CN110429151A - A kind of packaging method of solar components - Google Patents
A kind of packaging method of solar components Download PDFInfo
- Publication number
- CN110429151A CN110429151A CN201810403379.9A CN201810403379A CN110429151A CN 110429151 A CN110429151 A CN 110429151A CN 201810403379 A CN201810403379 A CN 201810403379A CN 110429151 A CN110429151 A CN 110429151A
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- China
- Prior art keywords
- laminating machine
- laminated
- high temperature
- component
- laminating
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- 238000000034 method Methods 0.000 title claims abstract description 49
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 22
- 238000010030 laminating Methods 0.000 claims abstract description 105
- 238000001816 cooling Methods 0.000 claims abstract description 50
- 238000003475 lamination Methods 0.000 claims abstract description 29
- 239000000463 material Substances 0.000 claims abstract description 28
- 238000003825 pressing Methods 0.000 claims description 35
- 239000004744 fabric Substances 0.000 claims description 32
- 239000003365 glass fiber Substances 0.000 claims description 4
- 239000012528 membrane Substances 0.000 claims description 4
- 229920001342 Bakelite® Polymers 0.000 claims description 3
- 239000004637 bakelite Substances 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 abstract description 13
- 230000007246 mechanism Effects 0.000 description 14
- 238000005538 encapsulation Methods 0.000 description 8
- 230000005540 biological transmission Effects 0.000 description 7
- 238000010438 heat treatment Methods 0.000 description 7
- 230000008901 benefit Effects 0.000 description 4
- 239000011230 binding agent Substances 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 229920001971 elastomer Polymers 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- 230000009471 action Effects 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 239000003292 glue Substances 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 239000003381 stabilizer Substances 0.000 description 2
- 238000010792 warming Methods 0.000 description 2
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 1
- BTBUEUYNUDRHOZ-UHFFFAOYSA-N Borate Chemical compound [O-]B([O-])[O-] BTBUEUYNUDRHOZ-UHFFFAOYSA-N 0.000 description 1
- 229920000742 Cotton Polymers 0.000 description 1
- BPQQTUXANYXVAA-UHFFFAOYSA-N Orthosilicate Chemical compound [O-][Si]([O-])([O-])[O-] BPQQTUXANYXVAA-UHFFFAOYSA-N 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 239000000498 cooling water Substances 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 230000003628 erosive effect Effects 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 238000012536 packaging technology Methods 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 239000002694 phosphate binding agent Substances 0.000 description 1
- 238000010248 power generation Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 230000002787 reinforcement Effects 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 239000000523 sample Substances 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 239000000741 silica gel Substances 0.000 description 1
- 229910002027 silica gel Inorganic materials 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
- 230000037303 wrinkles Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/042—PV modules or arrays of single PV cells
- H01L31/048—Encapsulation of modules
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
- H01L31/186—Particular post-treatment for the devices, e.g. annealing, impurity gettering, short-circuit elimination, recrystallisation
- H01L31/1864—Annealing
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Abstract
A kind of packaging method of solar components, which comprises the component to be laminated being made of solar battery sheet and encapsulating material is placed on heat-insulated high temperature plate；Laminating machine is heated to the laminating temperature of setting, component to be laminated and heat-insulated high temperature plate are sent into laminating machine, vacuumized, are pressurizeed；Alternatively, component to be laminated and heat-insulated high temperature plate are sent into laminating machine, are vacuumized, pressurizeed, laminating machine is heated to the laminating temperature of setting；Wherein, it completes to vacuumize and pressurization steps before the temperature of component to be laminated reaches the thermal distorsion temperature of encapsulating material；Laminated compenent is treated to be laminated；And the solar components for completing lamination and heat-insulated high temperature plate are subjected to pressure maintaining cooling.The packaging method of the solar components of the application avoids the generation of the bad orders such as lightning line, ripple glaze, and production efficiency is higher.
Description
Technical field
This application involves but be not limited to technical field of solar, be particularly, but not limited to a kind of encapsulation of solar components
Method.
Background technique
The main component of solar photovoltaic battery component is solar battery sheet.Since solar battery sheet cannot be directly sudden and violent
It is exposed under the natural conditions such as sunlight, rainwater, therefore, the practical application of Yao Shixian solar power generation is it is necessary to using specific material
Protectiveness encapsulation is carried out to it, and forms battery component, guarantees that it in effective life cycle, is invaded from physics and chemistry
Erosion, makes it provide reliable and stable output.Lamination is a kind of solar components packaging method being widely used, and lamination refers to true
It is with the method for heating, pressurization, the identical or different encapsulating material of multilayer is integral in conjunction with solar battery sheet under empty condition
Method for processing forming.
Flexible solar component, which refers to, has flexibility, foldable, curling solar components.Current flexible solar group
What part encapsulation used is all the ultra-thin membrane material of various functions, preferably to embody light, thin, the soft characteristic of thin-film solar cells.
But since the thickness of ultra-thin membrane material is excessively thin, temperature distortion between different materials, the amount of contracting on cooling it is widely different, cause it is flexible too
It is positive can the encapsulation of component to be easy to produce the bad orders such as obvious, the obvious difference in height of lightning line, ripple glaze, internal cabling trace existing
As so the encapsulation difficulty of flexible solar component is very big.For the encapsulation of flexible solar component, used in industry at present
It is the technique of alternating temperature lamination, that is, so that component to be laminated is entered laminating machine in low temperature, pressurize under vacuum conditions, then gradually
It is warming up to laminating temperature, is kept for a period of time after reaching laminating temperature, then by laminating machine heated flat in the way of recirculated water cooling
Platform cools down and keeps pressure constant, takes out after component is cooling.Wherein, component to be laminated is made to enter laminating machine in low temperature, it can
With the generation of effectively controllable lightning line；Component to be laminated is set to complete bonding encapsulation at high temperature；The component for completing to encapsulate is set to exist
Laminating machine is left under low temperature can prevent the generation of other bad orders such as ripple glaze.
Summary of the invention
It is the general introduction to the theme being described in detail herein below.This general introduction is not the protection model in order to limit claim
It encloses.
The inventor of the present application discovered that although existing alternating temperature laminating technology can be to avoid appearances such as lightning line, ripple glazes not
Good generation, but there is also some disadvantages, be summarized as follows: (1) equipment investment of water-cooling circulating system is big, energy consumption is high；And
The use of water-cooling circulating system is so that need to further improve production cost to the transformation of being customized of equipment.(2) entire envelope
All steps in dress technique are all completed in laminating machine, and a collection of component completes after entire packaging technology next group product could be into
Enter laminating machine, causes production efficiency low；Meanwhile carry out heating, cooling repeatedly, lamination times are extended, further reduced
Production efficiency.(3) lamination machine platform because being subjected to temperature shock, service life reduction repeatedly.
To existing packaging method there are the problem of deeply probe on the basis of, this application provides a kind of products without appearance
The packaging method of the higher solar components of bad phenomenon, production efficiency.
Specifically, this application provides a kind of packaging method of solar components, the method includes the following steps: will be by
The component to be laminated of solar battery sheet and encapsulating material composition is placed on heat-insulated high temperature plate；
Laminating machine is heated to the laminating temperature of setting, component to be laminated and heat-insulated high temperature plate are sent into laminating machine, carried out
It vacuumizes, pressurize；Alternatively, component to be laminated and heat-insulated high temperature plate are sent into laminating machine, are vacuumized, pressurizeed, by laminating machine
It is heated to the laminating temperature of setting；Wherein, it completes to take out before the temperature of component to be laminated reaches the thermal distorsion temperature of encapsulating material
Vacuum and pressurization steps；
Laminated compenent is treated to be laminated；And
It is cooling that the solar components for completing lamination and heat-insulated high temperature plate are subjected to pressure maintaining.
It should be noted that component to be laminated and heat-insulated high temperature plate are first sent into laminating machine, then laminating machine is heated to setting
The technical solution of fixed laminating temperature includes following situations: the initial temperature of laminating machine is not equal to room temperature or first adds laminating machine
Component to be laminated and heat-insulated high temperature plate are sent into laminating machine by the certain temperature of heat to less than the laminating temperature of setting, then will lamination
Machine is heated to the laminating temperature of setting, i.e., component to be laminated and heat-insulated high temperature plate are sent into lamination in laminating machine temperature-rise period
Machine.
In the technical solution of the application, term " component to be laminated " is defined as being laid on solar battery sheet surface
Good encapsulating material waits the combination of solar battery sheet and encapsulating material to be laminated.
In the technical solution of the application, term " thermal distorsion temperature " is defined as encapsulating material and out-of-flatness, warpage, pleat occurs
The temperature when deformation such as wrinkle.
In some embodiments, laminating machine can be first heated to the laminating temperature of setting, then by component to be laminated and
The laminating machine that heat-insulated high temperature plate is sent into.
In some embodiments, the pressure maintaining cooling step can be with are as follows: will complete the solar components output layer of lamination
Outside press, pressure maintaining cooling is carried out using cold pressing device, maintains pressure constant in cooling procedure.
In some embodiments, the cold pressing device may include:
The first nip portion and the second nip portion being oppositely arranged, first nip portion and second nip portion are opposite
Face is plane, and the pressing area for accommodating laminated compenent, institute are formed between first nip portion and second nip portion
The gap stated between the first nip portion and second nip portion is adjustable；
For carrying out cooling cooling body to the workpiece to be added being located in the pressing area.
In some embodiments, the cold pressing device can also include: for driving second nip portion to go up and down
Driving mechanism.
In some embodiments, the cold pressing device can also include bracket, and first nip portion is horizontally arranged
On the bracket, second nip portion is arranged below first nip portion.
In some embodiments, the lower surface of first nip portion is also provided with buffer protection plate.
In some embodiments, the cooling body may include cooling coil, and the cooling coil can be set
The outer surface of first nip portion and/or second nip portion.
In some embodiments, the cold pressing device can also include transmission mechanism, and the transmission mechanism can be set
In second nip portion, the pressing area is detached from for transmitting workpiece to be added.
In some embodiments, the transmission mechanism may include at least one driving roller bearing, second nip portion
On be provided with and slot correspondingly with the driving idler wheel, and the fluting can be used for accommodating corresponding driving idler wheel, described
Driving roller bearing is for driving workpiece motion s to be added.The driving roller bearing outer peripheral edge is also provided with friction rubber mat.
In some embodiments, the cold pressing device can also include: for detecting the pressure in the pressing area
Pressure sensor.
In some embodiments, the heat-insulated high temperature plate can be selected from any one in bakelite plate and glass mat
Or more.
In some embodiments, the bakelite plate can be by the work of any one or two kinds in cotton and brown paper
It presses to be formed with the phenolic resin as resin binder for reinforcement.
In some embodiments, the glass mat can be by glass fibre and selected from silicate binder, super resistance to
In hot epoxy resin, phosphate binder and borate binder any one or more binder shape glued together
At.
In some embodiments, described the step of vacuumizing, pressurizeing, can be with are as follows: while to the epicoele and cavity of resorption of laminating machine
It vacuumizes, is connected to laminating machine epicoele with external environment after vacuumizing a period of time, so that the pressure in laminating machine epicoele and outer
Boundary's environmental pressure is identical, and persistently vacuumizes to laminating machine cavity of resorption, pressurizes to treat laminated compenent.
In some embodiments, described a period of time can be 3~8 minutes, can simultaneously to the epicoele of laminating machine and
Cavity of resorption is evacuated to 200~30Pa.
In some embodiments, the pressure in laminating machine epicoele, which reaches the time identical with ambient pressure environment, to be
0.5~1.5 minute.
In some embodiments, the laminating temperature can be 90~160 DEG C.
In some embodiments, the time of the lamination can be 8~50 minutes.
In some embodiments, the pressure in the pressure maintaining cooling step can be 0.5~1 standard atmospheric pressure.
In some embodiments, the encapsulating material can be thickness in 100 microns of membrane materials below.
In some embodiments, the method may include following step:
Laminating machine is heated to the laminating temperature of setting；
Successively be laid on heat-insulated high temperature plate the first anti-sticking high temperature cloth, by solar battery sheet and encapsulating material form to
Laminated compenent and the second anti-sticking high temperature cloth are sent into laminating machine；
The epicoele and cavity of resorption of laminating machine are vacuumized simultaneously, make laminating machine epicoele and external environment after vacuumizing a period of time
Connection, and persistently laminating machine cavity of resorption is vacuumized, it pressurizes to treat laminated compenent, wherein in the temperature of component to be laminated
Degree, which reaches, to be completed before the thermal distorsion temperature of encapsulating material to vacuumize and pressurization steps；
When the temperature of component to be laminated reaches the laminating temperature of setting, start to be laminated；
After lamination, component, heat-insulated high temperature plate, the first anti-sticking high temperature cloth and the second anti-sticking high temperature cloth of lamination will be completed
It is delivered to outside laminating machine, is cooled down using cold pressing device, maintain pressure constant in cooling procedure.
In some embodiments, area shared by the described first anti-sticking high temperature cloth and the described second anti-sticking high temperature cloth can be with
It is equal.
In some embodiments, area shared by the component to be laminated can be less than the described first anti-sticking high temperature cloth and
Area shared by the second anti-sticking high temperature cloth.
In some embodiments, area shared by the described first anti-sticking high temperature cloth and the second anti-sticking high temperature cloth can be with
Less than area shared by the heat-insulated high temperature plate.
The packaging method of the solar components of the application can obtain it is following the utility model has the advantages that
1, the generation of the bad orders such as lightning line, ripple glaze is avoided.
2, it can reduce equipment investment, avoid that being customized of equipment is transformed, reduce production cost.
3, it carry out the pressure maintaining cooling outside component lamination and laminating machine can simultaneously, improve production efficiency.
4, production efficiency can be improved, and improve heating platform of laminating machine to avoid heating, cooling is repeated
Service life.
Other features and advantage will illustrate in the following description, also, partly become from specification
It obtains it is clear that being understood and implementing the application.The purpose of the application and other advantages can be by specifications, right
Specifically noted structure is achieved and obtained in claim and attached drawing.
Detailed description of the invention
Attached drawing is used to provide to further understand technical scheme, and constitutes part of specification, with this
The embodiment of application is used to explain the technical solution of the application together, does not constitute the limitation to technical scheme.
Fig. 1 is the process flow chart of the packaging method of the solar components of the embodiment of the present application 2；
Fig. 2 is the structural schematic diagram for the cold pressing device that the embodiment of the present application 2 uses；
Fig. 3 is the structural schematic diagram of the transmission mechanism for the cold pressing device that the embodiment of the present application 2 uses；
Fig. 4 is the main view for the cold pressing device that the embodiment of the present application 2 uses；
Fig. 5 is the appearance of the solar components obtained using the packaging method of existing packaging method and the embodiment of the present application 2
Comparison diagram.
Description of symbols:
The first nip portion of 11-, the second nip portion of 12-, 13- fluting, 2- drive roller bearing, 21- friction rubber mat, 3- driving machine
Structure, 4- bracket, 41- skeleton, 42- bottom plate, 43- stabilizer blade.
Specific embodiment
For the purposes, technical schemes and advantages of the application are more clearly understood, below in conjunction with attached drawing to the application
Embodiment be described in detail.It should be noted that in the absence of conflict, in the embodiment and embodiment in the application
Feature can mutual any combination.
The heat-insulated high temperature plate used in following embodiment is the glass fibers that is formed by glass fibre and super heat resistant epoxide resin
Plate is tieed up, solar battery sheet can be any type of solar battery sheet.
Embodiment 1
(1) heat-insulated high temperature plate is put on the feeding platform of laminating machine, tile on heat-insulated high temperature plate one it is first anti-sticking
The component to be laminated being made of solar battery sheet and encapsulating material is placed in anti-sticking high temperature cloth by high temperature cloth, and to layer
Tile a second anti-sticking high temperature cloth again on pressure component, wherein first is anti-sticking described in area < shared by the component to be laminated
Area shared by heat-insulated high temperature plate described in area < shared by area shared by high temperature cloth=second anti-sticking high temperature cloth；
(2) laminating machine is warming up to 90~160 DEG C of laminating temperature of setting, before heating or in temperature-rise period will it is described every
Hot high temperature plate, the first anti-sticking high temperature cloth, the second anti-sticking high temperature cloth and the component to be laminated are sent to the warm table of laminating machine
On；
(3) epicoele and cavity of resorption of laminating machine are vacuumized simultaneously, slowly opens laminating machine epicoele after vacuumizing 3~8 minutes
Air valve, be connected to laminating machine epicoele with external environment, and identical as ambient pressure environment in 1 minute, it is persistently right during this
Laminating machine cavity of resorption vacuumizes, and pressurizes to treat laminated compenent, wherein reaches encapsulating material in the temperature of component to be laminated
Thermal distorsion temperature before complete to vacuumize and pressurization steps；
(4) component to be laminated constantly heats up, until encapsulating material is in temperature when reaching 90~160 DEG C of laminating temperature of setting
It is flowed under the action of degree and pressure, glue connection gradually occurs, that is, starts to be laminated, terminates lamination after 8~50 minutes；
(5) cooled down by the water-cooling circulating system of laminating machine to heating platform and keep pressure constant, until component
It is cooling.
(6) epicoele of laminating machine is vacuumized, cavity of resorption is deflated, and is uncapped, is taken out cooling component, heat-insulated high temperature plate, first
Anti-sticking high temperature cloth and the second anti-sticking high temperature cloth.
The time that component to be packaged reaches laminating temperature is extended using heat-insulated high temperature plate in the present embodiment, is effectively prevented
The generation of the bad orders such as lightning line；Meanwhile the component for completing encapsulation leaves laminating machine after pressure maintaining is cooling and can prevent wave
The generation of other bad orders such as line.In addition, being directly placed into component to be packaged in the laminating machine of high temperature, work as laminating machine
In when being not put into component to be packaged, can be heated up with faster rate, then place into component to be packaged, in certain journey
Production efficiency is improved on degree.
Embodiment 2
(1) laminating machine is heated to 90~160 DEG C of laminating temperature of setting；
(2) heat-insulated high temperature plate is put on the feeding platform of laminating machine, tile on heat-insulated high temperature plate one it is first anti-sticking
The component to be laminated being made of solar battery sheet and encapsulating material is placed in anti-sticking high temperature cloth by high temperature cloth, and to layer
Tile a second anti-sticking high temperature cloth again on pressure component, wherein first is anti-sticking described in area < shared by the component to be laminated
Area shared by heat-insulated high temperature plate described in area < shared by area shared by high temperature cloth=second anti-sticking high temperature cloth；
(3) the heat-insulated high temperature plate, the anti-sticking high temperature cloth and the component to be laminated are sent to the layer for having reached setting
On the warm table for pressing the laminating machine of temperature；
(4) epicoele and cavity of resorption of laminating machine are vacuumized simultaneously, slowly opens laminating machine epicoele after vacuumizing 3~8 minutes
Air valve, be connected to laminating machine epicoele with external environment, and identical as ambient pressure environment in 1 minute, it is persistently right during this
Laminating machine cavity of resorption vacuumizes, and pressurizes to treat laminated compenent, wherein reaches encapsulating material in the temperature of component to be laminated
Thermal distorsion temperature before complete to vacuumize and pressurization steps；
(5) component to be laminated constantly heats up, until encapsulating material is in temperature when reaching 90~160 DEG C of laminating temperature of setting
It is flowed under the action of degree and pressure, glue connection gradually occurs, that is, starts to be laminated, terminates lamination after 8~50；
(6) epicoele of laminating machine is vacuumized, cavity of resorption deflate, uncap, take out complete lamination component, heat-insulated high temperature plate,
First anti-sticking high temperature cloth and the second anti-sticking high temperature cloth；
(7) component, heat-insulated high temperature plate and the anti-sticking high temperature cloth that complete lamination are transported on the cooling platform of cold pressing device,
Starting cold pressing device is cooled down, and applies the pressure of a standard atmospheric pressure to component, and is continued until that component completes cooling.
Wherein, the structure of the cold pressing device is as in Figure 2-4, comprising:
The first nip portion 11 and the second nip portion 12 being oppositely arranged, first nip portion 11 and second nip portion
12 opposite faces are plane, are formed between first nip portion 11 and second nip portion 12 for accommodating laminated compenent
Pressing area, the gap between first nip portion 11 and second nip portion 12 is adjustable；
For carrying out cooling cooling body to the workpiece to be added being located in the pressing area.
The cold pressing device can also include: the driving mechanism 3 for driving second nip portion 12 to go up and down.Driving machine
Structure 3 can also drive the first nip portion 11 go up and down, can also drive simultaneously the first nip portion 11 and the second nip portion 12 it is relatively close or
It is separate.There are many implementations of driving mechanism 3, can be the structures such as spring, hydraulic, mechanical arm, as long as being able to achieve the first pressure
Conjunction portion 11 and the second nip portion 12 are relatively close or separate.
The cold pressing device can also include bracket 4, the horizontal setting of first nip portion 11 on the bracket 4,
Second nip portion 12 is arranged below first nip portion 11；And second nip portion 12 is located at the driving mechanism
On 3, the driving mechanism 3 is arranged on bracket 4.The bracket 4 may include positioned at the top of the second nip portion 12 skeleton 41,
Bottom plate 42 positioned at the lower section of the second nip portion 12 is equipped with stabilizer blade 43 below bottom plate 42, and first nip portion 11 is arranged described
The lower surface of skeleton 41, the driving mechanism 3 are arranged on the bottom plate 42, and the driving mechanism 3 drives second pressing
Portion 12 is close to or far from first nip portion 11.
The lower surface of first nip portion 11 is also provided with buffer protection plate.Buffer protection plate generally uses silica gel
Plate is laid in the lower surface of the first nip portion 11, and thickness is generally 5-6mm, not so as to upper surface to machined part
Rule convexes to form protection, prevents the pressure of the first nip portion 11 from generating damage to it.
The cooling body may include cooling coil, and the cooling coil can be set in first nip portion 11
And/or the outer surface of second nip portion 12.Outer surface referred herein does not include the first nip portion 11 towards second
Nip portion 12 and the second nip portion 12 towards the first nip portion 11 while.Wherein, the implementation of cooling body
There are many, water cooling, air-cooled, natural cooling etc. can be used, for example, the cooling coil using water cooling, i.e., by being connected with cooling water
Docile is in 12 outer surface of the first nip portion 11 and/or the second nip portion, to realize quickly to workpiece to be added therein is clamped
It is uniformly cooling, while workpiece to be added is not influenced.
It is required to before clamping or after clamping so that workpiece to be added moves automatically, to greatly improve the degree of automation.Cause
This, the cold pressing device can also include transmission mechanism, and the transmission mechanism can be set in second nip portion 12, use
Pressing area is detached from transmitting workpiece to be added.The transmission mechanism may include at least one driving roller bearing 2, second nip portion
Be provided on 12 with the fluting 13 correspondingly of the driving roller bearing 2, and the fluting 13 can be used for accommodating corresponding driving and roll
Axis 2, the driving roller bearing 2 is for driving workpiece motion s to be added.2 outer peripheral edge of driving roller bearing is also provided with friction rubber mat
21。
The cold pressing device can also include pressure sensor, can be set in first nip portion 11 and described the
It between two nip portion 12, also can be set in other positions, pass through pressure sensor senses and the pressure of regulation to machined part.
The time that component to be packaged reaches laminating temperature is extended using heat-insulated high temperature plate in the present embodiment, is effectively prevented
The generation of the bad orders such as lightning line, while the pressure maintaining cooling in cold pressing device can prevent other bad orders such as ripple glaze
Generation.
In addition, the present embodiment can reduce the generation of bad order using cold pressing device, and improve the power stability of component
Property.Moreover, the investment of cold pressing device is small, water-cooling circulating system is replaced using cold pressing device, without changing to being customized of equipment
It makes, further reduced equipment investment.Moreover, laminating machine is occupied when avoiding cooling, so that outside component lamination and laminating machine
Pressure maintaining cooling can carry out simultaneously, improve production efficiency.
The packaging method of the present embodiment only need to once be heated up when starting laminating machine, can maintain lamination temperature later
The lamination of different batches of product is persistently carried out under degree, until production terminates.It is therefore not necessary to which heating cooling repeatedly, improves production
Efficiency and laminating machine service life.
The lamination times of existing laminating method are 2~2.5 hours, the lamination times of the packaging method of the present embodiment are 20~
30 minutes, lamination times are significantly shortened, production efficiency is made to improve 4 times or more.
Fig. 5 is the appearance of the solar components obtained using the packaging method of existing packaging method and the embodiment of the present application 2
Comparison diagram, the left solar components obtained for existing packaging method of figure, the figure right side are that the packaging method of the embodiment of the present application 2 obtains
Solar components.It can be seen from the figure that the solar components that the packaging method of the embodiment of the present application 2 obtains without bad order
Phenomenon can obtain the product as existing packaging method with good appearance.
Although embodiment disclosed by the application is as above, the content only for ease of understanding the application and use
Embodiment is not limited to the application.Technical staff in any the application fields, is taken off not departing from the application
Under the premise of the spirit and scope of dew, any modification and variation, but the application can be carried out in the form and details of implementation
Scope of patent protection, still should be subject to the scope of the claims as defined in the appended claims.
Claims (13)
1. a kind of packaging method of solar components, the method includes the following steps:
The component to be laminated being made of solar battery sheet and encapsulating material is placed on heat-insulated high temperature plate；
Laminating machine is heated to the laminating temperature of setting, component to be laminated and heat-insulated high temperature plate are sent into laminating machine, take out true
Empty, pressurization；Alternatively, component to be laminated and heat-insulated high temperature plate are sent into laminating machine, are vacuumized, pressurizeed, laminating machine is heated
To the laminating temperature of setting；Wherein, it completes to vacuumize before the temperature of component to be laminated reaches the thermal distorsion temperature of encapsulating material
And pressurization steps；
Laminated compenent is treated to be laminated；And
It is cooling that the solar components for completing lamination and heat-insulated high temperature plate are subjected to pressure maintaining.
2. according to the method described in claim 1, wherein, laminating machine to be first heated to the laminating temperature of setting, then will be to be laminated
The laminating machine that component and heat-insulated high temperature plate are sent into.
3. according to the method described in claim 1, wherein, the pressure maintaining cooling step are as follows: the solar components of lamination will be completed
It exports outside laminating machine, pressure maintaining cooling is carried out using cold pressing device, maintains pressure constant in cooling procedure.
4. according to the method described in claim 3, wherein, the cold pressing device includes:
The first nip portion and the second nip portion being oppositely arranged, first nip portion and second nip portion it is opposite face it is equal
For plane, the pressing area for accommodating laminated compenent is formed between first nip portion and second nip portion, described
Gap between one nip portion and second nip portion is adjustable；
For carrying out cooling cooling body to the workpiece to be added being located in the pressing area.
5. method according to any of claims 1-4, wherein the heat-insulated high temperature plate is selected from bakelite plate and glass fibers
Tie up any one in plate or more.
6. method according to any of claims 1-4, wherein described the step of vacuumizing, pressurizeing are as follows: while to layer
The epicoele and cavity of resorption of press vacuumize, and are connected to laminating machine epicoele with external environment after vacuumizing a period of time, so that laminating machine
Pressure in epicoele is identical as ambient pressure environment, and persistently vacuumizes to laminating machine cavity of resorption, to treat laminated compenent progress
Pressurization.
7. according to the method described in claim 6, wherein, described a period of time is 3~8 minutes, while to the epicoele of laminating machine
200~30Pa is evacuated to cavity of resorption.
8. according to the method described in claim 6, wherein, the pressure in laminating machine epicoele reaches identical with ambient pressure environment
Time is 0.5~1.5 minute.
9. method according to any of claims 1-4, wherein the laminating temperature is 90~160 DEG C.
10. according to the method described in claim 9, wherein, the time of the lamination is 8~50 minutes.
11. method according to any of claims 1-4, wherein pressure in the pressure maintaining cooling step is 0.5~
1 standard atmospheric pressure.
12. method according to any of claims 1-4, wherein the encapsulating material is thickness at 100 microns or less
Membrane material.
13. a kind of packaging method of solar components, the method includes the following steps:
Laminating machine is heated to the laminating temperature of setting；
The first anti-sticking high temperature cloth is successively laid on heat-insulated high temperature plate, be made of solar battery sheet and encapsulating material it is to be laminated
Component and the second anti-sticking high temperature cloth are sent into laminating machine；
The epicoele and cavity of resorption of laminating machine are vacuumized simultaneously, connect laminating machine epicoele and external environment after vacuumizing a period of time
It is logical, and persistently laminating machine cavity of resorption is vacuumized, it pressurizes to treat laminated compenent, wherein in the temperature of component to be laminated
Reach and completes before the thermal distorsion temperature of encapsulating material to vacuumize and pressurization steps；
When the temperature of component to be laminated reaches the laminating temperature of setting, start to be laminated；
After lamination, the component for completing lamination, heat-insulated high temperature plate, the first anti-sticking high temperature cloth and the second anti-sticking high temperature cloth are conveyed
It to outside laminating machine, is cooled down using cold pressing device, maintains pressure constant in cooling procedure.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810403379.9A CN110429151B (en) | 2018-04-28 | 2018-04-28 | Packaging method of solar module |
| PCT/CN2019/084532 WO2019206275A1 (en) | 2018-04-28 | 2019-04-26 | Solar assembly packaging method and packaging device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810403379.9A CN110429151B (en) | 2018-04-28 | 2018-04-28 | Packaging method of solar module |
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| CN110429151B CN110429151B (en) | 2021-11-09 |
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| CN201810403379.9A Active CN110429151B (en) | 2018-04-28 | 2018-04-28 | Packaging method of solar module |
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| WO (1) | WO2019206275A1 (en) |
Cited By (2)
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| CN111722602A (en) * | 2020-05-22 | 2020-09-29 | 中建材光芯科技有限公司 | Automatic hot-press molding system of optical fiber panel and working method |
| CN113193077A (en) * | 2021-04-06 | 2021-07-30 | 湖北美格新能源科技有限公司 | Solar module laminating method |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114583010B (en) * | 2022-02-24 | 2023-04-07 | 晟高发新能源发展(江苏)有限公司 | Solar crystalline silicon cell module laminating machine and laminating method |
| CN115148847B (en) * | 2022-05-23 | 2023-07-25 | 江苏瑞晶太阳能科技有限公司 | Automatic packaging equipment for photovoltaic module |
| CN115148854B (en) * | 2022-07-05 | 2023-07-07 | 苏州伟昇智能装备有限公司 | Solar module high temperature cloth takes out equipment |
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Also Published As
| Publication number | Publication date |
|---|---|
| CN110429151B (en) | 2021-11-09 |
| WO2019206275A1 (en) | 2019-10-31 |
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