CN110416679A - Microwave circuit structure and its wiring method - Google Patents
Microwave circuit structure and its wiring method Download PDFInfo
- Publication number
- CN110416679A CN110416679A CN201910691769.5A CN201910691769A CN110416679A CN 110416679 A CN110416679 A CN 110416679A CN 201910691769 A CN201910691769 A CN 201910691769A CN 110416679 A CN110416679 A CN 110416679A
- Authority
- CN
- China
- Prior art keywords
- transmission line
- artificial surface
- surface phasmon
- orthogonal
- microwave circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P11/00—Apparatus or processes specially adapted for manufacturing waveguides or resonators, lines, or other devices of the waveguide type
- H01P11/001—Manufacturing waveguides or transmission lines of the waveguide type
- H01P11/003—Manufacturing lines with conductors on a substrate, e.g. strip lines, slot lines
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P3/00—Waveguides; Transmission lines of the waveguide type
- H01P3/003—Coplanar lines
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P3/00—Waveguides; Transmission lines of the waveguide type
- H01P3/02—Waveguides; Transmission lines of the waveguide type with two longitudinal conductors
- H01P3/023—Fin lines; Slot lines
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P3/00—Waveguides; Transmission lines of the waveguide type
- H01P3/02—Waveguides; Transmission lines of the waveguide type with two longitudinal conductors
- H01P3/08—Microstrips; Strip lines
- H01P3/081—Microstriplines
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Waveguides (AREA)
Abstract
The present invention relates to the microwave technical field based on Novel manual electromagnetic material, a kind of microwave circuit structure and its wiring method are disclosed, is interfered with each other with reduce that transmission line generates in level-crossing.Structure of the invention includes: the microstrip line that orthogonal an at least artificial surface phasmon transmission line and at least one load interdigital capacitor are respectively equipped in the X-axis and Y-axis of same layer circuit board, the artificial surface phasmon transmission line is equipped at least two U-lags, corresponding orthogonal part is on the interconnecting piece positioned at adjacent two U-lag of the artificial surface phasmon transmission line between, and the microstrip line for loading interdigital capacitor with two adjacent interdigital capacitors with orthogonal artificial surface phasmon transmission line coupling to realize signal isolation.The present invention can be in the Cross transfer on same layer circuit realization two lines road without the methods of via hole, air-bridge wires, and design is easy, the processing is simple, stability is high, has very high application prospect in practice.
Description
Technical field
The present invention relates to microwave technical fields more particularly to a kind of microwave circuit structure based on Novel manual electromagnetic material
And its wiring method.
Background technique
It sometimes appear that transmission line is the case where same laminate submits fork in modern microwave circuit.To realize the friendship between two lines
Fork can be used and introduce the methods of metallic vias, air bridges.But this classpath requires circuit to have multilayered structure or thread take-up means,
To will increase loss, destroys circuit continuity, increases processing cost and system stability.Therefore, how to realize simple and easy
Cross transfer line between signal isolation be still a challenging problem.
Surface phasmon (Surface Plasmon Polaritons, SPPs) is that a kind of have opposite dielectric at two kinds
The special electromagnetic mode that the medium interface of constant motivates, it can be propagated along interface, and in remaining direction exponentially shape
Formula decaying.In optical frequencies, negative permittivity can be realized by the plasma characteristics of metal.The field containment and low pass of SPPs is special
Property makes it have very big potential using value.However in low-frequency range, metal shows as perfect electric conductor (Perfect Electric
Conductor, PEC), rather than the plasma with negative permittivity, therefore cannot support SPPs.To solve this problem, state
Inside and outside many scholars propose various metals structure and realize phasmon Meta Materials.In recent years, ultra-thin comb metal band is demonstrate,proved
Bright is a kind of artificial surface phasmon structure that can simulate natural surface phasmon, and with traditional microstrip line phase
Than it has the advantages such as low bending loss, anti-interference and miniaturization.
Summary of the invention
Present invention aims at a kind of microwave circuit structure and its wiring method is disclosed, to reduce transmission line in level-crossing
When generate interfere with each other.
In order to achieve the above object, the present invention discloses a kind of microwave circuit structure, divide in the X-axis and Y-axis of same layer circuit board
The microstrip line of an at least artificial surface phasmon transmission line (SPP) that She You be not orthogonal and at least one load interdigital capacitor
(Microstrip with Series Interdigital Capacitor, MSWIC), the artificial surface phasmon pass
Defeated line be equipped at least two U-lags, corresponding orthogonal part be located at adjacent two U-lag of the artificial surface phasmon transmission line it
Between interconnecting piece on, and it is described load interdigital capacitor microstrip line with two adjacent interdigital capacitors and orthogonal artificial surface etc.
From excimer transmission line coupling to realize signal isolation.
Correspondingly, the wiring method of microwave circuit structure disclosed by the invention includes:
With the wire laying mode of orthogonal coupled structure substitution via hole and air bridges, the orthogonal coupling knot on same layer circuit board
Structure specifically: be respectively equipped in the X-axis and Y-axis of same layer circuit board an orthogonal at least artificial surface phasmon transmission line and
The microstrip line of at least one load interdigital capacitor, corresponding orthogonal part are located at adjacent two U of the artificial surface phasmon transmission line
On interconnecting piece between shape slot, and the microstrip line of the load interdigital capacitor with two adjacent interdigital capacitors with it is orthogonal artificial
Surface phasmon transmission line coupling is to realize signal isolation.
Preferably, the present invention is passed for the distance of described two interdigital capacitors of coupling and the artificial surface phasmon
The width of defeated line is equal.
Preferably, the width of the microstrip line of the load interdigital capacitor is equal to the artificial surface phasmon transmission line phase
The width of interconnecting piece between adjacent two U-lags.
Preferably, the U-lag of the artificial surface phasmon transmission line of the present invention is using both ends gradually with the linkage section of port
The groove depth structure of change.
The invention has the following advantages:
1, the present invention is not necessarily to metallic vias, is not necessarily to air bridges, the friendship of two transmission lines only can be completed in the same plane
Fork can be used for reducing the number of plies of multilayer circuit and reduce jumper wire construction, and transmission is excellent with isolation performance, and can save processing
Cost improves stiffness of system.
2, the present invention using artificial SPP transmission line low-pass characteristic and load interdigital capacitor microstrip line high pass characteristic with
And the geometrical characteristic of the two, the transmission band on two lines road is separated, to substantially increase isolation.
3, the present invention can change passband by adjusting geometrical structure parameter, be easy to adjust, be suitable for a variety of application environments；And
And design is simple, the processing is simple, stability is high.
Below with reference to accompanying drawings, the present invention is described in further detail.
Detailed description of the invention
The attached drawing constituted part of this application is used to provide further understanding of the present invention, schematic reality of the invention
It applies example and its explanation is used to explain the present invention, do not constitute improper limitations of the present invention.In the accompanying drawings:
Fig. 1 is the structural schematic diagram and its dispersion curve of artificial surface phasmon transmission unit, wherein Fig. 1 (a) is several
What structure, Fig. 1 (b) is dispersion curve；
Fig. 2 is microstrip line (MSWIC) structural schematic diagram for loading interdigital capacitor；
Fig. 3 is independent artificial SPP transmission line and MSWIC structural schematic diagram, wherein Fig. 3 (a) is artificial SPP transmission line,
Fig. 3 (b) is MSWIC；
Fig. 4 is level-crossing structural schematic diagram；
Fig. 5 is intersection construction enlarged drawing；
Fig. 6 is the efficiency of transmission of individual transmission line and plane intersection construction；
Fig. 7 is the isolation of individual transmission line and plane intersection construction.
Specific embodiment
The embodiment of the present invention is described in detail below in conjunction with attached drawing, but the present invention can be defined by the claims
Implement with the multitude of different ways of covering.
Embodiment one
The present embodiment discloses a kind of microwave circuit structure, is respectively equipped in the X-axis and Y-axis of same layer circuit board orthogonal
The microstrip line (MSWIC) of an at least artificial surface phasmon transmission line (SPP) and at least one load interdigital capacitor, it is described artificial
Surface phasmon transmission line is equipped at least two U-lags, and corresponding orthogonal part is located at artificial surface phasmon transmission
On interconnecting piece between adjacent two U-lag of line, and the microstrip line of the load interdigital capacitor with adjacent two interdigital capacitors with
Orthogonal artificial surface phasmon transmission line coupling is to realize signal isolation.
In other words: the present embodiment is orthogonal to that by an artificial SPP transmission line and one using medium substrate as carrier
MSWIC is constituted, and without technologies such as metallic vias, air bridges, the Cross transfer on same layer circuit can be realized.
In the present embodiment, specific structure such as Fig. 1 (a) of artificial SPP transmission unit is shown, wherein unit period p=4mm,
Width w=4mm, groove width a=2.2mm, groove depth h=3.6mm.Dielectric-slab is the Rogers RO4003 with a thickness of 0.787mm.With
Business software CST, which carries out eigen mode emulation, can obtain shown in its dispersion curve such as Fig. 1 (b), it is seen that artificial SPP transmission line has low pass
Characteristic, and its cutoff frequency can be adjusted by changing groove depth.
It can make microstrip line that there is high pass characteristic by loading interdigital capacitor, specific structure is as shown in Fig. 2, wherein MSWIC
Width w2=1.8mm, the groove width s=0.12mm of interdigital capacitor, the period p of cochin capacitor1=4mm, and the appearance of interdigital capacitor
Value can change by adjusting groove depth s or cochin depth (l1 --- l7), to regulate and control the high pass characteristic of MSWIC.
The structure of independent artificial SPP transmission line and MSWIC are as shown in Figure 3.Wherein Fig. 3 (a) is artificial SPP transmission line,
Both ends go out SPP mode by gradual change groove depth structural excitation, and realize impedance matching, and Fig. 3 (b) is MSWIC schematic diagram.The two is same
Layer circuit is orthogonal, forms a kind of level-crossing structure, as shown in Figure 4.In order to cross over seamless artificial SPP transmission line, on the direction y
MSWIC can be coupled on any one unit of artificial SPP transmission line by two interdigital capacitors, as shown in Figure 5.The intersection
Structure does not destroy the continuity of artificial SPP transmission line on the direction x.And by the period p of MSWIC1It is set as transmitting with artificial SPP
When line width w is of substantially equal as, which can be regarded to the MSWIC unit on a direction y, while guarantee that x and the direction y are uploaded
The continuity of defeated line.Integrally-built efficiency of transmission simulation result is as shown in Figure 6.For the interference for excluding dielectric loss, will emulate
The dielectric material Rogers RO4003 of use is set as lossless.The efficiency of transmission of obvious two transmission lines is all higher and curve smoothing.
Meanwhile the two interdigital capacitors are also considered as the isolation capacitance of two transmission lines.The upper low frequency propagated in the x-direction
Artificial SPP mode is difficult to be crosstalked into the MSWIC on the direction y across the two capacitors (and other interdigital capacitors on MSWIC)
On.The upper frequency electromagnetic waves propagated then are difficult to propagate on artificial SPP transmission line in the x direction in the y-direction, to also contain
Its crosstalk.Isolation (S31, S41) between two lines is below -25dB in the working frequency range of two transmission lines, such as Fig. 7 institute
Show.The volume of entire circuit only has 57.8mm*57.8mm, and two transmission lines just only can be changed by changing geometric parameter
Working band.
It is worth noting that: the coupled structure that the present embodiment avoids crosstalk optimal are as follows: two interdigital capacitors for coupling
Distance it is equal with the width of artificial surface phasmon transmission line；The width for loading the microstrip line of interdigital capacitor is equal to labor statement
The width of interconnecting piece between adjacent two U-lag of face phasmon transmission line.As a kind of realization deteriorated: load interdigital capacitor
The width of microstrip line can be slightly less than the width of the interconnecting piece between adjacent two U-lag of artificial surface phasmon transmission line；With/
Or the distance of two interdigital capacitors for coupling may be slightly larger than the width of artificial surface phasmon transmission line；It is such to be deformed into
What those skilled in the art can readily occur in, be all protection scope of the present invention.
Embodiment two
Corresponding with above-described embodiment, the present embodiment discloses a kind of wiring method of microwave circuit structure, comprising:
With the wire laying mode of orthogonal coupled structure substitution via hole and air bridges, the orthogonal coupling knot on same layer circuit board
Structure specifically: be respectively equipped in the X-axis and Y-axis of same layer circuit board an orthogonal at least artificial surface phasmon transmission line and
The microstrip line of at least one load interdigital capacitor, corresponding orthogonal part are located at adjacent two U of the artificial surface phasmon transmission line
On interconnecting piece between shape slot, and the microstrip line of the load interdigital capacitor with two adjacent interdigital capacitors with it is orthogonal artificial
Surface phasmon transmission line coupling is to realize signal isolation.
Wherein, the specific deployment of the orthogonal coupled structure of the present embodiment is similar with above-described embodiment one, does not repeat them here.
To sum up, the various embodiments described above of the present invention are divided the work disclosed microwave circuit structure and its wiring method, are at least had
Below the utility model has the advantages that
1, the present invention is not necessarily to metallic vias, is not necessarily to air bridges, the friendship of two transmission lines only can be completed in the same plane
Fork can be used for reducing the number of plies of multilayer circuit and reduce jumper wire construction, and transmission is excellent with isolation performance, and can save processing
Cost improves stiffness of system.
2, the present invention using artificial SPP transmission line low-pass characteristic and load interdigital capacitor microstrip line high pass characteristic with
And the geometrical characteristic of the two, the transmission band on two lines road is separated, to substantially increase isolation.
3, the present invention can change passband by adjusting geometrical structure parameter, be easy to adjust, be suitable for a variety of application environments；And
And design is simple, the processing is simple, stability is high.
The foregoing is only a preferred embodiment of the present invention, is not intended to restrict the invention, for the skill of this field
For art personnel, the invention may be variously modified and varied.All within the spirits and principles of the present invention, made any to repair
Change, equivalent replacement, improvement etc., should all be included in the protection scope of the present invention.
Claims (10)
1. a kind of microwave circuit structure, which is characterized in that be respectively equipped in the X-axis and Y-axis of same layer circuit board it is orthogonal at least
The microstrip line of one artificial surface phasmon transmission line and at least one load interdigital capacitor, the artificial surface phasmon transmission
Line is equipped at least two U-lags, and corresponding orthogonal part is between adjacent two U-lag of the artificial surface phasmon transmission line
Interconnecting piece on, and the microstrip line of the load interdigital capacitor with two adjacent interdigital capacitors and orthogonal artificial surface etc. from
Excimer transmission line coupling is to realize signal isolation.
2. microwave circuit structure according to claim 1, which is characterized in that described two interdigital capacitors for coupling
Distance is equal with the width of the artificial surface phasmon transmission line.
3. microwave circuit structure according to claim 1 or 2, which is characterized in that the microstrip line of the load interdigital capacitor
Width be equal to adjacent two U-lag of the artificial surface phasmon transmission line between interconnecting piece width.
4. microwave circuit structure according to claim 1 or 2, which is characterized in that the artificial surface phasmon transmission
The U-lag of line is in the groove depth structure for using both ends gradual change with the linkage section of port.
5. microwave circuit structure according to claim 3, which is characterized in that the artificial surface phasmon transmission line
U-lag is in the groove depth structure for using both ends gradual change with the linkage section of port.
6. a kind of wiring method of microwave circuit structure characterized by comprising
With the wire laying mode of orthogonal coupled structure substitution via hole and air bridges, the orthogonal coupled structure tool on same layer circuit board
Body are as follows: an orthogonal at least artificial surface phasmon transmission line and at least is respectively equipped in the X-axis and Y-axis of same layer circuit board
The microstrip line of one load interdigital capacitor, corresponding orthogonal part are located at adjacent two U-lag of the artificial surface phasmon transmission line
Between interconnecting piece on, and it is described load interdigital capacitor microstrip line with two adjacent interdigital capacitors and orthogonal artificial surface
Phasmon transmission line coupling is to realize signal isolation.
7. the wiring method of microwave circuit structure according to claim 6, which is characterized in that for the described two of coupling
The distance of interdigital capacitor is equal with the width of the artificial surface phasmon transmission line.
8. the wiring method of microwave circuit structure according to claim 6 or 7, which is characterized in that the interdigital electricity of load
The width of the microstrip line of appearance is equal to the width of the interconnecting piece between adjacent two U-lag of the artificial surface phasmon transmission line.
9. the wiring method of microwave circuit structure according to claim 6 or 7, which is characterized in that described artificial surface etc.
U-lag from excimer transmission line is in the groove depth structure for using both ends gradual change with the linkage section of port.
10. the wiring method of microwave circuit structure according to claim 8, which is characterized in that described artificial surface etc. from
The U-lag of excimer transmission line is in the groove depth structure for using both ends gradual change with the linkage section of port.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910691769.5A CN110416679A (en) | 2019-07-30 | 2019-07-30 | Microwave circuit structure and its wiring method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910691769.5A CN110416679A (en) | 2019-07-30 | 2019-07-30 | Microwave circuit structure and its wiring method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110416679A true CN110416679A (en) | 2019-11-05 |
Family
ID=68363984
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910691769.5A Pending CN110416679A (en) | 2019-07-30 | 2019-07-30 | Microwave circuit structure and its wiring method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110416679A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113745790A (en) * | 2020-05-29 | 2021-12-03 | 合肥本源量子计算科技有限责任公司 | Method and system for determining coplanar waveguide transmission line path in rectangular constraint frame |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1588689A (en) * | 2004-07-12 | 2005-03-02 | 同济大学 | Microwave power distributor made from lumped element left hand transmission line |
| CN104157948A (en) * | 2014-08-12 | 2014-11-19 | 上海航天电子通讯设备研究所 | High directivity microstrip power coupler |
-
2019
- 2019-07-30 CN CN201910691769.5A patent/CN110416679A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1588689A (en) * | 2004-07-12 | 2005-03-02 | 同济大学 | Microwave power distributor made from lumped element left hand transmission line |
| CN104157948A (en) * | 2014-08-12 | 2014-11-19 | 上海航天电子通讯设备研究所 | High directivity microstrip power coupler |
Non-Patent Citations (1)
| Title |
|---|
| PEI HANG HE.ET.AL: "Planar Cross Technology of Transmission Lines Using Spoof Surface Plasmon Polaritons", 《2019 INTERNATIONAL CONFERENCE ON MICROWAVE AND MICROWAVE AND MILLIMETER WAVE TECHNOLOGY(ICMMT)》 * |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113745790A (en) * | 2020-05-29 | 2021-12-03 | 合肥本源量子计算科技有限责任公司 | Method and system for determining coplanar waveguide transmission line path in rectangular constraint frame |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN103531871B (en) | A kind of substrate integration wave-guide differential bandpass filter | |
| US20080158840A1 (en) | DC power plane structure | |
| CN104466308B (en) | A kind of balanced type dielectric filter and preparation method thereof | |
| CN107565223A (en) | A kind of stealthy random surface of ultra wide band complete polarization and its design method | |
| US7221240B2 (en) | Narrow bandpass filter installed on a circuit board for suppressing a high-frequency harmonic wave | |
| US20140022030A1 (en) | Signal transmission circuit and signal transmission cell thereof | |
| CN103413997A (en) | Vertical interdigital LTCC band-pass filter | |
| CN108123196B (en) | Broadband filtering integrated stereo balun based on vertical double-sided parallel strip lines | |
| CN109149044A (en) | Medium based on more endothecium structures integrates suspended substrate stripline coupler | |
| CN102856620A (en) | Balun with laminated structure | |
| CN110416679A (en) | Microwave circuit structure and its wiring method | |
| CN103779640B (en) | Micro-band double-passband filter | |
| CN103972619A (en) | UHF wave band high-performance band-pass filter | |
| CN102394325B (en) | L frequency band LTCC band pass filter | |
| CN201478427U (en) | Multilayer coplanar waveguide transmission line | |
| CN207052765U (en) | The dimension of one kind 2.5 closes ring-like frequency-selective surfaces structure | |
| EP1568099B1 (en) | A circuit that taps a differential signal | |
| CN104409807B (en) | Coupling type cross-shaped resonator-based novel differential band-pass filter | |
| CN113823885B (en) | Filter | |
| JP2006526883A (en) | How to optimize the high-frequency performance of via structures | |
| CN113314821B (en) | Dielectric integrated suspension twisted-pair transmission line | |
| CN101714683B (en) | Dielectric filter with trap graphs and duplexer | |
| CN102395245B (en) | U-shaped electromagnetic band gap circuit board with low-frequency simultaneous switching noise inhibiting function | |
| CN101252345A (en) | Band pass filter used for organic substate | |
| CN104092477B (en) | The method for designing of radio-frequency interface circuit and radio-frequency interface circuit |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| CB02 | Change of applicant information |
Address after: 410000 room 402, building 6, Changsha Zhongdian Software Park Phase I, No. 39, Jianshan Road, Changsha high tech Development Zone, Changsha City, Hunan Province Applicant after: HUNAN CYBER ELECTRONIC TECHNOLOGY Co.,Ltd. Address before: Room 503, floor 101, building 2, No. 56, Wanglong Road, high tech Development Zone, Changsha City, Hunan Province Applicant before: HUNAN CYBER ELECTRONIC TECHNOLOGY Co.,Ltd. |
|
| CB02 | Change of applicant information | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20191105 |
|
| RJ01 | Rejection of invention patent application after publication |