CN104092477B - The method for designing of radio-frequency interface circuit and radio-frequency interface circuit - Google Patents
The method for designing of radio-frequency interface circuit and radio-frequency interface circuit Download PDFInfo
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- CN104092477B CN104092477B CN201410317016.5A CN201410317016A CN104092477B CN 104092477 B CN104092477 B CN 104092477B CN 201410317016 A CN201410317016 A CN 201410317016A CN 104092477 B CN104092477 B CN 104092477B
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Abstract
The present invention provides method for designing and the radio-frequency interface circuit of a kind of radio-frequency interface circuit, its method is introducing matching network in former radio-frequency interface circuit, described matching network is used for increasing impedance, adopt the present invention program, the capacitive that former radio-frequency interface circuit itself is unnecessary can be reduced, or balance out the capacitive that former radio-frequency interface circuit itself is unnecessary, to eliminate the intrinsic impedance discontinuity of former radio-frequency interface circuit, reduce return loss.
Description
Technical field
The present invention relates to signal transmission technology field, particularly relate to method for designing and the radio-frequency interface circuit of a kind of radio-frequency interface circuit.
Background technology
Radio-frequency interface circuit, being usually the circuit being connected with planar transmission line and formed by radio frequency connector (such as joint), the frequency range related to is 30MHz～300GHz, and radio-frequency interface circuit is widely used in mobile communication, radar, the field such as armarium. Different from the angle of planar transmission line axial line according to radio frequency connector, it is possible to interface circuit to be divided into through-type with vertical-type radio-frequency interface circuit two kinds: 1) axis direction of radio-frequency joint is parallel with the direction of planar transmission line in through-type radio-frequency interface circuit; 2) axis direction of vertical-type radio-frequency interface circuit is vertical with the direction of planar transmission line.
Radio-frequency interface circuit is radio-frequency module or the requisite part of system: when 1) radio system is generally made up of many sub-radio-frequency modules, radio-frequency module all has input or output radio-frequency interface circuit, and the connection of the radiofrequency signal between different submodules is through what radio-frequency interface circuit completed; 2) development trend of radio-frequency module is volume miniaturization, internal densification, generally internal by two pieces or more pcb board upper and lower superimposed form time, between upper and lower pcb board, the connection of radiofrequency signal is also undertaken by radio-frequency interface circuit.
The concept of transmission line impedance. Transmission line is analyzed in the conventional impedance of RF application, and its definition is as follows:
Wherein, Z refers to impedance, and L is distributed inductance, and C is distribution capacity. When the impedance everywhere of one section of transmission line is all identical, will be transmitted smoothly by the radiofrequency signal of transmission line, it does not have signal can reflect back; When the impedance of this section of transmission line certain is bigger than normal or less than normal, the impedance near this place is just discontinuous, it will have signal can reflect back and produce power loss. Explanation bigger than normal distribution capacity L is relatively large in impedance; Otherwise explanation less than normal distribution capacity C is relatively large in impedance.
There is a general inevitable impedance discontinuity problem in existing radio-frequency interface circuit. Impedance discontinuity can hinder the transmission of radiofrequency signal, can worsen the performance of rf-mode and system, seriously influences whether the function of system. So the impedance discontinuity sex chromosome mosaicism of radio-frequency interface circuit is not due to the bad of joint self performance, neither bad due to planar transmission line performance, but both combinations and produce.
Existing mode solve only the echo problems of radio frequency connector self, it does not have solves the echo problems of radio-frequency interface circuit.
Summary of the invention
It is an object of the invention to provide the method for designing of a kind of radio-frequency interface circuit, former radio-frequency interface circuit that a kind of method for designing adopting this radio-frequency interface circuit obtains, the intrinsic impedance discontinuity of former radio-frequency interface circuit can be eliminated, it is possible to reduce return loss.
The purpose of the present invention is achieved through the following technical solutions:
The method for designing of a kind of radio-frequency interface circuit, introduces matching network in former radio-frequency interface circuit, and described matching network is used for increasing impedance.
A kind of radio-frequency interface circuit, it adopts the method for designing of above-mentioned radio-frequency interface circuit to obtain.
According to the solution of the present invention, owing to introducing matching network in former radio-frequency interface circuit, and this matching network is used for increasing impedance, as such, it is possible to reduce the capacitive that former radio-frequency interface circuit itself is unnecessary, or balance out the capacitive that former radio-frequency interface circuit itself is unnecessary, to eliminate the intrinsic impedance discontinuity of former radio-frequency interface circuit, reducing return loss, adopt the radio-frequency interface circuit that the method for designing of the radio-frequency interface circuit of the present invention obtains, return loss is low.
Accompanying drawing explanation
Fig. 1 is the structural representation of the first through-type radio-frequency interface circuit introducing matching network in an embodiment, and wherein, upper figure is top view, and figure below is sectional view;
Fig. 2 is the structural representation of the first through-type radio-frequency interface circuit introducing matching network in another embodiment, and wherein, upper figure is top view, and figure below is sectional view;
Fig. 3 is the structural representation of the first through-type radio-frequency interface circuit introducing matching network in further embodiment;
Fig. 4 is the structural representation of the first vertical-type radio-frequency interface circuit introducing matching network in an embodiment;
Fig. 5 is the structural representation of the 3rd through-type radio-frequency interface circuit introducing matching network in an embodiment, wherein, is top-level schematic, profile, intermediate layer schematic diagram, bottom schematic diagram from top to bottom successively;
Fig. 6 is the structural representation of the 3rd through-type radio-frequency interface circuit introducing matching network in another embodiment, and wherein, upper figure is top view, and figure below is sectional view;
Fig. 7 is the structural representation of the 3rd through-type radio-frequency interface circuit introducing matching network in further embodiment, and wherein, upper figure is top view, and figure below is sectional view;
Fig. 8 is the structural representation of the 3rd vertical-type radio-frequency interface circuit introducing matching network in an embodiment, and wherein, upper figure is top view, and figure below is sectional view;
Fig. 9 is the structural representation of the 3rd vertical-type radio-frequency interface circuit introducing matching network in another embodiment, and wherein, upper figure is top view, and figure below is sectional view;
Figure 10 is the structural representation of the 3rd vertical-type radio-frequency interface circuit introducing matching network in an embodiment, wherein, is top-level schematic, profile, intermediate layer schematic diagram, bottom schematic diagram from top to bottom successively;
Figure 11 is the structural representation of each matching section in an embodiment;
Figure 12 is that the former radio-frequency interface circuit in an embodiment adopts the method for designing in embodiment to be optimized the effect contrast figure of front and back;
Figure 13 is that the former radio-frequency interface circuit in another embodiment adopts the method for designing in embodiment to be optimized the effect contrast figure of front and back.
Detailed description of the invention
Below in conjunction with embodiment and accompanying drawing, the present invention is further elaborated, but the implementation of the present invention is not limited to this.
The method for designing of the radio-frequency interface circuit of the embodiment of the present invention, is introducing matching network in former radio-frequency interface circuit, and described matching network is used for increasing impedance;
Wherein, former radio-frequency interface circuit can be the radio-frequency interface circuit adopting the design of existing any-mode, or can be existing arbitrary radio-frequency interface circuit;
Former radio-frequency interface circuit introduces matching network and can include step: in described former radio-frequency interface circuit, introduce element with distributed parameters matching network, or step can also be included: in described former radio-frequency interface circuit, introduce collection set of pieces matching network, or step can also be included: in described former radio-frequency interface circuit, introduce element with distributed parameters matching network and collection set of pieces matching network, that is, the matching network introduced in former radio-frequency interface circuit can be element with distributed parameters matching network, it can also be collection set of pieces matching network, or the combination of element with distributed parameters matching network and collection set of pieces matching network,
According toKnown, increase impedance, be equivalent to add distributed inductance value, or reduce distributed capacitance, the present embodiment quotes matching network can reduce the unnecessary capacitive of former radio-frequency interface circuit itself (being equivalent to reduce distributed capacitance), or the unnecessary capacitive of former radio-frequency interface circuit itself (being equivalent to add distributed inductance value) can be balanced out, so make the unnecessary capacitive of former radio-frequency interface circuit itself be reduced or be canceled out, eliminate the intrinsic impedance discontinuity of former radio-frequency interface circuit.
Too much cause it should be noted that prior art does not disclose the intrinsic impedance discontinuity of former radio-frequency interface circuit due to the capacitive of former radio-frequency interface circuit own.
In order to select matching network targetedly, wherein in an embodiment, the described matching network that introduces in former radio-frequency interface circuit can include step: introduces matching network in described former radio-frequency interface circuit according to the structural type of described former radio-frequency interface circuit.
Accordingly, scheme according to above-described embodiment, owing to introducing matching network in former radio-frequency interface circuit, and the impedance that this matching network makes described former radio-frequency interface circuit increases, as such, it is possible to reduce the capacitive that former radio-frequency interface circuit itself is unnecessary, or balance out the capacitive that former radio-frequency interface circuit itself is unnecessary, to eliminate the intrinsic impedance discontinuity of former radio-frequency interface circuit, return loss is low.
Structural type according to described former radio-frequency interface circuit introduces the main process of matching network in described former radio-frequency interface circuit and comprises determining that the structural type of former radio-frequency interface circuit, select matching network according to the structural type determined, the matching network selected is applied to former radio-frequency interface circuit.
As previously mentioned, matching network can be introduced in described former radio-frequency interface circuit according to the structural type of described former radio-frequency interface circuit, eliminate the needs of its intrinsic impedance discontinuity meeting different former radio-frequency interface circuits, realize the design of the former radio-frequency interface circuit to various structural types accordingly. Design below in conjunction with several former radio-frequency interface circuits therein is described in detail.
Wherein in an embodiment, it is through-type with structural type for first, to should the first through-type radio-frequency interface circuit the first through-type radio-frequency interface circuit that to be five foot plug-in unit radio-frequency joints constituted with double-deck PCB (Printedcircuitboard, printed circuit board (PCB)) plate be that example illustrates.
As shown in FIG. 1 to 3, first through-type radio-frequency interface circuit includes first joint signal foot pad the 105, first transmission line the 107, first floor file 108, in order to clearly represent the structure of the first through-type radio-frequency interface circuit, also show four radio-frequency joint ground pads 101～104 of the first through-type radio-frequency interface circuit, pcb board medium 109 in shown at Fig. 1～Fig. 3, and Fig. 1～Fig. 3 is for the first transmission line 107 at top layer;
The above-mentioned structural type according to described former radio-frequency interface circuit introduces matching network in described former radio-frequency interface circuit and may include that the distance d1 widened between the first floor file 108 and the first joint signal foot pad 105 or/and the first matching section 106 introduced between the first joint signal foot pad 105 and the first transmission line 107, wherein, the first matching section 106 one-tenth perception.
Wherein, what figure 1 illustrates is both adopted the distance d1 widened between the first floor file 108 and the first joint signal foot pad 105, adopt again the mode of the first matching section 106 introduced between the first joint signal foot pad 105 and the first transmission line 107, widen the distance d1 between the first floor file 108 and the first joint signal foot pad 105, the capacitive that the first through-type radio-frequency interface circuit is unnecessary can be reduced, the first matching section 106 introduced between the first joint signal foot pad 105 and the first transmission line 107, the width of the first matching section 106 is it is generally required to be significantly less than the width of the first transmission line 107, due to the first matching section 106 one-tenth perception, the capacitive that the first through-type radio-frequency interface circuit is unnecessary can be balanced out further.
Shown in figure 2 is mode only with the distance d1 widened between the first floor file 108 and the first joint signal foot pad 105, it is possible to reduce the capacitive that the first through-type radio-frequency interface circuit is unnecessary.
What figure 3 illustrates is only with the mode of the first matching section 106 introduced between the first joint signal foot pad 105 and the first transmission line 107, it is possible to balance out the capacitive that the first through-type radio-frequency interface circuit is unnecessary.
What the above-mentioned distance d1 widened between the first floor file 108 and the first joint signal foot pad 105 was equivalent to quote at the first through-type radio-frequency interface circuit is element with distributed parameters matching network, and what above-mentioned the first matching section 106 introduced between the first joint signal foot pad 105 and the first transmission line 107 was equivalent to quote at the first through-type radio-frequency interface circuit is lamped element matching network.
Additionally, the technical characteristic that the first transmission line 107 is when bottom or multiple-plate intermediate layer is similar with first transmission line 107 technical characteristic when top layer and implementation with implementation, do not repeat them here.
Wherein in an embodiment, structural type can be second through-type, to should the second through-type radio-frequency interface circuit be the second through-type radio-frequency interface circuit that three foot plug-in unit radio-frequency joints are constituted with double-layer PCB board, described second through-type radio-frequency interface circuit includes the second joint signal foot pad, the second transmission line, the second floor file;
The described structural type according to described former radio-frequency interface circuit introduces matching network in described former radio-frequency interface circuit and may include that the distance widened between described second floor file and described second joint signal foot pad or/and introduce the second matching section between described second joint signal foot pad and described second transmission line, wherein, described second matching section becomes perception, and the width of the second matching section is significantly less than the width of the second transmission line;
The distance widened between described second floor file and described second joint signal foot pad in the present embodiment, to introduce the second matching section between described second joint signal foot pad and described second transmission line be all that the implementation quoting matching network in the first through-type embodiment is similar with structural type, does not repeat them here.
Wherein in an embodiment, it is with structural type for the first vertical-type, to should the radio-frequency interface circuit of the first vertical-type the first vertical-type radio-frequency interface circuit that to be five foot plug-in unit radio-frequency joints constituted with double-deck PCB (Printedcircuitboard, printed circuit board (PCB)) plate be that example illustrates.
Shown in Figure 4, for introducing the schematic diagram of matching network in the first vertical-type radio-frequency interface circuit. As shown in Figure 4, first vertical-type radio-frequency interface circuit includes the 3rd joint signal foot pad the 205, the 3rd transmission line 207, in order to clearly represent the structure of the first vertical-type radio-frequency interface circuit, as shown in Figure 4, Fig. 4 also show four radio-frequency joint ground pads the 201～204, the 3rd floor file 208 of the first vertical-type radio-frequency interface circuit;
The above-mentioned structural type according to described former radio-frequency interface circuit introduces matching network in described former radio-frequency interface circuit and may include that at the distance d2 with the 3rd joint signal foot pad 205 be (2n+1) × (λ1/ 2) the 3rd transmission line 207 introduces the 3rd matching section 206, wherein, the 3rd matching section 206 one-tenth perception, the width of the 3rd matching section 206 is it is generally required to be significantly less than the width of the 3rd transmission line 207,3rd matching section 206 can offset the capacitive that the first vertical-type radio-frequency interface circuit is unnecessary, λ1Be the 3rd transmission line 207 by the wavelength of signal, n=0,1,2,3,4......, therefore, for the signal of different wave length, the position of the 3rd matching section 206 is different, and the present embodiment is the scheme of an arrowband.
Wherein in an embodiment, being with structural type for the second vertical-type, the second vertical-type radio-frequency interface circuit that the radio-frequency interface circuit of corresponding described second vertical-type is three foot plug-in unit radio-frequency joints and double-layer PCB board composition is that example illustrates.
Wherein, the second vertical-type radio-frequency interface circuit includes the 4th joint signal foot pad, the 4th transmission line;
The described structural type according to described former radio-frequency interface circuit introduces matching network in described former radio-frequency interface circuit and includes: be (2n+1) × (λ in the distance with described 4th joint signal foot pad2/ 2) introducing the 4th matching section on described 4th transmission line, wherein, described 4th matching section becomes perception, and the width of the 4th matching section is significantly less than the width of the 4th transmission line, λ2For described 4th transmission line by the wavelength of signal, n=0,1,2,3,4.......
In the present embodiment is (2n+1) × (λ in the distance with described 4th joint signal foot pad2/ 2) described 4th transmission line introduces the mode quoting matching network in the embodiment that the 4th matching section is the first vertical-type with structural type similar, do not repeat them here.
Wherein in an embodiment, it is through-type with structural type for the 3rd, to should the 3rd through-type radio-frequency interface circuit the 3rd through-type radio-frequency interface circuit that to be patch-type radio-frequency joint constituted with double-layer PCB board be that example illustrates.
Needing explanation, above-mentioned each floor file can be top layer floor file, intermediate layer floor file or bottom floor file, and specifically that layer of floor file is relevant at that layer with transmission line.
As shown in Figure 5,3rd through-type radio-frequency interface circuit includes the 5th joint signal foot pad the 305, the 5th transmission line the 307, first bottom floor file the 310, first pier 311, in order to clearly represent the structure of the 3rd through-type radio-frequency interface circuit, as it is shown in figure 5, Fig. 5 also show two radio-frequency joint ground pads 301 of the first through-type radio-frequency interface circuit, 302, top layer floor file 308, pcb board medium 309;
The structural type according to described former radio-frequency interface circuit in above-described embodiment introduces matching network in described former radio-frequency interface circuit and may include that the subregion removing the first bottom floor file 310 below the 5th joint signal foot pad 305, and under this subregion, the first pier 311 is slotted, obtain the first pier fluting 312, so make the 5th joint signal foot pad 305 reference become first pier fluting 312 bottom, distance becomes big, capacitive diminishes, and has reached the purpose of the unnecessary capacitive of elimination.
When pcb board is multi-layer plate-type, the processing mode of intermediate layer floor file is identical with the processing mode of bottom floor file in Fig. 5.
Wherein in an embodiment, it is still with structural type for the 3rd through-type, to should the 3rd through-type radio-frequency interface circuit the 3rd through-type radio-frequency interface circuit that to be patch-type radio-frequency joint constituted with double-layer PCB board be that example illustrates.
Shown in Figure 6, the structural type according to described former radio-frequency interface circuit in above-described embodiment introduces matching network in described former radio-frequency interface circuit and may include that introducing the 5th matching section 3061 between the 5th joint signal foot pad 305 and the 5th transmission line 307, wherein, 5th matching section 3061 one-tenth perception, the width generally requiring the 5th matching section 3061 is significantly less than the width of the 5th transmission line 307, it is possible to offset the capacitive that the 3rd through-type radio-frequency interface circuit is unnecessary.
Wherein in an embodiment, or through-type with structural type for the 3rd, to should the 3rd through-type radio-frequency interface circuit the 3rd through-type radio-frequency interface circuit that to be patch-type radio-frequency joint constituted with double-layer PCB board be that example illustrates.
Shown in Figure 7, the structural type according to described former radio-frequency interface circuit in above-described embodiment introduces matching network in described former radio-frequency interface circuit and may include that at the distance d3 with the 5th joint signal foot pad 305 be (2n+1) × (λ3/ 2) the 5th transmission line 307 introduces the 6th matching section 3062, wherein, the 6th matching section 3062 one-tenth perception, the introducing of the 6th matching section 3062, it is possible to eliminate the capacitive that the 3rd through-type radio-frequency interface circuit is unnecessary, λ3For described 5th transmission line by the wavelength of signal, n=0,1,2,3,4......, so for the signal of different wave length, the position of the 6th matching section 3062 is different, present embodiment is the scheme of an arrowband.
When the 5th transmission line 307 is at bottom, or the 5th transmission line 307 is in multiple-plate intermediate layer, and its method for designing is identical with the mode shown in Fig. 7, does not repeat them here.
Wherein in an embodiment, it is with structural type for the 3rd vertical-type, to should the radio-frequency interface circuit of the 3rd vertical-type the 3rd vertical-type radio-frequency interface circuit that to be patch-type radio-frequency joint constituted with double-layer PCB board be that example illustrates.
As shown in Figure 8,3rd vertical-type radio-frequency interface circuit includes the 6th joint signal foot pad the 405, the 6th transmission line 407, in order to clearly represent the structure of the 3rd vertical-type radio-frequency interface circuit, as shown in Figure 8, Fig. 8 also show two radio-frequency joint ground pads 401 of the first vertical-type radio-frequency interface circuit, 402, floor file 408, pcb board medium 409;
The structural type according to described former radio-frequency interface circuit in above-described embodiment introduces matching network in described former radio-frequency interface circuit and may include that and introduce the 7th matching section 4061 at the 6th joint signal foot pad 405 and the 6th transmission line 407, wherein, 7th matching section 4061 one-tenth perception, the width generally requiring the 7th matching section 4061 is significantly less than the width of the 6th transmission line 407, it is possible to offset the capacitive that the 3rd through-type radio-frequency interface circuit is unnecessary.
Wherein in an embodiment, it is still with structural type for the 3rd vertical-type, to should the radio-frequency interface circuit of the 3rd vertical-type the 3rd vertical-type radio-frequency interface circuit that to be patch-type radio-frequency joint constituted with double-layer PCB board be that example illustrates.
Shown in Figure 9, the structural type according to described former radio-frequency interface circuit in above-described embodiment introduces matching network in described former radio-frequency interface circuit and may include that at the distance d4 with the 6th joint signal foot pad 405 be (2n+1) × (λ4/ 2) introducing the 8th matching section 4062 on the 6th transmission line 407, wherein, the 8th matching section 4062 one-tenth perception, the introducing of the 8th matching section 4062 can eliminate the capacitive that the 3rd through-type radio-frequency interface circuit is unnecessary, λ4For described 6th transmission line by the wavelength of signal, n=0,1,2,3,4......, so for the signal of different wave length, the position of the 8th matching section 4062 is different, present embodiment is the scheme of an arrowband.
When the 6th transmission line 407 is at bottom, or the 6th transmission line 407 is in multiple-plate intermediate layer, and its method for designing is identical with the mode shown in Fig. 9, does not repeat them here.
Wherein in an embodiment, or with structural type for the 3rd vertical-type, to should the radio-frequency interface circuit of the 3rd vertical-type the 3rd vertical-type radio-frequency interface circuit that to be patch-type radio-frequency joint constituted with double-layer PCB board be that example illustrates.
As shown in Figure 10,3rd vertical-type radio-frequency interface circuit includes the 6th joint signal foot pad the 405, the 6th transmission line the 407, second bottom floor file the 410, second pier 411, in order to clearly represent the structure of the 3rd vertical-type radio-frequency interface circuit, as shown in Figure 8, Fig. 8 also show two radio-frequency joint ground pads 401 of the first vertical-type radio-frequency interface circuit, 402, top layer floor file 408, pcb board medium 409.
The structural type according to described former radio-frequency interface circuit in above-described embodiment introduces matching network in described former radio-frequency interface circuit and may include that the subregion removing the described second bottom floor file below the 6th joint signal foot pad 405, and under this subregion, the second pier 411 is carried out fluting obtain second pier fluting 412, so make the 6th joint signal foot pad 405 reference become second pier fluting 412 bottom, distance becomes big, capacitive diminishes, and has reached the purpose of the unnecessary capacitive of elimination.
It should be noted that first above-mentioned matching section the 106, second matching section, the 3rd matching section the 206, the 4th matching section, the 5th matching section the 3061, the 6th matching section the 3062, the 7th matching section the 4061, the 8th matching section 4062 are to connect with corresponding transmission line respectively.
In describing the invention, it is to be understood that term " first " in above-described embodiment, " second ", " the 3rd ", " the 4th " etc. only for descriptive purposes, and it is not intended that instruction or hint relative importance.
The form that implements of each matching section in above-described embodiment can be diversified, as shown in figure 11, except the basic model matching section shown in the above-described embodiments, it is also possible to include monolateral gradual change matching section 501, monolateral staircase match section 502, bilateral gradual change matching section 503, bilateral staircase match section 504, or lamped element coupling 505, wherein, basic model matching section, monolateral gradual change matching section 501, monolateral staircase match section 502, bilateral gradual change matching section 503, bilateral staircase match section 504 is the shape definition of the top view with matching section or profile, such as, basic model matching section refers to the matching section that top view is the shape shown in Fig. 1, bilateral gradual change matching section 503 refers to the matching section that top view is the shape being similar to trapezoid, the first matching section 106 in above-described embodiment, second matching section, 3rd matching section 206, 4th matching section, 5th matching section 3061, 6th matching section 3062, 7th matching section 4061, 8th matching section 4062 may each be basic model matching section, 501, monolateral staircase match section 502, bilateral gradual change matching section 503, bilateral staircase match section 504, or any one among lamped element coupling 505, wherein, lamped element coupling 505 refers to and is connected on the transmission line of correspondence with lumped inductance element, so, lamped element coupling 505 is conveniently applied to bottom or the top layer of PCB, but not can be shown that and may not apply to intermediate layer.
The method for designing of the radio-frequency interface circuit according to the invention described above embodiment, the present invention also provides for a kind of radio-frequency interface circuit, this radio-frequency interface circuit adopts the method for designing of the radio-frequency interface circuit described in above-described embodiment to obtain, this radio-frequency interface circuit is except including the existing element of former radio-frequency interface circuit, also include matching network, such as, as shown in Figure 3, the radio-frequency interface circuit that the method for designing of the radio-frequency interface circuit described in above-described embodiment obtains is adopted not only to include the first joint signal foot pad 105 at the first through-type radio-frequency interface circuit, first transmission line 107, first floor file 108 device such as grade, also include the first matching section 106, the radio-frequency interface circuit of a pair each present invention that differ at this repeats.
The effect brought that two of which adopts the method for designing of the present invention below in actual example is illustrated.
Effect of the present invention citing 1, adopts 30mil thickness RO4350B sheet material and plug-in type joint MAFI6251B5-004, is referred to as radio-frequency interface circuit 1. When product is to the requirement of this interface circuit, the return loss (this index is the smaller the better) in 0GHz～3GHz is less than-20dB; Original design effect is that the return loss in 0GHz～3GHz is worst for-9.7dB, far cannot meet the designing requirement of product, shown in Figure 12, after adopting the method for designing of the present invention, in 0GHz～3GHz, return loss is worst is-30dB, has required 10dB than the designing requirement of product. In higher frequency range 0GHz～4GHz, return loss has all arrived-20dB, adopts the method for designing of the present invention to carry out finer design, it is possible to frequency range to be expanded further, until the frequency limitation of radio-frequency joint self.
Effect of the present invention citing 2, adopts 31mil thickness DICLAD880 sheet material and plug-in type joint MCX-KHD1, is referred to as radio-frequency interface circuit 2. When product is to the requirement of this interface circuit, the return loss (this index is the smaller the better) in 0GHz～3GHz is less than-20dB; Original design effect is that the return loss in 0GHz～3GHz is worst for-11.3dB, far cannot meet the designing requirement of product, shown in Figure 12, after adopting the method for designing of the present invention, in 0GHz～3GHz, return loss is worst is-26dB, will good 6dB than the designing requirement of product. In higher frequency range 0GHz～5GHz, return loss has all arrived-20dB, adopts the method for designing of the present invention to carry out finer design, it is possible to frequency range to be expanded further, until the frequency limitation of radio-frequency joint self.
The invention described above embodiment elaborates the former radio-frequency interface circuit example of multiclass and method for designing thereof, introduces matching network targetedly, eliminate wherein intrinsic impedance discontinuity, it is possible to achieve return loss performance preferably; Compared with original former radio-frequency interface circuit, the former radio-frequency interface circuit of introduction of the present invention does not increase extra Material Cost and processing cost; The embodiment of the present invention describes the former radio-frequency interface circuit of multiple employing distributed matcher network, and the concordance of the impact of performance is better; The embodiment of the present invention systematically describes the method for designing of radio-frequency interface circuit, defines a new technology point.
Embodiment described above only have expressed the several embodiments of the present invention, and it describes comparatively concrete and detailed, but therefore can not be interpreted as the restriction to the scope of the claims of the present invention. It should be pointed out that, for the person of ordinary skill of the art, without departing from the inventive concept of the premise, it is also possible to making some deformation and improvement, these broadly fall into protection scope of the present invention. Therefore, the protection domain of patent of the present invention should be as the criterion with claims.
Claims (13)
1. the method for designing of a radio-frequency interface circuit, it is characterised in that introducing matching network in described former radio-frequency interface circuit according to the structural type of former radio-frequency interface circuit, described matching network is used for increasing impedance;
It is through-type that described structural type includes first, corresponding described first through-type radio-frequency interface circuit is the first through-type radio-frequency interface circuit that five foot plug-in unit radio-frequency joints are constituted with double-layer PCB board, and described first through-type radio-frequency interface circuit includes the first joint signal foot pad, the first transmission line, the first floor file;
The described structural type according to described former radio-frequency interface circuit introduces matching network in described former radio-frequency interface circuit and includes: widen the distance between described first floor file and described first joint signal foot pad or/and between described first joint signal foot pad and described first transmission line introduce the first matching section, wherein, described first matching section becomes perception.
2. the method for designing of radio-frequency interface circuit according to claim 1, it is characterised in that described first matching section includes monolateral gradual change matching section, monolateral staircase match section, bilateral gradual change matching section, bilateral staircase match section or lamped element coupling.
3. the method for designing of a radio-frequency interface circuit, it is characterised in that introducing matching network in described former radio-frequency interface circuit according to the structural type of former radio-frequency interface circuit, described matching network is used for increasing impedance;
It is through-type that described structural type includes second, corresponding described second through-type radio-frequency interface circuit is the second through-type radio-frequency interface circuit that three foot plug-in unit radio-frequency joints are constituted with double-layer PCB board, and described second through-type radio-frequency interface circuit includes the second joint signal foot pad, the second transmission line, the second floor file;
The described structural type according to described former radio-frequency interface circuit introduces matching network in described former radio-frequency interface circuit and includes: widens the distance between described second floor file and described second joint signal foot pad or/and introduces the second matching section between described second joint signal foot pad and described second transmission line, wherein, described second matching section becomes perception.
4. the method for designing of radio-frequency interface circuit according to claim 3, it is characterised in that described second matching section includes monolateral gradual change matching section, monolateral staircase match section, bilateral gradual change matching section, bilateral staircase match section or lamped element coupling.
5. the method for designing of a radio-frequency interface circuit, it is characterised in that introducing matching network in described former radio-frequency interface circuit according to the structural type of former radio-frequency interface circuit, described matching network is used for increasing impedance;
Described structural type includes the first vertical-type, the radio-frequency interface circuit of corresponding described first vertical-type is the first vertical-type radio-frequency interface circuit that five foot plug-in unit radio-frequency joints are constituted with double-layer PCB board, and described first vertical-type radio-frequency interface circuit includes the 3rd joint signal foot pad, the 3rd transmission line;
The described structural type according to described former radio-frequency interface circuit introduces matching network in described former radio-frequency interface circuit and includes: be (2n+1) × (λ in the distance with described 3rd joint signal foot pad1/ 2) introducing the 3rd matching section on described 3rd transmission line, wherein, described 3rd matching section becomes perception, λ1For described 3rd transmission line by the wavelength of signal.
6. the method for designing of radio-frequency interface circuit according to claim 5, it is characterised in that described 3rd matching section includes monolateral gradual change matching section, monolateral staircase match section, bilateral gradual change matching section, bilateral staircase match section or lamped element coupling.
7. the method for designing of a radio-frequency interface circuit, it is characterised in that introducing matching network in described former radio-frequency interface circuit according to the structural type of former radio-frequency interface circuit, described matching network is used for increasing impedance;
Described structural type includes the second vertical-type, the radio-frequency interface circuit of corresponding described second vertical-type is the second vertical-type radio-frequency interface circuit that three foot plug-in unit radio-frequency joints are constituted with double-layer PCB board, and the described second vertical finger-type radio-frequency interface circuit includes the 4th joint signal foot pad, the 4th transmission line;
The described structural type according to described former radio-frequency interface circuit introduces matching network in described former radio-frequency interface circuit and includes: be (2n+1) × (λ in the distance with described 4th joint signal foot pad2/ 2) introducing the 4th matching section on described 4th transmission line, wherein, described 4th matching section becomes perception, λ2For described 4th transmission line by the wavelength of signal.
8. the method for designing of radio-frequency interface circuit according to claim 7, it is characterised in that described 4th matching section includes monolateral gradual change matching section, monolateral staircase match section, bilateral gradual change matching section, bilateral staircase match section or lamped element coupling.
9. the method for designing of a radio-frequency interface circuit, it is characterised in that introducing matching network in described former radio-frequency interface circuit according to the structural type of former radio-frequency interface circuit, described matching network is used for increasing impedance;
It is through-type that described structural type includes the 3rd, corresponding described 3rd through-type radio-frequency interface circuit is the 3rd through-type radio-frequency interface circuit that patch-type radio-frequency joint is constituted with double-layer PCB board, and described 3rd through-type radio-frequency interface circuit includes the 5th joint signal foot pad, the 5th transmission line, the first bottom floor file, the first pier;
The described structural type according to described former radio-frequency interface circuit introduces matching network in described former radio-frequency interface circuit and includes: removes the subregion of described first bottom floor file below described 5th joint signal foot pad, and under described subregion, described first pier is slotted; Or including: introducing the 5th matching section between described 5th joint signal foot pad and described 5th transmission line, wherein, described 5th matching section becomes perception; Or including: it is (2n+1) × (λ in the distance with described 5th joint signal foot pad3/ 2) introducing the 6th matching section on described 5th transmission line, wherein, described 6th matching section becomes perception, λ3For described 5th transmission line by the wavelength of signal.
10. the method for designing of radio-frequency interface circuit according to claim 9, it is characterized in that, described 5th matching section or described 6th matching section include monolateral gradual change matching section, monolateral staircase match section, bilateral gradual change matching section, bilateral staircase match section or lamped element coupling.
11. the method for designing of a radio-frequency interface circuit, it is characterised in that introducing matching network in described former radio-frequency interface circuit according to the structural type of former radio-frequency interface circuit, described matching network is used for increasing impedance;
Described structural type includes the 3rd vertical-type, the radio-frequency interface circuit of corresponding described 3rd vertical-type is the 3rd vertical-type radio-frequency interface circuit that patch-type radio-frequency joint is constituted with double-layer PCB board, and described 3rd vertical-type radio-frequency interface circuit includes the 6th joint signal foot pad, the 6th transmission line, the second bottom floor file, the second pier;
The described structural type according to described former radio-frequency interface circuit introduces matching network in described former radio-frequency interface circuit and includes: introduce the 7th matching section between described 6th joint signal foot pad and described 6th transmission line, and wherein, the 7th matching section becomes perception; Or including: it is (2n+1) × (λ in the distance with described 6th joint signal foot pad4/ 2) introducing the 8th matching section on described 6th transmission line, wherein, described 8th matching section becomes perception, λ4For described 6th transmission line by the wavelength of signal; Or including: remove the subregion of described second bottom floor file below described 6th joint signal foot pad, and under described subregion, described second pier is slotted.
12. the method for designing of radio-frequency interface circuit according to claim 11, it is characterized in that, described 7th matching section or described 8th matching section include monolateral gradual change matching section, monolateral staircase match section, bilateral gradual change matching section, bilateral staircase match section or lamped element coupling.
13. a radio-frequency interface circuit, it is characterised in that adopt the method for designing of the radio-frequency interface circuit described in one of claim 1 to 12 to obtain.
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| CN201410317016.5A CN104092477B (en) | 2014-07-04 | 2014-07-04 | The method for designing of radio-frequency interface circuit and radio-frequency interface circuit |
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| CN111542168B (en) * | 2020-04-09 | 2021-06-15 | 烽火通信科技股份有限公司 | Radio frequency interface circuit |
| CN113709971B (en) * | 2021-09-01 | 2023-06-09 | 常州移远通信技术有限公司 | Circuit board and communication equipment |
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| EP0531125A3 (en) * | 1991-09-04 | 1993-06-30 | Nec Corporation | Radio transceiver |
| CN101581758A (en) * | 2008-05-14 | 2009-11-18 | 北京中电华大电子设计有限责任公司 | Non-contact card chip WAFER-grade testing circuit |
| CN102594391A (en) * | 2011-01-12 | 2012-07-18 | Nxp股份有限公司 | Interface circuit |
| CN103873102A (en) * | 2012-12-10 | 2014-06-18 | 联想(北京)有限公司 | Radio-frequency chip, radio-frequency circuit and electronic device |
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| US6298244B1 (en) * | 1997-07-03 | 2001-10-02 | Ericsson Inc. | Dual-band, dual-mode power amplifier |
| CN202487765U (en) * | 2012-03-05 | 2012-10-10 | 苏州中科半导体集成技术研发中心有限公司 | Printed antenna |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0531125A3 (en) * | 1991-09-04 | 1993-06-30 | Nec Corporation | Radio transceiver |
| CN101581758A (en) * | 2008-05-14 | 2009-11-18 | 北京中电华大电子设计有限责任公司 | Non-contact card chip WAFER-grade testing circuit |
| CN102594391A (en) * | 2011-01-12 | 2012-07-18 | Nxp股份有限公司 | Interface circuit |
| CN103873102A (en) * | 2012-12-10 | 2014-06-18 | 联想(北京)有限公司 | Radio-frequency chip, radio-frequency circuit and electronic device |
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