CN110459847B - Electromagnetic coupling interdigital band-pass filter based on multiple through holes and design method - Google Patents

Electromagnetic coupling interdigital band-pass filter based on multiple through holes and design method Download PDF

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CN110459847B
CN110459847B CN201910710691.7A CN201910710691A CN110459847B CN 110459847 B CN110459847 B CN 110459847B CN 201910710691 A CN201910710691 A CN 201910710691A CN 110459847 B CN110459847 B CN 110459847B
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方勇
赵志龙
王阳阳
钟晓玲
郭勇
盛浩轩
郭听听
侯学师
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Chengdu Univeristy of Technology
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P1/00—Auxiliary devices
    • H01P1/20—Frequency-selective devices, e.g. filters
    • H01P1/201—Filters for transverse electromagnetic waves
    • H01P1/205—Comb or interdigital filters; Cascaded coaxial cavities
    • H01P1/2056—Comb filters or interdigital filters with metallised resonator holes in a dielectric block
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P11/00—Apparatus or processes specially adapted for manufacturing waveguides or resonators, lines, or other devices of the waveguide type
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Abstract

The invention discloses an electromagnetic coupling interdigital band-pass filter based on a plurality of through holes and a design method thereof, wherein through holes which are mutually staggered are punched in a substrate to generate a filtering effect, so that a manufactured product not only can make a planar interdigital filter into a three-dimensional interdigital filter, but also can make the filter inside the substrate from the substrate, thereby realizing filtering of the filter inside the substrate in a microwave integrated circuit, realizing the minimization of the space occupation ratio of the filter, overcoming the problems of large duty ratio and the like of the planar interdigital filter in the microwave integrated circuit. The product manufactured by the method has the advantages of small volume, wide bandwidth and good filtering effect. The invention also provides a specific design method, and the number of the metal through holes, the adjacent metal gaps, the radius of the metal through holes and the thickness of the dielectric substrate can be calculated through the method, so that the method can be quickly and accurately manufactured.

Description

Electromagnetic coupling interdigital band-pass filter based on multiple through holes and design method
Technical Field
The invention relates to a filter, in particular to an electromagnetic coupling interdigital band-pass filter based on multiple through holes and a design method.
Background
The interdigital filter is a structure formed by intersecting parallel coupled line resonator arrays, has excellent band-pass characteristics, but has poor practicability, occupies a large area and is not suitable for an integrated microwave circuit.
In the prior art, a planar interdigital filter is structured by placing two crossed parallel coupling linear arrays between two parallel ground plates, wherein one end of each rod is short-circuited, and the other end of each rod is open-circuited, and the length of each rod is about 1/(4 lambda 0). The rods 1 to n are resonators, and the rod 0 and the rod n +1 are short-circuited at one end and connected to an external circuit at the other end, called a terminal short-circuit line, so that the structure is called a terminal short-circuit interdigital filter.
Substrate Integrated Waveguide (SIW) is a new form of microwave transmission line that uses metal vias to implement the field propagation mode of the waveguide on a dielectric Substrate.
The concept principle of the invention is as follows: a row of through holes with uniform space and symmetrical structure are arranged between two ground planes of a substrate material, the inner surfaces of the through holes are arranged to be ideal conductor surfaces, one ends of the through holes are grounded, the other ends of the through holes are open, and the through holes between the substrates are mutually staggered to form the interdigital coupling band-pass filter. The method is equivalent to the mutual interleaving of planar microstrip lines, and uses through holes to replace the microstrip lines as a resonance source in a solid to generate self inductance and self capacitance, and then generates mutual inductance and mutual capacitance between the through holes. The height of the through-hole corresponds to a quarter of a wavelength, so that a band-pass filter can be formed.
Disclosure of Invention
The present invention is directed to solving the above problems, and an object of the present invention is to provide an electromagnetic coupling interdigital band pass filter and a design method thereof, which can reduce the size of the filter, improve the integration of the filter, and have small size, wide bandwidth and good filtering effect by using the property that a through hole between substrates has a microstrip line in the microwave field to convert a planar filter into a three-dimensional filter.
In order to achieve the purpose, the technical scheme adopted by the invention is as follows: an electromagnetic coupling interdigital band-pass filter based on a multi-through hole comprises a cavity, wherein a medium substrate is arranged in the cavity, and a signal input end and a signal output end are arranged at two ends of the cavity;
the dielectric substrate is provided with n metal through holes, the metal through holes are sequentially from 1 st to nth from a signal input end to a signal output end, n is an even number, and each metal through hole comprises an upper port and a lower port;
the upper port of the 1 st metal through hole is connected with a signal input end, the lower port of the metal through hole is grounded, the upper port of the nth metal through hole is connected with a signal output end, and the lower port of the nth metal through hole is grounded;
among the other metal through holes, the even number of metal through holes have upper ports connected with an open circuit of an underground port, the odd number of metal through holes have open circuits of the upper ports, and the lower ports are grounded;
the electromagnetic coupling between the adjacent metal through holes is used for transmitting signals from the signal output end to the signal output end; the metal through holes are provided with self-capacitance, and mutual capacitance is generated by electromagnetic coupling between adjacent metal through holes;
the two surfaces of the dielectric substrate penetrated by the metal through holes are grounded.
Preferably, the method comprises the following steps: the substrate is also provided with a common ground through hole penetrating through the front surface and the back surface of the substrate.
Preferably, the method comprises the following steps: the dielectric substrate material is Rogers RO 4350.
A design method of an electromagnetic coupling interdigital band-pass filter based on a plurality of through holes comprises the following steps,
(1) determining specification parameters of the band-pass filter, wherein the specification parameters comprise a pass band cut-off frequency and a stop band cut-off frequency fnIn-band jitter LArCalculating the number n of the metal through holes according to the following formula;
Figure BDA0002153627480000031
in the formula (I), the compound is shown in the specification,
Figure BDA0002153627480000032
(2) determining metal via gap S in a substratei,i-1；
(21) Calculating the self-capacitance of each metal through hole and the mutual capacitance between adjacent metal through holes, and calculating the metal through hole gap by combining the following formula;
Figure BDA0002153627480000033
Figure BDA0002153627480000034
Figure BDA0002153627480000035
wherein, CfDenotes the self-capacitance, C, at the center frequency fi,i+1Representing the mutual capacitance between the ith through hole and the (i + 1) th through hole, wherein B is the thickness of the substrate, t is the thickness of the conductor, and epsilon is the dielectric constant;
(3) determining the radius of the cross section of the metal through hole;
(31) calculating the radius of the cross section of the first metal through hole and the radius of the cross section of the nth metal through hole, wherein the radius of the cross section of the first metal through hole and the radius of the nth metal through hole are both R0;
Figure BDA0002153627480000041
Figure BDA0002153627480000042
(32) calculating the radius of the cross section of the rest metal through holes according to the following formula;
Figure BDA0002153627480000043
Figure BDA0002153627480000044
(31) in the formula of (32), C0Is the self-inductance of the 1 st metal via, R0Is the cross-sectional radius, R, of the first metal viaiThe radius of the cross section of the ith metal through hole;
Figure BDA0002153627480000045
(4) calculating the thickness H of the dielectric substrate according to the following formula;
Figure BDA0002153627480000046
(5) and (4) manufacturing an electromagnetic coupling interdigital band-pass filter based on the multi-pass holes according to the parameters obtained in the steps (1) to (4).
Compared with the prior art, the invention has the advantages that: through making crisscross through-hole each other in the base plate, make it produce the filtering effect, the product of making like this can not only make planar interdigital filter into three-dimensional interdigital filter, can also accomplish the base plate inside with the wave filter from the base plate to accomplish the wave filter and just can realize the filtering inside the base plate in microwave integrated circuit, realize the space of wave filter and account for the minimizing, overcome a great deal of problems such as plane interdigital filter is big at microwave integrated circuit duty cycle. The product manufactured by the method has the advantages of small volume, wide bandwidth and good filtering effect. The concrete points are as follows:
(1) the invention adopts the principle of substrate integrated waveguide to transmit signals, and with the improvement of the through hole punching process in the years, the through hole is used as a resonance unit to form a miniature interdigital coupling filter, so that the volume of the filter can be greatly reduced, and the integration of a radio frequency circuit can be improved.
(2) The invention changes the plane filtering of the microstrip line into the three-dimensional filtering, and the invention uses the metal through holes to punch a row of metal through holes on the medium substrate, one end of each metal through hole is grounded, the other end is open, the adjacent metal through holes are arranged in a staggered way, which is equivalent to the mutual staggering of the planar microstrip lines, the metal through holes are used for replacing the microstrip line as a resonance source, thereby generating the self inductance and the self capacitance, and then generating the mutual inductance and the mutual capacitance among the metal through holes. The height of the through hole is equal to one quarter of the wavelength, so that a miniature band-pass filter can be formed, and the filtering effect is achieved.
(3) The invention changes the plane interdigital filter on the surface of the substrate into the interdigital filter in the substrate, and changes the traditional filter which is attached on the surface of the substrate into the interdigital filter in the substrate, so that the function of the filter can be realized, the integration level of the microwave integrated circuit is greatly improved, the filter does not occupy the space of the circuit in the design of the integrated circuit, the volume of the integrated circuit is greatly reduced, and the cost is greatly reduced. In the future three-dimensional process of the microblog integrated circuit, a filter can be formed on one substrate, and the size of the integrated chip can be greatly reduced.
(4) The invention not only provides the structure, but also provides the design method, and parameters such as the number of the metal through holes, the adjacent metal clearance, the radius of the metal through holes, the thickness of the medium substrate and the like can be quickly obtained through the invention, so that the product of the invention is manufactured.
Drawings
FIG. 1 is a schematic structural view of the present invention;
FIG. 2 is a circuit simulation diagram of ADS according to the present invention in embodiment 2;
FIG. 3 shows the simulation results of the present invention in example 2;
FIG. 4 is a three-dimensional structure diagram of the HFSS of the present invention in example 3;
fig. 5 is a graph of simulation results of the present invention in example 3.
In the figure: 1. a dielectric substrate; 2. a signal input terminal; 3. a signal output terminal; 4. a metal via; 5. a common ground via.
Detailed Description
The invention will be further explained with reference to the drawings.
Example 1: referring to fig. 1, an electromagnetic coupling interdigital band-pass filter based on a multi-pass hole comprises a cavity, wherein a medium substrate 1 is arranged in the cavity, and a signal input end 2 and a signal output end 3 are arranged at two ends of the cavity;
n metal through holes 4 are formed in the dielectric substrate 1, the number of the metal through holes 4 is from 1 st to nth in sequence from the signal input end 2 to the signal output end 3, n is an even number, and each metal through hole 4 comprises an upper port and a lower port;
the upper port of the 1 st metal through hole 4 is connected with the signal input end 2, the lower port is grounded, the upper port of the nth metal through hole 4 is connected with the signal output end 3, and the lower port is grounded;
among the other metal through holes 4, the even number of metal through holes 4 have upper ports connected with an open circuit of an underground port, and the odd number of metal through holes 4 have open circuits of the upper ports and lower ports connected with the ground;
the adjacent metal through holes 4 are electromagnetically coupled and used for transmitting signals from the signal output end 3 to the signal output end 3; the metal through holes 4 are provided with self-capacitance, and mutual capacitance is generated by electromagnetic coupling between adjacent metal through holes 4;
the dielectric substrate 1 is grounded on both sides penetrated by the metal through hole 4.
In this embodiment, the substrate is further provided with a common ground via 5 penetrating through the front surface and the back surface of the substrate, the material of the dielectric substrate 1 is Rogers RO4350, in fig. 1, the solid rings connected to the upper ports of the odd-numbered metal vias 4 and the imaginary center rings connected to the lower ports of the even-numbered metal vias 4 represent open circuits.
A design method of an electromagnetic coupling interdigital band-pass filter based on a plurality of through holes comprises the following steps,
(1) determining specification parameters of the band-pass filter, wherein the specification parameters comprise a pass band cut-off frequency and a stop band cut-off frequency fnIn-band jitter LArCalculating the attenuation value Las of the stop band, and calculating the number n of the metal through holes 4 according to the following formula;
Figure BDA0002153627480000071
in the formula (I), the compound is shown in the specification,
Figure BDA0002153627480000072
(2) determining the gap S of the metal through hole 4 in the substratei,i-1；
(21) Calculating the self-capacitance of each metal through hole 4 and the mutual capacitance between adjacent metal through holes 4, and calculating the gap between the metal through holes 4 by combining the following formula;
Figure BDA0002153627480000073
Figure BDA0002153627480000074
Figure BDA0002153627480000075
wherein, CfDenotes the self-capacitance, C, at the center frequency fi,i+1Representing the mutual capacitance between the ith through hole and the (i + 1) th through hole, wherein B is the thickness of the substrate, t is the thickness of the conductor, and epsilon is the dielectric constant;
(3) determining the radius of the cross section of the metal through hole 4;
(31) calculating the radius of the cross section of the first and nth metal through holes 4, both of which are equal to R0;
Figure BDA0002153627480000076
Figure BDA0002153627480000077
(32) calculating the radius of the cross section of the rest of the metal through holes 4 according to the following formula;
Figure BDA0002153627480000081
Figure BDA0002153627480000082
(31) in the formula of (32), C0Is the self-inductance of the 1 st metal via 4, R0Is the cross-sectional radius, R, of the first metal via 4iIs the cross-sectional radius of the ith metal through hole 4;
Figure BDA0002153627480000083
(4) calculating the thickness H of the dielectric substrate 1 according to the following formula;
Figure BDA0002153627480000084
(5) and (4) manufacturing an electromagnetic coupling interdigital band-pass filter based on the multi-pass holes according to the parameters obtained in the steps (1) to (4).
By this method we derive the structure of the filter, as well as the necessary parameters for manufacturing and production.
Example 2: referring to fig. 2 and 3, in the present embodiment, the dielectric substrate 1 is a Rogers RO4350 material, which has a relative dielectric constant of 3.66, a dielectric loss tangent of 0.004, a substrate thickness of 1.2mm, and has a diameter of 0.2mm and a height corresponding to a quarter of a wavelength by forming a row of through holes in the substrate. The rest is the same as in example 1.
In order to better illustrate the present invention, we simulate the scheme of the present invention, and the simulation conditions are as follows: circuit simulation analysis is carried out in ADS software, in the figure, a middle row is orderly provided with eight microstrip lines from top to bottom, wherein the microstrip lines represent eight metal through holes 4, and the capacitance value is a ground capacitance C0/2；
One side of each of the eight microstrip lines is connected with an MLOC microstrip line, the length of the MLOC microstrip line is 0 to represent an open circuit, the input frequency is 0GHz to 40GHz, and for convenience of understanding, the MLOC microstrip lines with the length of 0 to represent the open circuit are numbered as follows: MLOC TL1, MLOC TL2 … … MLOC TL 6. As can be seen from the figure, the eight metal vias 4 are open-circuited at one end and grounded at the other end, and are arranged in a staggered manner.
The uppermost and lowermost Term1 and Term2 are excitation sources, representing signal input 2 and signal output 3, respectively.
The structural simulation result is used to form a filter with the center frequency of 20GHz and the bandwidth of 2GHz as shown in FIG. 3. In the figure, the broken line indicates the insertion loss of the filter, and the solid line indicates the return loss of the filter.
In embodiment 3, referring to fig. 4 and 5, HFSS software is adopted to perform simulation according to the present invention, a three-dimensional simulated structure diagram is shown in fig. 4, and a simulation result is shown in fig. 5.
In fig. 5, the implementation represents the return loss of the filter and the dashed line represents the insertion loss.
Therefore, the filter simulated by the invention has a filtering effect and can be realized.
The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the invention, and any modifications, equivalents and improvements made within the spirit and principle of the present invention are intended to be included within the scope of the present invention.

Claims (3)

1. The utility model provides an electromagnetic coupling interdigital band pass filter based on multiple-pass hole, is equipped with the medium base plate in including cavity, the cavity both ends are equipped with signal input part and signal output part, its characterized in that:
the dielectric substrate is provided with n metal through holes, the metal through holes are sequentially from 1 st to nth from a signal input end to a signal output end, n is an even number, and each metal through hole comprises an upper port and a lower port;
the upper port of the 1 st metal through hole is connected with a signal input end, the lower port of the metal through hole is grounded, the upper port of the nth metal through hole is connected with a signal output end, and the lower port of the nth metal through hole is grounded;
among the other metal through holes, the even number of metal through holes have upper ports connected with an open circuit of an underground port, the odd number of metal through holes have open circuits of the upper ports, and the lower ports are grounded;
the electromagnetic coupling between the adjacent metal through holes is used for transmitting signals from the signal output end to the signal output end; the metal through holes are provided with self-capacitance, and mutual capacitance is generated by electromagnetic coupling between adjacent metal through holes;
the two surfaces of the dielectric substrate penetrated by the metal through holes are grounded;
the design method of the electromagnetic coupling interdigital band-pass filter based on the multi-through-hole comprises the following steps,
(1) determining specification parameters of the band-pass filter, wherein the specification parameters comprise a pass band cut-off frequency and a stop band cut-off frequency fnIn-band jitter LArAttenuation value of stopband LasAnd calculating the number n of the metal through holes according to the following formula;
Figure FDA0002955714730000011
in the formula (I), the compound is shown in the specification,
Figure FDA0002955714730000012
and omeganIs a first intermediate value, alpha is a second intermediate value, omega1Is a third intermediate value;
(2) determining metal via gap S in a substratei,i-1；
(21) Calculating the self-capacitance of each metal through hole and the mutual capacitance between adjacent metal through holes, and calculating the metal through hole gap by combining the following formula;
Figure FDA0002955714730000021
Figure FDA0002955714730000022
Figure FDA0002955714730000023
Figure FDA0002955714730000024
wherein, CfExpressed at a central frequency f0Lower self-capacitance, Ci,i+1Representing the mutual capacitance between the ith through hole and the (i + 1) th through hole, B is the thickness of the substrate, t is the thickness of the conductor, epsilon is the dielectric constant, K1Is a fourth intermediate value, Ki,i-1Is a fifth intermediate value, Ki,i+1Is a sixth intermediate value;
(3) determining the radius of the cross section of the metal through hole;
(31) the first and nth metals are calculated by the following formulaThe radius of the cross section of the through hole is R0；
Figure FDA0002955714730000025
(32) Calculating the radius of the cross section of the rest metal through holes according to the following formula;
Figure FDA0002955714730000026
(31) in the formula of (32), C0Is the self-inductance of the 1 st metal via, R0Is the cross-sectional radius, R, of the first metal viaiThe radius of the cross section of the ith metal through hole;
Figure FDA0002955714730000031
Figure FDA0002955714730000032
Figure FDA0002955714730000033
of formula (II) to C'feIs a seventh intermediate value, C'fIs an eighth intermediate value, θiIs a ninth intermediate value;
(4) calculating the dielectric substrate thickness H according to the formularIs a relative dielectric constant;
Figure FDA0002955714730000034
(5) and (4) manufacturing an electromagnetic coupling interdigital band-pass filter based on the multi-pass holes according to the parameters obtained in the steps (1) to (4).
2. The multi-aperture based electromagnetic coupling interdigital band pass filter of claim 1, wherein: the substrate is also provided with a common ground through hole penetrating through the front surface and the back surface of the substrate.
3. The multi-aperture based electromagnetic coupling interdigital band pass filter of claim 1, wherein: the dielectric substrate material is Rogers RO 4350.
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