CN110429055A - A kind of quartz bar production method, grooving method and quartz cell boat - Google Patents
A kind of quartz bar production method, grooving method and quartz cell boat Download PDFInfo
- Publication number
- CN110429055A CN110429055A CN201910715106.2A CN201910715106A CN110429055A CN 110429055 A CN110429055 A CN 110429055A CN 201910715106 A CN201910715106 A CN 201910715106A CN 110429055 A CN110429055 A CN 110429055A
- Authority
- CN
- China
- Prior art keywords
- quartz bar
- quartz
- trough
- completed
- belt
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 title claims abstract description 144
- 239000010453 quartz Substances 0.000 title claims abstract description 142
- 238000000034 method Methods 0.000 title claims abstract description 28
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 23
- 238000005498 polishing Methods 0.000 claims abstract description 48
- 238000000137 annealing Methods 0.000 claims abstract description 36
- 238000005520 cutting process Methods 0.000 claims abstract description 33
- 238000005554 pickling Methods 0.000 claims abstract description 11
- 238000000227 grinding Methods 0.000 claims abstract description 10
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 claims description 36
- 238000004140 cleaning Methods 0.000 claims description 18
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 18
- 238000007654 immersion Methods 0.000 claims description 12
- 239000002253 acid Substances 0.000 claims description 3
- 239000004575 stone Substances 0.000 claims 1
- 239000011347 resin Substances 0.000 description 4
- 229920005989 resin Polymers 0.000 description 4
- 238000009991 scouring Methods 0.000 description 3
- 238000009792 diffusion process Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
- B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
- B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
- B24B7/228—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding thin, brittle parts, e.g. semiconductors, wafers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B9/00—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor
- B24B9/02—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground
- B24B9/06—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain
- B24B9/065—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of thin, brittle parts, e.g. semiconductors, wafers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24C—ABRASIVE OR RELATED BLASTING WITH PARTICULATE MATERIAL
- B24C1/00—Methods for use of abrasive blasting for producing particular effects; Use of auxiliary equipment in connection with such methods
- B24C1/04—Methods for use of abrasive blasting for producing particular effects; Use of auxiliary equipment in connection with such methods for treating only selected parts of a surface, e.g. for carving stone or glass
- B24C1/045—Methods for use of abrasive blasting for producing particular effects; Use of auxiliary equipment in connection with such methods for treating only selected parts of a surface, e.g. for carving stone or glass for cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/67333—Trays for chips
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
Abstract
The invention proposes a kind of quartz bar production method, grooving method and quartz cell boat, which includes the cutting of quartzy ingot being carried out using cutting equipment, and form quartz bar after dicing；Pickling processes are carried out to the quartz bar formed after cutting；Stock removal polishing processing is carried out to the quartz bar that a pickling is completed；The quartz bar that stock removal polishing is completed once is made annealing treatment；The grooving method includes that the quartz bar completed to primary annealing carries out slot treatment；The trough of belt quartz bar that cross-notching is completed carries out grinding process；The trough of belt quartz bar that polishing is completed carries out white picking and carries out the trough of belt quartz bar progress white picking that polishing is completed in white picking to the trough of belt quartz bar completed of polishing；Second polishing is carried out to the trough of belt quartz bar that white picking is completed；Double annealing is carried out to the trough of belt quartz bar after second polishing；Pickling three times is carried out to the trough of belt quartz bar after double annealing；Quartz bar production method, grooving method and quartz cell boat disclosed by the invention shorten fabrication cycle under the premise of increasing service life, and reduce use cost.
Description
Technical field
The present invention relates to quartz cell boat field, a kind of quartz bar production method, grooving method and quartz cell are particularly related to
Boat.
Background technique
Quartz cell boat is mainly used for the oxidized diffusion process in IC Chip Production line, the load as carrying wafer
Body is the key basic material in chip fabrication processes；
Quartz cell boat in the prior art is the support for needing to configure quartz pushrod (slot stick) the progress wafer of several flutings,
And the slot stick thickness actually used is thicker, is difficult to throw thoroughly by normal hand polish, is very easy to generate stress, causes to fry
It splits.Meanwhile in the oxidized diffusion process of chip, heated fast outside wafer by high-temperature heating, inside is heated slow, is formed
The temperature difference, will generate micro-deformation, and quartz cell stile and wafer generate friction, will generate tiny silica dust, continue
In the state of high temperature, silica dust can also be taken on wafer, causing amounts of particles is more than the number of semiconductor standard requirement
Amount reduces so as to cause the yield of wafer finished product.
Summary of the invention
The present invention proposes a kind of quartz bar production method, grooving method and quartz cell boat, solves in the prior art because of skill
The limitation of art can not complete the problem of meeting the quartz cell boat that technique requires.
The technical scheme of the present invention is realized as follows:
A kind of quartz bar production method, comprising:
S11, the cutting that quartzy ingot is carried out using cutting equipment, and quartz bar is formed after dicing；
S12, a pickling processes are carried out to the quartz bar formed after cutting in S1 step；
S13, stock removal polishing processing is carried out to the quartz bar that S2 step 1 hypo acid washes；
S14, the quartz bar that S3 step stock removal polishing is completed once is made annealing treatment, it is stand-by after the completion of primary annealing.
As further technical solution, the S1 step includes:
S111, the cutting that quartzy ingot is carried out using cast-cutting saw, and quartz plate is formed after dicing；
S112, the quartz plate formed after cutting in S11 step is cut using water-jet cutting machine, and after dicing
Form quartz bar.
As further technical solution, the S12 step includes:
The quartz bar formed after cutting in S11 step is placed in hydrofluoric acid solution, is impregnated 2-5 hours；After the completion of immersion
It is stand-by after pure water cleaning.
As further technical solution, the S14 step includes:
The quartz bar that S13 step stock removal polishing is completed is placed in 1000-1180 DEG C of temperature of annealing furnace, constant temperature 30-60
Minute, it is stand-by after the completion of primary annealing.
The invention also discloses the grooving methods of a kind of pair of quartz bar, include the following steps:
S21, the quartz bar completed to primary annealing carry out slot treatment；It is stand-by that trough of belt quartz bar is formed after the completion of fluting；
The trough of belt quartz bar that S22, cross-notching are completed carries out grinding process；
S23, white picking is carried out to the trough of belt quartz bar completed by S22 polishing, after the completion for use；
S24, second polishing is carried out to the trough of belt quartz bar that white picking in S23 step is completed；
S25, double annealing is carried out to the trough of belt quartz bar after S24 step second polishing；
S26, pickling three times is carried out to the trough of belt quartz bar after double annealing.
Preferably, the S21 step specifically: the trough of belt quartz bar that annealing is completed is placed in numerical control groover and is carried out
It slots, it is stand-by after the completion of fluting.
As further technical solution, the S22 step includes:
S221, the trough of belt quartz bar outer surface completed by flat-grinding machine cross-notching polish；
S222, chamfered is carried out to trough of belt quartz bar quadrangle using flat-grinding machine.
As further technical solution, the S23 step are as follows:
The trough of belt quartz bar formed after polishing in S21 step is placed in hydrofluoric acid solution, is impregnated 2-5 hours；It has impregnated
At stand-by after the cleaning of rear pure water.
Preferably, the S26 step are as follows: it is molten that the trough of belt quartz bar that second polishing in S25 step is completed is placed in hydrofluoric acid
2-5 hours in liquid；It is stand-by after pure water cleaning after the completion of immersion.
The invention also discloses a kind of quartz cell boats, including the trough of belt quartz bar to be completed by grooving method.
Technical solution of the present invention carries out the production of quartz bar by quartz bar production method, and has been made by this method
At quartz bar quartz bar is slotted, and completed by grooving method the quartz bar of trough of belt be applied to quartz
After boat, so that the use temperature of quartz boat when in use is expanded to 1200 degrees Celsius；And constant temperature time is compared with long, deformation quantity is small, with
The quartz boat to complete in the prior art reaches very big promotion compared to service life.
Specific embodiment
The following is a clear and complete description of the technical scheme in the embodiments of the invention, it is clear that described implementation
Example is only a part of the embodiment of the present invention, instead of all the embodiments.Based on the embodiments of the present invention, this field is general
Logical technical staff every other embodiment obtained without creative efforts, belongs to protection of the present invention
Range.
The invention proposes a kind of quartz bar production methods, comprising:
The cutting of quartzy ingot is carried out using cutting equipment, and forms quartz bar after dicing；In the present invention, need into
The operation of two step of row, i.e., carry out the cutting of quartzy ingot using cast-cutting saw, and forms quartz plate after dicing；Reuse high pressure waterjet
Machine cuts the quartz plate formed after cutting, and forms quartz bar after dicing；It is prepared after completing quartzy ingot cutting in this way
It is stand-by to complete quartz bar；
Pickling processes are carried out to the quartz bar formed after cutting；Specifically, the quartz bar formed after cutting is placed in
2-5 hours in hydrofluoric acid solution；It is stand-by after pure water cleaning after the completion of immersion；
It can choose in the present invention: the quartz bar formed after cutting be placed in hydrofluoric acid solution, impregnate 2 hours；It impregnates
It is stand-by after pure water cleaning after the completion；It can choose in the present invention；
It may also choose that can choose in the present invention: the quartz bar formed after cutting being placed in hydrofluoric acid solution, is soaked
Bubble 4 hours；It is stand-by after pure water cleaning after the completion of immersion；
It may also choose that can choose in the present invention: the quartz bar formed after cutting being placed in hydrofluoric acid solution, is soaked
Bubble 5 hours；It is stand-by after pure water cleaning after the completion of immersion；It can choose in the present invention；After passing through a pickling, to a hypo acid
The quartz bar washed carries out stock removal polishing processing；In the present invention, scouring machine is thrown by numerical control and is polished, and in the present invention,
Numerical control throw scouring machine use resin cutter, in this way by resin cutter be applied to numerical control throwing scouring machine polished, can to polish when
Between can be set, to improve the uniformity and stability of polishing, be not likely to produce stress, it is therefore prevented that deform and burst；
The quartz bar that step stock removal polishing is completed once is made annealing treatment, it is stand-by after the completion of primary annealing；Specifically
, the quartz bar that stock removal polishing is completed is placed in 1000-1180 DEG C of temperature of annealing furnace, constant temperature 30-60 minutes, is once moved back
It is stand-by after the completion of fire；
It can be in the present invention: the quartz bar that stock removal polishing is completed being placed in 1000 DEG C of temperature of annealing furnace, constant temperature 30 divides
Clock, it is stand-by after the completion of primary annealing；
It can be with: the quartz bar that stock removal polishing is completed being placed in 1100 DEG C of temperature of annealing furnace, constant temperature 40 minutes, one
It is stand-by after the completion of secondary annealing；
It can be with: the quartz bar that stock removal polishing is completed being placed in 1180 DEG C of temperature of annealing furnace, constant temperature 60 minutes, one
It is stand-by after the completion of secondary annealing；
For specific choice depending on actually asking, the present invention no longer further limits this；
According to quartz bar production method, by quartzy ingot after cutting, a pickling, stock removal polishing and primary annealing
Quartz bar ready for use is formed, i.e., carries out fluting use to subsequent；
The invention also discloses the grooving methods of a kind of pair of quartz bar, include the following steps:
The quartz bar completed to primary annealing carries out slot treatment；It is stand-by that trough of belt quartz bar is formed after the completion of fluting；Specifically
, the trough of belt quartz bar that annealing is completed is placed in numerical control groover and is slotted, it is stand-by after the completion of fluting；Wherein, slot institute
Numerical control groover selects resin cutter to slot, and carrying out polishing by resin cutter can make the section after cutting coarse
Degree is reduced to Ra < 0.5 by Ra < 1.6 in the prior art, and then reduces subsequent polishing time；
The trough of belt quartz bar that cross-notching is completed carries out grinding process；The trough of belt quartz completed by flat-grinding machine cross-notching
Outer surface polishes；Chamfered is carried out to trough of belt quartz bar quadrangle using flat-grinding machine；It certainly in actual application, can
To carry out selective polishing according to actual needs, and then the sharp position that do not polish is avoided to damage wafer；
The trough of belt quartz bar that polishing is completed carries out white picking and carries out white picking to the trough of belt quartz bar that polishing is completed,
It is stand-by after the completion；Specifically the trough of belt quartz bar formed after polishing is placed in hydrofluoric acid solution, is impregnated 2-5 hours；It has impregnated
At stand-by after the cleaning of rear pure water；
It can be in the present invention: the trough of belt quartz bar formed after polishing being placed in hydrofluoric acid solution, is impregnated 2 hours；It impregnates
It is stand-by after pure water cleaning after the completion；
It can be with: the trough of belt quartz bar formed after polishing being placed in hydrofluoric acid solution, is impregnated 4 hours；After the completion of immersion
It is stand-by after pure water cleaning；
It can be with: the trough of belt quartz bar formed after polishing being placed in hydrofluoric acid solution, is impregnated 5 hours；After the completion of immersion
It is stand-by after pure water cleaning；
For specific choice depending on actually asking, the present invention no longer further limits this；
Second polishing is carried out to the trough of belt quartz bar that white picking is completed；Second polishing uses stock removal polishing in the present invention
Same way carries out, and therefore, to save space, the present invention no longer further limits this；
Double annealing is carried out to the trough of belt quartz bar after second polishing；Double annealing is using primary annealing phase in the present invention
It is carried out with mode, therefore, to save space, the present invention no longer further limits this；
Pickling three times is carried out to the trough of belt quartz bar after double annealing；The trough of belt quartz that specifically second polishing is completed
Item, which is placed in hydrofluoric acid solution, to be impregnated 2-5 hours；It is stand-by after pure water cleaning after the completion of immersion；
In the present invention are as follows: the trough of belt quartz bar that second polishing is completed is placed in hydrofluoric acid solution and is impregnated 2 hours；It impregnates
It is stand-by after pure water cleaning after the completion.
It can be in the present invention are as follows: the trough of belt quartz bar that second polishing is completed is placed in hydrofluoric acid solution, it is small to impregnate 4
When；It is stand-by after pure water cleaning after the completion of immersion.
It can be in the present invention are as follows: the trough of belt quartz bar that second polishing is completed is placed in hydrofluoric acid solution, it is small to impregnate 5
When；It is stand-by after pure water cleaning after the completion of immersion.
By the above method, the quartz that the quartz bar that cutting is completed is slotted, and is completed fluting by each step
Item is handled the quartz bar that can be used.
The invention also discloses a kind of quartz cell boats, including the trough of belt quartz bar to be completed by grooving method.Pass through this
The quartz boat that the scheme preparation of invention is completed compared with the existing technology in the quartz boat that completes it is durable, be hardly damaged；
Common quartz boat is generally 1000 DEG C using temperature compared with prior art, and service life was at 6-9 months, and system of the present invention
Making the quartz cell boat completed using temperature is 1200 DEG C, and constant temperature time is longer, and deflection is small, and service life is up to December, significantly
Ground is that chip production enterprise has saved the cost of raw material.
The foregoing is merely illustrative of the preferred embodiments of the present invention, is not intended to limit the invention, all in essence of the invention
Within mind and principle, any modification, equivalent replacement, improvement and so on be should all be included in the protection scope of the present invention.
Claims (10)
1. a kind of quartz bar production method characterized by comprising
S11, the cutting that quartzy ingot is carried out using cutting equipment, and quartz bar is formed after dicing；
S12, a pickling processes are carried out to the quartz bar formed after cutting in S1 step；
S13, stock removal polishing processing is carried out to the quartz bar that S2 step 1 hypo acid washes；
S14, the quartz bar that S3 step stock removal polishing is completed once is made annealing treatment, it is stand-by after the completion of primary annealing.
2. quartz bar production method as described in claim 1, which is characterized in that the S1 step includes:
S111, the cutting that quartzy ingot is carried out using cast-cutting saw, and quartz plate is formed after dicing；
S112, the quartz plate formed after cutting in S11 step is cut using water-jet cutting machine, and forms stone after dicing
English item.
3. quartz bar production method as described in claim 1, which is characterized in that the S12 step includes:
The quartz bar formed after cutting in S11 step is placed in hydrofluoric acid solution, is impregnated 2-5 hours, pure water after the completion of immersion
It is stand-by after cleaning.
4. quartz bar production method as described in claim 1, which is characterized in that the S14 step includes:
The quartz bar that S13 step stock removal polishing is completed is placed in 1000-1180 DEG C of temperature of annealing furnace, constant temperature 30-60 minutes,
It is stand-by after the completion of primary annealing.
5. the grooving method for the quartz bar that any one of a kind of couple of claim 1-4 the method completes, which is characterized in that packet
Include following steps:
S21, the quartz bar completed to primary annealing carry out slot treatment；It is stand-by that trough of belt quartz bar is formed after the completion of fluting；
The trough of belt quartz bar that S22, cross-notching are completed carries out grinding process；
S23, white picking is carried out to the trough of belt quartz bar completed by S22 polishing, after the completion for use；
S24, second polishing is carried out to the trough of belt quartz bar that white picking in S23 step is completed；
S25, double annealing is carried out to the trough of belt quartz bar after S24 step second polishing；
S26, pickling three times is carried out to the trough of belt quartz bar after double annealing.
6. quartz bar production method as claimed in claim 5, which is characterized in that the S21 step specifically:
The trough of belt quartz bar that annealing is completed is placed in numerical control groover and is slotted, it is stand-by after the completion of fluting.
7. quartz bar production method as claimed in claim 5, which is characterized in that the S22 step includes:
S221, the trough of belt quartz bar outer surface completed by flat-grinding machine cross-notching polish；
S222, chamfered is carried out to trough of belt quartz bar quadrangle using flat-grinding machine.
8. quartz bar production method as claimed in claim 5, which is characterized in that the S23 step are as follows:
The trough of belt quartz bar formed after polishing in S21 step is placed in hydrofluoric acid solution, is impregnated 2-5 hours, after the completion of immersion
It is stand-by after pure water cleaning.
9. quartz bar production method as claimed in claim 5, which is characterized in that the S26 step are as follows:
The trough of belt quartz bar that second polishing in S25 step is completed is placed in hydrofluoric acid solution, is impregnated 2-5 hours, impregnates and completes
It is stand-by after pure water cleaning afterwards.
10. a kind of quartz cell boat, which is characterized in that including what is completed by any one of the claim 5-9 grooving method
Trough of belt quartz bar.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910715106.2A CN110429055A (en) | 2019-08-05 | 2019-08-05 | A kind of quartz bar production method, grooving method and quartz cell boat |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910715106.2A CN110429055A (en) | 2019-08-05 | 2019-08-05 | A kind of quartz bar production method, grooving method and quartz cell boat |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110429055A true CN110429055A (en) | 2019-11-08 |
Family
ID=68412526
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910715106.2A Pending CN110429055A (en) | 2019-08-05 | 2019-08-05 | A kind of quartz bar production method, grooving method and quartz cell boat |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110429055A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110975781A (en) * | 2019-12-21 | 2020-04-10 | 张忠恕 | Sieve plate type reactor quartz carrier and processing technology thereof |
| CN112499989A (en) * | 2020-11-18 | 2021-03-16 | 北京奥地探测仪器有限公司 | Processing method of quartz elastic system for electronic gravimeter |
| CN113414890A (en) * | 2021-06-08 | 2021-09-21 | 江苏富乐德石英科技有限公司 | Processing method of quartz product for vacuum sealing |
| CN115029786A (en) * | 2022-06-24 | 2022-09-09 | 云南北方光学科技有限公司 | Method for processing thin silicon window for infrared |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0878405A (en) * | 1994-08-31 | 1996-03-22 | Shinetsu Quartz Prod Co Ltd | Quartz glass jig for heat treating semiconductor element and its manufacture |
| CN101295747A (en) * | 2007-04-27 | 2008-10-29 | 上海强华石英有限公司 | Solar cell sheet quartz strip boat and manufacturing technique thereof |
| CN101549948A (en) * | 2009-05-14 | 2009-10-07 | 上海石创光学玻璃有限公司 | Grand specification quartz plate production technology. |
-
2019
- 2019-08-05 CN CN201910715106.2A patent/CN110429055A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0878405A (en) * | 1994-08-31 | 1996-03-22 | Shinetsu Quartz Prod Co Ltd | Quartz glass jig for heat treating semiconductor element and its manufacture |
| CN101295747A (en) * | 2007-04-27 | 2008-10-29 | 上海强华石英有限公司 | Solar cell sheet quartz strip boat and manufacturing technique thereof |
| CN101549948A (en) * | 2009-05-14 | 2009-10-07 | 上海石创光学玻璃有限公司 | Grand specification quartz plate production technology. |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110975781A (en) * | 2019-12-21 | 2020-04-10 | 张忠恕 | Sieve plate type reactor quartz carrier and processing technology thereof |
| CN110975781B (en) * | 2019-12-21 | 2024-03-29 | 北京凯德石英股份有限公司 | Quartz carrier of sieve plate type reactor and processing technology thereof |
| CN112499989A (en) * | 2020-11-18 | 2021-03-16 | 北京奥地探测仪器有限公司 | Processing method of quartz elastic system for electronic gravimeter |
| CN113414890A (en) * | 2021-06-08 | 2021-09-21 | 江苏富乐德石英科技有限公司 | Processing method of quartz product for vacuum sealing |
| CN113414890B (en) * | 2021-06-08 | 2022-04-19 | 江苏富乐德石英科技有限公司 | Processing method of quartz product for vacuum sealing |
| CN115029786A (en) * | 2022-06-24 | 2022-09-09 | 云南北方光学科技有限公司 | Method for processing thin silicon window for infrared |
| CN115029786B (en) * | 2022-06-24 | 2024-04-30 | 云南北方光学科技有限公司 | Processing method of infrared thin silicon window |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN110429055A (en) | A kind of quartz bar production method, grooving method and quartz cell boat | |
| KR100955962B1 (en) | Manufacturing method for semiconductor wafers and wire saw used for the same | |
| JP6189407B2 (en) | Method for producing edge-reinforced article | |
| CN100365774C (en) | Semiconductor wafer manufacturing method and wafer | |
| US5855735A (en) | Process for recovering substrates | |
| JP2894153B2 (en) | Method and apparatus for manufacturing silicon wafer | |
| JP3658454B2 (en) | Manufacturing method of semiconductor wafer | |
| CN109505140A (en) | Polished leather processing technology based on cerium oxide application | |
| EP1145296B1 (en) | Semiconductor wafer manufacturing method | |
| KR101137206B1 (en) | Method for manufacturing a non-reflective glass | |
| KR20140122999A (en) | Wire saw and method for preparing the same | |
| CN110383427B (en) | Method for manufacturing wafer | |
| CN105655240A (en) | Processing method of sapphire wafers | |
| JP2003080466A (en) | Wire tool used for wire saw cutting device, manufacturing method for wire tool and cutting method by wire saw | |
| JP3503444B2 (en) | Method for manufacturing semiconductor wafer having semiconductor wafer etching step | |
| JP6419578B2 (en) | Manufacturing method of glass substrate for hard disk | |
| JP2009004675A (en) | Etching method and device for silicon wafer | |
| CN107557869A (en) | The method for avoiding single crystal super alloy turbo blade platinum filament stud position from recrystallizing | |
| JP2003332183A (en) | Semiconductor wafer and its manufacturing method | |
| CN110255924B (en) | Curved glass temperature-changing tempering process | |
| US6733368B1 (en) | Method for lapping a wafer | |
| JP3329593B2 (en) | Method for manufacturing sapphire dummy wafer | |
| CN110561200A (en) | quartz wafer processing technology | |
| CN111430222A (en) | Production process of flexible monocrystalline silicon wafer | |
| JP7285507B1 (en) | Grinding method for semiconductor crystal wafer |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| TA01 | Transfer of patent application right | ||
| TA01 | Transfer of patent application right |
Effective date of registration: 20210308 Address after: No.6, Fuxing 3rd Street, development zone, Fuxian Town, Tongzhou District, Beijing Applicant after: BEIJING KAI DE QUARTZ Corp. Address before: No.6, Fuxing 3rd Street, development zone, Fuxian Town, Tongzhou District, Beijing Applicant before: Zhang Zhongshu |
|
| WD01 | Invention patent application deemed withdrawn after publication | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20191108 |