments without departing from the spirit of the present invention, and the scope of the present invention is determined by the scope of the appended claims.
Claims (16)
1. A display module is characterized by comprising an array substrate, a cover plate and an integrated chip; the display module further comprises a display area and a non-display area arranged around the display area, and the non-display area is provided with a fingerprint identification area;
the array substrate and the cover plate are oppositely arranged, the integrated chip is positioned between the array substrate and the cover plate, the integrated chip is bound on the array substrate in the non-display area, the vertical projection of the integrated chip on the array substrate covers the fingerprint identification area, a dielectric layer is also arranged between the integrated chip and the cover plate, and the dielectric constant of the dielectric layer is greater than that of air;
the integrated chip comprises a control driving circuit and a fingerprint identification module, the fingerprint identification module comprises a fingerprint identification driving circuit and a plurality of fingerprint identification electrodes, and the fingerprint identification driving circuit is electrically connected with the plurality of fingerprint identification electrodes; the control drive circuit is used for controlling display drive; the fingerprint identification driving circuit is used for driving the plurality of fingerprint identification electrodes to carry out fingerprint identification.
2. The display module assembly according to claim 1, wherein a surface of the cover plate facing the array substrate is provided with a receiving groove;
the distance between the array substrate and the cover plate is a, the depth of the accommodating groove is b, and the value range of the thickness c of the integrated chip is c < a + b.
3. The display module assembly of claim 1, wherein the distance between the array substrate and the cover plate is a, and the thickness c of the integrated chip has a value range of c < a.
4. The display module assembly according to claim 2 or 3, wherein the dielectric layer comprises a heat-dissipating silicone, the heat-dissipating silicone covers a side surface of the integrated chip facing the cover plate, and a side surface of the heat-dissipating silicone facing away from the integrated chip is bonded to the cover plate.
5. The display module assembly according to claim 2 or 3, wherein the dielectric layer comprises a heat dissipation silicone and an insulating buffer foam, the heat dissipation silicone covers a side surface of the integrated chip facing the cover plate, and the insulating buffer foam is filled between the heat dissipation silicone and the cover plate.
6. The display module assembly according to claim 5, wherein an orthographic projection of the heat-dissipating silicone on the array substrate is larger than an orthographic projection of the integrated chip on the array substrate.
7. The display module according to claim 5, further comprising a chip heat conducting structure disposed on a side surface of the cover plate facing the array substrate, wherein one end of the chip heat conducting structure is in thermal contact with the heat-dissipating silicone, and the other end of the chip heat conducting structure extends in a direction away from the integrated chip.
8. The display module of claim 2, wherein a gap exists between the side wall of the integrated chip and the receiving groove.
9. The display module according to claim 2 or 3, wherein the dielectric layer comprises an insulating buffer foam filled between the integrated chip and the cover plate.
10. The display module according to claim 2 or 3, wherein an organic light emitting structure array, a packaging substrate, a polarizer and an optical adhesive layer are sequentially disposed between the array substrate and the cover plate along a light emitting direction, and the organic light emitting structure array is located in the display area.
11. The display module according to claim 2 or 3, wherein a liquid crystal layer, a color film substrate, a polarizer and an optical adhesive layer are sequentially disposed between the array substrate and the cover plate along a light emitting direction, and a vertical projection of the liquid crystal layer on the array substrate covers the display area.
12. The display module assembly of claim 1, wherein the integrated chip further comprises a plurality of bonding pins, and the integrated chip is bonded on the array substrate in the non-display area through the bonding pins;
the fingerprint identification module is positioned on the surface of one side, away from the binding pin, of the integrated chip.
13. The display module of claim 1, wherein the plurality of fingerprint identification electrodes comprises a plurality of driving electrodes arranged along a first direction and a plurality of sensing electrodes arranged along a second direction, and the first direction and the second direction are mutually crossed.
14. The display module of claim 1, wherein the plurality of fingerprint identification electrodes comprises a plurality of sensing electrode blocks arranged in an array.
15. The display module of claim 1, wherein the vertical projection of the integrated chip on the array substrate is rectangular, and the sides of the rectangle are all greater than or equal to 3 mm.
16. A display device comprising a display module according to any one of claims 1 to 15.
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| CN111596400A (en) * | 2020-06-01 | 2020-08-28 | 安徽方兴光电新材料科技有限公司 | Polaroid with fingerprint identification function and display device thereof |
| CN113554987B (en) * | 2020-07-30 | 2022-08-09 | 华为技术有限公司 | Display module assembly and electronic equipment |
| CN113284883A (en) * | 2021-03-31 | 2021-08-20 | 华为技术有限公司 | Display module and electronic equipment |
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Effective date of registration: 20211103 Address after: No.8, liufangyuan Henglu, Donghu New Technology Development Zone, Wuhan City, Hubei Province Patentee after: WUHAN TIANMA MICRO-ELECTRONICS Co.,Ltd. Patentee after: Wuhan Tianma Microelectronics Co.,Ltd. Shanghai Branch Address before: Room 509, building 1, No. 6111, Longdong Avenue, Pudong New Area, Shanghai, 200120 Patentee before: SHANGHAI TIANMA AM-OLED Co.,Ltd. |