CN110419177A - 上行链路波束管理 - Google Patents

上行链路波束管理 Download PDF

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Publication number
CN110419177A
CN110419177A CN201880018751.2A CN201880018751A CN110419177A CN 110419177 A CN110419177 A CN 110419177A CN 201880018751 A CN201880018751 A CN 201880018751A CN 110419177 A CN110419177 A CN 110419177A
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CN
China
Prior art keywords
wtru
trp
uplink
correspondence
beam management
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Pending
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CN201880018751.2A
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English (en)
Chinese (zh)
Inventor
凯尔·正林·潘
郗风君
叶春宣
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IDAC Holdings Inc
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IDAC Holdings Inc
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Publication of CN110419177A publication Critical patent/CN110419177A/zh
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Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04B—TRANSMISSION
    • H04B7/00—Radio transmission systems, i.e. using radiation field
    • H04B7/02—Diversity systems; Multi-antenna system, i.e. transmission or reception using multiple antennas
    • H04B7/04—Diversity systems; Multi-antenna system, i.e. transmission or reception using multiple antennas using two or more spaced independent antennas
    • H04B7/06—Diversity systems; Multi-antenna system, i.e. transmission or reception using multiple antennas using two or more spaced independent antennas at the transmitting station
    • H04B7/0686—Hybrid systems, i.e. switching and simultaneous transmission
    • H04B7/0695—Hybrid systems, i.e. switching and simultaneous transmission using beam selection
    • H04B7/06952—Selecting one or more beams from a plurality of beams, e.g. beam training, management or sweeping
    • H04B7/06966—Selecting one or more beams from a plurality of beams, e.g. beam training, management or sweeping using beam correspondence; using channel reciprocity, e.g. downlink beam training based on uplink sounding reference signal [SRS]
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04B—TRANSMISSION
    • H04B7/00—Radio transmission systems, i.e. using radiation field
    • H04B7/02—Diversity systems; Multi-antenna system, i.e. transmission or reception using multiple antennas
    • H04B7/04—Diversity systems; Multi-antenna system, i.e. transmission or reception using multiple antennas using two or more spaced independent antennas
    • H04B7/0408—Diversity systems; Multi-antenna system, i.e. transmission or reception using multiple antennas using two or more spaced independent antennas using two or more beams, i.e. beam diversity
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04B—TRANSMISSION
    • H04B7/00—Radio transmission systems, i.e. using radiation field
    • H04B7/02—Diversity systems; Multi-antenna system, i.e. transmission or reception using multiple antennas
    • H04B7/04—Diversity systems; Multi-antenna system, i.e. transmission or reception using multiple antennas using two or more spaced independent antennas
    • H04B7/06—Diversity systems; Multi-antenna system, i.e. transmission or reception using multiple antennas using two or more spaced independent antennas at the transmitting station
    • H04B7/0613—Diversity systems; Multi-antenna system, i.e. transmission or reception using multiple antennas using two or more spaced independent antennas at the transmitting station using simultaneous transmission
    • H04B7/0615—Diversity systems; Multi-antenna system, i.e. transmission or reception using multiple antennas using two or more spaced independent antennas at the transmitting station using simultaneous transmission of weighted versions of same signal
    • H04B7/0617—Diversity systems; Multi-antenna system, i.e. transmission or reception using multiple antennas using two or more spaced independent antennas at the transmitting station using simultaneous transmission of weighted versions of same signal for beam forming
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04B—TRANSMISSION
    • H04B7/00—Radio transmission systems, i.e. using radiation field
    • H04B7/02—Diversity systems; Multi-antenna system, i.e. transmission or reception using multiple antennas
    • H04B7/04—Diversity systems; Multi-antenna system, i.e. transmission or reception using multiple antennas using two or more spaced independent antennas
    • H04B7/08—Diversity systems; Multi-antenna system, i.e. transmission or reception using multiple antennas using two or more spaced independent antennas at the receiving station
    • H04B7/0868—Hybrid systems, i.e. switching and combining
    • H04B7/088—Hybrid systems, i.e. switching and combining using beam selection
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04L—TRANSMISSION OF DIGITAL INFORMATION, e.g. TELEGRAPHIC COMMUNICATION
    • H04L25/00—Baseband systems
    • H04L25/02—Details ; arrangements for supplying electrical power along data transmission lines
    • H04L25/0202—Channel estimation
    • H04L25/0224—Channel estimation using sounding signals
    • H04L25/0226—Channel estimation using sounding signals sounding signals per se
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04L—TRANSMISSION OF DIGITAL INFORMATION, e.g. TELEGRAPHIC COMMUNICATION
    • H04L5/00—Arrangements affording multiple use of the transmission path
    • H04L5/003—Arrangements for allocating sub-channels of the transmission path
    • H04L5/0048—Allocation of pilot signals, i.e. of signals known to the receiver
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04L—TRANSMISSION OF DIGITAL INFORMATION, e.g. TELEGRAPHIC COMMUNICATION
    • H04L5/00—Arrangements affording multiple use of the transmission path
    • H04L5/003—Arrangements for allocating sub-channels of the transmission path
    • H04L5/0048—Allocation of pilot signals, i.e. of signals known to the receiver
    • H04L5/0051—Allocation of pilot signals, i.e. of signals known to the receiver of dedicated pilots, i.e. pilots destined for a single user or terminal
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04W—WIRELESS COMMUNICATION NETWORKS
    • H04W24/00—Supervisory, monitoring or testing arrangements
    • H04W24/08—Testing, supervising or monitoring using real traffic
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04W—WIRELESS COMMUNICATION NETWORKS
    • H04W24/00—Supervisory, monitoring or testing arrangements
    • H04W24/10—Scheduling measurement reports ; Arrangements for measurement reports
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04W—WIRELESS COMMUNICATION NETWORKS
    • H04W56/00—Synchronisation arrangements
    • H04W56/001—Synchronization between nodes
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04W—WIRELESS COMMUNICATION NETWORKS
    • H04W56/00—Synchronisation arrangements
    • H04W56/004—Synchronisation arrangements compensating for timing error of reception due to propagation delay
    • H04W56/0045—Synchronisation arrangements compensating for timing error of reception due to propagation delay compensating for timing error by altering transmission time
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04W—WIRELESS COMMUNICATION NETWORKS
    • H04W74/00—Wireless channel access
    • H04W74/002—Transmission of channel access control information
    • H04W74/004—Transmission of channel access control information in the uplink, i.e. towards network
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D64/00—Electrodes of devices having potential barriers
    • H10D64/01—Manufacture or treatment
    • H10D64/013—Manufacture or treatment of electrodes having a conductor capacitively coupled to a semiconductor by an insulator
    • H10D64/01302—Manufacture or treatment of electrodes having a conductor capacitively coupled to a semiconductor by an insulator the insulator being formed after the semiconductor body, the semiconductor being silicon
    • H10D64/01332—Making the insulator
    • H10D64/01352—Making the insulator with sacrificial oxide
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P32/00—Diffusion of dopants within, into or out of wafers, substrates or parts of devices
    • H10P32/10—Diffusion of dopants within, into or out of semiconductor bodies or layers
    • H10P32/14—Diffusion of dopants within, into or out of semiconductor bodies or layers within a single semiconductor body or layer in a solid phase; between different semiconductor bodies or layers, both in a solid phase
    • H10P32/1408—Diffusion of dopants within, into or out of semiconductor bodies or layers within a single semiconductor body or layer in a solid phase; between different semiconductor bodies or layers, both in a solid phase from or through or into an external applied layer, e.g. photoresist or nitride layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P32/00—Diffusion of dopants within, into or out of wafers, substrates or parts of devices
    • H10P32/10—Diffusion of dopants within, into or out of semiconductor bodies or layers
    • H10P32/17—Diffusion of dopants within, into or out of semiconductor bodies or layers characterised by the semiconductor material
    • H10P32/171—Diffusion of dopants within, into or out of semiconductor bodies or layers characterised by the semiconductor material being group IV material
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P50/00—Etching of wafers, substrates or parts of devices
    • H10P50/60—Wet etching
    • H10P50/64—Wet etching of semiconductor materials
    • H10P50/642—Chemical etching
    • H10P50/646—Chemical etching of Group III-V materials
    • H10P50/648—Anisotropic liquid etching
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W10/00—Isolation regions in semiconductor bodies between components of integrated devices
    • H10W10/01—Manufacture or treatment
    • H10W10/011—Manufacture or treatment of isolation regions comprising dielectric materials
    • H10W10/014—Manufacture or treatment of isolation regions comprising dielectric materials using trench refilling with dielectric materials, e.g. shallow trench isolations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W10/00—Isolation regions in semiconductor bodies between components of integrated devices
    • H10W10/10—Isolation regions comprising dielectric materials
    • H10W10/17—Isolation regions comprising dielectric materials formed using trench refilling with dielectric materials, e.g. shallow trench isolations

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  • Engineering & Computer Science (AREA)
  • Signal Processing (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Mobile Radio Communication Systems (AREA)
CN201880018751.2A 2017-02-03 2018-02-02 上行链路波束管理 Pending CN110419177A (zh)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US201762454568P 2017-02-03 2017-02-03
US62/454,568 2017-02-03
US201762501021P 2017-05-03 2017-05-03
US62/501,021 2017-05-03
PCT/US2018/016621 WO2018144844A1 (en) 2017-02-03 2018-02-02 Uplink beam management

Publications (1)

Publication Number Publication Date
CN110419177A true CN110419177A (zh) 2019-11-05

Family

ID=61226679

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201880018751.2A Pending CN110419177A (zh) 2017-02-03 2018-02-02 上行链路波束管理

Country Status (7)

Country Link
US (1) US20200136708A1 (https=)
EP (1) EP3577793A1 (https=)
JP (1) JP2020509651A (https=)
KR (1) KR20190119582A (https=)
CN (1) CN110419177A (https=)
IL (1) IL268437A (https=)
WO (1) WO2018144844A1 (https=)

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CN108809369A (zh) * 2017-05-05 2018-11-13 华为技术有限公司 无线通信的方法、网络设备和终端设备
US20210234597A1 (en) * 2020-01-27 2021-07-29 Qualcomm Incorporated Asymmetric uplink-downlink beam training in frequency bands
CN114126054A (zh) * 2020-08-28 2022-03-01 大唐移动通信设备有限公司 波束指示方法、网络设备、终端、装置及存储介质
CN114173414A (zh) * 2020-09-10 2022-03-11 三星电子株式会社 用于随机接入的波束管理的系统、方法和设备
CN115039352A (zh) * 2020-01-27 2022-09-09 高通股份有限公司 上毫米波频带中的动态混合模式波束对应关系
CN115943708A (zh) * 2020-06-16 2023-04-07 高通股份有限公司 用于基于随机接入信道的自干扰测量的技术
US12316412B2 (en) 2020-01-27 2025-05-27 Qualcomm Incorporated Antenna group selection and indication in frequency bands
US12374787B2 (en) 2020-02-11 2025-07-29 Qualcomm Incorporated Adjusting communications operations for changes to configurations for quasi co-location and number of antenna elements
US12401403B2 (en) 2020-01-27 2025-08-26 Qualcomm Incorporated Antenna group-specific parameter configuration in millimeter wave communications
US12407385B2 (en) 2020-01-27 2025-09-02 Qualcomm Incorporated Signaling of beam correlation across millimeter wave frequency bands

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WO2018155726A1 (ko) * 2017-02-21 2018-08-30 엘지전자 주식회사 무선통신 시스템에서 srs를 전송하는 방법 및 이를 위한 단말
US11224068B2 (en) * 2017-03-24 2022-01-11 Samsung Electronics Co., Ltd. Method and apparatus for contention-free random access and uplink power control in wireless communication system
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TWI710227B (zh) * 2018-08-17 2020-11-11 美商Ｉｄａｃ控股公司 多ｔｒｐ之波束管理
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CN113412587B (zh) * 2019-02-14 2024-06-07 索尼集团公司 建立波束互易性的方法、相关无线装置以及相关网络节点
CN113412582A (zh) * 2019-02-14 2021-09-17 索尼集团公司 用于波束对应信号通知的方法、相关无线设备和相关网络节点
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TWI836031B (zh) * 2019-03-27 2024-03-21 美商內數位專利控股公司 Nr中閒置/不活動模式定位方法、裝置及系統
JP7245361B2 (ja) * 2019-04-30 2023-03-23 ソニーグループ株式会社 ビーム参照シグナリングを可能にするための方法、無線デバイス、及びネットワークノード
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CN112583463B (zh) 2019-09-30 2023-02-14 华为技术有限公司 一种波束的指示方法及装置
CN114287164B (zh) * 2019-09-30 2023-09-22 华为技术有限公司 终端的定时提前量ta处理的方法和装置
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US11575420B2 (en) * 2019-12-10 2023-02-07 Qualcomm Incorporated Channel sounding techniques with analog beamforming
US11696333B2 (en) 2019-12-20 2023-07-04 Qualcomm Incorporated Beam sweep based random access msg 1 and msg 2
US12425897B2 (en) * 2019-12-20 2025-09-23 Qualcomm Incorporated Beam sweep based random access msg 2
CN114902572A (zh) * 2020-01-07 2022-08-12 Oppo广东移动通信有限公司 用于波束选择的方法、终端设备和网络设备
WO2021147682A1 (en) * 2020-01-25 2021-07-29 Qualcomm Incorporated Sounding reference signal configuration
US11831383B2 (en) 2020-01-27 2023-11-28 Qualcomm Incorporated Beam failure recovery assistance in upper band millimeter wave wireless communications
US11672006B2 (en) * 2020-02-21 2023-06-06 Qualcomm Incorporated Message 3 repetition with receive beam sweep and associated beam refinement for message 4
US11743742B2 (en) 2020-03-31 2023-08-29 Qualcomm Incorporated Beam sweep based random access msg 3 and msg 4
US11832115B2 (en) * 2020-05-04 2023-11-28 Qualcomm Incorporated Estimating features of a radio frequency band based on an inter-band reference signal
US20220046431A1 (en) * 2020-08-06 2022-02-10 Qualcomm Incorporated Cell and full duplex beam pair updating
US11363471B2 (en) * 2020-10-06 2022-06-14 Qualcomm Incorporated Data-aided beam management
CN114765860B (zh) * 2021-01-11 2026-03-24 中国移动通信有限公司研究院 传输方法、装置、设备及可读存储介质
US11864225B2 (en) * 2021-04-22 2024-01-02 Qualcomm Incorporated Managing uplink spatial filter configuration
US12309613B2 (en) * 2021-09-24 2025-05-20 Apple Inc. Uplink beam training on neighbor cell
WO2023066498A1 (en) * 2021-10-22 2023-04-27 Telefonaktiebolaget Lm Ericsson (Publ) Uplink beamforming at a wireless device
KR20230089161A (ko) * 2021-12-13 2023-06-20 삼성전자주식회사 단말 기반 빔 제어 기법의 승인 및 제어 방법 및 장치
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CN117042163A (zh) * 2022-04-29 2023-11-10 华为技术有限公司 通信方法及通信装置
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CN108809369A (zh) * 2017-05-05 2018-11-13 华为技术有限公司 无线通信的方法、网络设备和终端设备
CN108809369B (zh) * 2017-05-05 2023-11-03 华为技术有限公司 无线通信的方法、网络设备和终端设备
US20210234597A1 (en) * 2020-01-27 2021-07-29 Qualcomm Incorporated Asymmetric uplink-downlink beam training in frequency bands
US12531626B2 (en) * 2020-01-27 2026-01-20 Qualcomm Incorporated Asymmetric uplink-downlink beam training in frequency bands
US12407385B2 (en) 2020-01-27 2025-09-02 Qualcomm Incorporated Signaling of beam correlation across millimeter wave frequency bands
US12401403B2 (en) 2020-01-27 2025-08-26 Qualcomm Incorporated Antenna group-specific parameter configuration in millimeter wave communications
CN115039352A (zh) * 2020-01-27 2022-09-09 高通股份有限公司 上毫米波频带中的动态混合模式波束对应关系
CN115039352B (zh) * 2020-01-27 2025-03-28 高通股份有限公司 上毫米波频带中的动态混合模式波束对应关系
US12316412B2 (en) 2020-01-27 2025-05-27 Qualcomm Incorporated Antenna group selection and indication in frequency bands
US12374787B2 (en) 2020-02-11 2025-07-29 Qualcomm Incorporated Adjusting communications operations for changes to configurations for quasi co-location and number of antenna elements
CN115943708A (zh) * 2020-06-16 2023-04-07 高通股份有限公司 用于基于随机接入信道的自干扰测量的技术
WO2022042294A1 (zh) * 2020-08-28 2022-03-03 大唐移动通信设备有限公司 波束指示方法、网络设备、终端、装置及存储介质
CN114126054B (zh) * 2020-08-28 2025-11-14 大唐移动通信设备有限公司 波束指示方法、网络设备、终端、装置及存储介质
CN114126054A (zh) * 2020-08-28 2022-03-01 大唐移动通信设备有限公司 波束指示方法、网络设备、终端、装置及存储介质
CN114173414A (zh) * 2020-09-10 2022-03-11 三星电子株式会社 用于随机接入的波束管理的系统、方法和设备

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IL268437A (en) 2019-09-26
WO2018144844A1 (en) 2018-08-09

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