CN110443215A - Fingerprint recognition mould group and electronic equipment - Google Patents

Fingerprint recognition mould group and electronic equipment Download PDF

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Publication number
CN110443215A
CN110443215A CN201910741332.8A CN201910741332A CN110443215A CN 110443215 A CN110443215 A CN 110443215A CN 201910741332 A CN201910741332 A CN 201910741332A CN 110443215 A CN110443215 A CN 110443215A
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CN
China
Prior art keywords
signal
mould group
fingerprint recognition
recognition mould
fingerprint
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201910741332.8A
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Chinese (zh)
Inventor
吴安平
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Guangdong Oppo Mobile Telecommunications Corp Ltd
Original Assignee
Guangdong Oppo Mobile Telecommunications Corp Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Guangdong Oppo Mobile Telecommunications Corp Ltd filed Critical Guangdong Oppo Mobile Telecommunications Corp Ltd
Priority to CN201910741332.8A priority Critical patent/CN110443215A/en
Publication of CN110443215A publication Critical patent/CN110443215A/en
Pending legal-status Critical Current

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    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16Constructional details or arrangements
    • G06F1/1613Constructional details or arrangements for portable computers
    • G06F1/1633Constructional details or arrangements of portable computers not specific to the type of enclosures covered by groups G06F1/1615 - G06F1/1626
    • G06F1/1684Constructional details or arrangements related to integrated I/O peripherals not covered by groups G06F1/1635 - G06F1/1675
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06VIMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V40/00Recognition of biometric, human-related or animal-related patterns in image or video data
    • G06V40/10Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
    • G06V40/12Fingerprints or palmprints
    • G06V40/13Sensors therefor
    • G06V40/1318Sensors therefor using electro-optical elements or layers, e.g. electroluminescent sensing

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  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Human Computer Interaction (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Multimedia (AREA)
  • Image Input (AREA)

Abstract

The application embodiment provides a kind of fingerprint recognition mould group and electronic equipment, and the fingerprint recognition mould group includes packaging part, signal receiver, signal projector, and the packaging part is equipped with accommodating chamber.The signal receiver is arranged in the accommodating chamber, the signal projector and the packaging part stack setting and are attached to the surface of the packaging part, the signal that the signal projector issues is to irradiate fingerprint identification region, and the signal receiver is for receiving from the reflected signal of the fingerprint identification region.Since the signal projector and the packaging part stack setting and are attached to the surface of the packaging part, so that the setting of the fingerprint recognition mould group in the Y-axis direction is more compact, and the fingerprint recognition mould group is reduced in the size of X-direction, improve the arrangement mode of component in the fingerprint recognition mould group.

Description

Fingerprint recognition mould group and electronic equipment
Technical field
This application involves electronic technology field more particularly to a kind of fingerprint recognition mould group and electronic equipments.
Background technique
With the continuous development of electronic technology, using smart phone as the electronic equipment of representative in people's lives in occupation of Increasingly important role.General smart phone all has the fingerprint recognition mould group of user fingerprints information for identification.However, Component arrangement mode in traditional fingerprint recognition mould group is unreasonable.
Summary of the invention
The fingerprint recognition mould group that the application embodiment provides, improves the arrangement side of the component in fingerprint recognition mould group Formula.
The fingerprint recognition mould group includes packaging part, signal receiver, signal projector.The packaging part is equipped with receiving Chamber.The signal receiver is arranged in the accommodating chamber.The signal projector and the packaging part stack setting and attach On the surface of the packaging part, the signal that the signal projector issues is to irradiate fingerprint identification region.The signal receives Device is for receiving from the reflected signal of the fingerprint identification region.Since the signal projector and the packaging part stack It is arranged and is attached to the surface of the packaging part, so that the setting of the fingerprint recognition mould group in the Y-axis direction is more compact, and The fingerprint recognition mould group is reduced in the size of X-direction, improves the arrangement side of the part in the fingerprint recognition mould group Formula.
The application also provides a kind of electronic equipment, and the electronic equipment includes display screen and the fingerprint recognition mould group, institute Display screen is stated with fingerprint identification region, the fingerprint recognition mould group is arranged corresponding to the fingerprint identification area.
Detailed description of the invention
Technical solution in ord to more clearly illustrate embodiments of the present application, below will be to needed in the embodiment attached Figure is briefly described, it should be apparent that, the drawings in the following description are only some examples of the present application, for this field For those of ordinary skill, without creative efforts, it is also possible to obtain other drawings based on these drawings.
Fig. 1 is the structural schematic diagram for the electronic equipment that one embodiment of the application provides.
Fig. 2 is in Fig. 1 along the enlarged diagram of the broken section of I-I line.
Fig. 3 is the overlooking structure diagram for the fingerprint recognition mould group that one embodiment of the application provides.
Fig. 4 is enlarged diagram of the electronic equipment that provides of another embodiment of the application along the broken section of I-I line.
Fig. 5 is the overlooking structure diagram for the fingerprint recognition mould group that another embodiment of the application provides.
Fig. 6 is enlarged diagram of the electronic equipment that provides of another embodiment of the application along the broken section of I-I line.
Fig. 7 is the structural schematic diagram for the electronic equipment that the another embodiment of the application provides.
Fig. 8 is the broken section enlarged diagram in Fig. 7 along II-II line.
Fig. 9 is enlarged diagram of the electronic equipment that provides of the another embodiment of the application along the broken section of II-II line.
Figure 10 is that the electronic equipment that the another embodiment of the application provides is illustrated along the amplification of the broken section of II-II line Figure.
Figure 11 is the overlooking structure diagram for the fingerprint recognition mould group that the another embodiment of the application provides.
Figure 12 is broken section enlarged diagram of the electronic equipment that provides of the another embodiment of the application along II-II line.
Figure 13 is the overlooking structure diagram for the fingerprint recognition mould group that the another embodiment of the application provides.
Figure 14 is the structural schematic diagram for the electronic equipment that another embodiment of the application provides.
Along the partial schematic sectional view of III-III line in the electronic equipment that Figure 15 provides for another embodiment of the application.
Specific embodiment
Below in conjunction with the attached drawing in the application embodiment, the technical solution in the application embodiment is retouched It states, it is clear that described embodiment is only a part of embodiment of the application, rather than whole embodiments.It is based on Embodiment in the application, it is obtained by those of ordinary skill in the art without making creative efforts it is all its His embodiment, shall fall in the protection scope of this application.
Also referring to Fig. 1 to Fig. 2, Fig. 1 is the structural schematic diagram for the electronic equipment that one embodiment of the application provides;Figure 2 be in Fig. 1 along the enlarged diagram of the broken section of I-I line;Fig. 3 is the fingerprint recognition mould group that one embodiment of the application provides Overlooking structure diagram.A kind of side structure schematic diagram for fingerprint recognition mould group that the application embodiment provides;Fig. 2 is this Apply for a kind of overlooking structure diagram for fingerprint recognition mould group that embodiment provides.The fingerprint recognition mould group 10 is with one Determine mechanical structure and circuit structure, can receive user feedback, acquisition user data, for realizing the mould of identification user fingerprints function Group.Collected user fingerprints information in the electronic device 1, is reached the electronic equipment by the installation of fingerprint recognition mould group 10 1.Wherein, the electronic equipment 1 include but are not limited to smart phone, internet device (mobile internet device, MID), e-book, portable broadcast station (Play Station Portable, PSP) or personal digital assistant (Personal Digital Assistant, PDA) etc. with fingerprint identification function electronic equipment 1.Below to fingerprint provided herein Identification mould group 10 is described in detail.
The fingerprint recognition mould group 10 includes packaging part 11, signal receiver 12, signal projector 13.The packaging part 11 Equipped with accommodating chamber 11a.The signal receiver 12 is arranged in the accommodating chamber 11a.The signal projector 13 and the envelope Piece installing 11 stacks setting and is attached to the surface of the packaging part 11, and the signal that the signal projector 13 issues refers to irradiate Line identification region 21.The signal receiver 12 is for receiving from the reflected signal of the fingerprint identification region 21.Due to The signal projector 13 stacks setting with the packaging part 11 and is attached to the surface of the packaging part 11, so that the fingerprint It identifies that the setting of mould group 10 in the Y-axis direction is more compact, and reduces the fingerprint recognition mould group 10 in the ruler of X-direction It is very little, improve the arrangement mode of component in the fingerprint recognition mould group.
In the related technology, the signal projector 13 be often arranged the side of packaging part 11 and with the packaging part 11 side by side Setting.The i.e. described signal projector 13 is along X-direction with the packaging part 11 and is arranged side by side, and this arrangement mode can be led Cause the size of the fingerprint recognition mould group 10 in the X-axis direction larger.When this arrangement mode makes the fingerprint recognition mould group When applied to electronic equipment 1, so that backlight module or display panel correspond to the fingerprint recognition mould group in the electronic equipment 1 The aperture of setting is larger, to affect the display effect of the electronic equipment 1.
Compared to the relevant technologies, since the signal projector 13 stacks setting with the packaging part 11 and pastes in the application It is attached to the surface of the packaging part 11, so that the setting of the fingerprint recognition mould group 10 in the Y-axis direction is more compact, and is reduced Size of the fingerprint recognition mould group 10 in X-direction, improves the arrangement side of the component in the fingerprint recognition mould group 10 Formula.When the fingerprint recognition mould group 10 in the application is applied to electronic equipment 1, since the fingerprint recognition mould group 10 exists The size of X-direction is relatively smaller, can reduce backlight module or display panel in the electronic equipment 1 and correspond to the fingerprint knowledge The aperture that other mould group 10 is arranged.
It is to be appreciated that the shape of the packaging part 11 can be adjusted according to actual needs.In one embodiment, institute It states packaging part 11 to be formed by transparent material, to reach the signal from the reflected signal of the fingerprint identification region 21 Receiver 12.In one embodiment, the packaging part 11 is pasted with the surface of the signal projector 13 by transparent material It is formed, to reach the signal receiver 12 through the surface from the reflected signal of the fingerprint identification region 21.One In embodiment, the surface that the packaging part 11 is pasted with the signal projector 13 offers through-hole, so as to from the fingerprint The reflected signal of identification region 21 reaches the signal receiver 12 through the through-hole.The packaging part 11 is equipped with accommodating chamber 11a, to accommodate the signal receiver 12.The signal receiver 12 is used to receive to fire back from fingerprint identification region 21 Signal, to acquire the finger print information of user.The quantity of the signal projector 13 can be adjusted according to actual needs.The letter Number transmitter 13 is used to issue signal to the fingerprint identification region 21.The signal that the signal projector 13 issues can be but It is not limited to any one or more in ultrasonic wave, visible light, black light etc..Specifically, present embodiment is with described It is illustrated for the signal visible light that signal projector 13 issues.
When finger is placed in the fingerprint identification region 21 by user, the signal projector 13 is receiving transmitting signal After instruction, Xiang Suoshu fingerprint identification region 21 emits visible light signal.The visible light signal warp that the signal projector 13 issues After the fingerprint identification region 21 reaches the finger of user, the visible light signal is reflected back the signal and received by user's finger Device 12.Since the different position in the surface of user's finger can be uneven, then the different position of finger surface is by the visible light The degree that signal reflex is gone back is often different.The signal receiver 12 is received from user's finger surface reflection back After optical signal different capacitive/inductive numerical value will be generated, adopting for user fingerprints information is completed with the capacitive/inductive numerical value Collection.
Further, referring to Fig. 2, the packaging part 11 includes ontology 111 and projection on ontology 111 Protrusion 112.The ontology 111 includes the accommodating chamber 11a.Receiving is formed between the ontology 111 and the protrusion 112 Space 113, the signal projector 13 are housed in the accommodating space 113.The packaging part 11 includes ontology 111 and protrusion Portion 112, and accommodating space 113 is formed between the ontology 111 and the protrusion 112, the signal projector 13 is arranged In the accommodating space 113, the space utilization rate of the fingerprint recognition mould group 10 is improved, so that the signal projector 13 It is more compact with the design of the packaging part 11, improve the arrangement mode of component in the fingerprint recognition mould group 10.It can manage In the related technology often the side either packaging part 11 of packaging part 11 is arranged in side by side in signal projector 13 by Xie Di It is arranged, in these schemes, in order to reduce the effect of blocking for the signal that packaging part 11 issues signal projector 13, often in signal Gap is set between transmitter 13 and packaging part 11.However, such that the design of fingerprint recognition mould group 10 is not compact enough, and The accommodating space 113 formed between ontology 111 and the protrusion 112 described in packaging part 11 tends not to obtain fine land productivity With, and make the fingerprint recognition mould group 10 in the X-axis direction oversized.Compared to the relevant technologies, in the application, by institute It states signal projector 13 to be arranged in the accommodating space 113, the space of the accommodating space 113 can be effectively utilized, mentioned The high space utilization rate of the fingerprint recognition mould group 10;Further, the signal projector 13, which stacks, is arranged in the envelope The surface of piece installing 11, and be housed in the accommodating space 113, so that the design of the fingerprint recognition mould group 10 is more compact.
Optionally, referring to Fig. 2, gap is provided between the signal projector 13 and the protrusion 112.By It is provided with gap between the signal projector 13 and the protrusion 112, reduces the protrusion 112 to the signal The interference effect for the signal that transmitter 13 issues.
Optionally, referring to Fig. 3, the signal projector 13 includes multiple subsignal transmitter 13a, the multiple Subsignal transmitter 13a around the protrusion 112 periphery be arranged, and the center of the multiple subsignal transmitter 13a with The center of the protrusion 112 is overlapped.Due in the center of the multiple subsignal transmitter 13a and the protrusion 112 The heart is overlapped, and is enabled the multiple subsignal transmitter 13a that the periphery of the protrusion 112 symmetrically is arranged in, is made The signal for obtaining the multiple subsignal transmitter 13a sending symmetrically and is uniformly distributed about protrusion 112, so that the multiple son The signal that signal projector 13a is issued equably irradiates the fingerprint identification region 21.
Further, also referring to Fig. 1 and Fig. 4, Fig. 4 is the electronic equipment that provides of another embodiment of the application along I- The enlarged diagram of the broken section of I line.The fingerprint recognition mould group 10 further includes lens 14.The protrusion 112, which has, to be held A 112a is emptied, the lens 14 are arranged in the accommodating space 112a, and the lens 14 are used for will be from the fingerprint recognition The reflected signal gathering in region 21 is to the signal receiver 12.The signal projector 13 is set side by side with the lens 14 It sets.With the lens 14 compared with the signal projector 13 stacks the case where being arranged, due to the lens 14 and the signal Transmitter 13 is arranged side by side, and reduces the blocking to the lens 14 of signal projector 13, improves fingerprint recognition mould group The arrangement mode of component in 10.Further, the lens 14 are arranged in the accommodating space 112a, avoid described Mirror 14 is easy impaired due to revealing.Further, since the fingerprint recognition mould group 10 is integrated with the lens 14, institute Lens 14 are stated for that will improve from the reflected signal gathering of the fingerprint identification region 21 to the signal receiver 12 To the utilization rate of the reflected signal of the fingerprint identification region 21, used to improve the identification of fingerprint recognition mould group 10 The precision of family fingerprint.
Further, referring to Fig. 4, the fingerprint recognition mould group 10 further includes optical filter 15.The optical filter 15 Be arranged in the accommodating space 112a, the optical filter 15 be arranged side by side with the signal projector 13 and with the lens 14 It is stacked.Close to the ontology 111, the optical filter 15 is used to filter extraneous the relatively described lens 14 of the optical filter 15 Interference signal.With the optical filter 15 compared with the signal projector 13 stacks the case where being arranged, due to the optical filter 15 It is arranged side by side with the signal projector 13, reduces the blocking to the optical filter 15 of signal projector 13, improve The arrangement mode of component in fingerprint recognition mould group 10.Further, the optical filter 15 is arranged in the accommodating space 112a It is interior, it avoids the optical filter 15 and is easy impaired due to revealing.Further, the relatively described lens 14 of the filter plate Close to the ontology 111, so that being reached after the lens 14 convergence from the reflected signal of the fingerprint identification region 21 The filter plate.The optical filter 15 is filtered to from the reflected signal of the fingerprint identification region 21, outer to remove The interference signal on boundary reduces influence of the external interference signal to signal receiver 12, improves the fingerprint recognition mould group 10 Identify the precision of user fingerprints.
Further, referring to Figure 4 together and Fig. 5, Fig. 5 are the fingerprint recognition mould group that provides of another embodiment of the application Overlooking structure diagram.The fingerprint recognition mould group 10 further includes radiating part 16, and the radiating part 16 is arranged in the signal Between transmitter 13 and the packaging part 11, the radiating part 16 be used for by the heat that the signal projector 13 generates conduct to The packaging part 11.Since the fingerprint recognition mould group 10 further includes radiating part 16, the radiating part 16 is arranged in the signal Between transmitter 13 and the packaging part 11, the radiating part 16 is integrated in the fingerprint recognition mould group 10, is mentioned The high integrated level of the fingerprint recognition mould group 10.Further, the radiating part 16 is for producing the signal projector 13 Raw heat conducts the heat for enabling the signal projector 13 to generate to the packaging part 11 and conducts to the packaging part 11, the heat aggregation that the signal projector 13 generates is avoided, the temperature of the signal projector 13 is reduced.It is understood that Ground, the radiating part 16 can by but be not limited to the material with conductive force and formed.The radiating part 16 can be but not It is limited to for graphene.
Further, also referring to Fig. 1 and Fig. 6, Fig. 6 is the electronic equipment that provides of another embodiment of the application along I- The enlarged diagram of the broken section of I line.The fingerprint recognition mould group 10 further includes optical module 17.The optical module 17 is set It sets in the accommodating chamber 11a, the optical module 17 is arranged with the signal projector 13 interval, and the optical module 17 The corresponding signal receiver 12 is arranged, and the optical module 17 is used for will be from the reflected letter of the fingerprint identification region 21 Number converge to the signal receiver 12.Since the signal projector 13 and the optical module 17 interval are arranged, avoid Block effect of the signal projector 13 to the optical module 17 improves the row of component in the fingerprint recognition mould group 10 Mode for cloth.Further, the optical module 17 for will from the reflected signal gathering of the fingerprint identification region 21 to The signal receiver 12 improves the utilization rate to the reflected signal of the fingerprint identification region 21, to improve The fingerprint recognition mould group 10 identifies the precision of user fingerprints.
Further, the fingerprint recognition mould group 10 further includes wiring board 18.The wiring board 18 is arranged in the receiving It is electrically connected in chamber 11a and with the signal receiver 12.The fingerprint recognition mould group 10 further includes transmission line 19.The packaging part 11 are equipped with aperture 114.The transmission line 19 passes through the aperture 114, one end of the transmission line 19 and the signal projector 13 connections, the opposite other end of the transmission line 19 are connect with the wiring board 18, so that the signal source and the wiring board 18 electrical connections.Since signal projector 13 is electrically connected by the transmission line 19 with the wiring board 18, so that the signal emits Device 13 and the signal receiver 12 share the same wiring board 18, have saved material.It is to be appreciated that the wiring board 18 is not It is limited to for the circuit board of printed circuit board, flexible circuit board etc..Specifically, in the present embodiment, the wiring board 18 is soft Property circuit board.
Referring to Figure 7 together, Fig. 7 is the structural schematic diagram for the electronic equipment that the another embodiment of the application provides;Fig. 8 is Along the broken section enlarged diagram of II-II line in Fig. 7.The electronic equipment 1 includes display screen 20 and the fingerprint recognition mould Group 10, the display screen 20 have fingerprint identification region 21, and the fingerprint recognition mould group 10 corresponds to the fingerprint identification area and sets It sets.It is to be appreciated that the fingerprint identification region 21 is corresponding with the fingerprint recognition mould group 10, fingerprint identification module is along vertical Bigger in the area of the projection in 20 direction of display screen, then the fingerprint identification region 21 is bigger.With the signal projector 13, which are arranged in the arranged side by side of packaging part 11, compares, since the signal projector 13 in the fingerprint recognition mould group 10 is arranged in institute It states the surface of packaging part 11, and stacks and be arranged with the packaging part 11, reduce the fingerprint recognition mould group 10 along perpendicular to institute The area of the projection on 20 direction of display screen is stated, so that the fingerprint identification region 21 in shown display screen 20 can be set Set smaller.
Further, the display screen 20 includes the display panel 22 and backlight module 23 being stacked, the backlight mould For group 23 for providing light source for the display panel 22, the backlight module 23 has the first transmittance section 23a, first light transmission Portion 23a corresponds to the fingerprint identification region 21 and is arranged, and the signal projector 13 is along the direction perpendicular to the backlight module 23 On projection drop into the first transmittance section 23a, the signal that the signal projector 13 issues is through the first transmittance section 23a To the fingerprint identification region 21, passed from the reflected signal of the fingerprint identification region 21 through the first transmittance section 23a It is directed at the signal receiver 12.Since the back mould group has the first transmittance section 23a, and the first transmittance section 23a is corresponding The fingerprint identification region 21 is arranged, so that the signal that the signal projector 13 issues is through the first transmittance section 23a to institute State fingerprint identification region 21, from the reflected signal of the fingerprint identification region 21 through the first transmittance section 23a conduct to The signal receiver 12 identifies user fingerprints function to realize.Further, with the signal projector 13 and with the envelope The situation arranged side by side of piece installing 11 is compared, and stacks setting due to the signal projector 13 and with the packaging part 11, and described Projection of the signal projector 13 on the direction perpendicular to the backlight module 23 drops into the first transmittance section 23a, reduces The area of the first transmittance section 23a, reduces the light leakage of the backlight module 23.It is to be appreciated that first light transmission Portion 23a is not limited to the part by capableing of light transmission in backlight module 23.In one embodiment, the first transmittance section 23a by The material of light-permeable is formed, and the signal transduction issued so as to the signal projector 13 is to fingerprint identification region 21.In another reality It applies in mode, the first transmittance section 23a is equipped with aperture 114, and the signal that the signal projector 13 issues is through the aperture 114 It conducts to fingerprint identification region 21.
Optionally, referring to Fig. 7, the electronic equipment 1 further includes processor 30, when the bright screen of the display screen 20 When, the processor 30 controls the signal that the signal projector 13 issues the first brightness;When the display screen 20, which ceases, to be shielded, institute It states processor 30 and controls the signal that the signal projector 13 issues the second brightness, wherein the light of first brightness is less than The light of second brightness.Since the light of first brightness is less than the light of second brightness, so that display screen 20 When bright screen, the sending signal of signal projector 13 is relatively weak, avoids the brightness of the fingerprint identification region 21.
Further, referring to Fig. 8, the backlight module 23 includes the light guide plate 231 and substrate being stacked 232, for the relatively described substrate 232 of the light guide plate 231 close to the display panel 22, the substrate 232 is used to support described lead Tabula rasa 231, the substrate 232 have alternatively non-transparent district 2321 interconnected and transparent area 2322, described first transmittance section 23a In in the transparent area 2322, projection of the signal projector 13 on the direction perpendicular to the substrate 232 drops into institute It states in transparent area 2322.Since substrate 232 has transparent area 2322, and the first transmittance section 23a is located at the transparent area In 2322, so that the signal for issuing the signal projector 13 is through the conduction of transparent area 2322 to the fingerprint identification area Domain 21 is conducted from the reflected signal of the fingerprint identification region 21 through the transparent area 2322 to the signal receiver 12, user fingerprints function is identified to realize.Further, it is arranged side by side with the signal projector 13 and with the packaging part 11 The case where compare, since the signal projector 13 and stacking with the packaging part 11 is arranged, and 13 edge of the signal projector It is dropped into the transparent area 2322 perpendicular to the projection on the direction of the substrate 232, reduces the transparent area 2322 Area reduces the light leakage of the backlight module 23.
Further, referring to Figure 7 together and Fig. 9, Fig. 9 are the electronic equipment edge that provides of the another embodiment of the application The enlarged diagram of the broken section of II-II line.The substrate 232 has perforation 2323.The perforation 2323 is located at described In light area 2322.Perforation 2323 described in the signal that the signal projector 13 issues reaches the fingerprint identification region 21, from institute It states the reflected signal of fingerprint identification region 21 and reaches the signal receiver 12 through the perforation 2323.Due to the light transmission Perforation 2323 is arranged in area 2322, so that perforation 2323 described in the signal that the signal projector 13 issues reaches the fingerprint recognition Region 21 reaches the signal receiver 12 from the reflected signal of the fingerprint identification region 21 through the perforation 2323, To realize the function of identification user fingerprints.
It is to be appreciated that since the signal projector 13 stacks setting with the packaging part 11 and is attached to the encapsulation The surface of part 11 so that the setting of the fingerprint recognition mould group 10 in the Y-axis direction is more compact, and reduces the fingerprint and knows Size of the other mould group 10 in X-direction.The corresponding fingerprint recognition mould group of fingerprint identification region 21 in the electronic equipment 1 is set It sets, due to reducing the fingerprint recognition mould group 10 in the size of X-direction, so that perforation described in the electronic equipment 1 2323 size also reduces.So as to avoid the excessive brightness for reducing the backlight module 23 of perforation of the backlight module 23.
Further, referring to Figure 7 together, Figure 10 and Figure 11, Figure 10 be electronics that the another embodiment of the application provides Enlarged diagram of the equipment along the broken section of II-II line.Figure 11 is the fingerprint recognition mould that the another embodiment of the application provides The overlooking structure diagram of group.The light guide plate 231 is provided with the through-hole 2311 being correspondingly arranged with the perforation 2323.The letter Perforation 2323 described in the signal that number transmitter 13 issues and the through-hole 2311 reach the fingerprint identification region 21, from the finger The reflected signal of line identification region 21 reaches the signal receiver 12 through the perforation 2323 and the through-hole 2311.By It is relatively smaller in the size of X-direction in the fingerprint recognition mould group 10, so that light guide plate 231 in the electronic equipment 1 Through-hole 2311 size can be set it is smaller.Further, compared with the case where light guide plate 231 does not open up through-hole 2311, In present embodiment, since through-hole 2311 is arranged in the light guide plate 231, the light that the signal projector 13 issues is through described logical Hole 2311 reaches the fingerprint identification region 21, reduces the signal that the light guide plate 231 issues the signal projector 13 Reflex, improve the efficiency that the signal that the signal projector 13 issues is reached to the fingerprint identification region 21.Into One step, the signal receiver 12 is reached from the reflected signal of the fingerprint identification region 21 through the through-hole 2311, The light guide plate 231 is reduced to the reflex from the reflected signal of the fingerprint identification region 21, is improved The efficiency of the signal receiver 12 will be reached from the reflected signal of the identification region.And then it improves the fingerprint and knows Other mould group 10 identifies the precision of user fingerprints.
It is referred to it is to be appreciated that the light guide plate 231 is provided with the through-hole 2311 being correspondingly arranged with the perforation 2323 The through-hole 2311 is oppositely arranged with the perforation 2323, and the signal entered from the perforation 2323 can be passed from the through-hole 2311 Export is gone, and the signal entered from the through-hole 2311 can be conducted from the perforation 2323.
Optionally, the packaging part 11 includes the protrusion 112 of ontology 111 and projection on the ontology 111, institute Stating ontology 111 includes the accommodating chamber 11a, and accommodating space 113 is formed between the ontology 111 and the protrusion 112, described Signal projector 13 is housed in the accommodating space 113.The signal projector 13 includes multiple subsignal transmitter 13a, The multiple subsignal transmitter 13a is arranged around the periphery of the protrusion 112, and the multiple subsignal transmitter 13a Center be overlapped with the center of the protrusion 112.It is to be appreciated that the light guide plate 231 is provided with through-hole 2311, can make The luminance shortage of the part of the corresponding through-hole 2311 of the display screen 20 and the display effect for influencing display screen 20.Due to described Multiple subsignal transmitter 13a are arranged around the periphery of the protrusion 112, and in the multiple subsignal transmitter 13a The heart is overlapped with the center of the protrusion 112, so that the signal that the multiple subsignal transmitter 13a is issued is equably from described Through-hole 2311 exposes to the fingerprint identification region 21.
Optionally, the signal that the signal projector 13 issues is visible light.In the related technology, due to the light guide plate 231 are equipped with through-hole 2311, so that corresponding 2311 part luma of through-hole of the backlight module 23 is insufficient.In the application, due to The signal that the signal projector 13 issues is visible light, what the signal projector 13 was equably issued from the through-hole 2311 Radiation of visible light is to the fingerprint identification region 21, to solve the part of the corresponding through-hole 2311 of the backlight module 23 Luminance shortage the problem of.
Further, referring to Figure 7 together, Figure 12 and Figure 13, Figure 12 be electronics that the another embodiment of the application provides Broken section enlarged diagram of the equipment along II-II line;Figure 13 is the fingerprint recognition mould group that the another embodiment of the application provides Overlooking structure diagram.The light guide plate 231 includes connected light-emitting surface 2313 and incidence surface 2312, the light-emitting surface 2313 Towards the display panel 22, the backlight module 23 further includes light source 233, and the light source 233 is adjacent to the incidence surface 2312 Setting, the light that the light source 233 issues enter from the incidence surface 2312, are transmitted through the display from the light-emitting surface 2313 Panel 22, the signal projector 13 includes multiple first signal projectors 131 and multiple second signal transmitters 132, described Relatively described first signal projector 132 of first signal projector 131 is arranged far from the incidence surface 2312, and first letter The density degree of number transmitter 131 is greater than the density degree of the second signal transmitter 132.It is to be appreciated that the leaded light Plate 231 is provided with through-hole 2311, the laser site arrangement in the light guide plate 231 is destroyed, so that the light guide plate 231 is close The brightness of the part emergent ray of the incidence surface 2312 is greater than the light guide plate 231 and is emitted away from 2312 part of incidence surface The brightness of light.Since the density degree of first signal projector 131 is greater than the density of the second signal transmitter 132 Degree improves the brightness that the light guide plate 231 deviates from the 2312 part emergent ray of incidence surface, so that the light guide plate The brightness of 231 emergent rays is consistent.
Also referring to Figure 14 to Figure 15, Figure 14 is the structural representation for the electronic equipment that another embodiment of the application provides Figure;Along the partial schematic sectional view of III-III line in the electronic equipment that Figure 15 provides for another embodiment of the application.It is described aobvious Display screen 20 includes the self-luminous active layer 24 being stacked and barrier bed 25.The self-luminous active layer 24 is for showing image.It is described Barrier bed 25 is for blocking the fingerprint recognition mould group 10.The barrier bed 25 includes the second transmittance section 25a.The signal transmitting Projection of the device 13 along the direction perpendicular to the barrier bed 25 drops into the second transmittance section 25a, the signal projector 13 The signal of sending reaches the fingerprint identification region 21 through the second transmittance section 25a, reflects from the fingerprint identification region 21 Signal back reaches the signal receiver 12 through the second transmittance section 25a.It is issued due to the signal projector 13 Signal reaches the fingerprint identification region 21, and the self-luminous active layer 24 corresponding described second through the second transmittance section 25a The signal that the part of transmittance section 25a issues can also reach in the fingerprint identification region 21, to increase fingerprint identification region Signal strength in 21, and increase and reflect from the fingerprint identification region 21 to the signal of the signal receiver 12 Intensity, improve the precision that the fingerprint recognition mould group 10 identifies user fingerprints.It is to be appreciated that the barrier bed 25 can With by but be not limited to be formed by the material with interception.The material with interception can be but be not limited to Any one or more in foam, ink etc..
Referring to Figure 14, the electronic equipment 1 further includes center 40.The center 40 is provided with container 41.Institute Container 41 is stated for accommodating the display screen 20 and the fingerprint recognition mould group 10.The fingerprint recognition mould group 10 supports described The inner wall of container 41, the fingerprint recognition mould group 10 further includes radiating part 16.The setting of radiating part 16 is sent out in the signal Between emitter 13 and the packaging part 11, the heat that the radiating part 16 is used to generate the signal projector 13 is through the envelope Piece installing 11 is conducted to the center 40.Described in the heat warp for being used to generate the signal projector 13 as the radiating part 16 To the center 40, the heat that the signal projector 13 is generated is conducted to the center conduction of packaging part 11 40, the heat aggregation that the signal projector 13 generates is avoided, the temperature of the signal projector 13 is reduced, avoids institute It is excessively high and influence the running of the signal receiver 12 to state 13 temperature of signal projector.It is to be appreciated that the center 40 is used for Accommodate and support the display screen 20 and the fingerprint recognition mould group 10.
Specifically, the packaging part 11 supports 41 inner wall of container.The heat warp that the signal projector 13 generates The packaging part 11 is conducted to the center 40.In one embodiment, the surface of the packaging part 11 is coated with heat-conducting layer, with The heat that the signal projector 13 generates is conducted to center 40.In one embodiment, the packaging part 11 is by thermal conductivity The preferable material of energy is formed.
The embodiment of the present application is described in detail above, specific case used herein to the principle of the application and Embodiment is expounded, the description of the example is only used to help understand the method for the present application and its core ideas; At the same time, for those skilled in the art can in specific embodiments and applications according to the thought of the application There is change place, in conclusion the contents of this specification should not be construed as limiting the present application.

Claims (15)

1. a kind of fingerprint recognition mould group, which is characterized in that the fingerprint recognition mould group includes packaging part, signal receiver, signal Transmitter, the packaging part are equipped with accommodating chamber, and the signal receiver is arranged in the accommodating chamber, the signal projector with The packaging part stacks setting and is attached to the surface of the packaging part, and the signal that the signal projector issues refers to irradiate Line identification region, the signal receiver is for receiving from the reflected signal of the fingerprint identification region.
2. fingerprint recognition mould group as described in claim 1, which is characterized in that the packaging part includes that ontology and projection exist Protrusion on the ontology, the ontology include the accommodating chamber, and it is empty that receiving is formed between the ontology and the protrusion Between, the signal projector is housed in the accommodating space.
3. fingerprint recognition mould group as claimed in claim 2, which is characterized in that the fingerprint recognition mould group further includes lens, institute Protrusion is stated with accommodating space, the lens are arranged in the accommodating space, and the lens from the fingerprint for that will know The other reflected signal gathering in region is arranged side by side to the signal receiver, the signal projector and the lens.
4. fingerprint recognition mould group as claimed in claim 3, which is characterized in that the fingerprint recognition mould group further includes optical filter, The optical filter is arranged in the accommodating space, the optical filter and the signal projector be arranged side by side and with the lens It is stacked, close to the ontology, the optical filter is used to filter extraneous interference the relatively described lens of the optical filter Signal.
5. fingerprint recognition mould group as described in claim 1, which is characterized in that the fingerprint recognition mould group further includes radiating part, The radiating part is arranged between the signal projector and the packaging part, and the radiating part is used for the signal projector The heat of generation is conducted to the packaging part.
6. fingerprint recognition mould group as described in claim 1, which is characterized in that the fingerprint recognition mould group further includes optics group Part, the optical module are arranged in the accommodating chamber, and the optical module and the signal projector interval are arranged, and described Optical module corresponds to the signal receiver setting, and the optical module is used for will be reflected from the fingerprint identification region Signal gathering is to the signal receiver.
7. fingerprint identification device as described in claim 1, which is characterized in that the fingerprint recognition mould group further includes wiring board, The wiring board is arranged in the accommodating chamber and is electrically connected with the signal receiver, and the fingerprint recognition mould group further includes passing Defeated line, the packaging part are equipped with aperture, and the transmission line passes through the aperture, and one end of the transmission line and the signal emit Device connection, the opposite other end of the transmission line is connect with the wiring board, so that the signal source is electrically connected with the wiring board It connects.
8. a kind of electronic equipment, which is characterized in that the electronic equipment includes display screen and claim 1-7 described in any item Fingerprint recognition mould group, the display screen have fingerprint identification region, and the fingerprint recognition mould group corresponds to the fingerprint identification area Setting.
9. electronic equipment as claimed in claim 8, which is characterized in that the display screen include the display panel that is stacked and Backlight module, the backlight module are used to provide light source for the display panel, and the backlight module has the first transmittance section, institute It states the first transmittance section and corresponds to the fingerprint identification region setting, the signal projector is along the direction perpendicular to the backlight module On projection drop into first transmittance section, the signal that the signal projector issues is through first transmittance section to the finger Line identification region is conducted to the signal through first transmittance section from the reflected signal of the fingerprint identification region and is received Device.
10. electronic equipment as claimed in claim 9, which is characterized in that the backlight module includes the light guide plate being stacked And substrate, for the relatively described substrate of the light guide plate close to the display panel, the substrate is used to support the light guide plate, described Substrate has alternatively non-transparent district interconnected and transparent area, and first transmittance section is located in the transparent area, the signal hair Emitter edge drops into the transparent area perpendicular to the projection on the direction of the substrate.
11. electronic equipment as claimed in claim 10, which is characterized in that the substrate has perforation, and the perforation is located at institute It states in transparent area, perforation described in the signal that the signal projector issues reaches the fingerprint identification region, knows from the fingerprint The other reflected signal in region reaches the signal receiver through the perforation.
12. electronic equipment as claimed in claim 11, which is characterized in that the light guide plate is provided with set corresponding with the perforation The through-hole set, perforation and the through-hole described in the signal that the signal projector issues reach the fingerprint identification region, from institute It states the reflected signal of fingerprint identification region and reaches the signal receiver through the perforation and the through-hole.
13. electronic equipment as claimed in claim 12, which is characterized in that the light guide plate includes connected light-emitting surface and enters light Face, the light-emitting surface further include light source towards the display panel, the backlight module, and the light source is set adjacent to the incidence surface It sets, the light that the light source issues enters from the incidence surface, is transmitted through the display panel, the signal from the light-emitting surface Transmitter includes multiple first signal projectors and multiple second signal transmitters, first signal projector relatively described Binary signal transmitter is arranged far from the incidence surface, and the density degree of first signal projector is greater than the second signal The density degree of transmitter.
14. electronic equipment as claimed in claim 8, which is characterized in that the display screen includes the self-emitting light source being stacked Layer and barrier bed, the self-luminous active layer are described for blocking the fingerprint recognition mould group for showing image, the barrier bed Barrier bed includes the second transmittance section, and the projection of the signal projector along the direction perpendicular to the barrier bed drops into described the Two transmittance sections, the signal that the signal projector issues reach the fingerprint identification region through second transmittance section, from described The reflected signal of fingerprint identification region reaches the signal receiver through second transmittance section.
15. electronic equipment as claimed in claim 8, which is characterized in that the electronic equipment further includes center, and the center is set It is equipped with container, the container for accommodating the display screen and the fingerprint recognition mould group, support by the fingerprint recognition mould group The inner wall of the container is held, the fingerprint recognition mould group further includes radiating part, and the radiating part setting emits in the signal Between device and the packaging part, the radiating part be used for by heat that the signal projector generates through the packaging part conduct to The center.
CN201910741332.8A 2019-08-12 2019-08-12 Fingerprint recognition mould group and electronic equipment Pending CN110443215A (en)

Priority Applications (1)

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CN201910741332.8A CN110443215A (en) 2019-08-12 2019-08-12 Fingerprint recognition mould group and electronic equipment

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CN201910741332.8A CN110443215A (en) 2019-08-12 2019-08-12 Fingerprint recognition mould group and electronic equipment

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Application publication date: 20191112