CN110456892A - Board structure based on reed protection thermal interface - Google Patents
Board structure based on reed protection thermal interface Download PDFInfo
- Publication number
- CN110456892A CN110456892A CN201910657713.8A CN201910657713A CN110456892A CN 110456892 A CN110456892 A CN 110456892A CN 201910657713 A CN201910657713 A CN 201910657713A CN 110456892 A CN110456892 A CN 110456892A
- Authority
- CN
- China
- Prior art keywords
- cold plate
- heat
- reed
- thermal interface
- heat transfer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/18—Packaging or power distribution
- G06F1/183—Internal mounting support structures, e.g. for printed circuit boards, internal connecting means
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
Abstract
The invention discloses a kind of board structure based on reed protection thermal interface, structure composition includes: reed (1), heat transfer cold plate (2), locking device (3), heat dissipation cold plate (4) and heat-conducting interface material (5).The structure is that a kind of groove is designed on heat transfer cold plate (2) heat transfer contact face of cabinet board for installing reed (1), in board swapping process, pass through the elastic force of reed (1), so that the contact surface of both heat-conducting interface materials (5) and heat dissipation cold plate (4) in heat transfer cold plate (2) is disengaged and keep relative distance rapidly, avoids because damaging heat-conducting interface material (5) in swapping process.
Description
Technical field
The present invention relates to a kind of reeds and cabinet board structure to design.
Background technique
For cabinet board integrated installation on heat transfer cold plate, heat transfer cold plate is the main path of board circuit board heat transfer,
Circuit board heating device is fitted closely with heat transfer cold plate, and heat is by device conducts to the cold plate that conducts heat, then by heat transfer cold plate
Lower end thermal interface and heat-conducting interface material and heat dissipation cold plate transmission of heat by contact, final heat are taken away by heat dissipation cold plate.The biography of cabinet
On the one hand basis that hot cold plate is used as board to install, plays the role of guiding and support in board swapping process；On the other hand
Play the role of transmitting board heat.
The diabatic process bottleneck is that the thermal contact resistance of the heat transfer cold plate and heat dissipation cold plate contact surface of board is larger, in the two
Between generate biggish heat transfer temperature difference, therefore interface Heat Conduction Material is increased between thermal interface, main purpose is to reduce
Thermal contact resistance reduces heat transfer temperature difference, realizes preferably heat transfer.But in actual use, as the heat transfer of structure basis
Cold plate, there is the relative motion between heat transfer cold plate and heat dissipation cold plate thermal interface, therefore is having damage table in swapping process
Face and the risk for destroying heat-conducting interface material.Since board can be plugged often in actual use, traditional biography is used
Hot cold plate structure design causes boundary material damage to be difficult to avoid that there are holes to make just because of contact surface for the generation of thermal contact resistance
At surface damage will cause thermal contact resistance increase, be unfavorable for the heat transfer of cabinet board.
And heat transfer cold plate generallys use aluminum alloy materials, to improve material adverse environment resistant corrosive nature, needs to use
Process of surface treatment forms a thin layer of compact oxidation layer in aluminum alloy surface.But in heat transfer cold plate swapping process, meeting
Since the friction of heat dissipation cold plate thermal interface directly destroys the protective layer, material corrosion resistance is destroyed.
In conclusion the heat transfer cold plate of cabinet board and case radiation cold plate plug relative motion in how to avoid damage to and
Destroying heat-conducting interface material becomes critical issue.
Summary of the invention
It is an object of the invention to protect cabinet board heat transfer cold plate and heat dissipation cold plate thermal interface and heat-conducting interface material,
So that two thermal interfaces is able to maintain disengaging by the elastic force of reed, avoids generating surface damage in swapping process and increasing heat and connect
Thermal contact resistance between contacting surface.
Board structure disclosed by the invention based on reed protection thermal interface, including reed 1, heat transfer cold plate 2, locking dress
Set 3, heat dissipation cold plate 4 and heat-conducting interface material 5.Wherein: locking device 3 being installed in heat transfer 2 one side of cold plate；Conduct heat cold plate 2
Designed on opposite sides, that is, thermal interface of installation locking device 3 fluted, the groove is for installing reed 1, thermal interface
Remaining surface is filled with heat-conducting interface material 5 in addition to groove part；Slot is provided on heat dissipation cold plate 4；Reed 1, locking are installed
After the heat transfer cold plate 2 of device 3 and heat-conducting interface material 5 is inserted into the slot of heat dissipation cold plate 4, tighten locking device 3 will conduct heat it is cold
2 thermal interface of plate and 4 thermal interface of heat dissipation cold plate compress.
The design feature is that in cabinet board heat transfer cold plate insertion heat dissipation cold plate grooving process, reed is above heat transfer
Cold plate thermal interface is contacted with heat dissipation cold plate thermal interface first, conducts heat cold plate thermal interface and heat-conducting interface material thereon not
It can be contacted with the generation of heat dissipation cold plate thermal interface, avoid wearing.After heat transfer cold plate is inserted in place, it will be conducted heat using locking device
Both cold plate and heat dissipation cold plate thermal interface squeeze locking, at this time reed be squeezed power deformation be hidden in heat transfer cold plate groove in,
Thermal interface contact is not influenced.Similarly, in heat transfer cold plate withdrawal process, heat transfer cold plate locking device is unclamped first, at this time spring
Piece makes conduct heat cold plate and heat dissipation cold plate thermal interface two due to restoring shape not by pressure, using the process that reed restores shape
Person is detached from rapidly, protects thermal interface and heat-conducting interface material.
The present invention by the advantages of reed apply to cabinet board heat transfer cold plate structure design in, make its with heat dissipation cold plate two
In the relative motion of person's thermal interface, the damage of thermal interface is avoided, heat-conducting interface material can be formed and be protected, pulled out in board
Make to be rapidly separated between contact surface during out.
Detailed description of the invention
Fig. 1 is locking state.
Fig. 2 is partial enlarged view under locking state.
Fig. 3 is disengaged position.
Fig. 4 is partial enlarged view under disengaged position.
Wherein: 1- reed, 2- heat transfer cold plate, 3- locking device, 4- heat dissipation cold plate, 5- heat-conducting interface material.
Specific embodiment
The protection of liquid cooling VPX cabinet board thermal interface and detaching structure proposed by the present invention based on reed, reed 1 is pacified
In groove loaded on heat transfer cold plate 2, for reed 1 using gluing in heat transfer 2 groove floor of cold plate, 1 highest point of reed is higher than thermally conductive boundary
5 surface 0.8mm~1.0mm of plane materiel material, heat transfer cold plate 2 in 4 swapping process of heat dissipation cold plate by 1 extreme higher position of reed and heat dissipation
4 slot of cold plate contact face contact simultaneously generates relative motion, to protect the heat-conducting interface material on heat transfer cold plate 2 and its hot interface
5, it after heat transfer cold plate 2 is inserted in place, is locked by locking device 3, at this time 1 stress deformation of reed, conduct heat cold plate 2 and thermally conductive
It is in close contact between boundary material 5 and heat dissipation cold plate 4, to carry out hot transmitting.Similarly, after unclamping locking device 3, reed 1
Restoring deformation and generates thrust, the thermal interface between cold plate 2 and heat-conducting interface material 5 thereon and heat dissipation cold plate 4 that makes to conduct heat is detached from,
Form the purpose of protection.
Claims (3)
1. the board structure based on reed protection thermal interface, it is characterised in that: including reed (1), heat transfer cold plate (2), locking
Device (3), heat dissipation cold plate (4) and heat-conducting interface material (5)；Locking device wherein is installed in heat transfer cold plate (2) one side
(3)；Cold plate (2) are conducted heat in the opposite sides of installation locking device (3), i.e., design fluted on thermal interface, which is used for
It installs reed (1), thermal interface remaining surface in addition to groove part is filled with heat-conducting interface material (5)；Heat dissipation cold plate is opened on (4)
There is slot；Heat transfer cold plate (2) insertion heat dissipation cold plate (4) of reed (1), locking device (3) and heat-conducting interface material (5) is installed
Slot in after, tighten locking device (3) will conduct heat cold plate (2) thermal interface and heat dissipation cold plate (4) thermal interface and compress.
2. the board structure according to claim 1 based on reed protection thermal interface, it is characterised in that: reed (1) peace
In groove loaded on heat transfer cold plate (2) thermal interface side, and reed (1) highest point is higher than heat-conducting interface material surface after installation
(5) 0.8mm~1.0mm.
3. the board structure according to claim 1 based on reed protection thermal interface, it is characterised in that: tighten locking dress
Cold plate (2) thermal interface will be conducted heat with after heat dissipation cold plate (4) thermal interface compression by setting (3), and reed (1) is hidden in heat transfer cold plate
(2) in groove, thermal interface contact is not influenced.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910657713.8A CN110456892A (en) | 2019-07-20 | 2019-07-20 | Board structure based on reed protection thermal interface |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910657713.8A CN110456892A (en) | 2019-07-20 | 2019-07-20 | Board structure based on reed protection thermal interface |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110456892A true CN110456892A (en) | 2019-11-15 |
Family
ID=68481683
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910657713.8A Pending CN110456892A (en) | 2019-07-20 | 2019-07-20 | Board structure based on reed protection thermal interface |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110456892A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113784559A (en) * | 2021-09-13 | 2021-12-10 | 南京艾信云通智能科技有限公司 | Self-service equipment intelligent display device convenient to dismouting |
| CN114423244A (en) * | 2022-01-25 | 2022-04-29 | 中国船舶重工集团公司第七二四研究所 | Heat dissipation subrack with thermal interface material linkage coating function |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20040037059A1 (en) * | 2002-08-21 | 2004-02-26 | Leon Stiborek | Integrated circuit package with spacer |
| US20080278914A1 (en) * | 2007-05-11 | 2008-11-13 | Chant Sincere Co., Ltd. | Connector with a heat sink |
| CN204244630U (en) * | 2014-12-09 | 2015-04-01 | 中兴通讯股份有限公司 | Pluggable electronic module heat-transfer device |
| CN106102418A (en) * | 2016-07-22 | 2016-11-09 | 中国船舶重工集团公司第七二四研究所 | Liquid based on soaking plate cold VPX cabinet efficient radiating apparatus and method |
| CN107863803A (en) * | 2017-11-24 | 2018-03-30 | 郑州涵莱智能科技有限公司 | A kind of cell phone intelligent charging device that can prevent that mobile phone from coming off |
-
2019
- 2019-07-20 CN CN201910657713.8A patent/CN110456892A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20040037059A1 (en) * | 2002-08-21 | 2004-02-26 | Leon Stiborek | Integrated circuit package with spacer |
| US20080278914A1 (en) * | 2007-05-11 | 2008-11-13 | Chant Sincere Co., Ltd. | Connector with a heat sink |
| CN204244630U (en) * | 2014-12-09 | 2015-04-01 | 中兴通讯股份有限公司 | Pluggable electronic module heat-transfer device |
| CN106102418A (en) * | 2016-07-22 | 2016-11-09 | 中国船舶重工集团公司第七二四研究所 | Liquid based on soaking plate cold VPX cabinet efficient radiating apparatus and method |
| CN107863803A (en) * | 2017-11-24 | 2018-03-30 | 郑州涵莱智能科技有限公司 | A kind of cell phone intelligent charging device that can prevent that mobile phone from coming off |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113784559A (en) * | 2021-09-13 | 2021-12-10 | 南京艾信云通智能科技有限公司 | Self-service equipment intelligent display device convenient to dismouting |
| CN114423244A (en) * | 2022-01-25 | 2022-04-29 | 中国船舶重工集团公司第七二四研究所 | Heat dissipation subrack with thermal interface material linkage coating function |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20191115 |
|
| WD01 | Invention patent application deemed withdrawn after publication |