CN110454693A - 一种采用激光增强的led发光单元 - Google Patents
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Abstract
本发明公开了一种采用激光增强的LED发光单元,包括基板,基板上方设有激光器,所述基板上铺设有LED芯片组,LED芯片组上设有陶瓷荧光粉片,陶瓷荧光粉片与所述LED芯片组间设有镀在陶瓷荧光粉片上的单透膜,所述激光器发射的光线透过陶瓷荧光粉片后可被单透膜反射,所述LED芯片组产生的光线可穿过单透膜并透过陶瓷荧光粉片射出。该LED发光单元采用单透膜下方原有发光LED作为主要光源,再由单透膜上方反射激光实现增强,达到提高照明单元的亮度,缩小照明设备的体积,满足高集成度的要求,整体功能完善,实用性强。
Description
技术领域
本发明涉及照明技术领域,更具体地说,它涉及一种采用激光增强的LED发光单元。
背景技术
发光二极管简称LED,以其体积小、寿命长等优点被当前照明市场所追捧,虽然LED单颗芯片的亮度并不高,能量密度较低,但由于其具备较小的体积,可通过多颗芯片级联的方式满足不同的亮度要求,但缺点就是这样做变相导致了LED光源的发光面积变大,在特种照明领域应用时需配备较大的光学结构件以满足特种照明的配光要求。
在特种照明的配光过程中,通常将光源看作为点光源以简化理论计算所采用的数学模型,若要缩小特种照明设备的体积以满足高集成度的需求,则需要采用相对于其外形尺寸来说小得多的光源,在这种条件下,LED是很难满足设计要求的,与之相对应的,激光光源则可以做到较小的发光面积以及较高的能量密度,但由于现有激光照明的技术所限,激光光源的功率并不高,且价格也比较昂贵。
在现有的激光照明应用中,为了提高激光照明的亮度,通常采用与LED类似的方式,利用激光光束较为集中的特点,将多个激光光源所发出的光线汇聚到同一个点,以达到较小的发光面积和较高的亮度的要求,但由于其采用多个激光光源,其成本是采用LED作为光源的数百倍,整体效果不佳。据此,本发明提出了一种采用激光增强的LED发光单元。
发明内容
本发明的目的在于克服上述现有技术中的不足,提供一种采用激光增强的LED发光单元,该LED发光单元采用单透膜下方原有发光LED作为主要光源,再由单透膜上方反射激光实现增强,达到提高照明单元的亮度,缩小照明设备的体积,满足高集成度的要求。
为解决上述技术问题,本发明的目的是这样实现的:本发明所涉及的一种采用激光增强的LED发光单元,包括基板,基板上方设有激光器,所述基板上铺设有LED芯片组,LED芯片组上设有陶瓷荧光粉片,陶瓷荧光粉片与所述LED芯片组间设有镀在陶瓷荧光粉片上的单透膜,所述激光器发射的光线透过陶瓷荧光粉片后可被单透膜反射,所述LED芯片组产生的光线可穿过单透膜并透过陶瓷荧光粉片射出。
本发明进一步设置为:所述激光器为发射蓝色激光的激光器,所述LED芯片组为蓝色LED芯片组,所述陶瓷荧光粉片为黄色陶瓷荧光粉片。
本发明进一步设置为:所述LED芯片组包括一颗或多颗LED芯片,其发出的蓝色光线照射到黄色陶瓷荧光粉片上后激发白光;所述激光器发出的蓝光被单透膜反射并与黄色陶瓷荧光粉片激发形成白光,二者实现叠加。
本发明进一步设置为:所述单透膜采用耐高温且具备单向透光、背向高反光的导热材料。
本发明进一步设置为:所述基板为氮化铝基板。
综上所述,本发明具有以下有益效果:
1.采用多颗LED芯片组成LED芯片组,增大本发明的照明单元整体光通量,满足更大面积的照明需求;
2.采用激光器发射增强照明单元的光源之一,将原有LED芯片组设于单透膜下方,单透膜上方实现对激光的反射,将二者光线叠加,实现加强,光强更佳;
3.将LED光源组与激光光源集成在同一照明单元内,集成度高,并且不仅具备LED光源原有的优点,而且同时具备激光光源的优点,各取所长的同时也降低了整个照明单元的成本;
4.单透膜采用耐高温且具备单向透光、背向高反光的导热材料,使其下方光源可正常透过,而上方光源可被反射后用以加强下方光源,实现光强叠加,提高亮度;
5.基板采用为氮化铝基板,具有良好的高导热性能。
附图说明
图1是本发明的立体结构示意图;
图2是本发明的主视结构示意图;
图3是图2中A部放大结构示意图。
具体实施方式
为了使本领域的技术人员更好地理解本实验新型的技术方案,下面结合具体实施例对本发明的优选实施方案进行描述,但是应当理解,这些描述只是为了进一步说明本发明的特征和优点,而不是对本发明专利要求的限制。基于本发明中的实施例,本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例,都属于本发明保护的范围。
下面结合附图和优选实施例对本发明进一步说明。
参见图1至3所示,本实施例所涉及的一种采用激光增强的LED发光单元,包括基板1,基板1上方设有激光器2,所述基板1上铺设有LED芯片组3,LED芯片组3上设有陶瓷荧光粉片4,陶瓷荧光粉片4与所述LED芯片组3间设有镀在陶瓷荧光粉片4上的单透膜5,所述激光器2发射的光线透过陶瓷荧光粉片4后可被单透膜5反射,所述LED芯片组3产生的光线可穿过单透膜5并透过陶瓷荧光粉片4射出。
进一步的,所述激光器2为发射蓝色激光的激光器,所述LED芯片组3为蓝色LED芯片组,所述陶瓷荧光粉片4为黄色陶瓷荧光粉片。
进一步的,所述LED芯片组3包括一颗或多颗LED芯片,其发出的蓝色光线照射到黄色陶瓷荧光粉片上后激发白光;所述激光器2发出的蓝光被单透膜5反射并与黄色陶瓷荧光粉片激发形成白光,二者实现叠加。
在本实施方案中,LED芯片组3通电后发出蓝光,蓝光穿过单透膜5,并与黄色陶瓷荧光粉片激发形成白光,同时,激光器2发出蓝光激光,照射到单透膜5上后被反射,也与黄色陶瓷荧光粉片激发形成白光,两束白光相叠加,实现加强。
进一步的,所述单透膜5采用耐高温且具备单向透光、背向高反光的导热材料,使其下方光源可正常透过,而上方光源可被反射后用以加强下方光源,实现光强叠加,提高亮度。
进一步的,所述基板1为氮化铝基板,具有良好的高导热性能。
本发明所涉及的采用激光增强的LED发光单元,通过采用多颗LED芯片组成LED芯片组,增大本发明的照明单元整体光通量,满足更大面积的照明需求;通过采用激光器发射增强照明单元的光源之一,将原有LED芯片组设于单透膜下方,单透膜上方实现对激光的反射,将二者光线叠加,实现加强,光强更佳;通过将LED光源组与激光光源集成在同一照明单元内,集成度高,并且不仅具备LED光源原有的优点,而且同时具备激光光源的优点,各取所长的同时也降低了整个照明单元的成本;通过单透膜采用耐高温且具备单向透光、背向高反光的导热材料,使其下方光源可正常透过,而上方光源可被反射后用以加强下方光源,实现光强叠加,提高亮度;通过基板采用为氮化铝基板,具有良好的高导热性能。
如无特殊说明,本发明中,若有术语“长度”、“宽度”、“上”、“下”、“前”、“后”、“左”、“右”、“竖直”、“水平”、“顶”、“底”、“内”、“外”、“顺时针”、“逆时针”、“轴向”、“径向”、“周向”等指示的方位或位置关系是基于附图所示的方位或位置关系,仅是为了便于描述本发明和简化描述,而不是指示或暗示所指的装置或元件必须具有特定的方位、以特定的方位构造和操作,因此本发明中描述方位或位置关系的用语仅用于示例性说明,不能理解为对本专利的限制,对于本领域的普通技术人员而言,可以结合附图,并根据具体情况理解上述术语的具体含义。
除非另有明确的规定和限定,本发明中,若有术语“设置”、“相连”及“连接”应做广义理解,例如,可以是固定连接,也可以是可拆卸连接,或一体地连接;可以是直接连接,也可以通过中间媒介间接连接,可以是两个元件内部的连通。对于本领域的普通技术人员而言,可以具体情况理解上述术语在本发明中的具体含义。
以上详细描述了本发明的较佳具体实施例。应当理解,本领域的普通技术人员无需创造性劳动就可以根据本发明的构思做出诸多修改和变化。因此,凡本技术领域中技术人员依本发明的构思在现有技术的基础上通过逻辑分析、推理或者有限的实验可以得到的技术方案,皆应在由权利要求书所确定的保护范围内。
Claims (5)
1.一种采用激光增强的LED发光单元,包括基板,基板上方设有激光器,其特征在于:所述基板上铺设有LED芯片组,LED芯片组上设有陶瓷荧光粉片,陶瓷荧光粉片与所述LED芯片组间设有镀在陶瓷荧光粉片上的单透膜,所述激光器发射的光线透过陶瓷荧光粉片后可被单透膜反射,所述LED芯片组产生的光线可穿过单透膜并透过陶瓷荧光粉片射出。
2.根据权利要求1所述的采用激光增强的LED发光单元,其特征在于:所述激光器为发射蓝色激光的激光器,所述LED芯片组为蓝色LED芯片组,所述陶瓷荧光粉片为黄色陶瓷荧光粉片。
3.根据权利要求2所述的采用激光增强的LED发光单元,其特征在于:所述LED芯片组包括一颗或多颗LED芯片,其发出的蓝色光线照射到黄色陶瓷荧光粉片上后激发白光;所述激光器发出的蓝光被单透膜反射并与黄色陶瓷荧光粉片激发形成白光,二者实现叠加。
4.根据权利要求1-3任一项所述的采用激光增强的LED发光单元,其特征在于:所述单透膜采用耐高温且具备单向透光、背向高反光的导热材料。
5.根据权利要求1所述的采用激光增强的LED发光单元,其特征在于:所述基板为氮化铝基板。
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112599509A (zh) * | 2020-11-09 | 2021-04-02 | 新沂市锡沂高新材料产业技术研究院有限公司 | 一种高亮度、色温可调的固态照明光源 |
WO2022095005A1 (zh) * | 2020-11-09 | 2022-05-12 | 新沂市锡沂高新材料产业技术研究院有限公司 | 一种高亮度、色温可调的固态照明光源 |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105308385A (zh) * | 2013-06-25 | 2016-02-03 | 齐扎拉光系统有限责任公司 | 用于车辆的大灯 |
EP3187778A1 (en) * | 2015-12-29 | 2017-07-05 | Stanley Electric Co., Ltd. | Wavelength converting device, method for manufacturing the same and lighting unit using the same |
CN107036033A (zh) * | 2017-06-09 | 2017-08-11 | 超视界激光科技(苏州)有限公司 | 发光装置及照明系统 |
US20180187852A1 (en) * | 2017-01-02 | 2018-07-05 | Valeo Vision | Lighting device for a vehicle, combining two light sources |
CN108468955A (zh) * | 2018-03-30 | 2018-08-31 | 嘉兴米石科技有限公司 | 一种采用混合光源的照明单元 |
CN210291456U (zh) * | 2019-08-14 | 2020-04-10 | 浙江比肯科技有限公司 | 一种采用激光增强的led发光单元 |
-
2019
- 2019-08-14 CN CN201910747943.3A patent/CN110454693A/zh active Pending
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105308385A (zh) * | 2013-06-25 | 2016-02-03 | 齐扎拉光系统有限责任公司 | 用于车辆的大灯 |
EP3187778A1 (en) * | 2015-12-29 | 2017-07-05 | Stanley Electric Co., Ltd. | Wavelength converting device, method for manufacturing the same and lighting unit using the same |
US20180187852A1 (en) * | 2017-01-02 | 2018-07-05 | Valeo Vision | Lighting device for a vehicle, combining two light sources |
CN107036033A (zh) * | 2017-06-09 | 2017-08-11 | 超视界激光科技(苏州)有限公司 | 发光装置及照明系统 |
CN108468955A (zh) * | 2018-03-30 | 2018-08-31 | 嘉兴米石科技有限公司 | 一种采用混合光源的照明单元 |
CN210291456U (zh) * | 2019-08-14 | 2020-04-10 | 浙江比肯科技有限公司 | 一种采用激光增强的led发光单元 |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112599509A (zh) * | 2020-11-09 | 2021-04-02 | 新沂市锡沂高新材料产业技术研究院有限公司 | 一种高亮度、色温可调的固态照明光源 |
WO2022095005A1 (zh) * | 2020-11-09 | 2022-05-12 | 新沂市锡沂高新材料产业技术研究院有限公司 | 一种高亮度、色温可调的固态照明光源 |
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