CN110421924A - A kind of graphene and Ceramic Composite heat dissipation film and its preparation process - Google Patents
A kind of graphene and Ceramic Composite heat dissipation film and its preparation process Download PDFInfo
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- B32B37/153—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with at least one layer being manufactured and immediately laminated before reaching its stable state, e.g. in which a layer is extruded and laminated while in semi-molten state at least one layer is extruded and immediately laminated while in semi-molten state
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- B32B9/007—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising one layer of ceramic material, e.g. porcelain, ceramic tile comprising carbon, e.g. graphite, composite carbon
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- B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
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- B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
- B32B9/04—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising such particular substance as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B9/047—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising such particular substance as the main or only constituent of a layer, which is next to another layer of the same or of a different material made of fibres or filaments
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Abstract
The invention discloses a kind of graphenes and Ceramic Composite heat dissipation film and its preparation process.These raw materials of graphene powder, ceramic material, phase-change material and hot melt adhesive are uniformly mixed after stirring and pour into screw extruder by this graphene and Ceramic Composite heat dissipation film, and extrusion temperature is 100~180 DEG C, and film extrusion obtains substrate；Then hot pressing has macromolecule membrane on substrate upper and lower surfaces, and hot pressing temperature is 100~180 DEG C, obtains graphene and Ceramic Composite heat dissipation film, by cross cutting, is packaged to be finished product.The present invention has rational design, easy to operate, and by graphene powder, ceramic material, phase-change material and hot melt adhesive, these raw material film extrusions obtain substrate, then has macromolecule membrane in substrate upper and lower surface hot pressing again, obtains graphene and Ceramic Composite heat dissipation film finished product；Phase-change material in the present invention absorbs heat, so that graphene has sufficient time and cross-ventilation to radiate, is finally reached practical heat dissipation effect better than pure grapheme material.
Description
Technical field
The present invention relates to composite radiating membrane preparation technology field, especially a kind of graphene and Ceramic Composite heat dissipation film and its
Preparation process.
Background technique
It with electronic product intelligence increasingly and complicates, component number needed for interiors of products increases, and integrated level becomes
It is high.And it is that the heat that electronic product generates in the process of running is increasing that such case bring, which directly affects,.These heats
If be discharged not in time, it is easy to accumulate rapidly and form high temperature.The generation of high temperature will substantially reduce the property of these electronic products
Energy, reliability and service life.So requirement of the electronic product industry to the heat sink material as heat control system core component is got over
Come higher, not only require heat sink material that there is efficient heat dissipation performance, it is necessary to be provided simultaneously with that light weight, material be thin, flexibility
Good feature.
Widely used heat dissipation membrane material mainly has natural stone ink film and electrographite film in current electronic product.
Natural graphite film preparation complex process, difficult forming, the heat dissipation film flexibility prepared is poor, and thickness is thicker, no
The design requirement of electronic product can be met well.For natural stone ink film, Chinese patent application CN102730675A is disclosed
A kind of high thermal conductivity graphite film and preparation method thereof, the technology by the way that a certain proportion of natural graphite and composite oxidant are mixed,
And by series reaction, it will finally roll sheet of sample charing and graphitization prepare natural stone ink film.Although the product
With good thermal coefficient, but the film prepared thicker (at least up to 100 μm) and poor, the thicker heat dissipation film of flexibility
Material occupies too many space in electronic product, directly affects the design structure of product, and thin premise is increasingly done in electronic product
Under, the occupation rate of market of natural stone ink film will be lower and lower.
Electrographite film selling at exorbitant prices, mainly since its manufacturing cost is excessively high.During the preparation process electrographite film at
Type temperature is excessively high and the too long caused highly energy-consuming of molding time brings the rising of manufacturing cost, this kind of technical matters is not able to satisfy
The requirement of the national energy conservation and emission reduction to become more and more important.For electrographite film, stone disclosed in Chinese patent application CN103080005A
Electrographite is prepared by high temperature carbonization and high temperature graphitization Kapton in ink film and its manufacturing method, the technology
Film, the heat dissipation film material film thickness can design, and film is most thin to can reach 5 μm, and heat dissipation effect is very good, and density is smaller, can be well
Meet the frivolous requirement of electronic product, but the manufacturing cost of this kind of electrographite film is excessively high, easily the thousands of members of every square meter.Manufacture
At high cost is mainly as caused by largely consuming energy in charing and graphitizing process.Carbonization temperature is up to 1500 in the preparation method
DEG C, graphitization temperature is up to 3000 DEG C, this certainly will bring highly energy-consuming and Gao Chengben, and the price of heat dissipation membrane material is caused to occupy height not
Under.
Summary of the invention
The technical problem to be solved by the present invention is overcome the deficiencies in the existing technology, it is simple to provide a kind of structure, thermal diffusivity
Graphene and Ceramic Composite heat dissipation film and its preparation process that can be good.
The technical solution adopted by the present invention to solve the technical problems is: a kind of graphene and Ceramic Composite heat dissipation film, tool
There is substrate, substrate upper and lower surface hot pressing has macromolecule membrane, and substrate is prepared by the raw material comprising following mass percent:
The macromolecule membrane is PET, PE, OPP or fiber cloth, and ceramic material is aluminum oxide or aluminium nitride.
Further, the phase-change material includes one of organic class phase transformation material, inorganic hydrated salt class phase transformation material
Or two kinds.
Further, the hot melt adhesive is TTPA, TPU or resin.
A kind of preparation process of graphene and Ceramic Composite heat dissipation film, has follow steps:
(1), following raw material is weighed according to mass percent:
(2), above-mentioned raw materials are uniformly mixed after stirring and pour into screw extruder, extrusion temperature is 100~180 DEG C, is squeezed out
Film forming, obtains substrate；
(3), hot pressing has a macromolecule membrane on the substrate upper and lower surfaces that step (2) obtains, and hot pressing temperature is 100~
180 DEG C, obtain graphene and Ceramic Composite heat dissipation film；
(4), graphene and Ceramic Composite heat dissipation film that step (3) obtains are obtained into after coiled, cross cutting and packaging
Product.
Further, ceramic material is aluminum oxide or aluminium nitride in the step (1)；Phase-change material includes organic
One or both of phase-change material, inorganic hydrated salt class phase transformation material；Hot melt adhesive is TTPA, TPU or resin.Organic class phase transformation
Material may include one of polyethylene glycol, stearic acid, capric acid or a variety of.Inorganic hydrated salt class phase transformation material may include
LiNO3·2H2O、NaCO3·10H2O、CaCl2·6H2One of O or a variety of.
Further, macromolecule membrane is PET, PE, OPP or fiber cloth in the step (3).
Further, in the step (3) macromolecule membrane with a thickness of 1~10 μm.
The beneficial effects of the present invention are: the present invention has rational design, and it is easy to operate, by graphene powder, ceramic material, phase transformation
Material and hot melt adhesive these raw material film extrusions obtain substrate, then have macromolecule membrane in substrate upper and lower surface hot pressing again, obtain
To graphene and Ceramic Composite heat dissipation film finished product；Phase-change material in the present invention absorbs heat, fills so that graphene has
The time divided and cross-ventilation radiate, and are finally reached practical heat dissipation effect better than pure grapheme material.
Specific embodiment
Presently in connection with preferred embodiment, the present invention is further illustrated.
Embodiment 1
A kind of preparation process of graphene and Ceramic Composite heat dissipation film, has follow steps:
(1), graphene powder 50Kg, ceramic material 5Kg, phase-change material 5Kg, hot melt adhesive 40Kg are weighed, ceramic material is
Aluminum oxide, phase-change material are polyethylene glycol, hot melt adhesive TTPA；
(2), above-mentioned raw materials being uniformly mixed after stirring and pours into screw extruder, extrusion temperature is 100 DEG C, film extrusion,
Obtain substrate；
(3), hot pressing has PET film on the substrate upper and lower surfaces that step (2) obtains, and hot pressing temperature is 100 DEG C, obtains
Graphene and Ceramic Composite heat dissipation film；
(4), graphene and Ceramic Composite heat dissipation film that step (3) obtains are obtained into after coiled, cross cutting and packaging
Product.
Embodiment 2
A kind of preparation process of graphene and Ceramic Composite heat dissipation film, has follow steps:
(1), graphene powder 60Kg, ceramic material 10Kg, phase-change material 8Kg, hot melt adhesive 22Kg are weighed, ceramic material is
Aluminium nitride, phase-change material are capric acid, hot melt adhesive TPU；
(2), above-mentioned raw materials being uniformly mixed after stirring and pours into screw extruder, extrusion temperature is 140 DEG C, film extrusion,
Obtain substrate；
(3), hot pressing has OPP film on the substrate upper and lower surfaces that step (2) obtains, and hot pressing temperature is 140 DEG C, obtains
Graphene and Ceramic Composite heat dissipation film；
(4), graphene and Ceramic Composite heat dissipation film that step (3) obtains are obtained into after coiled, cross cutting and packaging
Product.
Embodiment 3
A kind of preparation process of graphene and Ceramic Composite heat dissipation film, has follow steps:
(1), graphene powder 70Kg, ceramic material 15Kg, phase-change material 10Kg, hot melt adhesive 5Kg are weighed, ceramic material is
Aluminum oxide, phase-change material are polyethylene glycol, hot melt adhesive TTPA；
(2), above-mentioned raw materials being uniformly mixed after stirring and pours into screw extruder, extrusion temperature is 180 DEG C, film extrusion,
Obtain substrate；
(3), hot pressing has fiber cloth on the substrate upper and lower surfaces that step (2) obtains, and hot pressing temperature is 180 DEG C, obtains
Graphene and Ceramic Composite heat dissipation film；
(4), graphene and Ceramic Composite heat dissipation film that step (3) obtains are obtained into after coiled, cross cutting and packaging
Product.
The graphene and Ceramic Composite heat dissipation film that different embodiments are prepared are according to testing standard ASTM E1461-01
It is tested, the thermal coefficient tested is as shown in table 1.
The performance test results of graphene and Ceramic Composite heat dissipation film that the different embodiments of table 1 are prepared
In conclusion operation of the present invention is easy, by graphene powder, ceramic material, phase-change material and hot melt adhesive, these are former
Material film extrusion obtains substrate, then has macromolecule membrane in substrate upper and lower surface hot pressing again, obtains graphene and Ceramic Composite
Heat dissipation film finished product；Phase-change material in the present invention absorbs heat, so that graphene has sufficient time and cross-ventilation
Heat dissipation is finally reached practical heat dissipation effect better than pure grapheme material.
The above embodiments merely illustrate the technical concept and features of the present invention, and its object is to allow person skilled in the art
Scholar can understand the contents of the present invention and be implemented, and it is not intended to limit the scope of the present invention, it is all according to the present invention
Equivalent change or modification made by Spirit Essence, should be covered by the scope of protection of the present invention.
Claims (7)
1. a kind of graphene and Ceramic Composite heat dissipation film, it is characterised in that: there is substrate, substrate upper and lower surface hot pressing has macromolecule
Film, substrate are prepared by the raw material comprising following mass percent:
The macromolecule membrane is PET, PE, OPP or fiber cloth, and ceramic material is aluminum oxide or aluminium nitride.
2. graphene according to claim 1 and Ceramic Composite heat dissipation film, it is characterised in that: the phase-change material includes
One or both of machine class phase transformation material, inorganic hydrated salt class phase transformation material.
3. graphene according to claim 1 and Ceramic Composite heat dissipation film, it is characterised in that: the hot melt adhesive be TTPA,
TPU or resin.
4. the preparation process of a kind of graphene and Ceramic Composite heat dissipation film, it is characterised in that: have follow steps:
(1), following raw material is weighed according to mass percent:
(2), above-mentioned raw materials being uniformly mixed after stirring and pours into screw extruder, extrusion temperature is 100~180 DEG C, film extrusion,
Obtain substrate (1)；
(3), hot pressing has macromolecule membrane (2) on the substrate upper and lower surfaces that step (2) obtains, and hot pressing temperature is 100~180
DEG C, obtain graphene and Ceramic Composite heat dissipation film；
(4), graphene and Ceramic Composite heat dissipation film that step (3) obtains are obtained into finished product after coiled, cross cutting and packaging.
5. the preparation process of graphene according to claim 4 and Ceramic Composite heat dissipation film, it is characterised in that: the step
(1) ceramic material is aluminum oxide or aluminium nitride in；Phase-change material includes organic class phase transformation material, inorganic hydrated salt class phase transformation
One or both of material；Hot melt adhesive is TTPA, TPU or resin.
6. the preparation process of graphene according to claim 4 and Ceramic Composite heat dissipation film, it is characterised in that: the step
(3) macromolecule membrane is PET, PE, OPP or fiber cloth in.
7. the preparation process of graphene according to claim 4 and Ceramic Composite heat dissipation film, it is characterised in that: the step
(3) macromolecule membrane with a thickness of 1~10 μm in.
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114085652A (en) * | 2021-11-16 | 2022-02-25 | 瑞声科技（南京）有限公司 | Heat-conducting composite material and preparation method thereof |
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| CN107254297A (en) * | 2017-06-13 | 2017-10-17 | 中国科学技术大学 | A kind of flexible phase-change material for electronic equipment thermal control |
| CN108000845A (en) * | 2017-12-06 | 2018-05-08 | 航天特种材料及工艺技术研究所 | The phase change thermal management component that a kind of forming method of phase change thermal management component and shaping obtain |
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| CN110079278A (en) * | 2019-04-30 | 2019-08-02 | 国电南瑞科技股份有限公司 | A kind of compound hydrated salt phase-change heat-storage material of high thermal conductivity and preparation method thereof |
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| CN104789151A (en) * | 2014-01-22 | 2015-07-22 | 浙江三元电子科技有限公司 | Hot melt adhesive composition and preparation method thereof, and hot melt adhesive heat-conducting strip and preparation method thereof |
| CN107254297A (en) * | 2017-06-13 | 2017-10-17 | 中国科学技术大学 | A kind of flexible phase-change material for electronic equipment thermal control |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114085652A (en) * | 2021-11-16 | 2022-02-25 | 瑞声科技（南京）有限公司 | Heat-conducting composite material and preparation method thereof |
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