CN110441847B - Cutting method suitable for diffraction grating - Google Patents
Cutting method suitable for diffraction grating Download PDFInfo
- Publication number
- CN110441847B CN110441847B CN201910679691.5A CN201910679691A CN110441847B CN 110441847 B CN110441847 B CN 110441847B CN 201910679691 A CN201910679691 A CN 201910679691A CN 110441847 B CN110441847 B CN 110441847B
- Authority
- CN
- China
- Prior art keywords
- diffraction grating
- cutting
- layer
- vacuum
- protection structure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
- B26D7/00—Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
- B26D7/08—Means for treating work or cutting member to facilitate cutting
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B5/00—Optical elements other than lenses
- G02B5/18—Diffraction gratings
- G02B5/1847—Manufacturing methods
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B5/00—Optical elements other than lenses
- G02B5/18—Diffraction gratings
- G02B5/1847—Manufacturing methods
- G02B5/1852—Manufacturing methods using mechanical means, e.g. ruling with diamond tool, moulding
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Life Sciences & Earth Sciences (AREA)
- Forests & Forestry (AREA)
- Mechanical Engineering (AREA)
- Diffracting Gratings Or Hologram Optical Elements (AREA)
Abstract
The invention provides a cutting method suitable for a diffraction grating, which comprises the following steps: s1: protecting the surface of the diffraction grating to be cut to prepare a diffraction grating protection structure; s2: fixing the diffraction grating protection structure on a cutting machine, and cutting the diffraction grating protection structure into required sizes; s3: and performing surface protection removing treatment on the cut small-size diffraction grating protection structure. The cutting method suitable for the diffraction grating effectively protects the surface of the diffraction grating, prevents the surface of the diffraction grating from being directly exposed in the air, prevents the irreparable damage to the diffraction grating caused by dust and cutting fluid generated by cutting in the cutting process, makes the cutting process possibly applied to the processing treatment of the diffraction grating, realizes the nondestructive cutting of the diffraction grating, realizes the preparation mode of firstly preparing the large-size diffraction grating and then cutting the large-size diffraction grating into the required small-size diffraction grating, and improves the preparation efficiency.
Description
Technical Field
The invention relates to the technical field of processing of diffraction gratings, in particular to a cutting method suitable for diffraction gratings.
Background
The diffraction grating is a regular structure that causes the amplitude or phase (or both) of the incident light to be periodically spatially modulated. The most important optical application of diffraction gratings is as beam splitters, often used in monochromators and spectrometers. Since the diffraction grating has a fine surface relief structure, the diffraction grating is easily damaged, and both dust and cutting fluid generated by cutting can irreparably damage the diffraction grating in the cutting process, and the diffraction grating is not suitable for the common processing technology of cutting processing. In the prior art, the diffraction gratings are prepared according to the required size of the diffraction gratings, and the preparation method is not suitable for preparing the large-size diffraction gratings and then cutting the large-size diffraction gratings into the required small-size diffraction gratings, so that the preparation efficiency is low.
In view of this, it is necessary to research a cutting method suitable for a diffraction grating, so that it is possible to apply the cutting process to the processing of the diffraction grating, and to implement the nondestructive cutting of the diffraction grating.
Disclosure of Invention
The invention aims to provide a cutting method suitable for a diffraction grating, which aims to overcome the defects in the prior art, and the method comprises the steps of effectively protecting the surface of the diffraction grating and then cutting the diffraction grating, so that the cutting processing can be applied to the processing treatment of the diffraction grating, and the nondestructive cutting of the diffraction grating can be realized.
The object of the invention can be achieved by the following technical measures:
the invention provides a cutting method suitable for a diffraction grating, which comprises the following steps:
s1: protecting the surface of the diffraction grating to be cut to prepare a diffraction grating protection structure;
s2: fixing the diffraction grating protection structure on a cutting machine, and cutting the diffraction grating protection structure into required sizes;
s3: and performing surface protection removing treatment on the cut small-size diffraction grating protection structure.
Further, the step S1 includes the following steps:
s11: preparing the diffraction grating, preparing the protective glass with the same surface size as the diffraction grating, and cleaning the protective glass for later use;
s12: vacuum evaporating the separation layer on the surface of the diffraction grating, placing the diffraction grating in a vacuum coating machine, controlling the vacuum degree in the vacuum coating machine to be more than 1.0 x 10 < -3 > Pa, and evaporating a separation layer material on the surface of the diffraction grating in vacuum to form the separation layer;
s13: continuing vacuum evaporation of the reflecting layer, controlling the vacuum degree in the vacuum coating machine to be more than 1.0 x 10 < -3 > Pa, carrying out vacuum evaporation of the reflecting layer material on the separation layer to form the reflecting layer, and taking out the diffraction grating after the vacuum evaporation is finished;
s14: bonding the protective glass, preparing and uniformly mixing epoxy resin and a curing agent according to a proportion, uniformly coating the epoxy resin mixed with the curing agent on the reflecting layer, covering and laying the protective glass and the surface of the diffraction grating on the epoxy resin, standing and curing to realize bonding of the protective glass and the diffraction grating, and obtaining the diffraction grating protective structure.
Further, in step S2, the diffraction grating protection structure is fixed to the cutting machine by vacuum adsorption, or by paraffin bonding, or by a fixture.
Further, the surface protection removing process of step S3 is to cut the small-sized diffraction grating protection structure along the edge with a blade and remove the protection glass.
Further, the material of the separation layer is 275 silicone oil, and the thickness of the separation layer is less than 10 nm.
Further, the reflecting layer is a metal reflecting layer.
Furthermore, the material of the metal reflecting layer is any one of Al, Ag and Au.
Further, the epoxy resin adopted by the resin layer is No. 618 epoxy resin or No. 6828 epoxy resin.
Further, the curing agent adopted by the resin layer is an imidazole curing agent.
Further, the protective glass is flat optical glass with the thickness of 1-3 mm.
The cutting method suitable for the diffraction grating effectively protects the surface of the diffraction grating, prevents the surface of the diffraction grating from being directly exposed in the air, prevents the irreparable damage to the diffraction grating caused by dust and cutting fluid generated by cutting in the cutting process, makes the cutting process possibly applied to the processing treatment of the diffraction grating, realizes the nondestructive cutting of the diffraction grating, realizes the preparation mode of firstly preparing the large-size diffraction grating and then cutting the large-size diffraction grating into the required small-size diffraction grating, and improves the preparation efficiency.
Drawings
FIG. 1 is a schematic flow diagram of a cutting method suitable for use with a diffraction grating of the present invention;
FIG. 2 is a schematic structural diagram of a diffraction grating protection structure in a cutting method for a diffraction grating according to an embodiment of the present invention;
description of reference numerals: 1-a diffraction grating; 2-a separation layer; 3-a reflective layer; 4-a resin layer; 5-protective glass.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention will be described in further detail with reference to the accompanying drawings and specific embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and do not limit the invention.
In order to make the description of the present disclosure more complete and complete, the following description is given for illustrative purposes with respect to the embodiments and examples of the present invention; it is not intended to be the only form in which the embodiments of the invention may be practiced or utilized. The embodiments are intended to cover the features of the various embodiments as well as the method steps and sequences for constructing and operating the embodiments. However, other embodiments may be utilized to achieve the same or equivalent functions and step sequences.
As shown in fig. 1, a schematic flow chart of a cutting method suitable for a diffraction grating of the present invention is shown, and the cutting method suitable for a diffraction grating includes the following steps:
s1: protecting the surface of the diffraction grating to be cut to prepare a diffraction grating protection structure;
s2: fixing the diffraction grating protection structure on a cutting machine, and cutting the diffraction grating protection structure into required sizes;
s3: and performing surface protection removing treatment on the cut small-size diffraction grating protection structure.
In an embodiment of the present invention, the method for preparing the diffraction grating protection structure in step S1 includes the following steps:
s11: preparing the diffraction grating, preparing the protective glass with the same surface size as the diffraction grating, and cleaning the protective glass for later use;
s12: vacuum evaporating the separation layer on the surface of the diffraction grating, placing the diffraction grating in a vacuum coating machine, and controlling the vacuum degree in the vacuum coating machine to be 1.0 multiplied by 10-3The separation layer material is evaporated on the surface of the diffraction grating in vacuum with Pa or above to form the separation layer;
s13: continuing vacuum evaporating the reflecting layer, and controlling the vacuum degree in the vacuum coating machine to be 1.0 multiplied by 10-3The material of the reflecting layer is subjected to vacuum evaporation on the separation layer to form the reflecting layer, and the diffraction grating is taken out after the vacuum evaporation is finished;
s14: bonding the protective glass, preparing and uniformly mixing epoxy resin and a curing agent according to a proportion, uniformly coating the epoxy resin mixed with the curing agent on the reflecting layer, covering and laying the protective glass and the surface of the diffraction grating on the epoxy resin, standing and curing to realize bonding of the protective glass and the diffraction grating, and obtaining the diffraction grating protective structure.
In the step S2, the diffraction grating protection structure may be fixed to the cutting machine by vacuum adsorption, paraffin bonding, or a fixture; the cutting machine may be a general optical element cutting machine.
The surface protection removing process of step S3 is to cut the small-sized diffraction grating protection structure along the edge with a blade and remove the protection glass. Wherein, the blade can be any sharp tool knife.
As shown in fig. 2, which is a schematic structural diagram of a diffraction grating protection structure in an embodiment of a cutting method applied to a diffraction grating, the diffraction grating protection structure is a multilayer structure, and includes a diffraction grating 1, a separation layer 2, a reflection layer 3, a resin layer 4, and a protective glass 5; the surface sizes of the separation layer 2, the reflection layer 3, the resin layer 4 and the protective glass 5 are the same as the surface size of the diffraction grating 1;
the surface of the diffraction grating 1 is plated with the separation layer 2 by a vacuum evaporation method, the reflection layer 3 is plated on the separation layer 2 by a vacuum evaporation method, epoxy resin mixed with a curing agent is uniformly coated on the reflection layer 3, the protective glass 5 and the surface of the diffraction grating are covered and paved on the epoxy resin, and the resin layer 4 is formed between the reflection layer 3 and the protective glass 5 after the epoxy resin is cured.
The material of the separation layer 2 is 275 silicone oil, and the thickness is generally less than 10 nm. The reflecting layer 3 is a metal reflecting layer, the thickness of which is generally hundreds of nanometers, and the material of the reflecting layer can be any one of Al, Ag and Au. The epoxy resin adopted by the resin layer 4 can be No. 618 epoxy resin or No. 6828 epoxy resin, the adopted curing agent is imidazole curing agent, and the thickness of the resin layer 4 is generally tens of micrometers. The protective glass 5 is flat optical glass with the thickness of 1-3 mm.
The separation layer 2 functions to separate the protected diffraction grating 1 from the cover glass 5 and to separate the diffraction grating 1 from the cover glass 5 under specific conditions (e.g., blade cut). The metal reflective layer 3 can be understood as a boundary layer or a protective layer of the separation layer 2, because the separation layer is in a liquid state and is thin and cannot be kept in an intact state when being solely present, and can be isolated by using the metal reflective layer 3 to play a role of protecting the separation layer 2. The resin layer 4 serves to bond the metal reflective layer 3 and the protective glass 5 together, and has high adhesion. When the diffraction grating 1 needs to be protected, the diffraction grating 1 and the protective glass 5 are integrated together, and when the separation is needed, the separation of the diffraction grating 1 and the protective glass 5 along the separation layer 2 can be ensured.
The cutting method suitable for the diffraction grating effectively protects the surface of the diffraction grating, prevents the surface of the diffraction grating from being directly exposed in the air, prevents the irreparable damage to the diffraction grating caused by dust and cutting fluid generated by cutting in the cutting process, makes the cutting process possibly applied to the processing treatment of the diffraction grating, realizes the nondestructive cutting of the diffraction grating, realizes the preparation mode of firstly preparing the large-size diffraction grating and then cutting the large-size diffraction grating into the required small-size diffraction grating, and improves the preparation efficiency.
The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the invention, and any modifications, equivalents and improvements made within the spirit and principle of the present invention are intended to be included within the scope of the present invention.
Claims (8)
1. A method of cutting a diffraction grating, comprising the steps of:
s1: protecting the surface of the diffraction grating to be cut to prepare a diffraction grating protection structure;
s2: fixing the diffraction grating protection structure on a cutting machine, and cutting the diffraction grating protection structure into required sizes;
s3: performing surface protection removing treatment on the cut small-size diffraction grating protection structure;
the step S1 includes the steps of:
s11: preparing the diffraction grating, preparing the protective glass with the same surface size as the diffraction grating, and cleaning the protective glass for later use;
s12: vacuum evaporating a separation layer on the surface of the diffraction grating, placing the diffraction grating in a vacuum coating machine, and controlling the vacuum degree in the vacuum coating machine to be 1.0 multiplied by 10-3The separation layer material is evaporated on the surface of the diffraction grating in vacuum with Pa or above to form the separation layer;
s13: continuing vacuum evaporating the reflecting layer, and controlling the vacuum degree in the vacuum coating machine to be in1.0×10-3The material of the reflecting layer is subjected to vacuum evaporation on the separation layer to form the reflecting layer, and the diffraction grating is taken out after the vacuum evaporation is finished;
s14: bonding the protective glass, preparing and uniformly mixing epoxy resin and a curing agent according to a proportion, uniformly coating the epoxy resin mixed with the curing agent on the reflecting layer, covering and laying the protective glass and the surface of the diffraction grating on the epoxy resin, standing and curing to realize bonding of the protective glass and the diffraction grating, and obtaining the diffraction grating protective structure;
the material of the separation layer is 275 silicone oil, and the thickness of the separation layer is less than 10 nm.
2. The method for cutting diffraction gratings according to claim 1, wherein the diffraction grating protection structure is fixed on the cutting machine in step S2 by vacuum suction, or by bonding with paraffin, or by fixing with a clamp.
3. The method for cutting a diffraction grating as claimed in claim 1, wherein the surface protection removing process of step S3 is to cut the protective glass along the edge of the small-sized diffraction grating protection structure with a blade and remove the protective glass.
4. The cutting method for diffraction gratings of claim 1, wherein the reflective layer is a metal reflective layer.
5. The cutting method suitable for the diffraction grating of claim 4, wherein the metal reflective layer is made of any one of Al, Ag and Au.
6. The method of claim 1, wherein the epoxy resin used in the resin layer is 618 # epoxy resin or 6828 # epoxy resin.
7. The cutting method suitable for the diffraction grating as claimed in claim 6, wherein the curing agent adopted by the resin layer is imidazole curing agent.
8. The cutting method for diffraction gratings according to claim 1, wherein the cover glass is a flat optical glass having a thickness of 1 to 3 mm.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201910679691.5A CN110441847B (en) | 2019-07-26 | 2019-07-26 | Cutting method suitable for diffraction grating |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201910679691.5A CN110441847B (en) | 2019-07-26 | 2019-07-26 | Cutting method suitable for diffraction grating |
Publications (2)
Publication Number | Publication Date |
---|---|
CN110441847A CN110441847A (en) | 2019-11-12 |
CN110441847B true CN110441847B (en) | 2021-02-12 |
Family
ID=68431549
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201910679691.5A Active CN110441847B (en) | 2019-07-26 | 2019-07-26 | Cutting method suitable for diffraction grating |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN110441847B (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN116699746A (en) * | 2023-07-31 | 2023-09-05 | 北京至格科技有限公司 | Grating cutting and splitting method with grating protection function |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE10054503B4 (en) * | 2000-11-03 | 2005-02-03 | Ovd Kinegram Ag | Light diffractive binary lattice structure and security element with such a lattice structure |
CN101329419A (en) * | 2008-01-04 | 2008-12-24 | 华工科技产业股份有限公司 | Diffraction grid component and manufacturing method thereof |
CN102515483A (en) * | 2012-01-04 | 2012-06-27 | 周晓辉 | Method for glass cutting, curved surface forming or grating manufacturing |
-
2019
- 2019-07-26 CN CN201910679691.5A patent/CN110441847B/en active Active
Also Published As
Publication number | Publication date |
---|---|
CN110441847A (en) | 2019-11-12 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
KR102024390B1 (en) | Surface protective member and machining method | |
US5650363A (en) | Method for processing thin wafers and solar cells of crystalline silicon | |
CN1655337A (en) | Substrate attaching method | |
CN1617305A (en) | Wafer processing method | |
CN110441847B (en) | Cutting method suitable for diffraction grating | |
MX2011003714A (en) | Method for treating an optical lens for the edging thereof. | |
CN101075580A (en) | Method for cutting crystal wafer | |
CN102736400B (en) | Dustproof pellicle film, manufacturing method thereof, and dustproof pellicle component with pellicle film attached | |
EP1413907A1 (en) | Method for protection of adhesives used to secure optics from ultra-violet light | |
CN114156168A (en) | Composite wafer processing method and super surface prepared by using same | |
CN1907893A (en) | Chamfering method for substrate and method for manufacturing optical element | |
US6483174B1 (en) | Apparatus and method for dicing and testing optical devices, including thin film filters | |
CN110488395B (en) | Diffraction grating protection structure and preparation method thereof | |
TW200306247A (en) | Method for cutting thin film filter work pieces | |
KR20110017379A (en) | Method of fabricating microscale optical structures | |
JP5903168B2 (en) | Method for manufacturing an adhesive film in the form of a precut semiconductor wafer on a dicing tape | |
CN1653365A (en) | Reflecting light polarizer having polarizing film between two sawtooth-shaped surfaces | |
TW406319B (en) | Method of manufacturing inactivated semiconductor devices | |
CN105990100A (en) | Manufacturing method for semiconductor device | |
CN110441115A (en) | A kind of preparation method of multilayer film X-ray zone plate | |
JP3379862B2 (en) | Method of forming antireflection film on light transmitting member | |
JP4273945B2 (en) | Manufacturing method of composite prism | |
TWI278033B (en) | Method for grinding wafer | |
US20080045124A1 (en) | Sawing method for a wafer | |
JP2014067944A (en) | Wafer processing method |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
GR01 | Patent grant | ||
GR01 | Patent grant |