CN110471512A - A kind of 5U reinforcing server of compact - Google Patents
A kind of 5U reinforcing server of compact Download PDFInfo
- Publication number
- CN110471512A CN110471512A CN201910876233.0A CN201910876233A CN110471512A CN 110471512 A CN110471512 A CN 110471512A CN 201910876233 A CN201910876233 A CN 201910876233A CN 110471512 A CN110471512 A CN 110471512A
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- China
- Prior art keywords
- heat
- cabinet
- mainboard
- dissipation
- radiating block
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- 230000003014 reinforcing effect Effects 0.000 title claims description 9
- 230000017525 heat dissipation Effects 0.000 claims abstract description 57
- 125000006850 spacer group Chemical group 0.000 claims abstract description 27
- 238000009434 installation Methods 0.000 claims abstract description 16
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 11
- 229910052782 aluminium Inorganic materials 0.000 claims description 11
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 10
- 239000010949 copper Substances 0.000 claims description 10
- 229910052802 copper Inorganic materials 0.000 claims description 10
- 238000002955 isolation Methods 0.000 claims description 8
- 238000009423 ventilation Methods 0.000 claims description 7
- 238000005192 partition Methods 0.000 claims description 2
- 230000000694 effects Effects 0.000 abstract description 8
- 239000000428 dust Substances 0.000 abstract description 5
- 206010037660 Pyrexia Diseases 0.000 abstract description 4
- 230000035939 shock Effects 0.000 abstract description 4
- 239000010410 layer Substances 0.000 description 13
- 238000010586 diagram Methods 0.000 description 6
- 238000013461 design Methods 0.000 description 5
- 230000008901 benefit Effects 0.000 description 3
- 230000005855 radiation Effects 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000002356 single layer Substances 0.000 description 2
- 238000005728 strengthening Methods 0.000 description 2
- 230000032683 aging Effects 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 238000007664 blowing Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000004880 explosion Methods 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000005065 mining Methods 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/18—Packaging or power distribution
- G06F1/181—Enclosures
- G06F1/182—Enclosures with special features, e.g. for use in industrial environments; grounding or shielding against radio frequency interference [RFI] or electromagnetical interference [EMI]
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/18—Packaging or power distribution
- G06F1/183—Internal mounting support structures, e.g. for printed circuit boards, internal connecting means
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management
Landscapes
- Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Physics & Mathematics (AREA)
- Human Computer Interaction (AREA)
- General Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Electromagnetism (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The present invention provides a kind of 5U of compact to reinforce server, by dividing the chassis into upper layer and lower layer cavity body structure；Fixed radiating block fixation is located on heat-dissipation spacer；The lower end of heat-conducting piece is located by connecting with mainboard assembly, and upper end is located by connecting after passing through heat-dissipation spacer with fixed radiating block；Power supply module passes through heat-dissipation spacer and is located by connecting with fixed radiating block；Fan is opposite to be located at the cabinet two sides of upper layer cavity body structure to form air duct, realizes the thermally conductive and heat dissipation respectively to emphasis fever mounting assembly；By the way that independent air duct is arranged, the dust for reducing internal unit gathers, and dustproof and waterproof effect is more preferable.The present invention is while realizing various components installation, also substantially increase the cabinet that cabinet and heat-dissipation spacer connect into, realization also reinforces mainboard assembly and power supply module while radiating to mainboard assembly, substantially increases complete machine anti-vibration, shock resistance, structure novel.
Description
Technical field
The present invention relates to reinforce server technology field, and in particular to a kind of 5U reinforcing server of compact.
Background technique
Currently, the field such as national defence, traffic, news, geology, medical treatment, mining, fire-fighting, rescue, services vehicle-mounted reinforcing
Device demand is very big.Due to the particularity of working environment, onboard servers had both required powerful processing capacity, also to have good
The performances such as EMC performance well, anti-vibration, shock resistance, while the environment such as high/low temperature, damp and hot, dusty are also adapted to, and it is current
The generally popular business computer in market, does not have this performance.It is usually that height is higher that existing 5U, which reinforces server, at present
Single layer square box structure, and the component arrangement in cabinet is in single layer square box structure, services since existing 5U is reinforced
Device commonly radiates to internal part using unilateral fan, special due to there is the barrier of each mounting assembly in cabinet
It is not emphasis installing component (CPU and GPU), heat dissipation effect and dust-proof effect and bad, it would be highly desirable to improve.
Summary of the invention
The object of the present invention is to provide a kind of 5U of compact to reinforce server, it is intended to which 5U reinforces server at this stage for optimization
Component integral installation structure and emphasis installing component radiator structure.
In order to achieve the above object, the present invention is achieved by the following technical programs:
A kind of 5U reinforcing server of compact, including positioning the radiating subassembly, the mainboard assembly, hard disk groups that are located in cabinet
Part and power supply module；The radiating subassembly includes heat-dissipation spacer, heat-conducting piece, fixed radiating block and fan；The heat-dissipation spacer is solid
It is realized with this and cabinet is separated into upper layer and lower layer cavity knot on the fixed support plate of the cabinet medium position in Dingan County
Structure；The fixed radiating block fixation is located on the heat-dissipation spacer；The mainboard assembly, Hard disc module and power supply module spacing are fixed
Position is located at the chassis bottom of lower layer's cavity body structure；The lower end of the heat-conducting piece is located by connecting with mainboard assembly, and upper end passes through described
It is located by connecting after heat-dissipation spacer with fixed radiating block；The power supply module passes through the heat-dissipation spacer and the fixed radiating block is fixed
Position connection；The fan is opposite to be located at the cabinet two sides of upper layer cavity body structure to form air duct.
Optionally, it is additionally provided with upper cover；The upper cover this be located at the upper opening of the cabinet；The upper cover passes through clamp screw
Nail is detachably fixed with the cabinet to be connect, and is realized with this to the entire closed box installation for reinforcing server.
Optionally, the mainboard assembly includes mainboard and supporting clapboard；The supporting clapboard is located at lower layer's cavity knot vertically
The rear portion of structure, being realized with this, the air plug connector of cabinet rear end will be isolated；The upper end of the supporting clapboard and the heat-dissipation spacer
It is fixedly connected, lower end is fixedly connected with the chassis bottom；A side of the mainboard and the side of the supporting clapboard are fixed
Connection, the location and installation of supporting plate is reinforced with this.
Optionally, the Hard disc module is located at the front side of the cabinet；The Hard disc module includes hard disk and bracket；It is described
Bracket is located on the hard disk, and is located by connecting on the bottom of the cabinet by bracket to realize that the positioning of the hard disk is set
It sets.
Optionally, the fixed radiating block is radiating fin；The fixed radiating block includes GPU radiating fin, CPU heat dissipation
Fin and power supply heat sinking fin；The power supply heat sinking fin and electrical power contacts.
Optionally, the heat-conducting piece includes aluminum heat conducting plate and heat dissipation copper pipe；The two sides of the lower part of the aluminum heat conducting plate point
Thermally conductive briquetting clamping position is not positioned by GPU；And the GPU positions the GPU positioning on thermally conductive briquetting and mainboard and is arranged, with this
Heat on GPU is passed through fixed radiating block respectively and is transferred on aluminum heat conducting plate by realization.
Optionally, the heat dissipation copper pipe is U-shaped tubular structure；It is fixed that the lower end support arm positioning of the heat dissipation copper pipe is located at CPU
In the thermally conductive briquetting in position, upper end support arm passes through the heat-dissipation spacer and positions and is located in CPU radiating fin, to realize on mainboard
The heat dissipation of CPU.
Optionally, multiple fans are arranged in correspondingly at the upper position of the cabinet two sides, and the fan
Uniformly it is covered on the cabinet；The fan mounting bit place of setting on the cabinet is additionally provided with ventilation hole.
Compared with prior art, the invention has the benefit that
1, the present invention also substantially increases the case that cabinet and heat-dissipation spacer connect into while realizing various components installation
Body is realized and also carries out transversely strengthening to mainboard assembly and power supply module while radiating to mainboard assembly, substantially increases whole
Machine anti-vibration, shock resistance；Pass through the thermally conductive and heat dissipation respectively to emphasis fever mounting assembly simultaneously, it is ensured that emphasis installation
Effective heat dissipation of component, substantially increases the useful life of emphasis mounting assembly.
2, the present invention is by the design in upper isolation air duct, Lai Shixian heat from top air duct radiation to cabinet outside, greatly
The internal heat dissipating efficiency of whole device is improved greatly.
3, the present invention greatly reduces the intracorporal main component of lower chamber by the way that independent isolation air duct is arranged on top
Dust gathers, good dustproof effect；By the way that independent isolation air duct is arranged on top, it is intracorporal main to greatly reduce lower chamber
The aqueous vapor of component is gathered, and dampproof effect is good.
Certainly, it implements any of the products of the present invention and does not necessarily require achieving all the advantages described above at the same time.
Detailed description of the invention
In order to more clearly explain the embodiment of the invention or the technical proposal in the existing technology, to embodiment or will show below
There is attached drawing needed in technical description to be briefly described, it is therefore apparent that the accompanying drawings in the following description is only this hair
Bright some embodiments for those of ordinary skill in the art without creative efforts, can be with root
Other attached drawings are obtained according to these attached drawings.
Fig. 1 is integral installation structural schematic diagram of the invention；
Fig. 2 is the cross-sectional structural schematic diagram of level of the invention；
Fig. 3 is vertical profile structural schematic diagram of the invention；
Fig. 4 is cross-sectional structural schematic diagram of the invention；
Fig. 5 is configuration schematic diagram of the invention；
Fig. 6 is local explosion structure diagram of the invention；
Figure label explanation:
1, cabinet；11, fixed support plate；12, ventilation hole；2, radiating subassembly；21, heat-dissipation spacer；22, heat-conducting piece；221,
Aluminum heat conducting plate；222, heat dissipation copper pipe；23, fixed radiating block；231, GPU radiating fin；232, CPU radiating fin；233, power supply
Radiating fin；24, fan；3, mainboard assembly；31, mainboard；32, supporting clapboard；4, Hard disc module；41, hard disk；42, bracket；5,
Power supply module；6, upper cover；8,GPU；7, GPU positions thermally conductive briquetting；9, CPU positions thermally conductive briquetting；10,CPU；20, air plug connector；
30, handle.
Specific embodiment
In order to make the object, technical scheme and advantages of the embodiment of the invention clearer, below in conjunction with the embodiment of the present invention,
Technical scheme in the embodiment of the invention is clearly and completely described, it is clear that described embodiment is the present invention one
Divide embodiment, instead of all the embodiments.Based on the embodiments of the present invention, those of ordinary skill in the art are not making
Every other embodiment obtained, shall fall within the protection scope of the present invention under the premise of creative work.
In conjunction with attached drawing 1 to Fig. 6, the present invention is further described:
A kind of 5U of compact reinforces server, including positioning the radiating subassembly 2 being located in cabinet 1, mainboard assembly 3, hard
Disk component 4 and power supply module 5；The radiating subassembly 2 includes heat-dissipation spacer 21, heat-conducting piece 22, fixed radiating block 23 and fan 24；
The heat-dissipation spacer 21 is fixedly mounted on the fixed support plate 11 of 1 medium position of cabinet, is realized with this by the cabinet 1
It is separated into upper layer and lower layer cavity body structure；The fixation of fixed radiating block 23 is located on the heat-dissipation spacer 21；The mainboard assembly
3, Hard disc module 4 and the positioning of 5 spacing of power supply module are located at 1 bottom of cabinet of lower layer's cavity body structure；The lower end of the heat-conducting piece 22
It is located by connecting with mainboard assembly 3, upper end is located by connecting after passing through the heat-dissipation spacer 21 with fixed radiating block 23；The power supply group
Part 5 passes through the heat-dissipation spacer 21 and is located by connecting with the fixed radiating block 23；The fan 24 is opposite to be located at upper layer cavity knot
1 two sides of cabinet of structure form air duct.
The present invention also substantially increases the case that cabinet and heat-dissipation spacer connect into while realizing various components installation
Body is realized and also carries out transversely strengthening to mainboard assembly and power supply module while radiating to mainboard assembly, substantially increases whole
Machine anti-vibration, shock resistance, structure novel；By the design in upper isolation air duct, Lai Shixian heat is from top air duct radiation
To outside cabinet, the internal heat dissipating efficiency of whole device is substantially increased；By the way that independent isolation air duct is arranged on top, significantly
Reduce gathering for the dust of the intracorporal main component of lower chamber, good dustproof effect；By the design in upper isolation air duct, come real
Existing heat from top air duct radiation to cabinet outside heat exchange, substantially increase the internal heat dissipating efficiency of whole device；Pass through
Independent isolation air duct is set on top, greatly reduces gathering for the aqueous vapor of the intracorporal main component of lower chamber, dampproof effect
It is good；Pass through the thermally conductive and heat dissipation respectively to emphasis fever mounting assembly, it is ensured that effective heat dissipation of emphasis mounting assembly mentions significantly
The high useful life of emphasis mounting assembly.
The power supply body upper end of the power supply module 5 passes through the through-hole on the heat-dissipation spacer 21, and passes through fixed heat dissipation
Block 23 realizes the limit of the power supply body；While realizing the positioning of power supply body with this, also achieve to power supply body
Thermally conductive and heat dissipation, it is compact-sized so that the structure of entire cabinet 1 is more firm.
It is additionally provided with upper cover 6；The upper cover 6 this be located at the upper opening of the cabinet 1；The upper cover 6 passes through holding screw
It is detachably fixed and connect with the cabinet 1, realized with this to the entire closed box installation for reinforcing server；In the upper cover 6
It is additionally provided with radiating fin.
The mainboard assembly 3 includes mainboard 31 and supporting clapboard 32；The supporting clapboard 32 is located at lower layer's cavity knot vertically
The rear portion of structure, being realized with this, the air plug connector 20 of 1 rear end of cabinet will be isolated；The upper end of the supporting clapboard 32 and the heat dissipation
Partition 21 is fixedly connected, and lower end is fixedly connected with 1 bottom of cabinet；A side of the mainboard 31 and the supporting clapboard 32
Side be fixedly connected, the location and installation of supporting plate is reinforced with this；
Preferably, the supporting clapboard 32 is equipped with perforation, and the data on the component of 32 front side of supporting clapboard are realized with this
Line is connect by perforation with the air plug connector 20 on 1 rear end of cabinet, while realizing reinforcing whole device, also achieves data
The sequence of line is arranged, and is easily installed and overhauls with later maintenance.
The Hard disc module 4 is located at the front side of the cabinet 1；The Hard disc module 4 includes hard disk 41 and bracket 42；It is described
Bracket 42 is located on the hard disk 41, and is located by connecting on the bottom of the cabinet 1 by bracket 42 to realize the hard disk
41 positioning setting；Lightening hole is additionally provided on the bracket 42.
The power supply module 5 is located at a side of 1 bottom of cabinet；
On the heat-dissipation spacer 21 array be equipped with the consistent fin of air channel, increase the radiating surface of convection gas
Product, the radiating efficiency greatly improved.
The fixed radiating block 23 is radiating fin；The fixed radiating block 23 includes GPU radiating fin 231, CPU heat dissipation
Fin 232 and power supply heat sinking fin 233；The power supply heat sinking fin 233 and electrical power contacts realize that the effective of power supply dissipates with this
Heat.
The heat-conducting piece 22 includes aluminum heat conducting plate 221 and heat dissipation copper pipe 222；The two sides of the lower part of the aluminum heat conducting plate 221
Side passes through GPU respectively and positions thermally conductive 7 clamping position of briquetting；And the GPU positions thermally conductive briquetting 7 and positions with the GPU8 on mainboard 31
Setting realizes that the heat on GPU8 is passed through fixed radiating block 23 respectively is transferred to 221 lower part of aluminum heat conducting plate with this, and by leading
Effective heat dissipation is realized in the GPU radiating fin 231 on hot 221 top of aluminium sheet and air duct；
The heat dissipation copper pipe 222 is U-shaped tubular structure；The lower end support arm positioning of the heat dissipation copper pipe 222 is located at CPU positioning
In thermally conductive briquetting 9, upper end support arm passes through the heat-dissipation spacer 21 and positions and is located in CPU radiating fin 232, to realize to mainboard
Effective heat dissipation of CPU10 on 31.
Multiple fans 24 are arranged in correspondingly at the upper position of 1 two sides of cabinet, and the fan 24 is equal
It is even to be covered on the cabinet 1；24 installed position of fan on the cabinet 1 is additionally provided with ventilation hole 12, is realizing opposite wind
In the case where 24 blowing of fan, it can realize that the wind of internal upper layer cavity body structure enters from front side ventilation hole by the ventilation hole 12
And blown out from rear side ventilation hole, realize the carry out heat exchange with 1 exterior space of cabinet；
By the design in air duct, can effectively avoid because of functional fault caused by by thermally-induced aging deformation, stability
It is higher；By the thermally conductive and heat dissipation respectively to emphasis fever mounting assembly, effective heat dissipation of mounting assembly is realized, it is ensured that installation
Effective heat dissipation of component, substantially increases the useful life of emphasis installing component；Simultaneously by the way that independent air duct, the gas made is arranged
Substantially in the cavity body structure of upper layer, dust is also substantially collected at dismountable radiating block on upper layer for stream exchange, reduces interior
The dust of portion's equipment gathers, and dustproof and waterproof effect is more preferable, and space utilization rate is higher.
Preferably, the front of the cabinet 1 is additionally provided with handle 30.
Location and installation in text is to be detachably connected, and can realize the location and installation between two components (for this by bolt
The conventional techniques in field).
Present apparatus structure is simple, and installation operation is convenient, economical and practical, and design is rationally, compact-sized, has good market
Prospect.
Techniques well known is partly belonged to it should be noted that not elaborating in the present invention, or can be directly from market
Upper buying obtains, and those skilled in the art do not need to make the creative labor and can be obtained, and specific connection type is in ability
Have in domain or daily life and be extremely widely applied, and will not be described here in detail.
In the description of the present invention, it is to be understood that, term " center ", " longitudinal direction ", " transverse direction ", " length ", " width ",
" thickness ", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom" "inner", "outside", " up time
The orientation or positional relationship of the instructions such as needle ", " counterclockwise ", " axial direction ", " radial direction ", " circumferential direction " be orientation based on the figure or
Positional relationship is merely for convenience of description of the present invention and simplification of the description, rather than the device or element of indication or suggestion meaning must
There must be specific orientation, be constructed and operated in a specific orientation, therefore be not considered as limiting the invention.
In addition, term " first ", " second " are used for descriptive purposes only and cannot be understood as indicating or suggesting relative importance
Or implicitly indicate the quantity of indicated technical characteristic.Define " first " as a result, the feature of " second " can be expressed or
Implicitly include at least one this feature.In the description of the present invention, the meaning of " plurality " is at least two, such as two, three
It is a etc., unless otherwise specifically defined.
In the present invention unless specifically defined or limited otherwise, term " installation ", " connected ", " connection ", " fixation " etc.
Term shall be understood in a broad sense, for example, it may be being fixedly connected, may be a detachable connection, or integral；It can be mechanical connect
It connects, is also possible to be electrically connected；It can be directly connected, can also can be in two elements indirectly connected through an intermediary
The interaction relationship of the connection in portion or two elements, unless otherwise restricted clearly.For those of ordinary skill in the art
For, the specific meanings of the above terms in the present invention can be understood according to specific conditions.
In the present invention unless specifically defined or limited otherwise, fisrt feature in the second feature " on " or " down " can be with
It is that the first and second features directly contact or the first and second features pass through intermediary mediate contact.Moreover, fisrt feature exists
Second feature " on ", " top " and " above " but fisrt feature be directly above or diagonally above the second feature, or be merely representative of
First feature horizontal height is higher than second feature.Fisrt feature can be under the second feature " below ", " below " and " below "
One feature is directly under or diagonally below the second feature, or is merely representative of first feature horizontal height less than second feature.
In the description of this specification, reference term " one embodiment ", " some embodiments ", " example ", " specifically show
The description of example " or " some examples " etc. means specific features, structure, material or spy described in conjunction with this embodiment or example
Point is included at least one embodiment or example of the invention.In the present specification, schematic expression of the above terms are not
It must be directed to identical embodiment or example.Moreover, particular features, structures, materials, or characteristics described can be in office
It can be combined in any suitable manner in one or more embodiment or examples.In addition, without conflicting with each other, the skill of this field
Art personnel can tie the feature of different embodiments or examples described in this specification and different embodiments or examples
It closes and combines.
Although the embodiments of the present invention has been shown and described above, it is to be understood that above-described embodiment is example
Property, it is not considered as limiting the invention, those skilled in the art within the scope of the invention can be to above-mentioned
Embodiment is changed, modifies, replacement and variant.
Claims (8)
1. a kind of 5U of compact reinforces server, it is characterised in that: including positioning the radiating subassembly being located in cabinet, mainboard group
Part, Hard disc module and power supply module；The radiating subassembly includes heat-dissipation spacer, heat-conducting piece, fixed radiating block and fan；It is described to dissipate
Hot partition is fixedly mounted on the fixed support plate of the cabinet medium position, is realized with this cabinet being separated into upper and lower two
Layer cavity body structure；The fixed radiating block fixation is located on the heat-dissipation spacer；The mainboard assembly, Hard disc module and power supply group
Part spacing positions the chassis bottom for being located at lower layer's cavity body structure；The lower end of the heat-conducting piece is located by connecting with mainboard assembly, upper end
It is located by connecting after the heat-dissipation spacer with fixed radiating block；The power supply module passes through the heat-dissipation spacer and the fixation
Radiating block is located by connecting；The fan is opposite to be located at the cabinet two sides of upper layer cavity body structure to form air duct.
2. the 5U of compact according to claim 1 reinforces server, it is characterised in that: be additionally provided with upper cover；The upper cover
This is located at the upper opening of the cabinet；The upper cover is detachably fixed with the cabinet by holding screw and is connect, with this reality
Now the entire closed box for reinforcing server is installed.
3. the 5U of compact according to claim 1 reinforces server, it is characterised in that: the mainboard assembly includes mainboard
And supporting clapboard；The supporting clapboard is located at the rear portion of lower layer's cavity body structure vertically, and being realized with this will be by the air plug of cabinet rear end
Connector isolation；The upper end of the supporting clapboard is fixedly connected with the heat-dissipation spacer, and lower end is fixedly connected with the chassis bottom；
A side of the mainboard is fixedly connected with the side of the supporting clapboard, and the location and installation of supporting plate is reinforced with this.
4. the 5U of compact according to claim 1 reinforces server, it is characterised in that: the Hard disc module is located at described
The front side of cabinet；The Hard disc module includes hard disk and bracket；The bracket is located on the hard disk, and is positioned by bracket
The bottom of the cabinet is connected to realize the positioning setting of the hard disk.
5. the 5U of compact according to claim 1 reinforces server, it is characterised in that: the fixed radiating block is heat dissipation
Fin；The fixed radiating block includes GPU radiating fin, CPU radiating fin and power supply heat sinking fin；The power supply heat sinking fin
With electrical power contacts.
6. the 5U of compact according to claim 1 reinforces server, it is characterised in that: the heat-conducting piece includes heat conduction aluminum
Plate and heat dissipation copper pipe；The two sides of the lower part of the aluminum heat conducting plate pass through GPU respectively and position thermally conductive briquetting clamping position；And it is described
GPU positions the GPU positioning on thermally conductive briquetting and mainboard and is arranged, and is realized with this heat on GPU passing through fixed radiating block respectively
It is transferred on aluminum heat conducting plate.
7. the 5U of compact according to claim 6 reinforces server, it is characterised in that: the heat dissipation copper pipe is U-tube
Shape structure；The lower end support arm positioning of the heat dissipation copper pipe is located at CPU and positions in thermally conductive briquetting, upper end support arm pass through the heat dissipation every
Plate and position be located in CPU radiating fin, to realize the heat dissipation to the CPU on mainboard.
8. the 5U of compact according to claim 1 reinforces server, it is characterised in that: multiple fans are set correspondingly
It sets at the upper position of the cabinet two sides, and the fan is uniformly covered on the cabinet；Wind on the cabinet
Fan installed position is additionally provided with ventilation hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910876233.0A CN110471512B (en) | 2019-09-17 | 2019-09-17 | Compact 5U consolidates server |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910876233.0A CN110471512B (en) | 2019-09-17 | 2019-09-17 | Compact 5U consolidates server |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN110471512A true CN110471512A (en) | 2019-11-19 |
| CN110471512B CN110471512B (en) | 2024-05-17 |
Family
ID=68515971
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910876233.0A Active CN110471512B (en) | 2019-09-17 | 2019-09-17 | Compact 5U consolidates server |
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| Country | Link |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114371767A (en) * | 2021-12-17 | 2022-04-19 | 深圳市融达计算机有限公司 | Reinforcement server with keep apart wind channel |
| CN114911315A (en) * | 2021-02-07 | 2022-08-16 | 北京图森智途科技有限公司 | Computing device and installation method of computing device |
| WO2023035861A1 (en) * | 2021-09-13 | 2023-03-16 | 北京比特大陆科技有限公司 | Server |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6862176B1 (en) * | 2003-06-27 | 2005-03-01 | Western Digital Technologies, Inc. | Disk drive cover for use with a disk drive to provide for disk shrouding and heat dissipation |
| US20080285228A1 (en) * | 2005-02-04 | 2008-11-20 | Knuerr Ag | Arrangement For Cooling Electronic Modular Units in Equipment and Network Cabinets |
| JP2016057902A (en) * | 2014-09-10 | 2016-04-21 | シムックス株式会社 | Server cooling system and method for cooling thereof |
| CN108491054A (en) * | 2018-05-23 | 2018-09-04 | 郑州云海信息技术有限公司 | A kind of server radiator structure based on gaseous exchange heat exchange |
| CN109388201A (en) * | 2018-10-08 | 2019-02-26 | 郑州云海信息技术有限公司 | Server |
| CN109491462A (en) * | 2018-10-30 | 2019-03-19 | 合肥恒研智能科技有限公司 | A kind of compact 3U reinforcing server |
| CN210324022U (en) * | 2019-09-17 | 2020-04-14 | 合肥恒研智能科技有限公司 | Compact 5U reinforcing server |
-
2019
- 2019-09-17 CN CN201910876233.0A patent/CN110471512B/en active Active
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6862176B1 (en) * | 2003-06-27 | 2005-03-01 | Western Digital Technologies, Inc. | Disk drive cover for use with a disk drive to provide for disk shrouding and heat dissipation |
| US20080285228A1 (en) * | 2005-02-04 | 2008-11-20 | Knuerr Ag | Arrangement For Cooling Electronic Modular Units in Equipment and Network Cabinets |
| JP2016057902A (en) * | 2014-09-10 | 2016-04-21 | シムックス株式会社 | Server cooling system and method for cooling thereof |
| CN108491054A (en) * | 2018-05-23 | 2018-09-04 | 郑州云海信息技术有限公司 | A kind of server radiator structure based on gaseous exchange heat exchange |
| CN109388201A (en) * | 2018-10-08 | 2019-02-26 | 郑州云海信息技术有限公司 | Server |
| CN109491462A (en) * | 2018-10-30 | 2019-03-19 | 合肥恒研智能科技有限公司 | A kind of compact 3U reinforcing server |
| CN210324022U (en) * | 2019-09-17 | 2020-04-14 | 合肥恒研智能科技有限公司 | Compact 5U reinforcing server |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114911315A (en) * | 2021-02-07 | 2022-08-16 | 北京图森智途科技有限公司 | Computing device and installation method of computing device |
| CN114911315B (en) * | 2021-02-07 | 2024-02-06 | 北京图森智途科技有限公司 | Computing device and method for installing computing device |
| WO2023035861A1 (en) * | 2021-09-13 | 2023-03-16 | 北京比特大陆科技有限公司 | Server |
| CN114371767A (en) * | 2021-12-17 | 2022-04-19 | 深圳市融达计算机有限公司 | Reinforcement server with keep apart wind channel |
| CN114371767B (en) * | 2021-12-17 | 2024-01-30 | 深圳市融达计算机有限公司 | Reinforced server with isolated air duct |
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| CN110471512B (en) | 2024-05-17 |
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