CN114423244A - Heat dissipation subrack with thermal interface material linkage coating function - Google Patents
Heat dissipation subrack with thermal interface material linkage coating function Download PDFInfo
- Publication number
- CN114423244A CN114423244A CN202210083221.4A CN202210083221A CN114423244A CN 114423244 A CN114423244 A CN 114423244A CN 202210083221 A CN202210083221 A CN 202210083221A CN 114423244 A CN114423244 A CN 114423244A
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- CN
- China
- Prior art keywords
- thermal interface
- interface material
- cold plate
- linkage
- heat dissipation
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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- 239000000463 material Substances 0.000 title claims abstract description 51
- 230000017525 heat dissipation Effects 0.000 title claims abstract description 23
- 239000011248 coating agent Substances 0.000 title claims abstract description 13
- 238000000576 coating method Methods 0.000 title claims abstract description 13
- 230000005540 biological transmission Effects 0.000 claims abstract description 4
- 239000004677 Nylon Substances 0.000 claims description 12
- 229920001778 nylon Polymers 0.000 claims description 12
- 238000010622 cold drawing Methods 0.000 abstract 6
- 238000001816 cooling Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 230000007774 longterm Effects 0.000 description 2
- 238000002791 soaking Methods 0.000 description 2
- 238000004891 communication Methods 0.000 description 1
- 230000007123 defense Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
Abstract
The invention discloses a heat dissipation subrack with a thermal interface material linkage coating function, which comprises an upper cold plate, a lower cold plate, a side plate, a VPX module, a locking mechanism and a thermal interface material linkage coating device. Go up the cold drawing and set up array step arch with cold drawing down, go up the cold drawing, form the cavity after cold drawing and curb plate welded fastening down, go up the step arch of cold drawing and cold drawing down and form the slot, the linkage of the fixed thermal interface material of one side of slot is executed and is covered the device, the fixed locking mechanism of opposite side. The thermal interface material linkage applying device evenly applies the thermal interface material to the surface of the VPX module when the VPX module is pushed into the plug box along the slot, and the VPX module is screwed with the locking mechanism after being inserted in place, so that a low-thermal-resistance transmission passage of the VPX module shell to the upper cold plate and the lower cold plate is formed. The heat dissipation plug box provided by the invention can realize automatic, quantitative and uniform application of the thermal interface material when the VPX module is repeatedly plugged, enhances the heat dissipation capability and improves the heat dissipation reliability.
Description
Technical Field
The invention relates to the technical field of electronic equipment thermal management.
Background
The plug-in box is used as a structure and a heat dissipation carrier of an electronic device and is widely applied to the fields of communication, national defense and the like. Along with the high-speed development of electronic information technology, the heat flow density and the heat dissipation capacity of an electronic device are rapidly improved, the requirements on the volume and the weight of a heat dissipation system are more and more strict, the heat dissipation capacity in the unit volume of a traditional air cooling mode VPX plug box is limited, the temperature control requirements of subsequent high-performance products are difficult to meet, and the liquid cooling plug box gradually becomes the key direction of the next-stage technical development.
The utility model discloses a chinese utility model patent of publication number "202603120U" discloses a heat dissipation subrack, and this heat dissipation subrack includes subrack and inserted block, and the inserted block inserts the subrack by the heat conduction strip at its both ends, install U type protection shield between subrack and the heat conduction strip, this protection shield curb plate is the fretwork form, and another curb plate bottom is curved convex, and the fretwork form of protection shield is equipped with soft heat conduction liner between curb plate and the heat conduction strip, install the latch strip on the subrack, and this latch strip pastes for the mutually of the curb plate of curved convex with the bottom of protection shield. A soft heat-conducting gasket with lower thermal resistance value is additionally arranged between the insert block and the thermal contact surface of the insert box, so that the soft contact between the insert block and the thermal contact surface of the insert box is realized, the original contact gap between the insert block and the insert box is eliminated, the thermal contact resistance is reduced, and the thermal reliability is improved. However, the following disadvantages are also present: 1. two heterogeneous materials, namely a heat-conducting gasket and a U-shaped plate, exist between the plug block and the plug box, three heat-conducting interfaces exist, particularly the U-shaped plate and the plug box are in metal dry contact, and contact thermal resistance is additionally introduced. 2. The thickness of the soft heat conducting gasket is limited, and the comprehensive heat transfer resistance cannot be greatly reduced. 3. After the heat conducting gasket is plugged and pulled for many times, the soft heat conducting gasket is easy to generate plastic deformation, and the heat conducting effect is influenced.
The patent (CN106102418B) discloses a liquid-cooled VPX case efficient heat dissipation device and method based on a soaking plate, wherein a thermal interface material needs to be manually added between the soaking plate and a liquid-cooled cold plate, the influence of too much, too little or uniformity of the applied thermal interface material on actual contact thermal resistance is large, and the thermal interface material is easy to be ignored to be laid again every time in multiple plugging, so that the requirement of a manual adding mode on a line of operators is high, and the long-term stable and reliable operation of a heat dissipation plug box is not facilitated.
Disclosure of Invention
In order to solve the technical problem, the invention provides a heat dissipation subrack with a thermal interface material linkage coating function.
The technical scheme for realizing the invention is as follows:
a heat dissipation subrack with a thermal interface material linkage coating function comprises an upper cold plate, a lower cold plate, a side plate, a VPX module, a locking mechanism and a thermal interface material linkage coating device; the upper cold plate and the lower cold plate are provided with arrayed step bulges, the upper cold plate, the lower cold plate and the side plates are welded to form a cavity, the step bulges of the upper cold plate and the lower cold plate form a slot, one side of the slot is fixed with the thermal interface material linkage applying device, and the other side of the slot is fixed with the locking mechanism; the thermal interface material linkage applying device evenly applies the thermal interface material to the surface of the VPX module when the VPX module is pushed into the plug box along the slot, and the VPX module is screwed with the locking mechanism after being inserted in place, so that a low-thermal-resistance transmission passage of the VPX module shell to the upper cold plate and the lower cold plate is formed.
Preferably, the thermal interface material linkage applying device comprises a shell, a linkage wheel, a directional ratchet wheel, a gear, a rack, a slide rail, a piston, a thermal interface material, a wedge-shaped diversion port and a nylon brush; the linkage wheel, the directional ratchet wheel and the gear are coaxial and are arranged on the shell; the linkage wheel is fixed with the outer side of the directional ratchet wheel, and the gear is fixed with the inner side of the directional ratchet wheel; the gear is meshed with the rack; the sliding rail is fixed with the shell, a rack is arranged on the sliding rail, and the rack is connected with the piston; the piston and the shell form a cavity, and the cavity is filled with thermal interface materials; the wedge-shaped diversion port is connected with the cavity, and the nylon brush covers the outlet of the wedge-shaped diversion port; when the VPX module is pushed into the plug box, the linkage wheel is driven to rotate, the piston extrudes the thermal interface material storage cavity, and the thermal interface material flows out of the coating structure; when the VPX module is pulled out of the plug box, the directional ratchet wheel cannot drive the central gear to rotate, and the position of the piston is fixed.
Preferably, the nylon bristles have a diameter of 0.1 to 0.2mm and a length of 5 to 10 mm.
Preferably, the linkage wheel is wrapped with rubber, and grooves are formed in the rubber to increase friction.
Compared with the prior art, the invention has the following advantages:
the invention provides an efficient heat dissipation plug box, which can realize automatic, quantitative and uniform application of a thermal interface material when a VPX module is repeatedly plugged and pulled, a low-thermal-resistance heat transfer path is constructed between the VPX module and a liquid cooling plug box, the heat dissipation capacity of the VPX module is enhanced, the flow requirement of operators on the application of the thermal interface material can be effectively reduced, and the long-term reliability of heat dissipation is improved.
Drawings
FIG. 1 is a schematic view of the apparatus of the present invention.
FIG. 2 is a schematic view of a thermal interface material linkage coating device of the present invention.
The figure includes an upper cold plate 1, a lower cold plate 2, a side plate 3, a VPX module 4, a locking mechanism 5, a thermal interface material linkage applying device 6, a shell 61, a linkage wheel 62, a directional ratchet wheel 63, a gear 64, a rack 65, a slide rail 66, a piston 67, a thermal interface material 68, a wedge-shaped diversion port 69 and a nylon brush 610.
Detailed Description
The invention is further described below with reference to the accompanying drawings.
Fig. 1 shows a schematic diagram of the device of the present invention, which includes an upper cold plate 1, a lower cold plate 2, a side plate 3, a VPX module 4, a locking mechanism 5, and a thermal interface material linkage applying device 6. The upper cold plate 1 and the lower cold plate 2 are provided with arrayed step bulges, the upper cold plate 1, the lower cold plate 2 and the side plate 3 are welded and formed to form a cavity, the step bulges of the upper cold plate 1 and the lower cold plate 2 form a slot, one side of the slot is fixed with a thermal interface material linkage coating device 5, and the other side is fixed with a locking mechanism 5; the thermal interface material linkage applying device 5 evenly applies the thermal interface material to the surface of the VPX module when the VPX module is pushed into the plug box along the 4 slots, and the VPX module 4 is screwed with the locking mechanism 5 after being plugged in place, so that a low-thermal-resistance transmission passage of the VPX module shell to the upper cold plate and the lower cold plate is formed. When the VPX module 4 needs to be pulled out, the locking mechanism 5 is firstly loosened, and then the VPX module 4 is pulled out along the direction of the slot.
Fig. 2 is a schematic diagram of a thermal interface material linkage applying device of the present invention, which includes a housing 61, a linkage wheel 62, a directional ratchet 63, a gear 64, a rack 65, a slide rail 66, a piston 67, a thermal interface material 68, a wedge-shaped diversion port 69, and a nylon brush 610. The linkage wheel 61, the directional ratchet wheel 62 and the gear 63 are coaxial and are arranged on the shell 61. Rubber is wrapped outside the linkage wheel 61, and grooves are formed in the rubber to increase friction. The linkage wheel 62 is fixed with the outer side of the directional ratchet wheel 63, and the gear 64 is fixed with the inner side of the directional ratchet wheel 63; when the linkage wheel 62 rotates anticlockwise, the gear 64 rotates anticlockwise; when the linkage wheel 62 rotates clockwise, the gear 64 does not rotate. The gear 64 is engaged with a rack 65, the slide rail 66 is fixed with the housing 61, the rack 65 is mounted on the slide rail 66, and the rack 65 can slide in the slide rail 66. Rack 64 is rigidly connected to piston 67. The piston 67 and the housing 61 form a cavity, which is filled with a thermal interface material 68. A wedge-shaped deflector 69 is connected to the chamber and a nylon brush 610 covers the wedge-shaped deflector outlet 69. The diameter of the bristles of the nylon brush 610 is 0.15mm, the length of the bristles is 8mm, and the length direction of the bristles exceeds the plane of the boss 21 of the cold plate by 5 mm. The locking device 5 is arranged on the boss 21 of the lower cold plate, the distance between the side edge of the VPX module 4 and the boss 21 is 3mm when the locking device is in a locking state, and the shell 61 and the boss 21 are arranged on the same plane. When the VPX module 4 is pushed into the inserting box, the linkage wheel 62 is driven to rotate, the piston 67 extrudes the thermal interface material storage cavity, the thermal interface material 68 flows out of the coating structure, and the thermal interface material is uniformly coated on the surface of the VPX module 4 under the action of the nylon brush 610; when the VPX module 4 is pulled out of the plug box, the directional ratchet 63 cannot drive the gear 64 to rotate, and the position of the piston 67 is fixed.
Claims (4)
1. The utility model provides a heat dissipation subrack with function is executed in thermal interface material linkage which characterized in that: the device comprises an upper cold plate, a lower cold plate, a side plate, a VPX module, a locking mechanism and a thermal interface material linkage coating device; the upper cold plate and the lower cold plate are provided with arrayed step bulges, the upper cold plate, the lower cold plate and the side plates are welded to form a cavity, the step bulges of the upper cold plate and the lower cold plate form a slot, one side of the slot is fixed with the thermal interface material linkage applying device, and the other side of the slot is fixed with the locking mechanism; the thermal interface material linkage applying device evenly applies the thermal interface material to the surface of the VPX module when the VPX module is pushed into the plug box along the slot, and the VPX module is screwed with the locking mechanism after being inserted in place, so that a low-thermal-resistance transmission passage of the VPX module shell to the upper cold plate and the lower cold plate is formed.
2. The thermal interface material gang application functional heat dissipation jack of claim 1, wherein: the thermal interface material linkage applying device comprises a shell, a linkage wheel, a directional ratchet wheel, a gear, a rack, a sliding rail, a piston, a thermal interface material, a wedge-shaped diversion port and a nylon brush; the linkage wheel, the directional ratchet wheel and the gear are coaxial and are arranged on the shell; the linkage wheel is fixed with the outer side of the directional ratchet wheel, and the gear is fixed with the inner side of the directional ratchet wheel; the gear is meshed with the rack; the sliding rail is fixed with the shell, a rack is arranged on the sliding rail, and the rack is connected with the piston; the piston and the shell form a cavity, and the cavity is filled with thermal interface materials; the wedge-shaped diversion port is connected with the cavity, and the nylon brush covers the outlet of the wedge-shaped diversion port; when the VPX module is pushed into the plug box, the linkage wheel is driven to rotate, the piston extrudes the thermal interface material storage cavity, and the thermal interface material flows out of the coating structure; when the VPX module is pulled out of the plug box, the directional ratchet wheel cannot drive the central gear to rotate, and the position of the piston is fixed.
3. The thermal interface material gang application functional heat dissipation jack of claim 2, wherein: the diameter of the nylon bristles is 0.1-0.2 mm, and the length of the nylon bristles is 5-10 mm.
4. The thermal interface material gang application functional heat dissipation jack of claim 2, wherein: rubber is wrapped on the outer side of the linkage wheel, and grooves are formed in the rubber to increase friction.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210083221.4A CN114423244A (en) | 2022-01-25 | 2022-01-25 | Heat dissipation subrack with thermal interface material linkage coating function |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210083221.4A CN114423244A (en) | 2022-01-25 | 2022-01-25 | Heat dissipation subrack with thermal interface material linkage coating function |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN114423244A true CN114423244A (en) | 2022-04-29 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210083221.4A Pending CN114423244A (en) | 2022-01-25 | 2022-01-25 | Heat dissipation subrack with thermal interface material linkage coating function |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN114423244A (en) |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN202410920U (en) * | 2011-11-14 | 2012-09-05 | Tcl王牌电器(惠州)有限公司 | Coating device of heat conduction material in gaps of light-emitting diode (LED) lamp bars |
| CN202603120U (en) * | 2012-03-30 | 2012-12-12 | 西安天伟电子系统工程有限公司 | A heat dissipating subrack |
| CN106102418A (en) * | 2016-07-22 | 2016-11-09 | 中国船舶重工集团公司第七二四研究所 | Liquid based on soaking plate cold VPX cabinet efficient radiating apparatus and method |
| CN110456892A (en) * | 2019-07-20 | 2019-11-15 | 中国船舶重工集团公司第七二四研究所 | Board structure based on reed protection thermal interface |
| CN210647046U (en) * | 2018-11-08 | 2020-06-02 | 西安诚安嵌入式计算机技术有限公司 | Automatic spraying heat-conducting glue device |
| CN211587215U (en) * | 2020-01-14 | 2020-09-29 | 江西观宇新材料有限公司 | Spraying machine for heat conduction materials |
| CN216905774U (en) * | 2022-01-25 | 2022-07-05 | 中国船舶重工集团公司第七二四研究所 | Heat dissipation subrack with thermal interface material linkage application function |
-
2022
- 2022-01-25 CN CN202210083221.4A patent/CN114423244A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN202410920U (en) * | 2011-11-14 | 2012-09-05 | Tcl王牌电器(惠州)有限公司 | Coating device of heat conduction material in gaps of light-emitting diode (LED) lamp bars |
| CN202603120U (en) * | 2012-03-30 | 2012-12-12 | 西安天伟电子系统工程有限公司 | A heat dissipating subrack |
| CN106102418A (en) * | 2016-07-22 | 2016-11-09 | 中国船舶重工集团公司第七二四研究所 | Liquid based on soaking plate cold VPX cabinet efficient radiating apparatus and method |
| CN210647046U (en) * | 2018-11-08 | 2020-06-02 | 西安诚安嵌入式计算机技术有限公司 | Automatic spraying heat-conducting glue device |
| CN110456892A (en) * | 2019-07-20 | 2019-11-15 | 中国船舶重工集团公司第七二四研究所 | Board structure based on reed protection thermal interface |
| CN211587215U (en) * | 2020-01-14 | 2020-09-29 | 江西观宇新材料有限公司 | Spraying machine for heat conduction materials |
| CN216905774U (en) * | 2022-01-25 | 2022-07-05 | 中国船舶重工集团公司第七二四研究所 | Heat dissipation subrack with thermal interface material linkage application function |
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| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| CB02 | Change of applicant information | ||
| CB02 | Change of applicant information |
Address after: 210003 No. 346, Zhongshan North Road, Jiangsu, Nanjing Applicant after: 724 Research Institute of China Shipbuilding Corp. Address before: 210003 No. 346, Zhongshan North Road, Jiangsu, Nanjing Applicant before: 724TH RESEARCH INSTITUTE OF CHINA SHIPBUILDING INDUSTRY Corp. |