CN110441847A - A kind of cutting method suitable for diffraction grating - Google Patents
A kind of cutting method suitable for diffraction grating Download PDFInfo
- Publication number
- CN110441847A CN110441847A CN201910679691.5A CN201910679691A CN110441847A CN 110441847 A CN110441847 A CN 110441847A CN 201910679691 A CN201910679691 A CN 201910679691A CN 110441847 A CN110441847 A CN 110441847A
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- Prior art keywords
- diffraction grating
- cutting
- protection
- cutting method
- layer
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
- B26D7/00—Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
- B26D7/08—Means for treating work or cutting member to facilitate cutting
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B5/00—Optical elements other than lenses
- G02B5/18—Diffraction gratings
- G02B5/1847—Manufacturing methods
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B5/00—Optical elements other than lenses
- G02B5/18—Diffraction gratings
- G02B5/1847—Manufacturing methods
- G02B5/1852—Manufacturing methods using mechanical means, e.g. ruling with diamond tool, moulding
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- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Life Sciences & Earth Sciences (AREA)
- Forests & Forestry (AREA)
- Mechanical Engineering (AREA)
- Diffracting Gratings Or Hologram Optical Elements (AREA)
Abstract
The present invention provides a kind of cutting methods suitable for diffraction grating, comprising the following steps: S1: the surface of diffraction grating to be cut being protected, diffraction grating protection structure is prepared into;S2: diffraction grating protection structure is fixed on cutting machine, required size is cut into;S3: surface protection is carried out to the small size diffraction grating protection structure after cutting and is handled.Cutting method suitable for diffraction grating of the invention; effective protection has been carried out on the surface of diffraction grating; the surface for avoiding diffraction grating is directly exposed to air; it avoids in cutting processing; it cuts the dust generated and cutting fluid causes irremediable damage to diffraction grating; make it possible that cutting processing is applied to the working process of diffraction grating; realize the lossless cutting of diffraction grating; it realizes and first prepares large-sized diffraction grating; it is cut into the preparation method of required small size diffraction grating again, improves preparation efficiency.
Description
Technical field
The present invention relates to the working process technical fields of diffraction grating, and in particular to a kind of cutting suitable for diffraction grating
Method.
Background technique
Diffraction grating is by regular structure, and the amplitude or phase (or both simultaneously) for making incident light are by periodical sky
Between modulate.The most important application of diffraction grating optically is commonly used on monochromator and spectrometer as light-splitting device.By
There is fine surface relief structure in diffraction grating, it is easily impaired, in cutting processing, cut the dust and cutting fluid of generation
Irremediable damage will be caused to diffraction grating, be not particularly suited for progress cutting processing and handled this common processing work
Skill.In the preparation of prior art diffraction grating, all it is to be prepared according to the required size of diffraction grating, is not particularly suited for elder generation
Large-sized diffraction grating is prepared, then is cut into the preparation method of required small size diffraction grating, preparation efficiency is low.
In consideration of it, needing to study a kind of cutting method suitable for diffraction grating, cutting processing is made to be applied to diffraction grating
Working process be possibly realized, realize the lossless cutting of diffraction grating.
Summary of the invention
It is an object of the invention in view of the above drawbacks of the prior art, provide a kind of cutting side suitable for diffraction grating
Method first carries out effective protection to the surface of diffraction grating, then carries out cutting processing, and cutting processing is made to be applied to adding for diffraction grating
Work is treated as possibility, realizes the lossless cutting of diffraction grating.
The purpose of the present invention can be realized by technical measures below:
The present invention provides a kind of cutting methods suitable for diffraction grating, comprising the following steps:
S1: the surface of diffraction grating to be cut is protected, and is prepared into diffraction grating protection structure;
S2: diffraction grating protection structure is fixed on cutting machine, required size is cut into;
S3: surface protection is carried out to the small size diffraction grating protection structure after cutting and is handled.
Further, the step S1 the following steps are included:
S11: it prepares the diffraction grating, prepare the protection glass identical with the surface size of the diffraction grating
Glass, it is spare after cleaning;
S12: the separating layer is deposited in the surface vacuum of the diffraction grating, the diffraction grating is placed in vacuum coating
In machine, the vacuum degree in the vacuum coating equipment is controlled in 1.0 × 10-3Pa or more, by separation layer materials vacuum evaporation described in
The surface of diffraction grating forms the separating layer;
S13: continue reflecting layer described in vacuum evaporation, control the vacuum degree in the vacuum coating equipment in 1.0 × 10-3Pa
More than, the reflecting layer will be formed in reflector material vacuum evaporation to the separating layer, takes out diffraction after completing vacuum evaporation
Grating;
S14: being bonded the protection glass, epoxy resin prepared in proportion with curing agent and is uniformly mixed, and is blended with solid
The epoxy resin of agent uniformly fills on the reflecting layer, and the surface cover of the protection glass and the diffraction grating is closed
Ground is layed on epoxy resin, stands solidification, is realized that the protection glass is Nian Jie with the diffraction grating, is obtained the diffraction light
Grid protect structure.
Further, diffraction grating protection structure is fixed on the mode on cutting machine using true in the step S2
Suction is attached, is perhaps bonded using paraffin or is fixed using fixture.
Further, the surface protection processing of going of the step S3 is to protect structure along small size diffraction grating with blade
Edge is cut, and takes the protection glass off.
Further, the material of the separating layer is 275 silicone oil, and the thickness of the separating layer is less than 10nm.
Further, the reflecting layer is metallic reflector.
Further, the material of the metallic reflector is any one in Al, Ag, Au.
Further, the epoxy resin that the resin layer uses is No. 618 epoxy resin or No. 6828 epoxy resin.
Further, the curing agent that the resin layer uses is imidazole curing agent.
Further, the protection glass is flat optical glass, with a thickness of 1-3mm.
Cutting method suitable for diffraction grating of the invention has carried out effective protection on the surface of diffraction grating, has avoided
The surface of diffraction grating is directly exposed to air, and is avoided in cutting processing, and the dust and cutting fluid for cutting generation are to spreading out
It penetrates grating and causes irremediable damage, make it possible that cutting processing is applied to the working process of diffraction grating, realize diffraction
The lossless cutting of grating, realizes and first prepares large-sized diffraction grating, then is cut into the system of required small size diffraction grating
Standby mode, improves preparation efficiency.
Detailed description of the invention
Fig. 1 is the flow diagram of the cutting method suitable for diffraction grating of the invention;
Fig. 2 is that one embodiment of the invention structure of diffraction grating protection structure suitable for the cutting method of diffraction grating is shown
It is intended to;
Description of symbols: 1- diffraction grating;2- separating layer;The reflecting layer 3-;4- resin layer;5- protects glass.
Specific embodiment
In order to make the objectives, technical solutions, and advantages of the present invention clearer, with reference to the accompanying drawing and specific implementation
Invention is further described in detail for example.It should be appreciated that the specific embodiments described herein are merely illustrative of the present invention,
Do not limit the present invention.
In order to keep the narration of this disclosure more detailed with it is complete, below for embodiments of the present invention and specific real
It applies example and proposes illustrative description;But this not implements or uses the unique forms of the specific embodiment of the invention.Embodiment
In cover multiple specific embodiments feature and to construction with operate these specific embodiments method and step it is suitable with it
Sequence.However, can also reach identical or impartial function and sequence of steps using other specific embodiments.
As shown in Figure 1, being the flow diagram of the cutting method suitable for diffraction grating of the invention, it is suitable for diffraction light
The cutting method of grid, comprising the following steps:
S1: the surface of diffraction grating to be cut is protected, and is prepared into diffraction grating protection structure;
S2: diffraction grating protection structure is fixed on cutting machine, required size is cut into;
S3: surface protection is carried out to the small size diffraction grating protection structure after cutting and is handled.
In one embodiment of this invention, the preparation method of the diffraction grating protection structure in step S1, including following step
It is rapid:
S11: it prepares the diffraction grating, prepare the protection glass identical with the surface size of the diffraction grating
Glass, it is spare after cleaning;
S12: the separating layer is deposited in the surface vacuum of the diffraction grating, the diffraction grating is placed in vacuum coating
In machine, the vacuum degree in the vacuum coating equipment is controlled 1.0 × 10-3Pa or more, by separation layer materials vacuum evaporation described in
The surface of diffraction grating forms the separating layer;
S13: continue reflecting layer described in vacuum evaporation, control the vacuum degree in the vacuum coating equipment 1.0 × 10-3Pa with
On, the reflecting layer will be formed in reflector material vacuum evaporation to the separating layer, takes out diffraction light after completing vacuum evaporation
Grid;
S14: being bonded the protection glass, epoxy resin prepared in proportion with curing agent and is uniformly mixed, and is blended with solid
The epoxy resin of agent uniformly fills on the reflecting layer, and the surface cover of the protection glass and the diffraction grating is closed
Ground is layed on epoxy resin, stands solidification, is realized that the protection glass is Nian Jie with the diffraction grating, is obtained the diffraction light
Grid protect structure.
In the step S2, diffraction grating protection structure is fixed on the mode on cutting machine, can choose use
Vacuum suction is perhaps bonded using paraffin or is fixed using fixture;Cutting machine can choose universal optical element cutting machine.
The step S3's goes surface protection processing to protect the edge of structure to cut along small size diffraction grating with blade,
Take the protection glass off.Wherein, blade is various sharp guarded blade utility knife.
As shown in Fig. 2, diffraction grating protects the structure of structure suitable for the cutting method of diffraction grating for an embodiment
Schematic diagram is multilayered structure, including diffraction grating 1, separating layer 2, reflecting layer 3, resin layer 4, protection glass 5;The separating layer
2, the reflecting layer 3, the resin layer 4, it is described protection glass 5 surface size and the diffraction grating 1 surface size phase
Together;
The separating layer 2 is plated on the surface of the diffraction grating 1 using the method for vacuum evaporation, and the reflecting layer 3 uses
The method of vacuum evaporation is plated in the separating layer 2, and the epoxy resin for being blended with curing agent is evenly applied to the reflecting layer 3
On, the surface cover of the protection glass 5 and the diffraction grating is layed on epoxy resin with closing, and is formed after epoxy resin cure
The resin layer 4 between the reflecting layer 3 and the protection glass 5.
Wherein, the material of the separating layer 2 is 275 silicone oil, and thickness is generally less than 10nm.The reflecting layer 3 is that metal is anti-
Layer is penetrated, for thickness generally at hundreds of nanometers, material can be any one in Al, Ag, Au.The epoxy that the resin layer 4 uses
Resin can be No. 618 epoxy resin or No. 6828 epoxy resin, and the curing agent used is imidazole curing agent, the resin layer
4 thickness is generally in some tens of pm.The protection glass 5 is flat optical glass, with a thickness of 1-3mm.
The effect of separating layer 2 be for protected diffraction grating 1 is isolated with protection glass 5, and can be in specific item
Part (such as blade incision) separates diffraction grating 1 with protection glass 5.Metallic reflector 3 can be understood as the boundary layer of separating layer 2
Or protective layer, because separating layer is in a liquid state, and very thin, individualism is not able to maintain good working condition, uses metallic reflector 3
It can be isolated, play the role of protecting separating layer 2.The effect of resin layer 4 is to glue metallic reflector 3 and protection glass 5
It is connected together, bonding force with higher.When diffraction grating 1 needs to protect, making it jointly becomes an entirety, is needing
When separation, it is ensured that separate diffraction grating 1 and protection glass 5 along separating layer 2.
Cutting method suitable for diffraction grating of the invention has carried out effective protection on the surface of diffraction grating, has avoided
The surface of diffraction grating is directly exposed to air, and is avoided in cutting processing, and the dust and cutting fluid for cutting generation are to spreading out
It penetrates grating and causes irremediable damage, make it possible that cutting processing is applied to the working process of diffraction grating, realize diffraction
The lossless cutting of grating, realizes and first prepares large-sized diffraction grating, then is cut into the system of required small size diffraction grating
Standby mode, improves preparation efficiency.
The foregoing is merely illustrative of the preferred embodiments of the present invention, is not intended to limit the invention, all in essence of the invention
Made any modifications, equivalent replacements, and improvements etc., should all be included in the protection scope of the present invention within mind and principle.
Claims (10)
1. a kind of cutting method suitable for diffraction grating, which comprises the following steps:
S1: the surface of diffraction grating to be cut is protected, and is prepared into diffraction grating protection structure;
S2: diffraction grating protection structure is fixed on cutting machine, required size is cut into;
S3: surface protection is carried out to the small size diffraction grating protection structure after cutting and is handled.
2. the cutting method according to claim 1 suitable for diffraction grating, which is characterized in that the step S1 include with
Lower step:
S11: preparing the diffraction grating, prepare the protection glass identical with the surface size of the diffraction grating,
It is spare after cleaning;
S12: the separating layer is deposited in the surface vacuum of the diffraction grating, the diffraction grating is placed in vacuum coating equipment
In, the vacuum degree in the vacuum coating equipment is controlled 1.0 × 10-3Pa or more spreads out separation layer materials vacuum evaporation described in
The surface for penetrating grating forms the separating layer;
S13: continue reflecting layer described in vacuum evaporation, control the vacuum degree in the vacuum coating equipment 1.0 × 10-3Pa or more,
The reflecting layer will be formed in reflector material vacuum evaporation to the separating layer, takes out diffraction grating after completing vacuum evaporation;
S14: it is bonded the protection glass, epoxy resin is prepared in proportion with curing agent and is uniformly mixed, curing agent is blended with
Epoxy resin uniformly fill on the reflecting layer, by it is described protection glass and the diffraction grating surface cover close shakedown
On epoxy resin, solidification is stood, realizes that the protection glass is Nian Jie with the diffraction grating, the diffraction grating is obtained and protects
Protection structure.
3. the cutting method according to claim 2 suitable for diffraction grating, which is characterized in that by institute in the step S2
It states the mode that diffraction grating protection structure is fixed on cutting machine and uses vacuum suction, be perhaps bonded or use using paraffin
Fixture is fixed.
4. the cutting method according to claim 2 suitable for diffraction grating, which is characterized in that the step S3's removes table
Face protection processing takes the protection glass off to protect the edge of structure to cut along small size diffraction grating with blade.
5. the cutting method according to claim 2 suitable for diffraction grating, which is characterized in that the material of the separating layer
Thickness for 275 silicone oil, the separating layer is less than 10nm.
6. the cutting method according to claim 2 suitable for diffraction grating, which is characterized in that the reflecting layer is metal
Reflecting layer.
7. the cutting method according to claim 6 suitable for diffraction grating, which is characterized in that the metallic reflector
Material is any one in Al, Ag, Au.
8. the cutting method according to claim 2 suitable for diffraction grating, which is characterized in that the resin layer used
Epoxy resin is No. 618 epoxy resin or No. 6828 epoxy resin.
9. the cutting method according to claim 8 suitable for diffraction grating, which is characterized in that the resin layer used
Curing agent is imidazole curing agent.
10. the cutting method according to claim 2 suitable for diffraction grating, which is characterized in that the protection glass is
Flat optical glass, with a thickness of 1-3mm.
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CN201910679691.5A CN110441847B (en) | 2019-07-26 | 2019-07-26 | Cutting method suitable for diffraction grating |
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CN201910679691.5A CN110441847B (en) | 2019-07-26 | 2019-07-26 | Cutting method suitable for diffraction grating |
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN116699746A (en) * | 2023-07-31 | 2023-09-05 | 北京至格科技有限公司 | Grating cutting and splitting method with grating protection function |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1478205A (en) * | 2000-11-03 | 2004-02-25 | OVD�������ķ�ɷݹ�˾ | Light-diffracting binary grating structure |
CN101329419A (en) * | 2008-01-04 | 2008-12-24 | 华工科技产业股份有限公司 | Diffraction grid component and manufacturing method thereof |
CN102515483A (en) * | 2012-01-04 | 2012-06-27 | 周晓辉 | Method for glass cutting, curved surface forming or grating manufacturing |
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2019
- 2019-07-26 CN CN201910679691.5A patent/CN110441847B/en active Active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1478205A (en) * | 2000-11-03 | 2004-02-25 | OVD�������ķ�ɷݹ�˾ | Light-diffracting binary grating structure |
CN101329419A (en) * | 2008-01-04 | 2008-12-24 | 华工科技产业股份有限公司 | Diffraction grid component and manufacturing method thereof |
CN102515483A (en) * | 2012-01-04 | 2012-06-27 | 周晓辉 | Method for glass cutting, curved surface forming or grating manufacturing |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN116699746A (en) * | 2023-07-31 | 2023-09-05 | 北京至格科技有限公司 | Grating cutting and splitting method with grating protection function |
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